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3nM半導体製造技術市場:最終用途産業・技術タイプ・地域別

Global 3nM Semiconductor Manufacturing Technology Market: Focus on End Use Industry, Technology Type, and Region


出版日
発行
BIS Research
ページ情報
英文
納期
7~10営業日
カスタマイズ可能
適宜更新あり
価格
価格表記: USDを日本円(税抜)に換算
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3nM半導体製造技術市場:最終用途産業・技術タイプ・地域別
出版日: 2024年05月10日
発行: BIS Research
ページ情報: 英文
納期: 7~10営業日
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  • 概要
  • 目次
概要

世界の3nM半導体製造技術の市場は、半導体業界のパラダイムシフトの渦中にあり、従来のノードと比較して、性能の向上、消費電力の削減、トランジスタ密度の向上が見られます。

CE製品、自動車、ヘルスケアなどさまざまな分野で、より小型で高性能なチップへの需要が加速する中、3nM技術の採用は半導体が展望に革命を起す見通しです。

世界の3nM半導体製造技術市場の成長を促進する主な要因には、AI、5G接続、IoTデバイスなど、データ中心の用途の急激な増加が含まれます。また、高性能コンピューティングソリューションに対する需要の高まりや、ナノテクノロジーや材料科学の進歩も3nM技術の開発と採用を後押ししています。さらに、市場では製造の複雑さを克服し、規模の経済を達成するために、半導体企業間の垂直統合や戦略的提携が進んでいます。

北米とアジア太平洋地域が世界の半導体産業のフロントランナーとして際立っており、特に中国、日本、韓国、台湾などの国が半導体装置への支出で大きく貢献しています。

当レポートでは、世界の3nM半導体製造技術の市場を調査し、業界の動向、市場成長促進要因・抑制要因、市場規模の推移・予測、各種区分・地域/主要国別の詳細分析、競合情勢、主要企業のプロファイルなどをまとめています。

目次

第1章 市場:業界の展望

  • 動向:現在および将来の影響評価
    • 新しい材料と構造
    • エッジAIチップ
  • 3nM半導体製造技術の進化
  • 2nm半導体製造技術の次のステップ
  • サプライチェーン分析
  • 進行中のプログラム
  • 3nMチップを採用する主要企業
  • 市場力学の概要
    • 市場促進要因
    • 市場抑制要因
    • 市場機会

第2章 世界の3nM半導体製造技術市場:用途別

  • 用途の概要
  • 世界の3nM半導体製造技術市場:最終用途産業別
    • CE製品
    • 自動車
    • 通信
    • ヘルスケア
    • 航空宇宙・防衛
    • その他

第3章 世界の3nM半導体製造技術市場:製品別

  • 製品概要
  • 世界の3nM半導体製造技術市場:技術タイプ別
    • FinFET
    • GAA
    • EUVリソグラフィ

第4章 世界の3nM半導体製造技術市場:地域別

  • 地域概要
  • 世界の3nM半導体製造技術市場:地域別
  • 北米
  • 欧州
  • アジア太平洋
  • その他の地域

第5章 企業プロファイル

  • GlobalFoundries Inc.
  • Intel
  • Samsung
  • Taiwan Semiconductor Manufacturing Company Limited
  • United Microelectronics Corporation
  • その他の主要企業

第6章 調査手法

目次
Product Code: ES02059SA

This report will be delivered in 7-10 working days.

Introduction to 3nM Semiconductor Manufacturing Technology Market

The global 3nm semiconductor manufacturing technology market is witnessing a paradigm shift in the semiconductor industry, offering enhanced performance, reduced power consumption, and increased transistor density compared to previous nodes. As demand for smaller, more powerful chips accelerates across various sectors, including consumer electronics, automotive, and healthcare, the adoption of 3nm technology is poised to revolutionize the semiconductor landscape.

Key drivers fueling the growth of the global 3nm semiconductor manufacturing technology market include the exponential rise in data-centric applications such as artificial intelligence, 5G connectivity, and Internet of Things (IoT) devices. Moreover, the escalating demand for high-performance computing solutions, coupled with advancements in nanotechnology and materials science, is propelling the development and adoption of 3nm technology. Additionally, the market is witnessing a trend towards vertical integration among semiconductor companies and strategic collaborations to overcome manufacturing complexities and achieve economies of scale.

Despite its promising prospects, the global 3nm semiconductor manufacturing technology market faces several challenges, including the escalating costs associated with R&D and manufacturing processes, as well as technical hurdles related to extreme ultraviolet (EUV) lithography and process node scaling. However, these challenges present opportunities for innovation and differentiation, encouraging players to invest in advanced manufacturing techniques, materials, and design methodologies to address performance, power efficiency, and reliability requirements.

North America and the Asia-Pacific region stand out as frontrunners in the global semiconductor industry, with significant contributions from countries such as China, Japan, South Korea, and Taiwan, particularly in semiconductor equipment spending. Prominent companies in the 3nm market, including Taiwan Semiconductor Manufacturing Company Limited (TSMC), Samsung, Intel, United Microelectronics Corporation, and Globalfoundries, are pivotal players in this technological advancement. They provide state-of-the-art process capabilities to major clients, spearheading innovation within the sector and leading the charge in this transformative era of semiconductor technology.

Market Segmentation:

Segmentation 1: by End-use Industry

  • Consumer Electronics
  • Automotive
  • Telecommunications
  • Healthcare
  • Aerospace and Defense
  • Others

Segmentation 2: by Technology Type

  • FinFET
  • Gate-All-Around (GAA)
  • Extreme Ultraviolet (EUV) Lithography

Segmentation 3: by Region

  • North America
  • Europe
  • Asia-Pacific
  • Rest-of-the-World

Table of Contents

Executive Summary

Scope and Definition

Market/Product Definition

Key Questions Answered

Analysis and Forecast Note

1. Markets: Industry Outlook

  • 1.1 Trends: Current and Future Impact Assessment
    • 1.1.1 Introduction of New Materials and Structures
    • 1.1.2 Edge AI Chips
  • 1.2 Evolution of 3nM Semiconductor Manufacturing Technology
  • 1.3 2nM: The Next Step Semiconductor Manufacturing Technology
  • 1.4 Supply Chain Analysis
  • 1.5 Ongoing Programs
  • 1.6 Key Companies Adopting 3nM Chips
  • 1.7 Market Dynamics Overview
    • 1.7.1 Market Drivers
    • 1.7.2 Market Restraints
    • 1.7.3 Market Opportunities

2. Global 3nM Semiconductor Manufacturing Technology Market by Application

  • 2.1 Application Summary
  • 2.2 Global 3nM Semiconductor Manufacturing Technology Market by End Use Industry
    • 2.2.1 Consumer Electronics
    • 2.2.2 Automotive
    • 2.2.3 Telecommunications
    • 2.2.4 Healthcare
    • 2.2.5 Aerospace and Defense
    • 2.2.6 Others

3. Global 3nM Semiconductor Manufacturing Technology Market by Product

  • 3.1 Product Summary
  • 3.2 Global 3nM Semiconductor Manufacturing Technology Market by Technology Type
    • 3.2.1 FinFET
    • 3.2.2 Gate-All-Around (GAA)
    • 3.2.3 Extreme Ultraviolet (EUV) Lithography

4. Global 3nM Semiconductor Manufacturing Technology Market by Region

  • 4.1 Regional Summary
  • 4.2 Global 3nM Semiconductor Manufacturing Technology Market - by Region
  • 4.3 North America
    • 4.3.1 Markets
      • 4.3.1.1 Key Market Participants in North America
    • 4.3.2 Application
    • 4.3.3 Product
    • 4.3.4 North America by Country
      • 4.3.4.1 U.S.
        • 4.3.4.1.1 Market by Application
        • 4.3.4.1.2 Market by Product
      • 4.3.4.2 Canada
  • 4.4 Europe
    • 4.4.1 Markets
      • 4.4.1.1 Key Market Participants in Europe
    • 4.4.2 Application
    • 4.4.3 Product
    • 4.4.4 Europe By Country
      • 4.4.4.1 Germany
        • 4.4.4.1.1 Market by Application
        • 4.4.4.1.2 Market by Product
      • 4.4.4.2 France
      • 4.4.4.3 U.K.
      • 4.4.4.4 Others
  • 4.5 Asia-Pacific
    • 4.5.1 Markets
      • 4.5.1.1 Key Market Participants in Asia-Pacific
    • 4.5.2 Application
    • 4.5.3 Product
    • 4.5.4 Asia-Pacific by Country
      • 4.5.4.1 China
        • 4.5.4.1.1 Market by Application
        • 4.5.4.1.2 Market by Product
      • 4.5.4.2 Japan
      • 4.5.4.3 India
      • 4.5.4.4 Others
  • 4.6 Rest-of-the-World
    • 4.6.1 Markets
      • 4.6.1.1 Key Market Participants in Rest-of-the-World
    • 4.6.2 Application
    • 4.6.3 Product
    • 4.6.4 Rest-of-the-World by Region
      • 4.6.4.1 Middle East and Africa
      • 4.6.4.2 Latin America

5. Companies Profiled

  • 5.1 GlobalFoundries Inc.
  • 5.2 Intel
  • 5.3 Samsung
  • 5.4 Taiwan Semiconductor Manufacturing Company Limited
  • 5.5 United Microelectronics Corporation
  • 5.6 Other Key Players

6. Research Methodology