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1446792

AMB基板の世界市場-2024-2031

Global AMB Substrate Market - 2024-2031
出版日: | 発行: DataM Intelligence | ページ情報: 英文 181 Pages | 納期: 約2営業日

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AMB基板の世界市場-2024-2031
出版日: 2024年02月13日
発行: DataM Intelligence
ページ情報: 英文 181 Pages
納期: 約2営業日
ご注意事項 :
本レポートは最新情報反映のため適宜更新し、内容構成変更を行う場合があります。ご検討の際はお問い合わせください。
  • 全表示
  • 概要
  • 目次
概要

AMB（活性金属ろう付け）基板の世界市場は2023年に13億米ドルに達し、2031年には19億米ドルに達すると予測され、予測期間2024-2031年のCAGRは4.9%で成長します。

5G、モノのインターネット、電気自動車などの新技術が生まれるにつれ、特殊な特性を持つセラミック基板へのニーズが高まり、活性金属ろう付けセラミック基板市場は新たな応用分野へと拡大します。5Gネットワークの展開や、より高速な無線通信システムへのニーズの高まりにより、高い周波数と電力密度に対応できる最新の電気部品の使用が必要となります。

Ericssonによると、世界の5G契約数は2019年から2027年にかけて急速に増加し、1,200万件以上から40億件以上になると予想されています。加入者数の予測が最も多い地域は、北東アジア、東南アジア、インド、ネパール、ブータンなどです。AMBセラミック基板は温度管理と電気絶縁性に優れ、基地局、アンテナ、RFモジュールに適しています。

2022年には、北米が世界のAMB基板市場の20％以上を占め、第二の支配地域になると予想されています。北米は医療機器イノベーションの中心地です。診断装置、画像処理装置、ウェアラブル医療技術など、医療用エレクトロニクスの進歩がAMB基板の需要を後押ししています。この地域は、多くの産業で研究開発が盛んに行われていることが特徴です。

力学

セラミックスとろう付け合金の進歩

AMB基板には、熱伝導率を向上させた先進セラミックスを使用することができます。これにより、電子部品から発生する熱を放散する基板の能力が向上し、高性能デバイスの最適な動作温度を維持するために不可欠となります。セラミックとブレージング合金の進歩は、より高い機械的強度と耐久性を持つ基板の製造に役立ちます。

これは、電子部品を支え、構造的完全性を維持し、製造中および使用中の機械的負荷に耐えるために必要です。材料の進歩により、各層の品質が最適化された多層AMB基板が製造できるようになりました。これにより、シグナルインテグリティ、熱制御、構造支持に関する特定の要件を満たす基板の製造が可能になります。

先端エレクトロニクスへの需要の高まり

さまざまな技術やガジェットを含む先端エレクトロニクスは、日常生活や産業用途でますます使用されるようになっています。AMB基板は、今日の小型化された革新的な電子部品に構造的・電気的サポートを提供する上で不可欠です。AMB基板は、小型・軽量のガジェットに含まれる高度な回路やコンポーネントをサポートするために不可欠です。

主要企業は、高度なエレクトロニクスに対する需要の増加に対応するため、多様な製品を生産しており、無数の市場展望を生み出しています。例えば、2021年5月、Whirlpool Corporationは、世界で完全に統合されたエンド・ツー・エンドのコマース・ソリューションを提供する世界のハイテク企業であるVTEXと協力し、デジタル・コマース戦略の開発において重要な役割を果たしました。

限られた互換性と環境への懸念

活性金属ろう付け法では、うまく接合できるセラミックや金属の種類が限られています。そのため、利用可能な材料の組み合わせが少なくなり、市場の成長可能性に影響を与えます。AMBセラミック基板は通常、アルミナや窒化アルミニウムのような低CTEセラミックで作られています。

対照的に、銅や銀をベースとする合金など、AMB手順で利用される金属ろう合金はCTE値が大きいです。活性金属ろう付けに関わる製造方法は、有害物質を使用したり、適切に処分しなければならない廃棄物を発生させたりすることがあります。厳しい環境規制は、企業にとってコンプライアンスを難しくし、コスト高になる可能性があります。

メーカーの仕様を遵守し、資格のあるHVACの専門家と協力することで、重要な洞察が得られ、適切なメンテナンス方法が守られるようになります。さらに、新興国では好ましい償還シナリオや技術導入がないこと、医療機器に過度の関税が課されていること、中低所得国では十分なインフラが整備されていないことなどが、市場の妨げになると予想されます。

目次

第1章 調査手法と調査範囲

第2章 定義と概要

第3章 エグゼクティブサマリー

第4章 市場力学

  • 影響要因
    • 促進要因
      • セラミックスとブレージング合金の進歩
      • 先端エレクトロニクスへの需要の高まり
    • 抑制要因
      • 限られた互換性と環境への懸念
    • 機会
    • 影響分析

第5章 産業分析

  • ポーターのファイブフォース分析
  • サプライチェーン分析
  • 価格分析
  • 規制分析
  • ロシア・ウクライナ戦争の影響分析
  • DMIの見解

第6章 COVID-19分析

第7章 タイプ別

  • Si3N4 AMB基板
  • AlN AMB基板

第8章 用途別

  • 自動車
  • エレクトロニクス
  • 新エネルギー＆パワーグリッド
  • 軍事・航空宇宙
  • 産業用
  • その他

第9章 地域別

  • 北米
    • 米国
    • カナダ
    • メキシコ
  • 欧州
    • ドイツ
    • 英国
    • フランス
    • イタリア
    • ロシア
    • その他欧州
  • 南米
    • ブラジル
    • アルゼンチン
    • その他南米
  • アジア太平洋
    • 中国
    • インド
    • 日本
    • オーストラリア
    • その他アジア太平洋地域
  • 中東・アフリカ

第10章 競合情勢

  • 競合シナリオ
  • 市況/シェア分析
  • M&A分析

第11章 企業プロファイル

  • Rogers Corporation
    • 会社概要
    • 製品ポートフォリオと説明
    • 財務概要
    • 主な発展
  • Winning Imperatives
  • Heraeus Electronics
  • Kyocera
  • NGK Electronics Devices
  • Toshiba Materials
  • Denka
  • DOWA METALTECH
  • Ferrotec
  • BYD

第12章 付録

目次
Product Code: MA7960

Overview

Global AMB (Active Metal Brazed) Substrate Market reached US$ 1.3 billion in 2023 and is expected to reach US$ 1.9 billion by 2031, growing with a CAGR of 4.9% during the forecast period 2024-2031.

As new technologies arise, such as 5G, the Internet of Things and electric vehicles, there will be a greater need for ceramic substrates with specialised characteristics, allowing the active metal brazed ceramic substrate market to expand into new application areas. The deployment of 5G networks, as well as the growing need for faster wireless communication systems, necessitate the use of modern electrical components that can handle high frequencies and power densities.

In accordance with Ericsson, global 5G subscriptions are expected to increase rapidly between 2019 and 2027, from more than 12 million to over 4 billion. The regions with the highest predicted number of subscribers include North East Asia, South East Asia, India, Nepal and Bhutan. AMB ceramic substrates provide good temperature management and electrical insulation, making them appropriate for use in base stations, antennas and RF modules.

In 2022, North America is expected to hold the second-dominant region in the global AMB substrate market covering over 20% of the market. North America is a hub of medical device innovation. Advances in medical electronics, such as diagnostic equipment, imaging devices and wearable health technology, help to drive demand for AMB substrates. The region is distinguished by considerable R&D operations in numerous industries.

Dynamics

Advancements in Ceramics and Brazing Alloys

Advanced ceramics with improved heat conductivity can be put into AMB substrates. It increases the substrate's ability to dissipate heat generated by electronic components, which is critical for maintaining optimal operating temperatures in high-performance devices. Ceramic and brazing alloy advancements help to build substrates with greater mechanical strength and durability.

It is required to support electronic components, maintain structural integrity and withstand mechanical loads during manufacturing and use. Material advancements help to create multilayered AMB substrates with optimised qualities in each layer. It allows for the fabrication of substrates that meet specific requirements for signal integrity, thermal control and structural support.

Rising Demand for Advanced Electronics

Advanced electronics, which include a variety of technologies and gadgets, are increasingly being used in everyday life and industrial applications. AMB substrates are essential in providing structural and electrical support for today's miniaturised and innovative electronic components. The substrates are critical for supporting the sophisticated circuitry and components included in tiny and lightweight gadgets.

Key firms are producing a diverse range of products to fulfil the increasing demand for advanced electronics, creating a myriad of market prospects. For example, in May 2021, Whirlpool Corporation collaborated with VTEX, a globally tech business that offers global, fully integrated end-to-end commerce solutions, to play a vital role in developing digital commerce strategy.

Limited Compatibility and Environmental Concerns

Active metal brazing methods are limited in the sorts of ceramics and metals that can be successfully bonded together. It reduces the number of accessible material combinations and impact the market's growth potential. AMB ceramic substrates are typically built of low-CTE ceramics like alumina or aluminum nitride.

In contrast, metal brazing alloys utilised in AMB procedures, such as copper or silver-based alloys, have greater CTE values. The production methods involved in active metal brazing may employ hazardous substances or produce waste items that must be properly disposed of. Stringent environmental rules can make compliance difficult and costly for enterprises.

Adhering to manufacturer specifications and collaborating with qualified HVAC professionals can provide significant insights and ensure proper maintenance practices are followed. Furthermore, the absence of favourable reimbursement scenarios and technology adoption in developing nations, excessive customs tax imposed on medical devices and lack of sufficient infrastructure in low- and middle-income countries are expected to hamper the market.

Segment Analysis

The global AMB substrate market is segmented based type, application and region.

Rising Demand for AMB Substrate in Automotive

Automotive is expected to drive the market demand with a share of about 1/3rd of the global AMB substrate market in 2022. As a result of their superior thermal and mechanical capabilities, the automotive industry is increasingly using active metal brazed ceramic substrates into components such as power electronics modules, sensors and exhaust gas management devices. AMB ceramic substrates are utilised in EV power modules, motor drives and battery management systems to provide reliable thermal and electrical insulation.

According to the International Energy Agency, the electric car market is expanding at an exponential rate, with sales exceeding 10 million by 2022. In 2022, electric vehicles accounted for 14% of all new automobile sales, up from 9% in 2021 and less than 5% in 2020. According to the IEA Stated Policies Scenario, the global forecast for the percentage of electric car sales based on existing policies and business aims has climbed to 35% in 2031, up from less than 25% in the prior outlook. The increased acceptance and production of EVs globally will boost the segment's growth.

Geographical Penetration

Rising Adoption of Connected Devices in Asia-Pacific

During the forecast period, Asia-Pacific is expected to be the dominant region in global AMB substrate market with over 1/3rd of the market. The growing popularity of smart devices, such as smartphones, tablets, smartwatches and other connected devices, drives up demand for AMB substrates utilised in their manufacture. AMB substrates play an important part in the production of electronic components utilised in modern cars, which helps to drive market growth.

Strong market giants such as Oppo, Xiaomi and Vivo are headquartered in Asia-Pacific. According to GSMA, smartphone usage in the Asia-Pacific area reached 74% in 2021 and is expected to climb to 84% by 2025. Furthermore, it is estimated that 62% of mobile customers will be present in the same year. The smartphone adoption rate in the region is expected to reach 20% between 2019 and 2025.

Competitive Landscape

The major global players in the market include Rogers Corporation, Winning Imperatives, Heraeus Electronics, Kyocera, NGK Electronics Devices, Toshiba Materials, Denka, DOWA METALTECH, Ferrotec and BYD.

COVID-19 Impact Analysis

The pandemic disrupted global supply networks, disrupting the production and shipment of materials necessary to manufacture AMB substrates. Lockdowns, social distance and worker disruptions caused manufacturing delays and temporary shutdown of production facilities, affecting the output of AMB substrates. The AMB substrate market is strongly related to end-user sectors including automotive and telecoms.

During the pandemic, the picture for global EV sales was uncertain at the start of the year. However, 2020 proved to be a surprise positive year, with global EV sales increasing by 43% over 2019 and the global electric car industry market share reaching a record 4.6% in 2020. The slowdown in these industries during the epidemic influenced the demand for AMB substrates.

Russia-Ukraine War Impact

The conflict interrupted the supply chain for materials needed in AMB substrate manufacture. Closures, logistical issues or personnel interruptions have a direct influence on the region's industrial facilities, affecting AMB substrate production. Geopolitical developments cause economic uncertainty, influencing global markets.

Uncertainty may influence investment decisions and overall demand for technology components, particularly AMB substrates. Depending on the commodities received from the region, costs fluctuated owing to geopolitical tensions and supply chain interruptions. Companies in the AMB substrate market may consider diversifying their supply chains to reduce the risks associated with reliance on specific locations.

By Type

  • Si3N4 AMB Substrates
  • AlN AMB Substrates

By Application

  • Automotive
  • Electronics
  • New Energy & Power Grid
  • Military & Aerospace
  • Industrial
  • Others

By Region

  • North America
    • U.S.
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • France
    • Italy
    • Russia
    • Rest of Europe
  • South America
    • Brazil
    • Argentina
    • Rest of South America
  • Asia-Pacific
    • China
    • India
    • Japan
    • Australia
    • Rest of Asia-Pacific
  • Middle East and Africa

Key Developments

  • In November 2023, Tecdia Co. Ltd. recently announced a significant development by opening its newest office in Chengdu, China. Chengdu, the country's third largest city and known for its significant developments in telecommunications and high technology, represents an attractive market for Tecdia's main product, single-layer ceramic capacitors.
  • In May 2022, Heraeus Electronics introduced the Condura.ultra Ag-free AMB substrate. The metal substrate is well-suited for power electronics uses.
  • In July 2021, Daleba Electronics Ltd. recently created a new AMB ceramic substrate for power electronics solutions. The active metal brazing process allows for double-sided copper weighing on 0.25mm thin ceramic substrates.

Why Purchase the Report?

  • To visualize the global AMB substrate market segmentation based on type, application and region, as well as understand key commercial assets and players.
  • Identify commercial opportunities by analyzing trends and co-development.
  • Excel data sheet with numerous data points of AMB substrate market-level with all segments.
  • PDF report consists of a comprehensive analysis after exhaustive qualitative interviews and an in-depth study.
  • Product mapping available as excel consisting of key products of all the major players.

The global AMB substrate market report would provide approximately 49 tables, 41 figures and 181 pages.

Target Audience 2024

  • Manufacturers/ Buyers
  • Industry Investors/Investment Bankers
  • Research Professionals
  • Emerging Companies

Table of Contents

1. Methodology and Scope

  • 1.1. Research Methodology
  • 1.2. Research Objective and Scope of the Report

2. Definition and Overview

3. Executive Summary

  • 3.1. Snippet by Type
  • 3.2. Snippet by Application
  • 3.3. Snippet by Region

4. Dynamics

  • 4.1. Impacting Factors
    • 4.1.1. Drivers
      • 4.1.1.1. Advancements in Ceramics and Brazing Alloys
      • 4.1.1.2. Rising Demand for Advanced Electronics
    • 4.1.2. Restraints
      • 4.1.2.1. Limited Compatibility and Environmental Concerns
    • 4.1.3. Opportunity
    • 4.1.4. Impact Analysis

5. Industry Analysis

  • 5.1. Porter's Five Force Analysis
  • 5.2. Supply Chain Analysis
  • 5.3. Pricing Analysis
  • 5.4. Regulatory Analysis
  • 5.5. Russia-Ukraine War Impact Analysis
  • 5.6. DMI Opinion

6. COVID-19 Analysis

  • 6.1. Analysis of COVID-19
    • 6.1.1. Scenario Before COVID
    • 6.1.2. Scenario During COVID
    • 6.1.3. Scenario Post COVID
  • 6.2. Pricing Dynamics Amid COVID-19
  • 6.3. Demand-Supply Spectrum
  • 6.4. Government Initiatives Related to the Market During Pandemic
  • 6.5. Manufacturers Strategic Initiatives
  • 6.6. Conclusion

7. By Type

  • 7.1. Introduction
    • 7.1.1. Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
    • 7.1.2. Market Attractiveness Index, By Type
  • 7.2. Si3N4 AMB Substrates*
    • 7.2.1. Introduction
    • 7.2.2. Market Size Analysis and Y-o-Y Growth Analysis (%)
  • 7.3. AlN AMB Substrates

8. By Application

  • 8.1. Introduction
    • 8.1.1. Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
    • 8.1.2. Market Attractiveness Index, By Application
  • 8.2. Automotive*
    • 8.2.1. Introduction
    • 8.2.2. Market Size Analysis and Y-o-Y Growth Analysis (%)
  • 8.3. Electronics
  • 8.4. New Energy & Power Grid
  • 8.5. Military & Aerospace
  • 8.6. Industrial
  • 8.7. Others

9. By Region

  • 9.1. Introduction
    • 9.1.1. Market Size Analysis and Y-o-Y Growth Analysis (%), By Region
    • 9.1.2. Market Attractiveness Index, By Region
  • 9.2. North America
    • 9.2.1. Introduction
    • 9.2.2. Key Region-Specific Dynamics
    • 9.2.3. Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
    • 9.2.4. Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
    • 9.2.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
      • 9.2.5.1. U.S.
      • 9.2.5.2. Canada
      • 9.2.5.3. Mexico
  • 9.3. Europe
    • 9.3.1. Introduction
    • 9.3.2. Key Region-Specific Dynamics
    • 9.3.3. Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
    • 9.3.4. Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
    • 9.3.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
      • 9.3.5.1. Germany
      • 9.3.5.2. UK
      • 9.3.5.3. France
      • 9.3.5.4. Italy
      • 9.3.5.5. Russia
      • 9.3.5.6. Rest of Europe
  • 9.4. South America
    • 9.4.1. Introduction
    • 9.4.2. Key Region-Specific Dynamics
    • 9.4.3. Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
    • 9.4.4. Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
    • 9.4.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
      • 9.4.5.1. Brazil
      • 9.4.5.2. Argentina
      • 9.4.5.3. Rest of South America
  • 9.5. Asia-Pacific
    • 9.5.1. Introduction
    • 9.5.2. Key Region-Specific Dynamics
    • 9.5.3. Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
    • 9.5.4. Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
    • 9.5.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
      • 9.5.5.1. China
      • 9.5.5.2. India
      • 9.5.5.3. Japan
      • 9.5.5.4. Australia
      • 9.5.5.5. Rest of Asia-Pacific
  • 9.6. Middle East and Africa
    • 9.6.1. Introduction
    • 9.6.2. Key Region-Specific Dynamics
    • 9.6.3. Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
    • 9.6.4. Market Size Analysis and Y-o-Y Growth Analysis (%), By Application

10. Competitive Landscape

  • 10.1. Competitive Scenario
  • 10.2. Market Positioning/Share Analysis
  • 10.3. Mergers and Acquisitions Analysis

11. Company Profiles

  • 11.1. Rogers Corporation*
    • 11.1.1. Company Overview
    • 11.1.2. Product Portfolio and Description
    • 11.1.3. Financial Overview
    • 11.1.4. Key Developments
  • 11.2. Winning Imperatives
  • 11.3. Heraeus Electronics
  • 11.4. Kyocera
  • 11.5. NGK Electronics Devices
  • 11.6. Toshiba Materials
  • 11.7. Denka
  • 11.8. DOWA METALTECH
  • 11.9. Ferrotec
  • 11.10. BYD

LIST NOT EXHAUSTIVE

12. Appendix

  • 12.1. About Us and Services
  • 12.2. Contact Us