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パワーエレクトロニクスの世界市場：デバイスタイプ別、材料別、用途別、最終用途別 - 機会分析と産業予測、2024年～2033年

Power Electronics Market By Device Type, By Material, By Application, By End Use : Global Opportunity Analysis and Industry Forecast, 2024-2033

出版日
ページ情報
英文 411 Pages
納期
2～3営業日
価格
価格表記: USDを日本円(税抜)に換算
本日の銀行送金レート: 1USD=144.06円
パワーエレクトロニクスの世界市場：デバイスタイプ別、材料別、用途別、最終用途別 - 機会分析と産業予測、2024年～2033年
出版日: 2024年12月01日
発行: Allied Market Research
ページ情報: 英文 411 Pages
納期: 2～3営業日
GIIご利用のメリット
  • 全表示
  • 概要
  • 目次
概要

パワーエレクトロニクス市場は、2023年に418億米ドルと評価され、2024年から2033年までのCAGRは5.8%を示し、2033年には717億米ドルに達すると推定されています。

Power Electronics Market-IMG1

パワーエレクトロニクスは、半導体のスイッチに基づく電気コンバータを用いた電力の変換と制御を扱います。パワーコンバータには、DC/DCコンバータ、AC/DCコンバータ、DC/ACコンバータ、AC/ACコンバータの4つの主要カテゴリーがあります。各コンバータは、抵抗器、コンデンサ、インダクタなどの基本的な電子部品と、ダイオード、サイリスタ、トランジスタなどの半導体素子で構成されています。パワーエレクトロニクスは、電動化された車両用途において極めて重要であり、電力変換のためのコンパクトで効率的なソリューションを提供します。これらのデバイスは、電源から負荷への電力伝達を堅牢かつ効率的、コンパクトな方法で管理し、最適な利用を促進します。ダイオード、トランジスタ、サイリスタなどのコンポーネントを採用することで、パワーエレクトロニクスは異なる形態間の電力変換を制御します。パワーエレクトロニクスは、その高速スイッチング能力と高効率により、高電圧・大電流動作に優れています。さらに、パワーエレクトロニクスは、一方向と双方向の両方のエネルギーの流れを管理することができ、再生したエネルギーを送電網に戻すことができます。これらのデバイスは、自動車や省エネルギー用途のシステム効率と性能を向上させる重要な技術になると予想されます。パワーモジュール（パワーエレクトロニクスモジュール）は、パワー半導体などの複数のパワーコンポーネントを1つのパッケージに統合したもので、ディスクリートコンポーネントと比較して高い電力密度と信頼性を提供します。

パワーMOSFET（金属酸化膜半導体電界効果トランジスタ）は、電子スイッチとして重要な役割を果たし、非常に低い抵抗と高周波スイッチングで負荷を制御します。こうした特性は、高効率電源、電気自動車やハイブリッド車、太陽光発電インバーター、RFスイッチング、IT機器の電源などで活用されています。カーエレクトロニクスの進歩は、パワーエレクトロニクス市場の主要な促進要因です。現代の自動車は、性能、安全性、効率の向上のために高度な電子システムへの依存度を高めており、高度なパワーエレクトロニクス部品に対する需要の高まりを生み出しています。電動パワートレイン、ADAS（先進運転支援システム）、最先端のインフォテインメントなどの革新には、高性能の電力変換器、インバータ、バッテリー管理システムが必要です。こうした技術改良は、自動車の機能性を高めるだけでなく、信頼性が高く効率的なパワーエレクトロニクスソリューションの必要性を高めています。自動車技術の進化に伴い、最先端のパワーエレクトロニクスコンポーネントへのニーズが加速するため、市場の成長が促進され、この分野の技術進歩が促進されます。さらに、中国、ブラジル、インドなどの新興諸国では、SiCベースの太陽電池の需要が急増しており、世界市場の成長を後押ししています。

しかし、主な阻害要因の1つは、先端エレクトロニクスデバイスの複雑な統合プロセスです。複雑なデバイスを設計するには、統合のための強固な手法、スキルセット、さまざまなツールセットが必要で、デバイスのコストも上昇します。このデバイスの高コストが、ユーザーが革新的な新技術のデバイスに乗り換えるのを抑制しています。これとは逆に、プラグイン電気自動車（PEV）の需要の増加とパワーMOSFET（金属酸化膜半導体電界効果トランジスタ）の技術革新は、予測期間中にパワーエレクトロニクス市場の拡大に有利な機会を提供すると予想されます。

パワーエレクトロニクス市場は、デバイスタイプ、材料、用途、最終用途、地域に区分されます。デバイスタイプ別では、パワーディスクリート、パワーモジュール、パワーICに分類されます。材料別では、炭化ケイ素、窒化ガリウム、サファイア、その他に分類されます。用途別では、電源管理、無停電電源装置（UPS）、再生可能エネルギー、その他に分類されます。最終用途別では、通信、産業、自動車、再生可能、民生・企業、軍事・防衛、エネルギー・電力、その他に細分化されます。地域別では、北米（米国、カナダ、メキシコ）、欧州（英国、ドイツ、フランス、イタリア、その他欧州地域）、アジア太平洋地域（中国、日本、インド、韓国、その他アジア太平洋地域）、ラテンアメリカ、中東・アフリカで市場動向が分析されています。

利害関係者にとっての主なメリット

  • 当レポートでは、2023年から2033年にかけてのパワーエレクトロニクス市場分析の市場セグメント、現在の動向、推定・動向分析、ダイナミクスを定量的に分析し、一般的なパワーエレクトロニクス市場機会を特定します。
  • 市場促進要因、市場抑制要因、市場機会に関連する情報とともに市場調査を提供します。
  • ポーターのファイブフォース分析では、利害関係者が利益重視のビジネス決定を下し、サプライヤーとバイヤーのネットワークを強化できるよう、バイヤーとサプライヤーの潜在力を明らかにします。
  • パワーエレクトロニクス市場のセグメンテーションを詳細に分析することで、市場機会を見極めることができます。
  • 各地域の主要国は、世界市場への収益貢献度に応じてマッピングされています。
  • 市場企業のポジショニングはベンチマーキングを容易にし、市場企業の現在のポジションを明確に理解することができます。
  • 本レポートには、地域および世界のパワーエレクトロニクス市場動向、主要企業、市場セグメント、応用分野、市場成長戦略の分析が含まれています。

本レポートで可能なカスタマイズ（追加費用とスケジュールが必要です。）

  • 企業の市場シェア分析：製品/セグメント別
  • 規制ガイドライン
  • SWOT分析

目次

第1章 イントロダクション

第2章 エグゼクティブサマリー

第3章 市場概要

  • 市場の定義と範囲
  • 主な調査結果
    • 影響要因
    • 主な投資機会
  • ポーターのファイブフォース分析
  • 市場力学
    • 促進要因
      • さまざまな業界におけるパワーエレクトロニクスコンポーネント需要の増加
      • スマートグリッドインフラへの投資の増加
      • 電気自動車へのパワーエレクトロニクスコンポーネントの統合の増加
    • 抑制要因
      • 統合とシステム設計の複雑さ
    • 機会
      • 再生可能エネルギー源の使用増加
      • パワー用金属-酸化膜-半導体電界効果トランジスタ（MOSFET）の技術革新

第4章 パワーエレクトロニクス市場：デバイスタイプ別

  • 概要
  • パワーディスクリート
  • パワーモジュール
  • パワーIC

第5章 パワーエレクトロニクス市場：材料別

  • 概要
  • 炭化ケイ素
  • 窒化ガリウム
  • サファイア
  • その他

第6章 パワーエレクトロニクス市場：用途別

  • 概要
  • 電源管理
  • 無停電電源装置
  • 再生可能エネルギー
  • その他

第7章 パワーエレクトロニクス市場：最終用途別

  • 概要
  • 通信用
  • 産業用
  • 自動車
  • 民生用電子機器
  • 軍事・防衛
  • エネルギー・電力
  • その他

第8章 パワーエレクトロニクス市場：地域別

  • 概要
  • 北米
    • 米国
    • カナダ
    • メキシコ
  • 欧州
    • ドイツ
    • フランス
    • 英国
    • イタリア
    • その他
  • アジア太平洋
    • 中国
    • インド
    • 日本
    • 韓国
    • その他
  • ラテンアメリカ
    • ラテンアメリカ
    • 中東
    • アフリカ

第9章 競合情勢

  • イントロダクション
  • 主要成功戦略
  • 主要10社の製品マッピング
  • 競合ダッシュボード
  • 競合ヒートマップ
  • 主要企業のポジショニング（2023年）

第10章 企業プロファイル

  • ABB, Ltd
  • FUJI ELECTRIC CO, LTD.
  • Infineon Technologies AG
  • Microsemi Corporation
  • Mitsubishi Electric Corporation
  • Renesas Electronics Corporation
  • Rockwell Automation, Inc.
  • STMicroelectronics N.V.
  • Texas Instruments Incorporated
  • Toshiba Corporation
目次
Product Code: A01456

The power electronics market was valued at $41.8 billion in 2023 and is estimated to reach $71.7 billion by 2033, exhibiting a CAGR of 5.8% from 2024 to 2033.

Power Electronics Market - IMG1

Power electronics deals with the conversion and control of electric power using electric converters based on the switch of semiconductors. The power converter has four major categories such as DC/DC converters, AC/DC converters, DC/AC converters, and AC/AC converters. Each converter is composed of fundamental electronic components, including resistors, capacitors, and inductors, as well as semiconductor devices such as diodes, thyristors, and transistors. Power electronics are crucial in electrified vehicle applications, offering compact and efficient solutions for power conversion. These devices manage the transfer of power from a source to a load in a robust, efficient, and compact manner, facilitating optimal utilization. By employing components such as diodes, transistors, and thyristors, power electronics control the conversion of electric power between different forms. They excel in high-voltage and highcurrent operations due to their rapid switching capabilities and high efficiency. Additionally, power electronics can manage both unidirectional and bidirectional energy flows, allowing regenerated energy to be returned to the grid. These devices are anticipated to be key technologies for enhancing system efficiency and performance in automotive and energy-saving applications. Power modules, or power electronic modules, integrate multiple power components, such as power semiconductors, into a single package, offering higher power density and reliability compared to discrete components.

Power metal oxide semiconductor field effect transistors (MOSFETs) play a critical role as electronic switches, controlling loads with very low resistance and high-frequency switching. These attributes are leveraged in high-efficiency power supplies, electric and hybrid vehicles, photovoltaic inverters, RF switching, and IT equipment power supplies. Advancements in automotive electronics are a key driver for the power electronics market. Modern vehicles increasingly depend on sophisticated electronic systems for enhanced performance, safety, and efficiency, creating a rising demand for advanced power electronics components. Innovations such as electric powertrains, advanced driver-assistance systems (ADAS), and state-of-the-art infotainment require high-performance power converters, inverters, and battery management systems. These technological improvements not only boost vehicle functionality but also escalate the need for reliable and efficient power electronics solutions. As automotive technology evolves, the need for cutting-edge power electronics components accelerates, thus driving market growth and fostering technological advancements in the sector. Moreover, surge in demand for SiC-based photovoltaic cells in the developing countries, including China, Brazil, and India fuels the growth of the global market.

However, one of the major restraints is the complex integration process for advanced electronics devices. Designing complex devices requires robust methodology, skillsets, and different toolsets for integration, which also raises the cost of the devices. This high cost of devices restrains users from switching to new innovative technologies devices. On the contrary, rise in demand for plug-in electric vehicles (PEVs) and innovation in power metal-oxide- semiconductor field effect transistor (MOSFET) is anticipated to provide lucrative opportunities for the expansion of the power electronics market during the forecast period.

The power electronics market is segmented into device type, material, application, end use, and region. On the basis of device type, the market is classified into power discrete, power module, and power IC. By material, it is categorized into silicon carbide, gallium nitride, sapphire, and others. By application, it includes power management, uninterruptible power supply (UPS), renewable, and others. By end use, the market is fragmented into telecommunication, industrial, automotive, renewable, consumer & enterprise, military & defense, energy & power, and others. Region wise, the market trends are analyzed across North America (U.S., Canada, and Mexico), Europe (UK, Germany, France, Italy, and rest of Europe), Asia-Pacific (China, Japan, India, South Korea, and rest of AsiaPacific), and LAMEA (Latin America, Middle East, and Africa).

The key players profiled in the report include Infineon Technologies AG, Mitsubishi Electric Corporation, ABB, Ltd, FUJI ELECTRIC CO, LTD., Microsemi Corporation, Rockwell Automation, Inc., Renesas Electronics Corporation, Texas Instruments Incorporated, STMicroelectronics N.V., and Toshiba Corporation. Market players have adopted various strategies such as product launch, expansion, collaboration, partnership, innovation, investment, new product development, and acquisition to strengthen their foothold in the power electronics industry.

Key Benefits For Stakeholders

  • This report provides a quantitative analysis of the market segments, current trends, estimations, and dynamics of the power electronics market analysis from 2023 to 2033 to identify the prevailing power electronics market opportunities.
  • The market research is offered along with information related to key drivers, restraints, and opportunities.
  • Porter's five forces analysis highlights the potency of buyers and suppliers to enable stakeholders make profit-oriented business decisions and strengthen their supplier-buyer network.
  • In-depth analysis of the power electronics market segmentation assists to determine the prevailing market opportunities.
  • Major countries in each region are mapped according to their revenue contribution to the global market.
  • Market player positioning facilitates benchmarking and provides a clear understanding of the present position of the market players.
  • The report includes the analysis of the regional as well as global power electronics market trends, key players, market segments, application areas, and market growth strategies.

Additional benefits you will get with this purchase are:

  • Quarterly Update and* (only available with a corporate license, on listed price)
  • 5 additional Company Profile of client Choice pre- or Post-purchase, as a free update.
  • Free Upcoming Version on the Purchase of Five and Enterprise User License.
  • 16 analyst hours of support* (post-purchase, if you find additional data requirements upon review of the report, you may receive support amounting to 16 analyst hours to solve questions, and post-sale queries)
  • 15% Free Customization* (in case the scope or segment of the report does not match your requirements, 15% is equivalent to 3 working days of free work, applicable once)
  • Free data Pack on the Five and Enterprise User License. (Excel version of the report)
  • Free Updated report if the report is 6-12 months old or older.
  • 24-hour priority response*
  • Free Industry updates and white papers.

Possible Customization with this report (with additional cost and timeline, please talk to the sales executive to know more)

  • Market share analysis of players by products/segments
  • Regulatory Guidelines
  • SWOT Analysis

Key Market Segments

By Device Type

  • Power Discrete
  • Power Module
  • Power IC

By Material

  • Silicon Carbide
  • Gallium Nitride
  • Sapphire
  • Others

By Application

  • Power Management
  • Uninterruptible Power Supply
  • Renewable
  • Others

By End Use

  • Telecommunication
  • Industrial
  • Automotive
  • Consumer Electronics
  • Military and Defense
  • Energy and Power
  • Others

By Region

  • North America
    • U.S.
    • Canada
    • Mexico
  • Europe
    • Germany
    • France
    • UK
    • Italy
    • Rest of Europe
  • Asia-Pacific
    • China
    • India
    • Japan
    • South Korea
    • Rest of Asia-Pacific
  • LAMEA
    • Latin America
    • Middle East
    • Africa

Key Market Players:

    • ABB, Ltd
    • FUJI ELECTRIC CO, LTD.
    • Infineon Technologies AG
    • Microsemi Corporation
    • Mitsubishi Electric Corporation
    • Renesas Electronics Corporation
    • Rockwell Automation, Inc.
    • STMicroelectronics N.V.
    • Texas Instruments Incorporated
    • Toshiba Corporation

TABLE OF CONTENTS

CHAPTER 1: INTRODUCTION

  • 1.1. Report description
  • 1.2. Key market segments
  • 1.3. Key benefits to the stakeholders
  • 1.4. Research methodology
    • 1.4.1. Primary research
    • 1.4.2. Secondary research
    • 1.4.3. Analyst tools and models

CHAPTER 2: EXECUTIVE SUMMARY

  • 2.1. CXO perspective

CHAPTER 3: MARKET OVERVIEW

  • 3.1. Market definition and scope
  • 3.2. Key findings
    • 3.2.1. Top impacting factors
    • 3.2.2. Top investment pockets
  • 3.3. Porter's five forces analysis
    • 3.3.1. Moderate bargaining power of suppliers
    • 3.3.2. Moderate threat of new entrants
    • 3.3.3. Low to moderate threat of substitutes
    • 3.3.4. Low to high intensity of rivalry
    • 3.3.5. Low to high bargaining power of buyers
  • 3.4. Market dynamics
    • 3.4.1. Drivers
      • 3.4.1.1. Increase in Demand for Power Electronics Component across Various Industry Verticals
      • 3.4.1.2. Growing Investments in Smart Grid Infrastructure
      • 3.4.1.3. Rise in Integration of Power Electronics Components in Electric Vehicles
    • 3.4.2. Restraints
      • 3.4.2.1. Complexity in Integration and System Design
    • 3.4.3. Opportunities
      • 3.4.3.1. Rising Use of Renewable Energy Sources
      • 3.4.3.2. Innovation in Power Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET)

CHAPTER 4: POWER ELECTRONICS MARKET, BY DEVICE TYPE

  • 4.1. Overview
    • 4.1.1. Market size and forecast
  • 4.2. Power Discrete
    • 4.2.1. Key market trends, growth factors and opportunities
    • 4.2.2. Market size and forecast, by region
    • 4.2.3. Market share analysis by country
  • 4.3. Power Module
    • 4.3.1. Key market trends, growth factors and opportunities
    • 4.3.2. Market size and forecast, by region
    • 4.3.3. Market share analysis by country
  • 4.4. Power IC
    • 4.4.1. Key market trends, growth factors and opportunities
    • 4.4.2. Market size and forecast, by region
    • 4.4.3. Market share analysis by country

CHAPTER 5: POWER ELECTRONICS MARKET, BY MATERIAL

  • 5.1. Overview
    • 5.1.1. Market size and forecast
  • 5.2. Silicon Carbide
    • 5.2.1. Key market trends, growth factors and opportunities
    • 5.2.2. Market size and forecast, by region
    • 5.2.3. Market share analysis by country
  • 5.3. Gallium Nitride
    • 5.3.1. Key market trends, growth factors and opportunities
    • 5.3.2. Market size and forecast, by region
    • 5.3.3. Market share analysis by country
  • 5.4. Sapphire
    • 5.4.1. Key market trends, growth factors and opportunities
    • 5.4.2. Market size and forecast, by region
    • 5.4.3. Market share analysis by country
  • 5.5. Others
    • 5.5.1. Key market trends, growth factors and opportunities
    • 5.5.2. Market size and forecast, by region
    • 5.5.3. Market share analysis by country

CHAPTER 6: POWER ELECTRONICS MARKET, BY APPLICATION

  • 6.1. Overview
    • 6.1.1. Market size and forecast
  • 6.2. Power Management
    • 6.2.1. Key market trends, growth factors and opportunities
    • 6.2.2. Market size and forecast, by region
    • 6.2.3. Market share analysis by country
  • 6.3. Uninterruptible Power Supply
    • 6.3.1. Key market trends, growth factors and opportunities
    • 6.3.2. Market size and forecast, by region
    • 6.3.3. Market share analysis by country
  • 6.4. Renewable
    • 6.4.1. Key market trends, growth factors and opportunities
    • 6.4.2. Market size and forecast, by region
    • 6.4.3. Market share analysis by country
  • 6.5. Others
    • 6.5.1. Key market trends, growth factors and opportunities
    • 6.5.2. Market size and forecast, by region
    • 6.5.3. Market share analysis by country

CHAPTER 7: POWER ELECTRONICS MARKET, BY END USE

  • 7.1. Overview
    • 7.1.1. Market size and forecast
  • 7.2. Telecommunication
    • 7.2.1. Key market trends, growth factors and opportunities
    • 7.2.2. Market size and forecast, by region
    • 7.2.3. Market share analysis by country
  • 7.3. Industrial
    • 7.3.1. Key market trends, growth factors and opportunities
    • 7.3.2. Market size and forecast, by region
    • 7.3.3. Market share analysis by country
  • 7.4. Automotive
    • 7.4.1. Key market trends, growth factors and opportunities
    • 7.4.2. Market size and forecast, by region
    • 7.4.3. Market share analysis by country
  • 7.5. Consumer Electronics
    • 7.5.1. Key market trends, growth factors and opportunities
    • 7.5.2. Market size and forecast, by region
    • 7.5.3. Market share analysis by country
  • 7.6. Military and Defense
    • 7.6.1. Key market trends, growth factors and opportunities
    • 7.6.2. Market size and forecast, by region
    • 7.6.3. Market share analysis by country
  • 7.7. Energy and Power
    • 7.7.1. Key market trends, growth factors and opportunities
    • 7.7.2. Market size and forecast, by region
    • 7.7.3. Market share analysis by country
  • 7.8. Others
    • 7.8.1. Key market trends, growth factors and opportunities
    • 7.8.2. Market size and forecast, by region
    • 7.8.3. Market share analysis by country

CHAPTER 8: POWER ELECTRONICS MARKET, BY REGION

  • 8.1. Overview
    • 8.1.1. Market size and forecast By Region
  • 8.2. North America
    • 8.2.1. Key market trends, growth factors and opportunities
    • 8.2.2. Market size and forecast, by Device Type
    • 8.2.3. Market size and forecast, by Material
    • 8.2.4. Market size and forecast, by Application
    • 8.2.5. Market size and forecast, by End Use
    • 8.2.6. Market size and forecast, by country
      • 8.2.6.1. U.S.
      • 8.2.6.1.1. Market size and forecast, by Device Type
      • 8.2.6.1.2. Market size and forecast, by Material
      • 8.2.6.1.3. Market size and forecast, by Application
      • 8.2.6.1.4. Market size and forecast, by End Use
      • 8.2.6.2. Canada
      • 8.2.6.2.1. Market size and forecast, by Device Type
      • 8.2.6.2.2. Market size and forecast, by Material
      • 8.2.6.2.3. Market size and forecast, by Application
      • 8.2.6.2.4. Market size and forecast, by End Use
      • 8.2.6.3. Mexico
      • 8.2.6.3.1. Market size and forecast, by Device Type
      • 8.2.6.3.2. Market size and forecast, by Material
      • 8.2.6.3.3. Market size and forecast, by Application
      • 8.2.6.3.4. Market size and forecast, by End Use
  • 8.3. Europe
    • 8.3.1. Key market trends, growth factors and opportunities
    • 8.3.2. Market size and forecast, by Device Type
    • 8.3.3. Market size and forecast, by Material
    • 8.3.4. Market size and forecast, by Application
    • 8.3.5. Market size and forecast, by End Use
    • 8.3.6. Market size and forecast, by country
      • 8.3.6.1. Germany
      • 8.3.6.1.1. Market size and forecast, by Device Type
      • 8.3.6.1.2. Market size and forecast, by Material
      • 8.3.6.1.3. Market size and forecast, by Application
      • 8.3.6.1.4. Market size and forecast, by End Use
      • 8.3.6.2. France
      • 8.3.6.2.1. Market size and forecast, by Device Type
      • 8.3.6.2.2. Market size and forecast, by Material
      • 8.3.6.2.3. Market size and forecast, by Application
      • 8.3.6.2.4. Market size and forecast, by End Use
      • 8.3.6.3. UK
      • 8.3.6.3.1. Market size and forecast, by Device Type
      • 8.3.6.3.2. Market size and forecast, by Material
      • 8.3.6.3.3. Market size and forecast, by Application
      • 8.3.6.3.4. Market size and forecast, by End Use
      • 8.3.6.4. Italy
      • 8.3.6.4.1. Market size and forecast, by Device Type
      • 8.3.6.4.2. Market size and forecast, by Material
      • 8.3.6.4.3. Market size and forecast, by Application
      • 8.3.6.4.4. Market size and forecast, by End Use
      • 8.3.6.5. Rest of Europe
      • 8.3.6.5.1. Market size and forecast, by Device Type
      • 8.3.6.5.2. Market size and forecast, by Material
      • 8.3.6.5.3. Market size and forecast, by Application
      • 8.3.6.5.4. Market size and forecast, by End Use
  • 8.4. Asia-Pacific
    • 8.4.1. Key market trends, growth factors and opportunities
    • 8.4.2. Market size and forecast, by Device Type
    • 8.4.3. Market size and forecast, by Material
    • 8.4.4. Market size and forecast, by Application
    • 8.4.5. Market size and forecast, by End Use
    • 8.4.6. Market size and forecast, by country
      • 8.4.6.1. China
      • 8.4.6.1.1. Market size and forecast, by Device Type
      • 8.4.6.1.2. Market size and forecast, by Material
      • 8.4.6.1.3. Market size and forecast, by Application
      • 8.4.6.1.4. Market size and forecast, by End Use
      • 8.4.6.2. India
      • 8.4.6.2.1. Market size and forecast, by Device Type
      • 8.4.6.2.2. Market size and forecast, by Material
      • 8.4.6.2.3. Market size and forecast, by Application
      • 8.4.6.2.4. Market size and forecast, by End Use
      • 8.4.6.3. Japan
      • 8.4.6.3.1. Market size and forecast, by Device Type
      • 8.4.6.3.2. Market size and forecast, by Material
      • 8.4.6.3.3. Market size and forecast, by Application
      • 8.4.6.3.4. Market size and forecast, by End Use
      • 8.4.6.4. South Korea
      • 8.4.6.4.1. Market size and forecast, by Device Type
      • 8.4.6.4.2. Market size and forecast, by Material
      • 8.4.6.4.3. Market size and forecast, by Application
      • 8.4.6.4.4. Market size and forecast, by End Use
      • 8.4.6.5. Rest of Asia-Pacific
      • 8.4.6.5.1. Market size and forecast, by Device Type
      • 8.4.6.5.2. Market size and forecast, by Material
      • 8.4.6.5.3. Market size and forecast, by Application
      • 8.4.6.5.4. Market size and forecast, by End Use
  • 8.5. LAMEA
    • 8.5.1. Key market trends, growth factors and opportunities
    • 8.5.2. Market size and forecast, by Device Type
    • 8.5.3. Market size and forecast, by Material
    • 8.5.4. Market size and forecast, by Application
    • 8.5.5. Market size and forecast, by End Use
    • 8.5.6. Market size and forecast, by country
      • 8.5.6.1. Latin America
      • 8.5.6.1.1. Market size and forecast, by Device Type
      • 8.5.6.1.2. Market size and forecast, by Material
      • 8.5.6.1.3. Market size and forecast, by Application
      • 8.5.6.1.4. Market size and forecast, by End Use
      • 8.5.6.2. Middle East
      • 8.5.6.2.1. Market size and forecast, by Device Type
      • 8.5.6.2.2. Market size and forecast, by Material
      • 8.5.6.2.3. Market size and forecast, by Application
      • 8.5.6.2.4. Market size and forecast, by End Use
      • 8.5.6.3. Africa
      • 8.5.6.3.1. Market size and forecast, by Device Type
      • 8.5.6.3.2. Market size and forecast, by Material
      • 8.5.6.3.3. Market size and forecast, by Application
      • 8.5.6.3.4. Market size and forecast, by End Use

CHAPTER 9: COMPETITIVE LANDSCAPE

  • 9.1. Introduction
  • 9.2. Top winning strategies
  • 9.3. Product mapping of top 10 player
  • 9.4. Competitive dashboard
  • 9.5. Competitive heatmap
  • 9.6. Top player positioning, 2023

CHAPTER 10: COMPANY PROFILES

  • 10.1. ABB, Ltd
    • 10.1.1. Company overview
    • 10.1.2. Key executives
    • 10.1.3. Company snapshot
    • 10.1.4. Operating business segments
    • 10.1.5. Product portfolio
    • 10.1.6. Business performance
    • 10.1.7. Key strategic moves and developments
  • 10.2. FUJI ELECTRIC CO, LTD.
    • 10.2.1. Company overview
    • 10.2.2. Key executives
    • 10.2.3. Company snapshot
    • 10.2.4. Operating business segments
    • 10.2.5. Product portfolio
    • 10.2.6. Business performance
    • 10.2.7. Key strategic moves and developments
  • 10.3. Infineon Technologies AG
    • 10.3.1. Company overview
    • 10.3.2. Key executives
    • 10.3.3. Company snapshot
    • 10.3.4. Operating business segments
    • 10.3.5. Product portfolio
    • 10.3.6. Business performance
    • 10.3.7. Key strategic moves and developments
  • 10.4. Microsemi Corporation
    • 10.4.1. Company overview
    • 10.4.2. Key executives
    • 10.4.3. Company snapshot
    • 10.4.4. Operating business segments
    • 10.4.5. Product portfolio
    • 10.4.6. Business performance
    • 10.4.7. Key strategic moves and developments
  • 10.5. Mitsubishi Electric Corporation
    • 10.5.1. Company overview
    • 10.5.2. Key executives
    • 10.5.3. Company snapshot
    • 10.5.4. Operating business segments
    • 10.5.5. Product portfolio
    • 10.5.6. Business performance
    • 10.5.7. Key strategic moves and developments
  • 10.6. Renesas Electronics Corporation
    • 10.6.1. Company overview
    • 10.6.2. Key executives
    • 10.6.3. Company snapshot
    • 10.6.4. Operating business segments
    • 10.6.5. Product portfolio
    • 10.6.6. Business performance
    • 10.6.7. Key strategic moves and developments
  • 10.7. Rockwell Automation, Inc.
    • 10.7.1. Company overview
    • 10.7.2. Key executives
    • 10.7.3. Company snapshot
    • 10.7.4. Operating business segments
    • 10.7.5. Product portfolio
    • 10.7.6. Business performance
  • 10.8. STMicroelectronics N.V.
    • 10.8.1. Company overview
    • 10.8.2. Key executives
    • 10.8.3. Company snapshot
    • 10.8.4. Operating business segments
    • 10.8.5. Product portfolio
    • 10.8.6. Business performance
    • 10.8.7. Key strategic moves and developments
  • 10.9. Texas Instruments Incorporated
    • 10.9.1. Company overview
    • 10.9.2. Key executives
    • 10.9.3. Company snapshot
    • 10.9.4. Operating business segments
    • 10.9.5. Product portfolio
    • 10.9.6. Business performance
    • 10.9.7. Key strategic moves and developments
  • 10.10. Toshiba Corporation
    • 10.10.1. Company overview
    • 10.10.2. Key executives
    • 10.10.3. Company snapshot
    • 10.10.4. Operating business segments
    • 10.10.5. Product portfolio
    • 10.10.6. Business performance
    • 10.10.7. Key strategic moves and developments