表紙:半導体業界における積層造形:技術の普及とロードマップ
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1167931

半導体業界における積層造形:技術の普及とロードマップ

Additive Manufacturing in the Semiconductor Industry: Technology Penetration and Roadmap

出版日: | 発行: Frost & Sullivan | ページ情報: 英文 69 Pages | 納期: 即日から翌営業日

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半導体業界における積層造形:技術の普及とロードマップ
出版日: 2022年11月15日
発行: Frost & Sullivan
ページ情報: 英文 69 Pages
納期: 即日から翌営業日
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  • 概要
  • 目次
概要

当レポートでは、3D印刷としても知られる積層造形(AM)の半導体業界における市場機会を分析しています。市場動向と促進要因を詳しく説明し、2028年までの半導体産業における予測をまとめ、主要企業のプロファイルなども提供しています。

目次

戦略的インペラティブ

  • 成長がますます困難になるのはなぜか
  • 戦略的インペラティブ
  • 半導体業界における積層造形に対する上位3つの戦略的インペラティブの影響
  • 成長の機会が成長パイプラインエンジンを加速させる
  • 調査手法
  • 調査結果の要約

成長機会分析

  • 分析範囲
  • 半導体でのAMの使用が影響を与えた最終市場のセグメンテーション
  • 成長促進要因
  • 成長抑制要因

業界の見通し、技術と応用情勢、採用動向

  • 世界の半導体セクターの見通し
  • 2020年から2021年までの自動車産業に対するIC不足の影響
  • パンデミック時の半導体製造に対するAMの影響
  • AMで製造される半導体部品
  • エアロゾルジェット印刷(AJP)と選択的レーザー焼結(SLS)は、半導体製造を可能にするAM技術です。
  • ステレオリソグラフィー(SLA)とデジタルライトプロセッシング(DLP)は、半導体製造を可能にするAM技術
  • 6つのエンドマーケットにわたる半導体産業に対するAMの影響分析
  • 半導体産業におけるAMの応用情勢分析
  • 3Dプリント半導体の採用に影響を与える世界の動向
  • 技術開発:マイクロサイズの電子印刷と先端材料に焦点を当てる
  • 技術開発:印刷リードタイムの短縮と複雑な部品印刷に注力
  • 3Dプリント半導体部品の用途別市場動向

地域情勢とバリューチェーン分析

  • 地域での採用シナリオ:3Dプリントの採用を促進する要因
  • 世界の競合情勢
  • 市場への浸透と採用を促進する新たなビジネスモデル
  • 半導体3Dプリンティングのプロセスバリューチェーン
  • 市場開拓戦略:地理的拡大とサービス戦略別消費者獲得
  • 使用事例1:Nano Dimension(米国)とHensoldt(ドイツ)- 多層回路基板
  • 使用事例2:Optomec(米国)およびLite-On Technology Corporation(台湾):スケーラブルな電子部品の印刷
  • 使用事例3:BotFactory(米国)- 温度計の短いリードタイムPCB印刷

業界のベストプラクティス:主要企業が採用する開発戦略

  • 戦略的パートナーシップ:3Dプリント技術のさらなる探求
  • R&Dコラボレーション:半導体製造における5G性能強化と革新への収束
  • 政府のイニシアチブ:チップ製造の新たな可能性を探るための有利な政策と調査協力
  • M&A:先端材料とAIを使用した精密半導体印刷に注目
  • 新製品発表:マイクロサイズの導電性インクを使用した微細化半導体用3Dプリンター
  • 先端材料、新しいイノベーション、市場拡大のための資金提供
  • 資金調達分析(2020年~2022年):政府はスタートアップを支援

技術ロードマップ

  • 半導体業界におけるAMの技術ロードマップ

活躍企業

  • Nano Dimension
  • Optomec
  • Fabric8Labs
  • Scrona
  • ATLANT 3D Nanosystems

成長の機会領域

  • 成長の機会1:戦略的M&Aとパートナーシップ
  • 成長の機会2:技術競争力
  • 成長の機会3:標準化された印刷工程と厳格な品質管理

付録

次のステップ

目次
Product Code: D9F2

Disruptive technologies are driving the adoption of 3D printing in the semiconductor industry

The research report analyzes the market opportunities for additive manufacturing (AM), also known as 3D printing, in the semiconductor industry. The study discusses technological development, including semiconductor 3D printing innovations. It elaborates on the market trends and drivers and charts the expected evolution of this technology in the semiconductor industry up to 2028. The ecosystem analysis includes research breakthroughs for semiconductor 3D printing and the profiles of some key players. The study also discusses market restraints that potentially hinder the adoption of semiconductor 3D printing. This report concludes with a growth opportunity analysis of related industries and recommendations for market players and stakeholders that will accelerate the growth of 3D printing in the semiconductor industry.

The commercialization of 3D printing for the semiconductor industry largely centers on printing electronic components, resistors, transistors, capacitors, antennas, radio frequency (RF) devices, etc. Researchers believe that 3D printing will enhance the 5G connection in mobile devices by enabling the manufacture of densely printed electronic components.

Many 3D printing companies are pioneering advanced chip packaging technologies as the conventional method is labor-intensive and time-consuming. In terms of applications, 3D semiconductor printing impacts many industries, especially the automotive, consumer electronics, and medical industries, with large-scale adoption expected in the next 2 to 5 years resulting from improved functional requirements of 3D-printed electronic parts.

Key questions this study will answer:

  • 1. What is the outlook of the global semiconductor industry? What impact has the chip shortage had on the automotive industry?
  • 2. What impact has 3D printing had on the global semiconductor sector and the key emerging application landscape of semiconductor 3D printing across different industry verticals?
  • 3. What are the influencing factors driving the opportunities for semiconductor 3D printing? What do the competitive landscape and regional adoption scenario look like?
  • 4. What developmental strategies have companies adopted to leverage 3D printing technology and enhance market penetration?

Table of Contents

Strategic Imperatives

  • Why Is It Increasingly Difficult to Grow?The Strategic Imperative 8™: Factors Creating Pressure on Growth
  • The Strategic Imperative 8™
  • The Impact of the Top 3 Strategic Imperatives of Additive Manufacturing (AM) in the Semiconductor Industry
  • Growth Opportunities Fuel the Growth Pipeline Engine™
  • Research Methodology
  • Summary of Findings

Growth Opportunity Analysis

  • Scope of Analysis
  • Segmentation of End Markets that the Use of AM in Semiconductors has Impacted
  • Growth Drivers
  • Growth Restraints

Industry Outlook, Technology and Application Landscape, and Adoption Trends

  • Global Semiconductor Sector Outlook
  • The Impact of the IC Shortage on the Automotive Industry between 2020 and 2021
  • The Impact of AM on Semiconductor Production During the Pandemic
  • Semiconductor Components Manufactured Using AM
  • Aerosol Jet Printing (AJP) and Selective Laser Sintering (SLS) are AM Technologies Enabling Semiconductor Manufacturing
  • Stereolithography (SLA) and Digital Light Processing (DLP) are AM Technologies that Enable Semiconductor Manufacturing
  • Impact Analysis of AM on the Semiconductor Industry across 6 End Markets
  • Application Landscape Analysis of AM in the Semiconductor Industry
  • Global Trends Influencing 3D-printed Semiconductor Adoption
  • Technology Development: A Focus on Micro-sized Electronic Printing and Advanced Materials
  • Technology Development: A Focus on Shorter Printing Lead Time and Intricate Part Printing
  • Market Trends by Application of 3D-printed Semiconductor Components

Regional Landscape and Value Chain Analysis

  • Regional Adoption Scenario: Factors Driving the Adoption of 3D Printing
  • Global Competitive Landscape
  • Emerging Business Models Encouraging Market Penetration and Adoption
  • Process Value Chain of Semiconductor 3D Printing
  • Go-to-market Strategy: Consumer Acquisition through Geographical Expansion and Service Strategy
  • Use Case 1: Nano Dimension (United States) and Hensoldt (Germany)-The Multilayered Circuit Board
  • Use Case 2: Optomec (United States) and Lite-On Technology Corporation (Taiwan): Printing Electronic Parts at Scalable Volumes
  • Use Case 3: BotFactory (United States)-Short Lead Time PCB Printing for Thermometers

Industry Best Practices: Developmental Strategies Adopted by Key Players

  • Strategic Partnership: Further Exploration in 3D Printing Technology
  • R&D Collaboration: Convergence to 5G Performance Enhancement and Innovation in Semiconductor Production
  • Government Initiatives: Favorable Policies and Research Collaboration to Explore New Possibilities in Chip Manufacturing
  • M&As: A Focus on Precision Semiconductor Printing Using Advanced Material and AI
  • New Product Launches: 3D Printers for Miniaturized Semiconductors Using Micro-sized Conductive Ink
  • Funding for Advanced Material, New Innovations, and Market Expansion
  • Funding Analysis from 2020 to 2022: Governments Support Start-ups

Technology Roadmap

  • Technology Roadmap of AM in the Semiconductor Industry

Companies to Action

  • Nano Dimension, United States
  • Optomec, United States
  • Fabric8Labs, United States
  • Scrona, Switzerland
  • ATLANT 3D Nanosystems, Denmark

Growth Opportunity Universe

  • Growth Opportunity 1: Strategic M&As and Partnerships
  • Growth Opportunity 1: Strategic M&As and Partnerships (continued)
  • Growth Opportunity 2: Technology Competitiveness
  • Growth Opportunity 2: Technology Competitiveness (continued)
  • Growth Opportunity 3: Standardized Printing Process and Stringent Quality Control
  • Growth Opportunity 3: Standardized Printing Process and Stringent Quality Control (continued)

Appendix

  • Technology Readiness Levels (TRL): Explanation

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