先進半導体パッケージング向け熱管理システム・材料の世界市場（2026年～2036年）

先進半導体パッケージング向け熱管理システム・材料の世界市場は、電力密度の絶え間ない向上と、従来の2Dパッケージングから革新的な2.5D/3D集積アーキテクチャへの移行により、幅広い半導体エコシステムの中でもっとも急成長しているセグメントの1つです。この市場には、サーマルインターフェースマテリアル、液冷システム、先進のヒートスプレッダー、次世代コンピューティング性能を可能にするグラフェンベースのソリューションやマイクロ流体冷却などの新技術が含まれます。

市場規模の予測では、2036年までの爆発的な成長が見込まれています。これは、熱管理要求の増加と、従来のアプローチよりも大幅に高い価格設定が可能なプレミアムサーマルソリューションの採用を反映しています。従来の熱管理から先進のソリューションへの移行は、技術の高度化と性能のプレミアム化により、金額の伸びが数量の伸びを大幅に上回る市場の進化を生み出します。

サーマルインターフェースマテリアルは最大の市場セグメントとなり、従来のサーマルグリースから、従来の材料に比べて熱伝導率を10～100倍向上させることのできる、液体金属、グラフェン複合材料、ダイヤモンド強化ソリューションなどの先進材料へと進化しています。液冷技術は、ハイパフォーマンスコンピューティングとAIの用途における空冷能力を上回る熱設計出力の増加により、もっとも急速に成長している市場セグメントです。ダイレクトツーチップ冷却が市場の主導権を維持する一方、液浸冷却とマイクロ流体冷却が新たな機会となっています。

データセンターとハイパフォーマンスコンピューティングは主な市場です。カーエレクトロニクスは、電気自動車の熱管理要件が先進の冷却技術の採用を促進し、急成長しているセグメントであり、コンシューマーエレクトロニクスは小型化と性能強化の動向を通じて安定した成長を維持しています。熱管理市場における技術の進化は、従来の材料の漸進的な改良から、マイクロ流体力学、先進材料、統合冷却ソリューションなどの革新的なアプローチへの明らかな進歩を示しています。このような技術の移行は、既存の熱管理企業と、画期的な技術を開発する革新的なスタートアップの双方に市場機会を生み出し、技術が成熟して製造規模が拡大するにつれて、市場の統合が進むと予測されます。

2036年までの市場見通しは、AIアクセラレーション、3Dパッケージングの採用、自動車の電化などの基礎的な産業動向が、優れた熱管理機能に対する飽くなき需要を生み出し、力強い成長が続くことを示しています。

当レポートでは、世界の先進半導体パッケージング向け熱管理システム・材料市場について調査分析し、熱管理技術の進化、2036年までの市場規模と予測、競合情勢、参入企業への戦略的提言などの情報を提供してします。

目次

第1章 エグゼクティブサマリー

• 先進の半導体パッケージング - 2Dアーキテクチャから先進の2.5D/3D統合技術へ
• 課題
• TSVのパフォーマンス
• 水平方向から垂直方向への電力供給の移行
• TIM1用途向けのサーマルインターフェースマテリアルの選択
• HPC向け冷却技術

第2章 イントロダクション

• 熱設計電力（TDP）
• HPCチップにおける先進の半導体パッケージング技術
• GPUにおける2.5D/3Dパッケージング
• GPUの平面ダイパッケージング分野の進化
• 高出力先進パッケージングの熱管理

第3章 2.5D/3D先進半導体パッケージング技術

• イントロダクション
• 最新の半導体パッケージング技術
• 先進半導体パッケージング技術の最適化
• 相互接続技術
• 2.5Dパッケージング
• バンピング技術
• 製造歩留まり
• コスト分析
• 基板技術の進化（シリコン vs. 有機 vs. ガラス）
• 先進パッケージングの組立と検査の課題

第4章 電力管理

• イントロダクション
• 電力供給システム
• HPCチップのエコシステム
• 先進の電力供給ネットワーク（PDN）
• 電源ノイズ
• 動的電圧・周波数スケーリング（DVFS）
• パワーゲーティング
• クロックゲーティング
• インターポーザーの統合電圧レギュレーター（IVR）
• スイッチトキャパシター電圧コンバーター
• パッケージ基板への磁気統合
• AIによる動的電力管理
• 熱管理ランタイムループ
• オンパッケージ電圧制御（OPVR）
• デカップリングコンデンサー（Decap）
• 低抵抗相互接続
• 課題

第5章 先進パッケージング向けの新しい熱材料とソリューション

• イントロダクション
• ダイアタッチ技術
• 3D半導体パッケージングにおけるTIM1
• 新しい熱技術
• 熱モデリング、シミュレーション

第6章 液体冷却

• 概要
• 液体冷却技術
• ラックレベル電力制限
• チップレベル冷却アプローチ
• 先進の冷却統合
• 冷却技術の比較

第7章 世界市場の予測

• タイプ別
• エリア別
• 収益別
• パッケージングタイプ別
• 液体冷却市場の予測
• 先進熱材料市場の進化
• 地理的市場分布

第8章 企業プロファイル（企業48社のプロファイル）

第9章 参考文献

List of Tables

• Table 1. Evolution of semiconductor packaging
• Table 2. Comparison Table of 2.5D and 3D IC Integration in HPC chips
• Table 3. Overview of Power Management Components for HPC chips
• Table 4. Impact of Key Design Parameters on PDN Performance in 2.5D Integration
• Table 5. Backside Power Delivery for Next Generation HPC chips
• Table 6. TSV Reliability in Advanced Packaging
• Table 7. Lateral Power Delivery (LPD) to Vertical Power Delivery (VPD)
• Table 8. Thermal interface material selection for TIM1
• Table 9. Diamond as substrate materials
• Table 10. Cooling Technologies for HPC
• Table 11. TDP Trends for HPC (High Performance Computing) Chips to 2025
• Table 12. Comparison of 2.5D and 3D IC Integration in HPC chips
• Table 13. TDP Implications in Advanced Packaging
• Table 14. 2.5D and 3D Packaging in GPUs
• Table 15. Evolution of planar die packaging area for GPUs
• Table 16. Cooling Strategies for High-Power 2.5D/3D Packages
• Table 17. Advanced cooling strategies
• Table 18. Semiconductor packaging technology
• Table 19. Key metrics for advanced semiconductor packaging performance
• Table 20. Interconnection techniques in semiconductor packaging
• Table 21. Thermal management in 2.5D packaging
• Table 22. Bumping Technology Overview
• Table 23. Challenges in scaling bumps
• Table 24. 3.8 micrometer bump for advanced semiconductor packaging
• Table 25. Bumpless Cu-Cu hybrid bonding Overview
• Table 26. Manufacturing Yield Considerations in Advanced Packaging
• Table 27. Cost Analysis: 2.5D vs 3D Implementation Economics
• Table 28. Substrate Technology Evolution (Silicon vs Organic vs Glass)
• Table 29. Assembly and Test Challenges for Advanced Packages
• Table 30. Power Delivery in Advanced Semiconductor Packaging for HPC
• Table 31. Power Management Components for HPC chips
• Table 32. Advanced power delivery networks for HPC packaging
• Table 33. Overview of Power gating technology
• Table 34. OPVR Implementation
• Table 35. Decoupling Technology
• Table 36. Trend Towards 3D Packaging and Advanced Thermal Management
• Table 37. Die-Attach for CPUs, GPUs and Memory Modules
• Table 38. Die Attach Materials Comparison
• Table 39. TIM1 applications in advanced packaging
• Table 40. Selection and optimization of TIM1 materials
• Table 41. Microfluidic cooling for advanced semiconductor packaging forecast: 2026-2036 (units)
• Table 42. Liquid Cooling Options
• Table 43. Carbon Nanotube Thermal Interface Materials
• Table 44. Graphene Manufacturing for TIMs
• Table 45. Layer Count, Defect Density, and Thermal Performance
• Table 46. Graphene-Polymer Composites for TIM Applications
• Table 47. Graphene Oxide vs Reduced Graphene Oxide Trade-offs
• Table 48. Vertical Graphene Structures for Enhanced Heat Transfer
• Table 49. Graphene-metal matrix composites
• Table 50. Cost Reduction Roadmap for Graphene Materials
• Table 51. Aerogel-Based Thermal Solutions
• Table 52. Metamaterial heat spreaders
• Table 53. Bio-inspired thermal management approaches
• Table 54. Comparison of Liquid Cooling Technologies
• Table 55. Power Limitation of Different Cooling on Rack Level
• Table 56. Chip-level cooling approaches
• Table 57. Hybrid Cooling System Performance Comparison
• Table 58. Thermoelectric Cooling Integration Specifications
• Table 59. Heat Recovery System Economics
• Table 60. Cooling System Reliability Analysis
• Table 61. Cooling Technology Comparison
• Table 62. Market share forecast of TIM1 and TIM1.5 for advanced semiconductor packaging forecast, by type 2026-2036
• Table 63. TIM1 and TIM1.5 for advanced semiconductor packaging, revenues forecast by type, 2026-2036
• Table 64. TIM1 and TIM1.5 area forecast for advanced semiconductor packaging, 2026-2036
• Table 65. TIM1 and TIM1.5 market size forecast for advanced semiconductor packaging 2026-2036
• Table 66. Thermal Management Market by Package Type, 2026-2036
• Table 67. Package Size Impact Analysis
• Table 68. Liquid cooling for data center forecast 2025-2036
• Table 69. Liquid Cooling Market Penetration by Segment, 2025-2036
• Table 70. Advanced Thermal Materials Market Forecast, 2026-2036
• Table 71. Geographic Market Analysis

List of Figures

• Figure 1. Scheme of the three essential components in power devices thermal management and the big gap between the theoretical limit and current developed TIMs
• Figure 2. Schematic of thermal interface materials used in a flip chip package
• Figure 3. Evolution roadmap of semiconductor packaging
• Figure 4. 2.5D packaging structure
• Figure 5. CoWoS - development progress and roadmap
• Figure 6. Typical IC package construction identifying TIM1 and TIM2
• Figure 7. Transtherm-R PCMs
• Figure 8. Carbice carbon nanotubes
• Figure 9. Internal structure of carbon nanotube adhesive sheet
• Figure 10. Carbon nanotube adhesive sheet
• Figure 11. HI-FLOW Phase Change Materials
• Figure 12. Shinko Carbon Nanotube TIM product
• Figure 13. The Sixth Element graphene products
• Figure 14. Thermal conductive graphene film
• Figure 15. Submer's immersion cooling tanks
• Figure 16. VB Series of TIMS from Zeon

The global market for thermal management systems and materials in advanced semiconductor packaging represents one of the fastest-growing segments within the broader semiconductor ecosystem, driven by the relentless increase in power densities and the industry's transition from traditional 2D packaging toward revolutionary 2.5D and 3D integration architectures. This market encompasses thermal interface materials, liquid cooling systems, advanced heat spreaders, and emerging technologies including graphene-based solutions and microfluidic cooling that enable next-generation computing performance.

Market size projections indicate explosive growth to 2036, reflecting both increasing thermal management requirements and the adoption of premium thermal solutions that command substantially higher pricing than traditional approaches. The transition from conventional thermal management toward advanced solutions creates a market evolution where value growth significantly exceeds volume growth due to technology sophistication and performance premiums.

Thermal interface materials represent the largest market segment, evolving from traditional thermal greases toward advanced materials including liquid metals, graphene composites, and diamond-enhanced solutions that can achieve thermal conductivity improvements of 10-100x compared to conventional materials. Liquid cooling technologies represent the fastest-growing market segment, driven by thermal design power increases that exceed air cooling capabilities in high-performance computing and AI applications. Direct-to-chip cooling maintains market leadership, while immersion cooling and microfluidic cooling represent emerging opportunities.

Data centers and high-performance computing are primary markets. Automotive electronics is a fast growing segment as electric vehicle thermal management requirements drive adoption of advanced cooling technologies, while consumer electronics maintains steady growth through miniaturization and performance enhancement trends. Technology evolution within the thermal management market demonstrates clear progression from evolutionary improvements in traditional materials toward revolutionary approaches including microfluidics, advanced materials, and integrated cooling solutions. This technology transition creates market opportunities for both established thermal management companies and innovative startups developing breakthrough technologies, with market consolidation expected as technologies mature and manufacturing scales increase.

The market outlook through 2036 indicates continued robust growth driven by fundamental industry trends including AI acceleration, 3D packaging adoption, and automotive electrification that create insatiable demand for superior thermal management capabilities.

"The Global Market for Thermal Management Systems and Materials for Advanced Semiconductor Packaging 2026-2036" provides essential analysis of thermal interface materials (TIMs), liquid cooling systems, advanced heat management solutions, and emerging technologies that enable next-generation high-performance computing, artificial intelligence, and automotive electronics applications.

As semiconductor packages evolve toward higher power densities exceeding 1000W and package sizes approaching 100mm edge dimensions, conventional thermal management approaches become inadequate, creating substantial market opportunities for advanced thermal solutions including graphene-based materials, liquid metal interfaces, microfluidic cooling systems, and revolutionary cooling architectures. The market encompasses both evolutionary improvements to existing thermal management technologies and disruptive innovations including carbon nanotube thermal interfaces, metamaterial heat spreaders, and AI-driven dynamic thermal optimization.

This market report delivers critical intelligence on thermal management technology evolution, market sizing and forecasts through 2036, competitive landscape analysis, and strategic recommendations for industry participants ranging from established thermal management suppliers to innovative startups developing breakthrough technologies. The analysis covers market dynamics across geographic regions, application segments, and technology categories while providing detailed company profiles of leading market participants and emerging technology developers.

The report addresses fundamental thermal management challenges including power delivery optimization, thermal interface material selection for TIM1 applications, cooling technology comparison for high-performance computing systems, and integration strategies for hybrid cooling solutions that combine air and liquid cooling approaches. Advanced topics include thermoelectric cooling integration, heat recovery systems, cooling system reliability and redundancy strategies, and next-generation technologies including bio-inspired thermal management and metamaterial heat spreaders.

Market forecasts encompass thermal interface materials by type and application, liquid cooling system adoption across market segments, advanced thermal materials evolution, and geographic market distribution patterns that reflect regional concentrations of semiconductor manufacturing, data center development, and automotive electronics production. The analysis includes detailed examination of market drivers, technology adoption curves, pricing evolution, and competitive dynamics that shape market development through 2036.

Report contents include:

• Advanced semiconductor packaging evolution from 2D to 2.5D and 3D integration technologies
• Power delivery challenges and thermal management requirements for next-generation packages
• TSV performance analysis and transition from lateral to vertical power delivery architectures
• Thermal interface material selection criteria and cooling technology assessment for HPC applications
• Technology Analysis & Innovation Trends:
  • 2.5D and 3D advanced semiconductor packaging technologies including CoWoS development roadmap
  • Interconnection technology evolution including bumping technologies and copper-to-copper hybrid bonding
  • Manufacturing yield considerations, cost analysis, and substrate technology evolution
  • Assembly and test challenges for advanced packages with multi-die integration complexity
• Power Management Systems:
  • Advanced power delivery networks (PDNs) and power supply noise management strategies
  • Dynamic voltage and frequency scaling (DVFS), power gating, and clock gating implementations
  • Integrated voltage regulators (IVRs) in interposers and switched capacitor voltage converters
  • Magnetic integration in package substrates and AI-driven dynamic power management systems
• Thermal Materials & Solutions:
  • Novel thermal materials including die-attach technologies and TIM1 applications in 3D packaging
  • Emerging thermal technologies: carbon nanotube thermal interface materials and comprehensive graphene analysis
  • Advanced materials: aerogel-based thermal solutions, metamaterial heat spreaders, and bio-inspired approaches
  • Thermal modeling and simulation including multi-physics requirements and AI-enhanced design optimization
• Liquid Cooling Technologies:
  • Comprehensive liquid cooling technology comparison and rack-level power limitation analysis
  • Chip-level cooling approaches and advanced cooling integration strategies
  • Hybrid cooling systems combining air and liquid technologies with thermoelectric integration
  • Heat recovery and reuse systems with cooling system reliability and redundancy assessment
• Market Forecasts (2026-2036):
  • TIM1 and TIM1.5 market forecasts by type, area, and revenue with detailed package type analysis
  • Liquid cooling market penetration by segment and geographic market distribution patterns
  • Advanced thermal materials market evolution and technology adoption timeline projections
  • Package size impact analysis and emerging technology market development trajectories
• Company Profiles: comprehensive profiles of 48 leading companies across the thermal management ecosystem, including established industry leaders and innovative technology developers: 2D Generation, 2D Photonics/CamGraphIC, 3M, Accelsius, Akash Systems, Apheros, Arieca Inc., Asperitas Immersed Computing, Black Semiconductor GmbH, BNNano, Boyd Corporation, Carbice Corp., First Graphene Ltd., Carbon Waters, Destination 2D, Dexerials Corporation, Engineered Fluids, Fujitsu Laboratories, Global Graphene Group, Graphmatech AB, Green Revolution Cooling (GRC), Henkel AG & Co. KGAA, Huntsman Corporation, Iceotope, Indium Corporation, JetCool Technologies, KULR Technology Group Inc., LG Innotek, LiquidCool Solutions, Maxwell Labs, Momentive Performance Materials, Nexalus, NovoLINC, and more.....

TABLE OF CONTENTS

1. EXECUTIVE SUMMARY

• 1.1. Advanced semiconductor packaging-2D architectures to advanced 2.5D and 3D integration technologies
• 1.2. Challenges
  • 1.2.1. Power delivery
  • 1.2.2. Thermal management
• 1.3. TSV Performance
• 1.4. Transition from lateral to vertical power delivery
• 1.5. Thermal interface material selection for TIM1 applications
• 1.6. Cooling Technologies for HPC

2. INTRODUCTION

• 2.1. Thermal design power (TDP)
• 2.2. Advanced Semiconductor Packaging Technologies in HPC chips
  • 2.2.1. Thermal properties
  • 2.2.2. Thermal Benefits
  • 2.2.3. TDP in Advanced Packaging
• 2.3. 2.5D and 3D Packaging in GPUs
• 2.4. Evolution of planar die packaging area for GPUs
• 2.5. Thermal management of high-power advanced packages

3. 2.5D AND 3D ADVANCED SEMICONDUCTOR PACKAGING TECHNOLOGIES

• 3.1. Introduction
• 3.2. Modern semiconductor packaging technology
• 3.3. Optimization of advanced semiconductor packaging technologies
• 3.4. Interconnection technology
• 3.5. 2.5D packaging
  • 3.5.1. Chip-on-Wafer-on-Substrate (CoWoS)
• 3.6. Bumping technologies
  • 3.6.1. Overview
  • 3.6.2. Challenges
  • 3.6.3. Micro-bump technology
  • 3.6.4. Copper-to-copper hybrid bonding
• 3.7. Manufacturing Yield
• 3.8. Cost Analysis
• 3.9. Substrate Technology Evolution (Silicon vs Organic vs Glass)
• 3.10. Assembly and Test Challenges for Advanced Packages

4. POWER MANAGEMENT

• 4.1. Introduction
• 4.2. Power delivery systems
• 4.3. Ecosystem for HPC chips
• 4.4. Advanced Power Delivery Networks (PDNs)
• 4.5. Power supply noise
• 4.6. Dynamic Voltage and Frequency Scaling (DVFS)
• 4.7. Power Gating
• 4.8. Clock Gating
• 4.9. Integrated Voltage Regulators (IVRs) in Interposers
• 4.10. Switched Capacitor Voltage Converters
• 4.11. Magnetic Integration in Package Substrates
• 4.12. AI-Driven Dynamic Power Management
• 4.13. Thermal Management Runtime Loops
• 4.14. On-Package Voltage Regulation (OPVR)
• 4.15. Decoupling Capacitors (Decaps)
• 4.16. Low-Resistance Interconnects
• 4.17. Challenges

5. NOVEL THERMAL MATERIALS AND SOLUTIONS FOR ADVANCED PACKAGING

• 5.1. Introduction
  • 5.1.1. Progression toward three-dimensional packaging architectures
• 5.2. Die-attach technology
• 5.3. TIM1 in 3D Semiconductor Packaging
  • 5.3.1. Overview
  • 5.3.2. Applications
  • 5.3.3. Selection and optimization of TIM1 materials
  • 5.3.4. Liquid Cooling Technologies
• 5.4. Emerging Thermal Technologies
  • 5.4.1. Carbon Nanotube Thermal Interface Materials
  • 5.4.2. Graphene
    • 5.4.2.1. Graphene Manufacturing: CVD vs Solution Processing vs Mechanical Exfoliation
    • 5.4.2.2. Graphene Quality Metrics
    • 5.4.2.3. Graphene-Polymer Composites for TIM Applications
    • 5.4.2.4. Graphene Oxide vs Reduced Graphene Oxide
    • 5.4.2.5. Vertical Graphene Structures
    • 5.4.2.6. Graphene-Metal Matrix Composites
    • 5.4.2.7. Graphene Heat Spreaders and Thermal Planes
    • 5.4.2.8. Graphene-Enhanced Phase Change Materials
    • 5.4.2.9. Graphene Thermal Interface Films vs Pastes
    • 5.4.2.10. Multi-Layer Graphene Thermal Management Systems
  • 5.4.3. Aerogel-Based Thermal Solutions
  • 5.4.4. Metamaterial Heat Spreaders
  • 5.4.5. Bio-Inspired Thermal Management Approaches
• 5.5. Thermal Modelling and Simulation
  • 5.5.1. Multi-Physics Simulation Requirements
  • 5.5.2. AI-Enhanced Thermal Design Optimization
  • 5.5.3. Real-Time Thermal Monitoring Integration

6. LIQUID COOLING

• 6.1. Overview
• 6.2. Liquid Cooling Technologies
• 6.3. Rack-level power limitations
• 6.4. Chip-level cooling approaches
• 6.5. Advanced Cooling Integration
  • 6.5.1. Hybrid Cooling Systems (Air + Liquid)
  • 6.5.2. Thermoelectric Cooling Integration
  • 6.5.3. Heat Recovery and Reuse Systems
  • 6.5.4. Cooling System Reliability and Redundancy
• 6.6. Cooling Technology Comparison

7. GLOBAL MARKET FORECASTS

• 7.1. By Type
• 7.2. By Area
• 7.3. By Revenues
• 7.4. By Package Type
• 7.5. Liquid Cooling Market Forecast
• 7.6. Advanced Thermal Materials Market Evolution
• 7.7. Geographic Market Distribution

8. COMPANY PROFILES (48 company profiles)

9. REFERENCES