ヘテロジニアス・インテグレーションの世界市場-2024-2031

概要

ヘテロジニアス・インテグレーションの世界市場は、2023年に9億米ドルに達し、2031年には102億米ドルに達すると予測され、予測期間2024-2031年のCAGRは35.7%で成長します。

データセンター、科学研究、シミュレーションなどの用途で高性能コンピューティング・ソリューションのニーズが高まっていることが、ヘテロジニアス統合の需要を後押ししています。CPU、GPU、メモリ・コンポーネントを組み合わせた統合ソリューションは、エネルギー効率、優れた性能、スケーラビリティを要求の厳しいコンピューティング・ワークロードに提供します。ムーアの法則のスケーリング、3D集積、先進パッケージング技術、新素材など、半導体技術の進歩がヘテロジニアス・インテグレーションの技術革新に拍車をかけています。半導体メーカーとファウンドリは、先進プロセス、パッケージング・ソリューション、統合手法を開発するための研究開発に投資し、市場成長を促進しています。

ヘテロジニアス・インテグレーションに対する消費者の需要の高まりは、予測期間中の市場成長を後押しします。例えば、2023年7月13日、Camtek Ltd.は、Tier-1メーカーからヘテロジニアス集積、HBM、ファンアウトアプリケーション向けに42システムを受注しました。受注の大半は、高帯域幅メモリ（HBM）とヘテロジニアス統合用チップセットモジュールの製造です。チップセット・モジュールは、コンピューティング・パワーを向上させる重要なコンポーネントです。

北米は、ヘテロジニアス・インテグレーションの様々な産業による研究開発支出の増加により、市場を独占している地域です。エレクトロニクス、航空宇宙、IT、製造、ヘルスケアなど、幅広い技術産業における研究開発費は北米に集中しています。研究開発プロジェクトは、ヘテロジニアス集積のための集積能力の向上とパッケージング手法の開発に集中しています。

ダイナミクス

半導体技術の急速な進歩

半導体の技術的進歩は、集積密度の向上を可能にし、より多くのコンポーネントをより小さなスペースに集積することを可能にします。これは、異なるタイプのコンポーネントを単一のパッケージやシステムに統合する必要があるヘテロジニアス・インテグレーションにとって特に重要です。集積密度が高まれば、集積ソリューションの全体的な性能、機能、効率が向上します。半導体の進歩はコンポーネントの小型化に貢献し、小型デバイスの製造を可能にします。これは、モバイル機器や車載電子機器など、携帯可能でスペース効率の高いソリューションを必要とするアプリケーションにとって有益です。ヘテロジニアス・インテグレーションは、このような小型化の動向を活用して、小型でありながら強力な統合システムを実現します。

主要メーカーの新製品投入に向けた取り組みが活発化していることも、予測期間中の市場成長を後押ししています。例えば、2023年5月16日、iDEAL Semiconductor社はSuperQ Technologyを市場に投入しました。これは、ソーラーパネル、データセンター、電気自動車、モータードライブなど、さまざまなアプリケーションの電力損失を削減するのに役立ちます。その高い効率はカーボンフットプリントの削減に役立ちます。

拡大するスマート製造とインダストリー4.0への取り組み

統合型産業用IoTソリューションの採用が拡大しているのは、スマート製造とインダストリー4.0プロジェクトが後押ししています。これらのソリューションを実現するには、センサー、アクチュエーター、コントローラー、通信モジュール、データ処理ユニットを首尾一貫したシステムに統合する必要があります。異種統合により、コンポーネントのシームレスな統合、予知保全、産業におけるプロセスの最適化が可能になります。

インダストリー4.0では、生産プロセス全体のデータ統合が重視されています。分析主導の意思決定と多様なシステムの統合は、異種統合によって容易になります。統合されたシステムは、複数のソースからデータを収集し、それに基づいて行動することができ、スマート工場における効率と生産性の向上につながります。半導体産業協会のデータによると、2025年までにインストールされるIoTデバイスは世界で750億台を超えます。世界のIoT半導体コンポーネント市場は、2025年にCAGR 19%で成長し、800億米ドルに達する予定です。

統合の複雑さ

さまざまな技術、フォームファクター、機能を持つ多様なコンポーネントを統合する複雑さは、開発コストの上昇につながることが多いです。異種統合ソリューションに投資する企業は、専用設計ツール、統合技術の専門知識、プロトタイピング、テスト、検証、設計の反復に関連する費用が発生する可能性があります。開発コストが高くなると、特に研究開発予算が限られている企業やコスト重視のアプリケーションでは、ヘテロジニアス・インテグレーションを採用することを躊躇する場合もあります。

ヘテロジニアス・インテグレーションの複雑な性質により、統合ソリューションの開発サイクルと市場投入までの時間が長くなる可能性があります。複雑な統合システムの設計、テスト、最適化、検証には、綿密な計画、部門を超えたチーム間の協力、設計の反復が必要です。開発スケジュールの遅延は、市場競争力に影響を与え、機会を逃し、急速に進化する業界における異種統合ソリューションの採用が遅れる可能性があります。

異なるインターフェイス、プロトコル、動作電圧、温度プロファイルを持つコンポーネントを統合することは、技術的な課題をもたらします。統合されたコンポーネントの互換性、シグナルインテグリティ、電力供給、熱管理、信頼性を確保するには、徹底したエンジニアリングの専門知識と革新的なソリューションが必要です。統合の課題を克服することは、開発プロセスを複雑化し、カスタマイズや回避策を必要とする場合があり、開発時間とコストをさらに増大させます。

目次

第1章 調査手法と調査範囲

第2章 定義と概要

第3章 エグゼクティブサマリー

第4章 市場力学

• 影響要因
  • 促進要因
    • 半導体技術の急速な進歩
    • スマート・マニュファクチャリングとインダストリー4.0への取り組みの拡大
  • 抑制要因
    • 統合の複雑さ
  • 機会
  • 影響分析

第5章 業界分析

• ポーターのファイブフォース分析
• サプライチェーン分析
• 価格分析
• 規制分析
• ロシア・ウクライナ戦争影響分析
• DMIの見解

第6章 COVID-19分析

第7章 コンポーネント別

• 先端製造とマルチチップ統合
• 集積フォトニクス
• 統合パワーエレクトロニクス
• MEMSとセンサーの統合
• G、RF、アナログ混載ブリッジ

第8章 デザイン

• 共同設計
• モデリングとシミュレーション

第9章 エンドユーザー別

• 半導体・エレクトロニクス
• IT・通信
• 自動車・運輸
• ヘルスケア・ライフサイエンス
• 製造・産業
• 航空宇宙・防衛
• その他

第10章 地域別

• 北米
  • 米国
  • カナダ
  • メキシコ
• 欧州
  • ドイツ
  • 英国
  • フランス
  • イタリア
  • スペイン
  • その他欧州
• 南米
  • ブラジル
  • アルゼンチン
  • その他南米
• アジア太平洋
  • 中国
  • インド
  • 日本
  • オーストラリア
  • その他アジア太平洋地域
• 中東・アフリカ

第11章 競合情勢

• 競合シナリオ
• 市況/シェア分析
• M&A分析

第12章 企業プロファイル

• ASE TECHNOLOGY HOLDING
  • 会社概要
  • 製品ポートフォリオと説明
  • 財務概要
  • 主な発展
• Intel
• Etron Technology
• EV Group
• Taiwan Semiconductor Manufacturing Company Limited
• Applied Materials, Inc.
• Semi
• Micross
• Skywater Technology
• Silicon Austria Labs GmbH

第13章 付録

Overview

Global Heterogeneous Integration Market reached US$ 0.9 Billion in 2023 and is expected to reach US$ 10.2 Billion by 2031, growing with a CAGR of 35.7% during the forecast period 2024-2031.

The growing need for high-performance computing solutions in applications such as data centers, scientific research and simulation drives the demand for heterogeneous integration. Integrated solutions combining CPUs, GPUs and memory components offer energy efficiency, superior performance and scalability for demanding computing workloads. Growing advancements in semiconductor technologies, including Moore's Law scaling, 3D integration, advanced packaging techniques and new materials, fuel innovation in heterogeneous integration. Semiconductor manufacturers and foundries invest in R&D to develop advanced processes, packaging solutions and integration methodologies, driving market growth.

Growing consumer demand for heterogeneous integration helps to boost market growth over the forecast period. For instance, on July 13, 2023, Camtek Ltd, received an order of 42 Systems from Tier-1 Manufacturers for Heterogeneous Integration, HBM and Fan-out Applications. Most of the orders are for High Bandwidth Memory (HBM) and the manufacture of chipset modules for heterogeneous integration. The chipset module is an important component in enhancing computing power.

North America is a dominating region in the market due to the growing research and development expenditure by various industries of heterogeneous integration. Research and development expenditures across a wide range of technological industries such as electronics, aerospace, IT, manufacturing and healthcare are heavily attracted to North America. Research and development projects concentrate on improving integration capabilities and developing packaging methods for heterogeneous integration.

Dynamics

Rapid Advancements in Semiconductor Technologies

Technological Advancements in semiconductors allow for higher integration densities and enable more Component to be integrated into smaller spaces. The is particularly important for heterogeneous integration, where different types of Component need to be integrated into a single package or system. Higher integration densities improve the overall performance, functionality and efficiency of integrated solutions. Semiconductor advancements contribute to the miniaturization of Component, making it possible to create compact devices. The is beneficial for applications that require portable and space-efficient solutions like mobile devices and automotive electronics. Heterogeneous integration leverages these miniaturization trends to create smaller yet powerful integrated systems.

Growing major key player's initiatives in the new product launches helps to boost market growth over the forecast period. For instance, on May 16, 2023, iDEAL Semiconductor launched SuperQ Technology in the market. It helps to reduce power loss in various applications such as solar panels, data centers, electric vehicles and motor drives. Its elevated efficiency helps to reduce carbon footprint.

Growing Smart Manufacturing and Industry 4.0 Initiatives

The growing adoption of integrated industrial IoT solutions is boosted by smart manufacturing and Industry 4.0 projects. Sensors, actuators, controllers, communication modules and data processing units must frequently be integrated into a coherent system to implement these solutions. Heterogeneous integration makes it possible for Component to be seamlessly integrated, predictive maintenance and process optimization in industry.

Industry 4.0 places a strong emphasis on data integration throughout the production process. Analytics-driven decision-making and the integration of diverse systems are made easier by heterogeneous integration. Integrated systems can gather and act upon data from multiple sources, leading to improved efficiency and productivity in smart factories. According to the Semiconductor Industry Association data, by 2025, over 75 billion installed IoT devices globally. The global IoT semiconductor component market is slated to grow at a CAGR of 19% to US$80 billion in 2025.

Complexity of Integration

The complexity of integrating diverse Component with varying technologies, form factors and functionalities often leads to higher development costs. Companies investing in heterogeneous integration solutions may incur expenses related to specialized design tools, expertise in integration techniques, prototyping, testing, validation and iteration of designs. The higher development costs can deter some companies from adopting heterogeneous integration, particularly those with limited R&D budgets or cost-sensitive applications.

The intricate nature of heterogeneous integration can result in longer development cycles and time-to-market for integrated solutions. Designing, testing, optimizing and validating complex integrated systems require meticulous planning, collaboration among cross-functional teams and iterative design iterations. Delays in development timelines can impact market competitiveness, missed opportunities and slower adoption of heterogeneous integration solutions in rapidly evolving industries.

Integrating Component with different interfaces, protocols, operating voltages and thermal profiles presents technical challenges. Ensuring compatibility, signal integrity, power delivery, thermal management and reliability across integrated Component requires thorough engineering expertise and innovative solutions. Overcoming integration challenges adds complexity to the development process and may require customizations or workarounds, further contributing to development time and costs.

Segment Analysis

The global heterogeneous integration market is segmented based on component, design, end-user and region.

Advanced Manufacturing & Multi-Chip Integration Component is Dominating in the Market

Based on the component, the heterogeneous integration market is segmented into advanced manufacturing & multi chip integration, integrated photonics, integrated power electronics, mems and sensor integration, 5g and rf and analog mixed signal.

Modern manufacturing methods enable electrical components to be made smaller while maintaining their functionality. By combining several chips or components into a single package, multichip integration (MCI) approaches can reduce package size and increase efficiency. The complexity of electronic devices is making it increasingly necessary to integrate many functionalities into constrained spaces. Processors, memory, sensors and other components combined more easily because of advanced manufacturing and MCI, resulting in highly integrated systems with better functionality and performance.

Improved heat management in electronic systems is supported by MCI techniques and advanced production procedures. The technologies help address thermal issues in high-performance electronics by incorporating cooling solutions, heat dissipation structures and thermal interfaces right into the package. Long-term cost savings can result from advanced manufacturing and MCI techniques, despite the initial infrastructure and R&D costs. Through component reduction, assembly process simplification and increased dependability, these technologies help lower the total cost of electronic systems.

Geographical Penetration

North America is Dominating the Heterogeneous Integration Market

Having a high concentration of top semiconductor businesses, producers of electronic Component, academic institutions and technical inventors, North America has a strong technological ecosystem. The creation of cutting-edge heterogeneous integration solutions is encouraged by this environment, along with innovation and collaboration. The region is home of some of the largest semiconductor manufacturers. The creation of heterogeneous integration solutions depends on the semiconductor integration techniques and technologies that these companies invented.

Growing Government funding for heterogeneous integration helps to boost regional market growth over the forecast period. For instance, on May 17, 2022, UCLA and SEMI announced that they won a US$ 300,000 grant from U.S. Department of Commerce's National Institute of Standards and Technology for the production of a roadmap for advanced packaging technologies.

Competitive Landscape

The major global players in the market include ASE TECHNOLOGY HOLDING, Intel, Etron Technology, EV Group, Taiwan Semiconductor Manufacturing Company Limited, Applied Materials, Inc., Semi, Micross, Skywater Technology and Silicon Austria Labs GmbH.

COVID-19 Impact Analysis

As global shortage of raw materials, the pandemic caused disruptions in globally supply chains. The complex supply chain of electronic Component and materials is necessary for heterogeneous integration. Many manufacturing facilities and production lines were temporarily shut down or operated at reduced capacity due to restrictions, lockdowns and safety protocols. The led to production slowdowns and challenges in meeting demand for heterogeneous integration solutions, impacting market growth and delivery schedules.

The pandemic-induced changes in consumer behavior, remote working trends, digitalization initiatives and healthcare requirements influenced the demand for heterogeneous integration solutions. Increased demand for telecommunication equipment, data centers, IoT devices, healthcare electronics and e-commerce platforms led to shifts in demand patterns within the heterogeneous integration market. The shift to remote work and virtual collaboration posed challenges for companies involved in heterogeneous integration, particularly in terms of project management, engineering collaboration, prototyping and testing. Remote work setups impacted productivity, innovation cycles and the development of new integrated solutions, requiring adjustments and digital transformation efforts.

Russia-Ukraine War Impact Analysis

Global supply chains are disrupted by geopolitical tensions between the countries which have an impact on the distribution and travel of raw materials and Component. The availability and cost of vital Component used in integrated systems are impacted in the case of the heterogeneous integration market by disruptions in the semiconductor supply chain and logistics brought on by the conflict between Russia and Ukraine. Market turbulence and uncertainty are frequently caused by geopolitical tensions as investors and companies respond to geopolitical risks and incidents. In the heterogeneous integration market and close industries, uncertainty affects decisions regarding investments and causes volatility in market trends, demand and investment patterns.

Geopolitical events influence currency exchange rates. Currency fluctuations affect import/export costs, international trade, pricing strategies and profitability for companies operating in the global heterogeneous integration market, especially those with exposure to affected currencies. Geopolitical tensions result in regulatory changes, trade restrictions, sanctions or export policies that impacted the operations and business environment for companies in the heterogeneous integration market. Changes in trade policies or regulatory frameworks can affect market access, trade relationships, compliance requirements and business continuity planning for industry players.

By Component

• Advanced Manufacturing & Multi Chip Integration
• Integrated Photonics
• Integrated Power Electronics
• MEMS and Sensor Integration
• 5G, RF and Analog Mixed Signal

By Design

• Co-Design
• Modeling & Simulation

By End-User

• Semiconductor and Electronics
• IT and Telecommunications
• Automotive and Transportation
• Healthcare and Life Sciences
• Manufacturing and Industrial
• Aerospace and Defense
• Others

By Region

• North America
  • U.S.
  • Canada
  • Mexico
• Europe
  • Germany
  • UK
  • France
  • Italy
  • Spain
  • Rest of Europe
• South America
  • Brazil
  • Argentina
  • Rest of South America
• Asia-Pacific
  • China
  • India
  • Japan
  • Australia
  • Rest of Asia-Pacific
• Middle East and Africa

Key Developments

• On February 21, 2024, Intel Foundry and Cadence collaborated to enable Heterogeneous Integration with EMIB Packaging Technology to address the growing complexity in heterogeneously integrated multi-chip(let) architectures.
• On September 20, 2023, ITRI led a global semiconductor collaboration for heterogeneous integration to pioneer pilot production solutions. Leading semiconductor companies from Taiwan and throughout the globe are brought together by Alliance to offer a wide range of services, including package design, testing and verification, as well as pilot production.
• On July 10, 2023, Applied Materials, Inc. advanced heterogeneous chip integration with new technologies for hybrid bonding and through-silicon vias. It helps chipmakers integrate chipsets into advanced 2.5D and 3D packages using hybrid bonding and through-silicon vias (TSVs).

Why Purchase the Report?

• To visualize the global heterogeneous integration market segmentation based on component, design, end-user and region, as well as understand key commercial assets and players.
• Identify commercial opportunities by analyzing trends and co-development.
• Excel data sheet with numerous data points of heterogeneous integration market-level with all segments.
• PDF report consists of a comprehensive analysis after exhaustive qualitative interviews and an in-depth study.
• Product mapping available as excel consisting of key products of all the major players.

The global heterogeneous integration market report would provide approximately 62 tables, 57 figures and 180 Pages.

Target Audience 2024

• Manufacturers/ Buyers
• Industry Investors/Investment Bankers
• Research Professionals
• Emerging Companies

Table of Contents

1.Methodology and Scope

• 1.1.Research Methodology
• 1.2.Research Objective and Scope of the Report

2.Definition and Overview

3.Executive Summary

• 3.1.Snippet by Component
• 3.2.Snippet by Design
• 3.3.Snippet by End-User
• 3.4.Snippet by Region

4.Dynamics

• 4.1.Impacting Factors
  • 4.1.1.Drivers
    • 4.1.1.1.Rapid Advancements in Semiconductor Technologies
    • 4.1.1.2.Growing Smart Manufacturing and Industry 4.0 Initiatives
  • 4.1.2.Restraints
    • 4.1.2.1.Complexity of Integration
  • 4.1.3.Opportunity
  • 4.1.4.Impact Analysis

5.Industry Analysis

• 5.1.Porter's Five Force Analysis
• 5.2.Supply Chain Analysis
• 5.3.Pricing Analysis
• 5.4.Regulatory Analysis
• 5.5.Russia-Ukraine War Impact Analysis
• 5.6.DMI Opinion

6.COVID-19 Analysis

• 6.1.Analysis of COVID-19
  • 6.1.1.Scenario Before COVID-19
  • 6.1.2.Scenario During COVID-19
  • 6.1.3.Scenario Post COVID-19
• 6.2.Pricing Dynamics Amid COVID-19
• 6.3.Demand-Supply Spectrum
• 6.4.Government Initiatives Related to the Market During Pandemic
• 6.5.Manufacturers Strategic Initiatives
• 6.6.Conclusion

7.By Component

• 7.1.Introduction
  • 7.1.1.Market Size Analysis and Y-o-Y Growth Analysis (%), By Component
  • 7.1.2.Market Attractiveness Index, By Component
• 7.2.Advanced Manufacturing & Multi Chip Integration*
  • 7.2.1.Introduction
  • 7.2.2.Market Size Analysis and Y-o-Y Growth Analysis (%)
• 7.3.Integrated Photonics
• 7.4.Integrated Power Electronics
• 7.5.MEMS and Sensor Integration
• 7.6.5G, RF and Analog Mixed Signal Embedded Bridge

8.By Design

• 8.1.Introduction
  • 8.1.1.Market Size Analysis and Y-o-Y Growth Analysis (%), By Design
  • 8.1.2.Market Attractiveness Index, By Design
• 8.2.Co-Design *
  • 8.2.1.Introduction
  • 8.2.2.Market Size Analysis and Y-o-Y Growth Analysis (%)
• 8.3.Modeling & Simulation

9.By End-User

• 9.1.Introduction
  • 9.1.1.Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
  • 9.1.2.Market Attractiveness Index, By End-User
• 9.2.Semiconductor and Electronics*
  • 9.2.1.Introduction
  • 9.2.2.Market Size Analysis and Y-o-Y Growth Analysis (%)
• 9.3.IT and Telecommunications
• 9.4.Automotive and Transportation
• 9.5.Healthcare and Life Sciences
• 9.6.Manufacturing and Industrial
• 9.7.Aerospace and Defense
• 9.8.Others

10.By Region

• 10.1.Introduction
  • 10.1.1.Market Size Analysis and Y-o-Y Growth Analysis (%), By Region
  • 10.1.2.Market Attractiveness Index, By Region
• 10.2.North America
  • 10.2.1.Introduction
  • 10.2.2.Key Region-Specific Dynamics
  • 10.2.3.Market Size Analysis and Y-o-Y Growth Analysis (%), By Component
  • 10.2.4.Market Size Analysis and Y-o-Y Growth Analysis (%), By Design
  • 10.2.5.Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
  • 10.2.6.Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
    • 10.2.6.1.U.S.
    • 10.2.6.2.Canada
    • 10.2.6.3.Mexico
• 10.3.Europe
  • 10.3.1.Introduction
  • 10.3.2.Key Region-Specific Dynamics
  • 10.3.3.Market Size Analysis and Y-o-Y Growth Analysis (%), By Component
  • 10.3.4.Market Size Analysis and Y-o-Y Growth Analysis (%), By Design
  • 10.3.5.Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
  • 10.3.6.Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
    • 10.3.6.1.Germany
    • 10.3.6.2.UK
    • 10.3.6.3.France
    • 10.3.6.4.Italy
    • 10.3.6.5.Spain
    • 10.3.6.6.Rest of Europe
• 10.4.South America
  • 10.4.1.Introduction
  • 10.4.2.Key Region-Specific Dynamics
  • 10.4.3.Market Size Analysis and Y-o-Y Growth Analysis (%), By Component
  • 10.4.4.Market Size Analysis and Y-o-Y Growth Analysis (%), By Design
  • 10.4.5.Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
  • 10.4.6.Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
    • 10.4.6.1.Brazil
    • 10.4.6.2.Argentina
    • 10.4.6.3.Rest of South America
• 10.5.Asia-Pacific
  • 10.5.1.Introduction
  • 10.5.2.Key Region-Specific Dynamics
  • 10.5.3.Market Size Analysis and Y-o-Y Growth Analysis (%), By Component
  • 10.5.4.Market Size Analysis and Y-o-Y Growth Analysis (%), By Design
  • 10.5.5.Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
  • 10.5.6.Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
    • 10.5.6.1.China
    • 10.5.6.2.India
    • 10.5.6.3.Japan
    • 10.5.6.4.Australia
    • 10.5.6.5.Rest of Asia-Pacific
• 10.6.Middle East and Africa
  • 10.6.1.Introduction
  • 10.6.2.Key Region-Specific Dynamics
  • 10.6.3.Market Size Analysis and Y-o-Y Growth Analysis (%), By Component
  • 10.6.4.Market Size Analysis and Y-o-Y Growth Analysis (%), By Design
  • 10.6.5.Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User

11.Competitive Landscape

• 11.1.Competitive Scenario
• 11.2.Market Positioning/Share Analysis
• 11.3.Mergers and Acquisitions Analysis

12.Company Profiles

• 12.1.ASE TECHNOLOGY HOLDING*
  • 12.1.1.Company Overview
  • 12.1.2.Product Portfolio and Description
  • 12.1.3.Financial Overview
  • 12.1.4.Key Developments
• 12.2.Intel
• 12.3.Etron Technology
• 12.4.EV Group
• 12.5.Taiwan Semiconductor Manufacturing Company Limited
• 12.6.Applied Materials, Inc.
• 12.7.Semi
• 12.8.Micross
• 12.9.Skywater Technology
• 12.10.Silicon Austria Labs GmbH

LIST NOT EXHAUSTIVE

13.Appendix

• 13.1.About Us and Services
• 13.2.Contact Us