VLSI製造における計測・検査・プロセス管理

当レポートでは、VLSI製造における計測・検査・プロセス管理について調査し、リソグラフィ計測、ウエハ検査/欠陥検査、薄膜計測、その他プロセス管理システムの概要、市場の予測、競合他社の市場シェアなどについてまとめています。

目次

第1章 イントロダクション

第2章 エグゼクティブサマリー

第3章 計測・検査技術

• イントロダクション
• イメージング技術
• 走査型プローブ顕微鏡
• 光学技術
• 膜厚と粗さ

第4章 欠陥レビュー/ウエハ検査

• イントロダクション
• 欠陥レビュー
• パターンウエハ検査
• パターンなしウエハ検査
• マクロ欠陥検査

第5章 薄膜計測

• イントロダクション
  • フロントエンド
  • バックエンド
• 金属薄膜計測
• 非金属薄膜計測
• 基板/その他の薄膜計測

第6章 リソグラフィ計測

• オーバーレイ
• CD
• マスク（レチクル）計測・検査

第7章 市場予測

• イントロダクション
• 市場予測の前提条件
• 市場予測

第8章 統合/現場計測/検査の動向

• イントロダクション
• その場計測
• 統合計測

第9章 主な要因

• 3D
• バックエンド計測検査
• 300mm/450mmウエハ
• 銅計測
• Low-K誘電体
• 化学機械平坦化（CMP）
• イオン注入

LIST OF TABLES

• 3.1. Comparison Of Derivative AFM Techniques
• 5.1. Comparison Of White-Light With Multiple-Angle Laser Ellipsometry
• 7.1. Total Process Control Market Forecast
• 7.2. Lithography Metrology Market Forecast
• 7.3. Overlay Market Forecast
• 7.4. CD Measurement Market Forecast
• 7.5. Mask Inspection Market Forecast
• 7.6. Mask Metrology Market Forecast
• 7.7. Wafer Inspection / Defect Review Market Forecast
• 7.8. Patterned Wafer Inspection Market Forecast
• 7.9. E-Beam Patterned Wafer Inspection Market Forecast
• 7.10. Optical Patterned Wafer Inspection Market Forecast
• 7.11. Defect Review Market Forecast
• 7.12. SEM Defect Review Market Forecast
• 7.13. Optical Defect Review Market Forecast
• 7.14. Unpatterned Wafer Inspection Market Forecast
• 7.15. Macro Defect Detection Market Forecast
• 7.16. Thin Film Metrology Market Forecast
• 7.17. Non-Metal Thin Film Metrology Market Forecast
• 7.18. Non-Metal Standalone Thin Film Metrology Market Forecast
• 7.19. Non-Metal Integrated Thin Film Metrology Market Forecast
• 7.20. Substrate / Other Thin Film Metrology Market Forecast
• 7.21. Other Process Control Systems Market Forecast
• 7.22. Back-End Metrology/Inspection Market Forecast
• 9.1. Dielectric Film Challenges

LIST OF FIGURES

• 3.1. Schematic Of Scanning Electron Microscope
• 3.2. Schematic Of Transmission Electron Microscope
• 3.3. Schematic Of Atomic Force Microscopy
• 3.4. Schematic Of Scanning Tunneling Microscopy
• 3.5. Interaction Between Two Atoms In AFM
• 3.6. Schematic Of Lateral Force Microscopy
• 3.7. Schematic Of Dynamic Force Mode AFM
• 3.8. Schematic Of Scanning Surface Potential Microscopy
• 3.9. Principle Of Scatterometry
• 3.10. Schematic Of Ellipsometer
• 3.11. Principles Of CD Scatterometry
• 3.12. Conventional TXRF Analysis Geometry
• 3.13. Schematic Of Secondary Ion Mass Spectrometry
• 3.14. Principle Of Auger Electron Emission
• 3.15. Schematic Of Auger Electron Spectroscopy
• 3.16. Schematic Of Focused Ion Beam Technology
• 3.17. Schematic Of X-Ray Reflectometry
• 3.18. Schematic Of X-Ray Photoelectron Spectroscopy
• 3.19. Schematic Of Rutherford Backscattering
• 3.20. Schematic Of Optical Acoustics Metrology
• 3.21. Schematic Of Optical Second Harmonic Generation
• 3.22. Spatial Wavelength Of Nanotopography
• 3.23. Schematic Of Non-Contact Capacitive Gauging
• 3.24. Schematic Of Stylus Profilometer
• 5.1. Spectroscopic Ellipsometry Diagram
• 6.1. ITRS Overlay Technology Roadmap
• 6.2. Illustration Of 3D Structure
• 6.3. ITRS Metrology Roadmap
• 6.4. Schematic Of OCD Optics
• 7.1. Total Process Control Market Forecast
• 7.2. Total Process Control Market By Geographic Region
• 7.3. Total Process Control Market Vs. Overall Equipment Market
• 7.4. Lithography Metrology Market Shares
• 7.5. Overlay Market Shares
• 7.6. CD Measurement Market Shares
• 7.7. Mask Inspection Market Shares
• 7.8. Mask Metrology Market Shares
• 7.9. Wafer Inspection / Defect Review Market Shares
• 7.10. Patterned Wafer Inspection Market Shares
• 7.11. E-Beam Patterned Wafer Inspection Market Shares
• 7.12. Optical Patterned Wafer Inspection Market Shares
• 7.13. Defect Review Market Shares
• 7.14. SEM Defect Review Market Shares
• 7.15. Optical Defect Review Market Shares
• 7.16. Unpatterned Wafer Inspection Market Shares
• 7.17. Macro Defect Detection Market Shares
• 7.18. Thin Film Metrology Market Shares
• 7.19. Non-Metal Thin Film Metrology Market Shares
• 7.20. Non-Metal Standalone Thin Film Metrology Market Shares
• 7.21. Non-Metal Integrated Thin Film Metrology Market Shares
• 7.22. Substrate / Other Thin Film Metrology Market Shares
• 7.23. Other Process Control Systems Market Shares
• 7.24. Other Process Software Market Shares
• 7.26. Back-End Metrology/Inspection Market Shares
• 8.1. Integrated Control In A Fab
• 9.1. Polish Endpoint Control

Chipmakers remain committed to their capex and shrinkage plans for now: Chipmakers are, according to our research, holding on to their existing orders. There are no indications, for now, that they plan to make cancellations. In addition, we believe KLA's tool is required for foundry and logic chips, rather than memory chips, for which demand is more volatile. We therefore do not expect significant order cancellations for KLA's tools.

The demand for semiconductor equipment is largely driven by the additional tools required for chipmakers to migrate to leading-edge nodes. For KLA, this is especially the case because its tool is required in foundry and logic chip manufacturing processes. Foundry and logic players are, compared to memory chip manufacturers, more committed to shrinkage. In addition, its tool is crucial for developing new processes. With capacity-driven capex slowing down, semiconductor equipment demand may prove resilient if chipmakers migrate more aggressively to the leading edge nodes.

China has been actively expanding its semiconductor capacity and manufacturing facilities. Its foundry and logic chip vendors are at least a few generations behind the leaders in the market. However, China remains committed to making progress on its semiconductor roadmap. In our view, KLA's tool will be used more intensively when the chipmakers are at R&D stages compared to the manufacturing phase. China currently spends about $5 billion on wafer fab equipment so it could help to offset a potential capex cut from large chip manufacturers.

This report offers a complete analysis of the Process Control market, segmented as: Lithography Metrology; Wafer Inspection/Defect Review; Thin Film Metrology; and Other Process Control Systems. Each of these sectors is further segmented. Market shares of competitors for all segment is presented.

Table of Contents

Chapter 1. Introduction

Chapter 2. Executive Summary

Chapter 3. Metrology/Inspection Technologies

• 3.1. Introduction
• 3.2. Imaging Techniques
  • 3.2.1. Scanning Electron Microscope (SEM)
  • 3.2.2. Transmission Electron Microscope (TEM)
• 3.3. Scanning Probe Microscopes
  • 3.3.1. Atomic Force Microscopy (AFM)
  • 3.3.2. Scanning Tunneling Microscopy (STM)
  • 3.3.3. Scanning Probe Microscopy (SPM)
  • 3.3.4. AFM Types
    • 3.3.4.1 Contact AFM
    • 3.3.4.2 Dynamic Force Mode AFM Techniques
  • 3.3.5. Scanning Surface Potential Microscopy (SSPM)
• 3.4. Optical Techniques
  • 3.4.1. Scatterometry
    • 3.4.1.1 Ellipsometry
    • 3.4.1.2 Reflectometry
    • 3.4.1.3 Scatterometry Developments
  • 3.4.2. Total Reflection X-Ray Fluorescence (TXRF)
  • 3.4.3. Energy Dispersive X-Ray Analysis (EDX)
  • 3.4.4. Secondary Ion Mass Spectrometry (SIMS)
    • 3.4.4.1 Surface Imaging Using SIMS
    • 3.4.4.2 SIMS Depth Profiling
  • 3.4.5. Auger Electron Spectroscopy
  • 3.4.6. Focused Ion Beam (FIB)
  • 3.4.7. X-Ray Reflectometry (XRR)
  • 3.4.8. X-Ray Photoelectron Spectroscopy (XPS)
  • 3.4.9. Rutherford Backscattering (RBS)
  • 3.4.10. Optical Acoustics Metrology
  • 3.4.11. Fourier Transform Infrared Spectroscopy (FTIR)
  • 3.4.12. Thermally-Induced Voltage Alteration (TIVA)
  • 3.4.13 Optical Second Harmonic Generation (SHG)
• 3.5. Film Thickness And Roughness
  • 3.5.1. Surface Inspection Technology
  • 3.5.2. Dimensional Technology
  • 3.5.3. Stylus Profilometer

Chapter 4. Defect Review/Wafer Inspection

• 4.1. Introduction
• 4.2. Defect Review
  • 4.2.1. SEM Defect Review
  • 4.2.2. Optical Defect Review
  • 4.2.3. Other Defect Review
• 4.3. Patterned Wafer Inspection
  • 4.3.1. E-Beam Patterned Wafer Inspection
  • 4.3.2. Optical Patterned Wafer Inspection
• 4.4. Unpatterned Wafer Inspection
• 4.5. Macro-Defect Inspection

Chapter 5. Thin Film Metrology

• 5.1. Introduction
  • 5.1.1. Front End Applications
  • 5.1.2. Back End Applications
• 5.2. Metal Thin-Film Metrology
• 5.3. Non-Metal Thin-Film Metrology
• 5.4. Substrate/Other Thin Film Metrology

Chapter 6. Lithography Metrology

• 6.1. Overlay
• 6.2. CD
• 6.3. Mask (Reticle) Metrology/Inspection

Chapter 7. Market Forecast

• 7.1. Introduction
• 7.2. Market Forecast Assumptions
• 7.3. Market Forecast
  • 7.3.1. Total Process Control Market Forecast
  • 7.3.2. Lithography Metrology Market Forecast
    • 7.3.2.1 Overlay Market Forecast
    • 7.3.2.2 CD Measurement Market Forecast
    • 7.3.2.3 Mask Inspection Market Forecast
    • 7.3.2.4 Mask Metrology Market Forecast
  • 7.3.3. Wafer Inspection / Defect Review Market
    • 7.3.3.1 Patterned Wafer Inspection Market Forecast
      • E-Beam Patterned Wafer Inspection Market Forecast
      • Optical Patterned Wafer Inspection Market Forecast
    • 7.3.3.2 Defect Review Market Forecast
      • SEM Defect Review Market Forecast
      • Optical Defect Review Market Forecast
    • 7.3.3.3 Unpatterned Wafer Inspection Market Forecast
    • 7.3.3.4 Macro Defect Detection Market Forecast
  • 7.3.4. Thin Film Metrology Market Forecast
    • 7.3.4.1 Non-Metal Thin Film Metrology Market Forecast
      • Non-Metal Standalone Thin Film Metrology Market Forecast
      • Non-Metal Integrated Thin Film Metrology Market Forecast
    • 7.3.4.2 Substrate / Other Thin Film Metrology Market Forecast
  • 7.3.5. Other Process Control Systems Market Forecast
  • 7.3.6 Back-End Metrology/Inspection Market Forecast

Chapter 8. Integrated/In-Situ Metrology/Inspection Trends

• 8.1. Introduction
• 8.2. In-Situ Metrology
• 8.3. Integrated Metrology
  • 8.3.1. Benefits
  • 8.3.2. Limitations

Chapter 9. Key Drivers

• 9.1. 3D
• 9.2. Back End Metrology Inspection
• 9.3. 300mm/450mm Wafers
• 9.4. Copper Metrology
• 9.5. Low-K Dielectrics
• 9.6. Chemical Mechanical Planarization (CMP)
• 9.7. Ion Implant