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1781951

ワイヤボンダ装置市場：タイプ別、接着方法別、エンドユーザー別、国別、地域別- 産業分析、市場規模、市場シェア、2025～2032年予測

Wire Bonder Equipment Market, By Type, By Bonding Method, By End User, By Country, and By Region - Industry Analysis, Market Size, Market Share & Forecast from 2025-2032

出版日
ページ情報
英文 303 Pages
納期
2～3営業日
カスタマイズ可能
価格
価格表記: USDを日本円(税抜)に換算
本日の銀行送金レート: 1USD=148.26円
ワイヤボンダ装置市場：タイプ別、接着方法別、エンドユーザー別、国別、地域別- 産業分析、市場規模、市場シェア、2025～2032年予測
出版日: 2025年06月04日
発行: AnalystView Market Insights
ページ情報: 英文 303 Pages
納期: 2～3営業日
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概要

レポートハイライト

ワイヤボンダ装置市場規模は2024年に9億9,590万米ドルで、2025～2032年にかけてCAGR 10.96%で拡大

ワイヤボンダ装置市場-市場力学

半導体産業と自動車エレクトロニクスからの需要増加が市場需要を促進する見込み

ワイヤボンダ装置市場は主に半導体産業が牽引しています。スマートデバイス、電気自動車、人工知能（AI）、5G技術、モノのインターネット（IoT）の急速な普及により、高集積でコンパクトな半導体チップのニーズが高まっています。これらのチップには精密で信頼性の高いボンダが必要であり、先進的ワイヤボンダ技術がこの要求に直接応えます。ワイヤボンダは、特に大量生産において、チップと包装の相互接続のための最もコスト効率が高く、柔軟な方法です。フリップチップやウエハーレベル包装などの代替技術が普及しても、ワイヤボンダは特定のセグメント、特にアナログ、パワー、低～中ピン数のデバイスで優位を保っています。

スマートフォン、ノートパソコン、タブレット端末、ウェアラブル端末、スマートホームデバイスなどの民生用電子機器の普及は、ワイヤボンダ装置市場の成長に大きく寄与しています。これらの製品には、高い性能と信頼性を備えた小型でエネルギー効率の高いチップが必要です。自動車には、安全性、ナビゲーション、エンターテインメント、電源管理、自律走行などのための先進的電子システムが搭載されるようになってきています。このようなカーエレクトロニクスの台頭は、ワイヤボンダ装置の需要を押し上げる重要な要因となっています。ADAS（先進運転支援システム）、電動パワートレイン、自動車インフォテインメント、バッテリー管理システムなどの用途は、堅牢で信頼性の高い半導体に大きく依存しており、市場の成長を後押ししています。

ワイヤボンダ装置市場-主要な洞察

調査アナリストの分析によると、世界市場は予測期間（2025～2032年）に約10.96%のCAGRで年間成長すると推定されます。

タイプ別では、ウェッジボンダセグメントは、自動車用途で高度に使用されているため、2024年に主要なタイプセグメントでした。

接着方法別では、半導体デバイスの組み立て需要が高いことから、エポキシセグメントが2024年のトップでした。

エンドユーザーセグメント別では、タブレット、スマートフォン、ノートパソコンなどの需要が高いことから、2024年にはコンシューマーエレクトロニクスセグメントが主要エンドユーザーセグメントとなりました。

地域別では、アジア太平洋のが、IoTデバイス、EV、技術進歩の採用増加により、2024年の売上高をリードしています。

ワイヤボンダ装置市場-セグメンテーション分析

世界のワイヤボンダ装置市場は、タイプ、ボンダ方法、エンドユーザー、地域に基づいてセグメント化されます。

タイプ別では、ボールボンダ、ウェッジボンダ、スタッドバンプボンダ、その他の4つに分類されます。市場を独占しているのはウェッジボンダセグメントです。ウェッジボンダはコスト効率が高く、信頼性も高いため、同セグメントの需要を押し上げています。

市場は接着方法によって、エポキシ、UV硬化、共晶、その他の4カテゴリーに分類されます。エポキシセグメントは、過酷な環境条件下でも高い強度を発揮するため、最大のシェアを占めると予想されます。

エンドユーザー別では、民生用電子機器、通信、自動車、その他の4カテゴリーに分類されます。エンドユーザー別では、民生用電子機器セグメントが最も高いシェアを占めています。自動車セグメントは、EVの需要が高く、電子部品の需要も高いため、急成長が見込まれています。

ワイヤボンダ装置市場-地域別洞察

ワイヤボンダ装置市場は、北米、ラテンアメリカ、欧州、アジア太平洋、中東・アフリカの各地域に広がっています。アジア太平洋のは、世界のワイヤボンダ装置販売で最大のシェアを占めています。中国、韓国、台湾は先進包装とメモリー生産の主要拠点であり、ハイエンドワイヤボンダ装置の需要を牽引しています。北米は世界市場で大きなシェアを占めています。米国は、AIチップ、データセンター、軍事用電子機器に重点を置き、ハイエンドR&Dと先進包装ソリューションをサポートしています。ラテンアメリカでは、メキシコが最大の電子機器製造と自動車部品で優位を占めており、ミッドレンジのボンダ装置に対する現地需要が高まる可能性があります。

ワイヤボンダ装置市場-競合情勢

ワイヤボンダ装置市場は適度に統合されており、少数の主要参入企業が世界を支配しています。各社は、技術進歩、自動化、接合精度、処理能力、顧客サービスに基づいて競争しています。また、強力な研究開発投資、戦略的パートナーシップ、製品の差別化も市場の特徴です。

目次

第1章 ワイヤボンダ装置市場概要

  • 調査範囲
  • 市場推定年数

第2章 エグゼクティブサマリー

  • 市場内訳
  • 競合考察

第3章 ワイヤボンダ装置の主要市場動向

  • 市場促進要因
  • 市場抑制要因
  • 市場機会
  • 市場の将来動向

第4章 ワイヤボンダ装置産業の調査

  • PEST分析
  • ポーターのファイブフォース分析
  • 成長展望マッピング
  • 規制枠組み分析

第5章 ワイヤボンダ装置市場：COVID-19の影響分析

  • COVID-19前の影響分析
  • COVID-19後の影響分析

第6章 ワイヤボンダ装置の市場情勢

  • ワイヤボンダ装置市場シェア分析、2024年
  • 主要メーカー別内訳データ
    • 既存企業の分析
    • 新興企業の分析

第7章 ワイヤボンダ装置市場-タイプ別

  • 概要
    • タイプ別セグメントシェア分析
    • ボールボンダ
    • ウェッジボンダ
    • スタッドバンプボンダ
    • その他

第8章 ワイヤボンダ装置市場-接着方法別

  • 概要
    • 接着方法別セグメントシェア分析
    • エポキシ
    • UV硬化
    • 共晶
    • その他

第9章 ワイヤボンダ装置市場-エンドユーザー別

  • 概要
    • エンドユーザー別セグメントシェア分析
    • 民生用電子機器
    • 通信
    • 自動車
    • その他

第10章 ワイヤボンダ装置市場-地域

  • イントロダクション
  • 北米
    • 概要
    • 北米の主要メーカー
    • 米国
    • カナダ
  • 欧州
    • 概要
    • 欧州の主要メーカー
    • ドイツ
    • イタリア
    • 英国
    • フランス
    • ロシア
    • オランダ
    • スウェーデン
    • ポーランド
    • その他
  • アジア太平洋
    • 概要
    • アジア太平洋の主要メーカー
    • インド
    • 中国
    • 日本
    • 韓国
    • オーストラリア
    • タイ
    • インドネシア
    • フィリピン
    • その他
  • ラテンアメリカ
    • 概要
    • ラテンアメリカの主要メーカー
    • ブラジル
    • メキシコ
    • アルゼンチン
    • コロンビア
    • その他
  • 中東・アフリカ
    • 概要
    • 中東・アフリカの主要メーカー
    • サウジアラビア
    • アラブ首長国連邦
    • イスラエル
    • トルコ
    • アルジェリア
    • エジプト
    • その他

第11章 主要ベンダー分析-ワイヤボンダ装置産業

  • 競合ダッシュボード
  • 企業プロファイル
    • Kulicke & Soffa Industries, Inc.
    • ASMPT
    • Palomar Technologies
    • Hesse Mechatronics GmbH
    • Shinkawa Ltd.
    • TPT Wire Bonder GmbH
    • F& K Delvotec Bondtechnik GmbH
    • Panasonic Factory Solutions
    • Toray Engineering Co., Ltd.
    • West*Bond, Inc.
    • Hybond, Inc.
    • DIAS Automation Co., Ltd.
    • Fasford Technology Co., Ltd.
    • ASM Japan KK
    • Beijing BE Semiconductor Co., Ltd.
    • SUSS MicroTec SE
    • Besi
    • KAIJO Corporation
    • Amada Weld Tech
    • Delvotec GmbH
    • その他

第12章 アナリストの全方位展望

目次
Product Code: ANV5357

REPORT HIGHLIGHT

Wire Bonder Equipment Market size was valued at USD 995.90 Million in 2024, expanding to a CAGR of 10.96% from 2025 to 2032.

Wire bonder equipment is a specialized machine used in the semiconductor and electronics industries to make electrical connections between a silicon chip (die) and its external circuitry, typically using fine wires made of gold, aluminum, or copper. This process is called wire bonding, and it is a crucial step in packaging microelectronic devices.

Wire Bonder Equipment Market- Market Dynamics

Growing demand from semiconductor industry and automotive electronics are expected to propel market demand

The wire bonder equipment market is primarily led by the semiconductor industry. The rapid adoption of smart devices, electric vehicles, artificial intelligence (AI), 5G technology, and the Internet of Things (IoT) has increased the need for highly integrated and compact semiconductor chips. These chips require precise and reliable bonding, a demand directly met by advanced wire bonding technologies. Wire bonding is the most cost-effective and flexible method for chip-to-package interconnections, especially in high-volume manufacturing. Even as alternative technologies like flip-chip and wafer-level packaging gain traction, wire bonding continues to dominate in specific sectors, particularly for analog, power, and low-to-medium pin count devices.

The proliferation of consumer electronics such as smartphones, laptops, tablets, wearables, and smart home devices is significantly contributing to the growth of the wire bonder equipment market. These products require compact, energy-efficient chips with high performance and reliability. Vehicles are increasingly equipped with sophisticated electronic systems for safety, navigation, entertainment, power management, and autonomous driving. This rise in automotive electronics is a key factor boosting the demand for wire bonder equipment. Applications such as Advanced Driver Assistance Systems (ADAS), electric powertrains, in-vehicle infotainment, and battery management systems rely heavily on robust, high-reliability semiconductors are boosting market growth.

Wire Bonder Equipment Market- Key Insights

As per the analysis shared by our research analyst, the global market is estimated to grow annually at a CAGR of around 10.96% over the forecast period (2025-2032)

Based on Type segmentation, the wedge bonders segment was the leading type segment in 2024, as it is highly used in automotive applications.

Based on Bonding Method segmentation, epoxy segment was the leading Bonding Method segment in 2024, due to high demand from assembly of semiconductor devices.

Based on End User segmentation, the consumer electronics segment was the leading End User segment in 2024, as high demand for tablets, smartphones, laptops, etc.

On the basis of the region, Asia Pacific was the leading revenue generator in 2024, due to increased adoption of IoT devices, EVs and tech advancements.

Wire Bonder Equipment Market- Segmentation Analysis:

The Global Wire Bonder Equipment Market is segmented on the basis of Type, Bonding Method, End User, and Region.

The market is divided into four categories based on Type: ball bonders, wedge bonders, stud-bump bonders, and others. The wedge bonders segment dominates the market. The wedge bonders are highly cost-effective and offer more reliability, thus boosting segment demand.

The market is divided into four categories based on Bonding Method: epoxy, UV curing, eutectic, and others. The epoxy segment is expected to hold the largest share as they provide high strength under harsh environmental conditions.

The market is divided into four categories based on End User: consumer electronics, telecom, automotive, and others. The consumer electronics segment holds the highest share of the End User segment. The automotive segment is expected to grow at fastest rate due to high demand for EVs and high demand for electronic components.

Wire Bonder Equipment Market- Geographical Insights

Across the globe, the Wire Bonder Equipment market is widespread in the regions of North America, Latin America, Europe, Asia Pacific, and the Middle East and Africa. Asia Pacific is accounting for the largest share of global wire bonder equipment sales. China, South Korea, and Taiwan are major hubs for advanced packaging and memory production, driving demand for high-end wire bonding equipment. North America holds significant share in the global market. The U.S. supports high-end R&D and advanced packaging solutions, with emphasis on AI chips, data centers, and military-grade electronics. In Latin America, Mexico dominates with largest electronics manufacturing and automotive components, which may increase local demand for mid-range bonding equipment.

Wire Bonder Equipment Market- Competitive Landscape:

The wire bonder equipment market is moderately consolidated, with a few key players dominating globally. Companies compete based on technological advancement, automation, bonding precision, throughput, and customer service. The market is also characterized by strong R&D investments, strategic partnerships, and product differentiation.

Recent Developments:

In 2024, ASMPT introduced an Eagle A60 wire bonder, optimized for advanced packaging and multi-tier applications.

In May 2024, ITEC launched the ADAT3 XF TwinRevolve Flip-Chip Die Bonder to expand their product portfolio.

SCOPE OF THE REPORT

The scope of this report covers the market by its major segments, which include as follows:

GLOBAL WIRE BONDER EQUIPMENT MARKET KEY PLAYERS

  • Kulicke & Soffa Industries, Inc.
  • ASMPT
  • Palomar Technologies
  • Hesse Mechatronics GmbH
  • Shinkawa Ltd.
  • TPT Wire Bonder GmbH
  • F&K Delvotec Bondtechnik GmbH
  • Panasonic Factory Solutions
  • Toray Engineering Co., Ltd.
  • West*Bond, Inc.
  • Hybond, Inc.
  • DIAS Automation Co., Ltd.
  • Fasford Technology Co., Ltd.
  • ASM Japan K.K.
  • Beijing BE Semiconductor Co., Ltd.
  • SUSS MicroTec SE
  • Besi
  • KAIJO Corporation
  • Amada Weld Tech
  • Delvotec GmbH
  • Others

GLOBAL WIRE BONDER EQUIPMENT MARKET, BY TYPE- MARKET ANALYSIS, 2019-2032

  • Ball bonders
  • Wedge bonders
  • Stud-bump bonders
  • Others

GLOBAL WIRE BONDER EQUIPMENT MARKET, BY BONDING METHOD- MARKET ANALYSIS, 2019-2032

  • Epoxy
  • UV curing
  • Eutectic
  • Others

GLOBAL WIRE BONDER EQUIPMENT MARKET, BY END USER- MARKET ANALYSIS, 2019-2032

  • Consumer electronics
  • Telecom
  • Automotive
  • Others

GLOBAL WIRE BONDER EQUIPMENT MARKET, BY REGION- MARKET ANALYSIS, 2019-2032

  • North America
  • The U.S.
  • Canada
  • Europe
  • Germany
  • France
  • Italy
  • Spain
  • United Kingdom
  • Russia
  • Netherlands
  • Sweden
  • Poland
  • Rest of Europe
  • Asia Pacific
  • India
  • China
  • South Korea
  • Japan
  • Australia
  • Thailand
  • Indonesia
  • Philippines
  • Rest of APAC
  • Latin America
  • Brazil
  • Mexico
  • Argentina
  • Colombia
  • Rest of LATAM
  • The Middle East and Africa
  • Saudi Arabia
  • UAE
  • Israel
  • Turkey
  • Algeria
  • Egypt
  • Rest of MEA

Table of Contents

1. Wire Bonder Equipment Market Overview

  • 1.1. Study Scope
  • 1.2. Market Estimation Years

2. Executive Summary

  • 2.1. Market Snippet
    • 2.1.1. Wire Bonder Equipment Market Snippet by Type
    • 2.1.2. Wire Bonder Equipment Market Snippet by Bonding Method
    • 2.1.3. Wire Bonder Equipment Market Snippet by End User
    • 2.1.4. Wire Bonder Equipment Market Snippet by Country
    • 2.1.5. Wire Bonder Equipment Market Snippet by Region
  • 2.2. Competitive Insights

3. Wire Bonder Equipment Key Market Trends

  • 3.1. Wire Bonder Equipment Market Drivers
    • 3.1.1. Impact Analysis of Market Drivers
  • 3.2. Wire Bonder Equipment Market Restraints
    • 3.2.1. Impact Analysis of Market Restraints
  • 3.3. Wire Bonder Equipment Market Opportunities
  • 3.4. Wire Bonder Equipment Market Future Trends

4. Wire Bonder Equipment Industry Study

  • 4.1. PEST Analysis
  • 4.2. Porter's Five Forces Analysis
  • 4.3. Growth Prospect Mapping
  • 4.4. Regulatory Framework Analysis

5. Wire Bonder Equipment Market: COVID-19 Impact Analysis

  • 5.1. Pre-COVID-19 Impact Analysis
  • 5.2. Post-COVID-19 Impact Analysis
    • 5.2.1. Top Performing Segments
    • 5.2.2. Marginal Growth Segments
    • 5.2.3. Top Looser Segments
    • 5.2.4. Marginal Loss Segments

6. Wire Bonder Equipment Market Landscape

  • 6.1. Wire Bonder Equipment Market Share Analysis, 2024
  • 6.2. Breakdown Data, by Key Manufacturer
    • 6.2.1. Established Players' Analysis
    • 6.2.2. Emerging Players' Analysis

7. Wire Bonder Equipment Market - By Type

  • 7.1. Overview
    • 7.1.1. Segment Share Analysis, By Type, 2024 & 2032 (%)
    • 7.1.2. Ball bonders
    • 7.1.3. Wedge bonders
    • 7.1.4. Stud-bump bonders
    • 7.1.5. Others

8. Wire Bonder Equipment Market - By Bonding Method

  • 8.1. Overview
    • 8.1.1. Segment Share Analysis, By Bonding Method, 2024 & 2032 (%)
    • 8.1.2. Epoxy
    • 8.1.3. UV curing
    • 8.1.4. Eutectic
    • 8.1.5. Others

9. Wire Bonder Equipment Market - By End User

  • 9.1. Overview
    • 9.1.1. Segment Share Analysis, By End User, 2024 & 2032 (%)
    • 9.1.2. Consumer electronics
    • 9.1.3. Telecom
    • 9.1.4. Automotive
    • 9.1.5. Others

10. Wire Bonder Equipment Market- By Geography

  • 10.1. Introduction
    • 10.1.1. Segment Share Analysis, By Geography, 2024 & 2032 (%)
  • 10.2. North America
    • 10.2.1. Overview
    • 10.2.2. Wire Bonder Equipment Key Manufacturers in North America
    • 10.2.3. North America Market Size and Forecast, By Country, 2019 - 2032 (US$ Million)
    • 10.2.4. North America Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
    • 10.2.5. North America Market Size and Forecast, By Bonding Method, 2019 - 2032 (US$ Million)
    • 10.2.6. North America Market Size and Forecast, By End User, 2019 - 2032 (US$ Million)
    • 10.2.7. U.S.
      • 10.2.7.1. Overview
      • 10.2.7.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.2.7.3. U.S. Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 10.2.7.4. U.S. Market Size and Forecast, By Bonding Method, 2019 - 2032 (US$ Million)
      • 10.2.7.5. U.S. Market Size and Forecast, By End User, 2019 - 2032 (US$ Million)
    • 10.2.8. Canada
      • 10.2.8.1. Overview
      • 10.2.8.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.2.8.3. Canada Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 10.2.8.4. Canada Market Size and Forecast, By Bonding Method, 2019 - 2032 (US$ Million)
      • 10.2.8.5. Canada Market Size and Forecast, By End User, 2019 - 2032 (US$ Million)
  • 10.3. Europe
    • 10.3.1. Overview
    • 10.3.2. Wire Bonder Equipment Key Manufacturers in Europe
    • 10.3.3. Europe Market Size and Forecast, By Country, 2019 - 2032 (US$ Million)
    • 10.3.4. Europe Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
    • 10.3.5. Europe Market Size and Forecast, By Bonding Method, 2019 - 2032 (US$ Million)
    • 10.3.6. Europe Market Size and Forecast, By End User, 2019 - 2032 (US$ Million)
    • 10.3.7. Germany
      • 10.3.7.1. Overview
      • 10.3.7.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.3.7.3. Germany Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 10.3.7.4. Germany Market Size and Forecast, By Bonding Method, 2019 - 2032 (US$ Million)
      • 10.3.7.5. Germany Market Size and Forecast, By End User, 2019 - 2032 (US$ Million)
    • 10.3.8. Italy
      • 10.3.8.1. Overview
      • 10.3.8.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.3.8.3. Italy Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 10.3.8.4. Italy Market Size and Forecast, By Bonding Method, 2019 - 2032 (US$ Million)
      • 10.3.8.5. Italy Market Size and Forecast, By End User, 2019 - 2032 (US$ Million)
    • 10.3.9. United Kingdom
      • 10.3.9.1. Overview
      • 10.3.9.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.3.9.3. United Kingdom Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 10.3.9.4. United Kingdom Market Size and Forecast, By Bonding Method, 2019 - 2032 (US$ Million)
      • 10.3.9.5. United Kingdom Market Size and Forecast, By End User, 2019 - 2032 (US$ Million)
    • 10.3.10. France
      • 10.3.10.1. Overview
      • 10.3.10.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.3.10.3. France Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 10.3.10.4. France Market Size and Forecast, By Bonding Method, 2019 - 2032 (US$ Million)
      • 10.3.10.5. France Market Size and Forecast, By End User, 2019 - 2032 (US$ Million)
    • 10.3.11. Russia
      • 10.3.11.1. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.3.11.2. Russia Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 10.3.11.3. Russia Market Size and Forecast, By Bonding Method, 2019 - 2032 (US$ Million)
      • 10.3.11.4. Russia Market Size and Forecast, By End User, 2019 - 2032 (US$ Million)
    • 10.3.12. Netherlands
      • 10.3.12.1. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.3.12.2. Netherlands Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 10.3.12.3. Netherlands Market Size and Forecast, By Bonding Method, 2019 - 2032 (US$ Million)
      • 10.3.12.4. Netherlands Market Size and Forecast, By End User, 2019 - 2032 (US$ Million)
    • 10.3.13. Sweden
      • 10.3.13.1. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.3.13.2. Sweden Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 10.3.13.3. Sweden Market Size and Forecast, By Bonding Method, 2019 - 2032 (US$ Million)
      • 10.3.13.4. Sweden Market Size and Forecast, By End User, 2019 - 2032 (US$ Million)
    • 10.3.14. Poland
      • 10.3.14.1. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.3.14.2. Poland Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 10.3.14.3. Poland Market Size and Forecast, By Bonding Method, 2019 - 2032 (US$ Million)
      • 10.3.14.4. Poland Market Size and Forecast, By End User, 2019 - 2032 (US$ Million)
    • 10.3.15. Rest of Europe
      • 10.3.15.1. Overview
      • 10.3.15.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.3.15.3. Rest of the Europe Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 10.3.15.4. Rest of the Europe Market Size and Forecast, By Bonding Method, 2019 - 2032 (US$ Million)
      • 10.3.15.5. Rest of the Europe Market Size and Forecast, By End User, 2019 - 2032 (US$ Million)
  • 10.4. Asia Pacific (APAC)
    • 10.4.1. Overview
    • 10.4.2. Wire Bonder Equipment Key Manufacturers in Asia Pacific
    • 10.4.3. Asia Pacific Market Size and Forecast, By Country, 2019 - 2032 (US$ Million)
    • 10.4.4. Asia Pacific Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
    • 10.4.5. Asia Pacific Market Size and Forecast, By Bonding Method, 2019 - 2032 (US$ Million)
    • 10.4.6. Asia Pacific Market Size and Forecast, By End User, 2019 - 2032 (US$ Million)
    • 10.4.7. India
      • 10.4.7.1. Overview
      • 10.4.7.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.4.7.3. India Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 10.4.7.4. India Market Size and Forecast, By Bonding Method, 2019 - 2032 (US$ Million)
      • 10.4.7.5. India Market Size and Forecast, By End User, 2019 - 2032 (US$ Million)
    • 10.4.8. China
      • 10.4.8.1. Overview
      • 10.4.8.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.4.8.3. China Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 10.4.8.4. China Market Size and Forecast, By Bonding Method, 2019 - 2032 (US$ Million)
      • 10.4.8.5. China Market Size and Forecast, By End User, 2019 - 2032 (US$ Million)
    • 10.4.9. Japan
      • 10.4.9.1. Overview
      • 10.4.9.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.4.9.3. Japan Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 10.4.9.4. Japan Market Size and Forecast, By Bonding Method, 2019 - 2032 (US$ Million)
      • 10.4.9.5. Japan Market Size and Forecast, By End User, 2019 - 2032 (US$ Million)
    • 10.4.10. South Korea
      • 10.4.10.1. Overview
      • 10.4.10.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.4.10.3. South Korea Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 10.4.10.4. South Korea Market Size and Forecast, By Bonding Method, 2019 - 2032 (US$ Million)
      • 10.4.10.5. South Korea Market Size and Forecast, By End User, 2019 - 2032 (US$ Million)
    • 10.4.11. Australia
      • 10.4.11.1. Overview
      • 10.4.11.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.4.11.3. Australia Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 10.4.11.4. Australia Market Size and Forecast, By Bonding Method, 2019 - 2032 (US$ Million)
      • 10.4.11.5. Australia Market Size and Forecast, By End User, 2019 - 2032 (US$ Million)
    • 10.4.12. Thailand
      • 10.4.12.1. Overview
      • 10.4.12.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.4.12.3. Thailand Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 10.4.12.4. Thailand Market Size and Forecast, By Bonding Method, 2019 - 2032 (US$ Million)
      • 10.4.12.5. Thailand Market Size and Forecast, By End User, 2019 - 2032 (US$ Million)
    • 10.4.13. Indonesia
      • 10.4.13.1. Overview
      • 10.4.13.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.4.13.3. Indonesia Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 10.4.13.4. Indonesia Market Size and Forecast, By Bonding Method, 2019 - 2032 (US$ Million)
      • 10.4.13.5. Indonesia Market Size and Forecast, By End User, 2019 - 2032 (US$ Million)
    • 10.4.14. Philippines
      • 10.4.14.1. Overview
      • 10.4.14.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.4.14.3. Philippines Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 10.4.14.4. Philippines Market Size and Forecast, By Bonding Method, 2019 - 2032 (US$ Million)
      • 10.4.14.5. Philippines Market Size and Forecast, By End User, 2019 - 2032 (US$ Million)
    • 10.4.15. Rest of APAC
      • 10.4.15.1. Overview
      • 10.4.15.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.4.15.3. Rest of APAC Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 10.4.15.4. Rest of APAC Market Size and Forecast, By Bonding Method, 2019 - 2032 (US$ Million)
      • 10.4.15.5. Rest of APAC Market Size and Forecast, By End User, 2019 - 2032 (US$ Million)
  • 10.5. Latin America
    • 10.5.1. Overview
    • 10.5.2. Wire Bonder Equipment Key Manufacturers in Latin America
    • 10.5.3. Latin America Market Size and Forecast, By Country, 2019 - 2032 (US$ Million)
    • 10.5.4. Latin America Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
    • 10.5.5. Latin America Market Size and Forecast, By Bonding Method, 2019 - 2032 (US$ Million)
    • 10.5.6. Latin America Market Size and Forecast, By End User, 2019 - 2032 (US$ Million)
    • 10.5.7. Brazil
      • 10.5.7.1. Overview
      • 10.5.7.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.5.7.3. Brazil Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 10.5.7.4. Brazil Market Size and Forecast, By Bonding Method, 2019 - 2032 (US$ Million)
      • 10.5.7.5. Brazil Market Size and Forecast, By End User, 2019 - 2032 (US$ Million)
    • 10.5.8. Mexico
      • 10.5.8.1. Overview
      • 10.5.8.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.5.8.3. Mexico Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 10.5.8.4. Mexico Market Size and Forecast, By Bonding Method, 2019 - 2032 (US$ Million)
      • 10.5.8.5. Mexico Market Size and Forecast, By End User, 2019 - 2032 (US$ Million)
    • 10.5.9. Argentina
      • 10.5.9.1. Overview
      • 10.5.9.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.5.9.3. Argentina Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 10.5.9.4. Argentina Market Size and Forecast, By Bonding Method, 2019 - 2032 (US$ Million)
      • 10.5.9.5. Argentina Market Size and Forecast, By End User, 2019 - 2032 (US$ Million)
    • 10.5.10. Colombia
      • 10.5.10.1. Overview
      • 10.5.10.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.5.10.3. Colombia Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 10.5.10.4. Colombia Market Size and Forecast, By Bonding Method, 2019 - 2032 (US$ Million)
      • 10.5.10.5. Colombia Market Size and Forecast, By End User, 2019 - 2032 (US$ Million)
    • 10.5.11. Rest of LATAM
      • 10.5.11.1. Overview
      • 10.5.11.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.5.11.3. Rest of LATAM Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 10.5.11.4. Rest of LATAM Market Size and Forecast, By Bonding Method, 2019 - 2032 (US$ Million)
      • 10.5.11.5. Rest of LATAM Market Size and Forecast, By End User, 2019 - 2032 (US$ Million)
  • 10.6. Middle East and Africa
    • 10.6.1. Overview
    • 10.6.2. Wire Bonder Equipment Key Manufacturers in Middle East and Africa
    • 10.6.3. Middle East and Africa Market Size and Forecast, By Country, 2019 - 2032 (US$ Million)
    • 10.6.4. Middle East and Africa Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
    • 10.6.5. Middle East and Africa Market Size and Forecast, By Bonding Method, 2019 - 2032 (US$ Million)
    • 10.6.6. Middle East and Africa Market Size and Forecast, By End User, 2019 - 2032 (US$ Million)
    • 10.6.7. Saudi Arabia
      • 10.6.7.1. Overview
      • 10.6.7.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.6.7.3. Saudi Arabia Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 10.6.7.4. Saudi Arabia Market Size and Forecast, By Bonding Method, 2019 - 2032 (US$ Million)
      • 10.6.7.5. Saudi Arabia Market Size and Forecast, By End User, 2019 - 2032 (US$ Million)
    • 10.6.8. United Arab Emirates
      • 10.6.8.1. Overview
      • 10.6.8.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.6.8.3. United Arab Emirates Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 10.6.8.4. United Arab Emirates Market Size and Forecast, By Bonding Method, 2019 - 2032 (US$ Million)
      • 10.6.8.5. United Arab Emirates Market Size and Forecast, By End User, 2019 - 2032 (US$ Million)
    • 10.6.9. Israel
      • 10.6.9.1. Overview
      • 10.6.9.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.6.9.3. Israel Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 10.6.9.4. Israel Market Size and Forecast, By Bonding Method, 2019 - 2032 (US$ Million)
      • 10.6.9.5. Israel Market Size and Forecast, By End User, 2019 - 2032 (US$ Million)
    • 10.6.10. Turkey
      • 10.6.10.1. Overview
      • 10.6.10.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.6.10.3. Turkey Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 10.6.10.4. Turkey Market Size and Forecast, By Bonding Method, 2019 - 2032 (US$ Million)
      • 10.6.10.5. Turkey Market Size and Forecast, By End User, 2019 - 2032 (US$ Million)
    • 10.6.11. Algeria
      • 10.6.11.1. Overview
      • 10.6.11.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.6.11.3. Algeria Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 10.6.11.4. Algeria Market Size and Forecast, By Bonding Method, 2019 - 2032 (US$ Million)
      • 10.6.11.5. Algeria Market Size and Forecast, By End User, 2019 - 2032 (US$ Million)
    • 10.6.12. Egypt
      • 10.6.12.1. Overview
      • 10.6.12.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.6.12.3. Egypt Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 10.6.12.4. Egypt Market Size and Forecast, By Bonding Method, 2019 - 2032 (US$ Million)
      • 10.6.12.5. Egypt Market Size and Forecast, By End User, 2019 - 2032 (US$ Million)
    • 10.6.13. Rest of MEA
      • 10.6.13.1. Overview
      • 10.6.13.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.6.13.3. Rest of MEA Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 10.6.13.4. Rest of MEA Market Size and Forecast, By Bonding Method, 2019 - 2032 (US$ Million)
      • 10.6.13.5. Rest of MEA Market Size and Forecast, By End User, 2019 - 2032 (US$ Million)

11. Key Vendor Analysis- Wire Bonder Equipment Industry

  • 11.1. Competitive Dashboard
  • 11.2. Company Profiles
    • 11.2.1. Kulicke & Soffa Industries, Inc.
    • 11.2.2. ASMPT
    • 11.2.3. Palomar Technologies
    • 11.2.4. Hesse Mechatronics GmbH
    • 11.2.5. Shinkawa Ltd.
    • 11.2.6. TPT Wire Bonder GmbH
    • 11.2.7. F&K Delvotec Bondtechnik GmbH
    • 11.2.8. Panasonic Factory Solutions
    • 11.2.9. Toray Engineering Co., Ltd.
    • 11.2.10. West*Bond, Inc.
    • 11.2.11. Hybond, Inc.
    • 11.2.12. DIAS Automation Co., Ltd.
    • 11.2.13. Fasford Technology Co., Ltd.
    • 11.2.14. ASM Japan K.K.
    • 11.2.15. Beijing BE Semiconductor Co., Ltd.
    • 11.2.16. SUSS MicroTec SE
    • 11.2.17. Besi
    • 11.2.18. KAIJO Corporation
    • 11.2.19. Amada Weld Tech
    • 11.2.20. Delvotec GmbH
    • 11.2.21. Others

12. 360 Degree Analyst View

13. Appendix

  • 13.1. Research Methodology
  • 13.2. References
  • 13.3. Abbreviations
  • 13.4. Disclaimer
  • 13.5. Contact Us