市場調査レポート

組込みハードウェア&システム:スタック可能モジュールのサービス市場

Stackables - PC/104 Family Modules & Other Stackable Form Factors: Embedded Boards Supplier Analysis

発行 VDC Research Group, Inc. 商品コード 232054
出版日 ページ情報 英文 55 Pages, 34 Exhibits
納期: 即日から翌営業日
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組込みハードウェア&システム:スタック可能モジュールのサービス市場 Stackables - PC/104 Family Modules & Other Stackable Form Factors: Embedded Boards Supplier Analysis
出版日: 2011年11月30日 ページ情報: 英文 55 Pages, 34 Exhibits
概要

スタック可能モジュール(stackables)は、元来その外形規格の柔軟性から、組み込まれる製品の用途や使用環境から生じる空間ニーズを満たすことを目的に導入されたものですが、洗練を重ねた結果、現在は拡張機能、小型化、機動性向上など、より高いレベルの利点を機器設計に提供しています。

当レポートでは、VDC Research Groupによる徹底調査情報サービスの一環として、スタック可能モジュールに携わる組込みハードウェアおよびシステムのサプライヤーおよびステークホルダーの皆様に、価値提案やソリューション開発などの活動を研ぎ澄ますための産業動向ニュースや最新市場データを、概略以下の構成でお届けします。

エグゼクティブサマリー

  • PC/104系モジュールに対する世界需要は、2015年まで緩やかに拡大する見込み
  • PC/104系モジュールは引き続き、産業オートメーションおよび軍事・防衛セグメントで使用される
  • その他のスタック可能外形規格に対する世界需要は、2015年まで加速する見込み
  • その他のスタック可能外形規格は、産業オートメーション、制御、医療の各垂直セグメントで人気が高い
  • スタック可能外形規格に対する世界需要は、2015年まで拡大する見込み

調査の範囲と方法

  • VDCによる調査は独自の範囲設定と分析手法により、3つの基軸評価基準に沿ってさまざまな市場セグメントを検証する
  • 組込みハードウェア、システム、サービスの調査方法

市場概要

  • 多数の市場セグメントから導き出された組込み技術への需要が、複合的な内外環境ファクターに沿って勢いを変えながら増減する状況へ
  • 持続的成長の機会を生み出す新たな垂直市場への進出

市場のセグメンテーションと推定・予測数値

  • PC/104系モジュールに対する世界需要は、2015年まで緩やかに拡大する見込み
  • PC/104系モジュールは、とりわけ南北アメリカ地域でよく知られる組込み技術
  • PC/104系モジュールの販売比率は、自主流通とサードパーティチャネルの間でほぼ半々
  • PC/104系モジュールの取引形態は引き続き、機器OEMとディストリビューター販売が中心
  • PC/104およびPC/104-Plusアーキテクチャへの需要は、PCI/104が登場する2013年まで持続する見通し
  • PC/104系モジュールは、さまざまなプロセッサーを使用するが、2013年まではAtomがリードすると見られる
  • PC/104系モジュールでの複数プロセッサーコア利用は2013年まで加速する
  • PC/104系モジュールのOS付き出荷比率は、2013年まで上昇が続く見込み
  • Linux Embedded StandardとWindows Embedded Standardが引き続き、PC/104系モジュールのもっとも一般的なOS
  • PC/104サプライヤーは概して、シリアルポートコントローラー、USBコントローラー、また最近の傾向として、完成状態にあるビデオ機能付きで、ユニットを出荷
  • その他さまざまな詳細情報

サマリーと所見

  • スタック可能外形規格に対する世界需要は、2015年まで拡大する見込み
  • 独自の機能要件を持つ垂直産業は引き続き、コンパクトなスタック可能外形規格から恩恵を受ける
目次

Abstract

Market Overview

Expansion into new vertical markets presenting sustained growth opportunities

Whereas the "Other Stackables" commercial market is expected to grow at a rate more than twice that of the PC-104 board market, this growth is partially driven by revenue attributable to small form factor boards without any expansion capability. These are only classified within the "Other Stackables" market segment because of the legacy lineage of their respective board standards.

We do, however, anticipate that the continued size reductions of these related motherboards will present the market - and well positioned vendors - with opportunities for growth going forward.

The same time-to-market pressures that originally drove many OEMs to look for flexible COTS computing systems and fostered the creation of many of the stackable form factors is now causing many board vendors to reevaluate the breadth of their own solution portfolio. Increasingly, OEMs are looking for board vendors to provide - or at least facilitate - a higher level of out-of-thebox end system functionality through tighter integration of operating systems and other software stack components with their own solutions. We expect that these types features and bundles, as well as access to software development kits and tools, will become an increasingly important factor influencing the merchant computer board market going forward.

The market for stackable computer boards originally evolved out of a need for flexible, secure computing platforms that could withstand the environmental factors in rugged and/or industrial settings. Whereas this innate requirement of many embedded application classes continues to dictate component and solution selection, increasing pressures for smaller, more mobile designs is causing some OEMs to look to other form factors such as COMs in greater frequency.

Despite the potential shift of some designs to other computing form factors and the downward pressures driven by the market's traditional dependence on the military / aerospace sector (which will likely face public policy-driven budget cuts over the next few years), we still project the aggregate market to grow at a rate of over 8% per year. This resilient market growth is largely attributable to two main factors: the long design/life cycles and relatively inelastic component requirements typical of the mil/aero and industrial automation projects; and the sustained, gradual expansion of market demand for boards incorporating more sophisticated integrated feature sets, largely driven by the continued adoption of the board in new higher growth markets such as transportation.

Strategic Issues, Trends & Market Drivers

The stackables market faces a number of challenges to its adoption

Other Stackables Trends

  • For the past 20 years, stackable architectures, in general, have enabled hundreds if not thousands of new embedded applications to use an off-theshelf x86 solution where a custom solution might otherwise have been required.
  • VDC believes the introduction of even smaller form factors, be they stackable or not, could result in ubiquitous, interconnected, low-power, eco-friendly computing solutions with long production life and simplified I/O, software connectivity, and legacy support.
  • Among the leading stackable form factors in 2013 will be 3.5", EPIC and EPIC Express .
  • The growth in "other stackables" is due to the increased demand for small form factor motherboards (active backplane), and not to their stackable capability.

PC104 Stackables Trends

  • Asia Pacific countries will likely show a slightly increased demand for stackables.
  • While multicore is a trend in stackables technology like the rest of the embedded space, it is occurring at a slower pace in stackables because the additional performance may not justify the additional design effort and cost.
  • However, VDC believes the PC/104 family, which has slowly evolved over the past twenty years, has not grown as rapidly as other embedded stackable form factors, or even modern embedded board technology in general. Apparent confusion around standards, and the perceived lack of a cohesive ecosystem could - conceivably - derail the platform, unless PC/104 expansion modules can keep pace with the changes needed to enable contemporary high-speed, high-throughput, and highlysecure rugged applications.
  • Nonetheless, PC/104 technology is still ideal for rugged applications with wide temperature ranges, due to the pin-andsocket stacking expansion bus connector system and the corner mounting holes which may be used to bolt the stack together.

Market Segmentation, Estimates & Forecasts

Global demand for PC/104 family modules is expected to increase moderately through 2015

image1

While VDC sees the PC/104 family modules market growing, some PC/104 suppliers have expressed concerns about the stackable concept and the cabling complexity and extensive mechanical design efforts that may be required. When applications have higher production volumes, designers may utilize COMs and COM carriers due to ease of use and more advantageous cost structure.

Multiple PC/104 form factors also require compatible expansion modules that may have the same functionality but utilize different expansion buses, potentially adding to design and production complexity.

Nonetheless, PC/104 technology is still ideal for rugged applications with wide temperature ranges, due to the pinand- socket stacking expansion bus connector system and the corner mounting holes which may be used to bolt the stack together.

This makes PC/104 ideal for transportation vehicles and military equipment, where shock and vibration might ultimately destroy a system built and mounted without the rugged and hardened features available through PC/104.

Table of Contents

Executive Summary

  • Page 8 Global demand for PC/104 family modules is expected to increase moderately through 2015
  • Page 9 PC/104 family modules will continue to be deployed in industrial automation and military and defense segments
  • Page 10 Global demand for other stackable form factors is expected to accelerate through 2015
  • Page 11 Other stackable form factors are prominent in the industrial automation and control and medical vertical segments
  • Page 12 Worldwide demand for stackable form factors is predicted to rise through 2015

Scope & Methodology

  • Page 14 VDC's research coverage and analysis examines a number of market segments along three primary dimensions
  • Page 15 Embedded hardware, systems and services research methodology
  • Page 16 Embedded hardware, systems and services research methodology
  • Page 17 Embedded hardware, systems and services research methodology

Market Overview

  • Page 19 Demand for embedded technology derived from multiple market segments will accelerate / decline at varying rates depending
  • on multiple internal / external environmental factors
  • Page 20 Expansion into new vertical markets presenting sustained growth opportunities

Market Segmentation, Estimates & Forecasts

  • Page 22 Global demand for PC/104 family modules is expected to increase moderately through 2015
  • Page 23 PC/104 family modules remain prominent embedded technology, particularly across the Americas region
  • Page 24 Sales of PC/104 family modules are nearly evenly distributed between internal sales teams and third-party distribution
  • Page 25 Equipment OEMs and distributors continue to be the primary customer types for PC/104 family modules
  • Page 26 PC/104 family modules will continue to be deployed in industrial automation and military and defense segments
  • Page 27 Demand for PC/104 and PC/104-Plus architectures is predicted to continue through 2013, as PCI/104 emerges
  • Page 28 PC/104 family modules utilize a range of processors; However, Atom expected to lead by 2013
  • Page 29 Utilization of multiple processor cores in PC/104 family modules will accelerate through 2013
  • Page 30 The percentage of PC/104 family modules shipped with operating systems is expected to rise through 2013
  • Page 31 Linux and Windows Embedded Standard remain the most common operating systems for PC/104 family modules
  • Page 32 PC/104 suppliers typically ship units with serial port controllers, USB controllers, and, increasingly, integrated video
  • Page 33 PC/104 expansion modules increasing being utilized with PC/104 architectures to add features and scalability
  • Page 34 Audio and video among the features increasingly being integrated into PC/104 family modules
  • Page 35 Based on 2010 revenue estimates, Eurotech captured the leading market share position for PC/104 family modules
  • Page 36 Global demand for other stackable form factors is expected to accelerate through 2015
  • Page 37 Other stackable form factors are prominent in the industrial automation and control and medical vertical segments
  • Page 38 Worldwide demand for "other stackable" form factors is expected to grow at a 5-year CAGR of just over 20%
  • Page 39 Among the leading stackable form factors in 2013 will be 3.5" and EPIC and EPIC Express
  • Page 40 Cost pressures expected to fuel Linux adoption over the forecast period
  • Page 41 Other stackable form factors utilize a range of processors, including AMD; However, Atom expected to lead by 2013
  • Page 42 Designs utilizing dual and quad processor cores in "other stackable" form factors expected to grow through 2013
  • Page 43 IEI Technology Corporation captured nearly 19% of worldwide market in 2010 for other stackable form factors

Summaries & Observations

  • Page 45 Worldwide demand for stackable form factors is predicted to rise through 2015
  • Page 46 Vertical industries with unique functional requirements continue to benefit from compact, stackable form factors

LIST OF EXHIBITS

PC/104 Family Modules

  • Exhibit I-1 Total Global Market, PC/104 Family Modules, 2010-2015 (US$ in Millions)
  • Exhibit I-2 PC/104 Family Modules, Normalized Growth Curves, 2010-2015 (Dollar Volume Shipments normalized to 2010 levels)
  • Exhibit I-3 PC/104 Family Modules, Geographic Distribution, 2010 & 2013 (% of Dollar Volume Shipments)
  • Exhibit I-4 PC/104 Family Modules, Distribution / Sales Channels, 2010 & 2013 (% of Dollar Volume Shipments)
  • Exhibit I-5 PC/104 Family Modules, Customer Classes, 2010 & 2013 (% of Dollar Volume Shipments)
  • Exhibit I-6 PC/104 Family Modules, Vertical Markets, 2010 & 2013 (% of Dollar Volume Shipments)
  • Exhibit I-7 PC/104 Family Modules, Communications Market Sub-Segments, 2010 & 2013 (% of Dollar Volume Shipments)
  • Exhibit I-8 PC/104 Family CPU Modules, PC/104 Architectures, 2010 & 2013 (% of Dollar Volume Shipments)
  • Exhibit I-9 PCI/104 Family CPU Modules, Primary Processor Types, 2010 & 2013 (% of Dollar Volume Shipments)
  • Exhibit I-10 PC/104 CPU Modules, Number of Cores, 2010 & 2013 (% of Dollar Volume Shipments)
  • Exhibit I-11 PC/104 Family CPU Modules, Integrated Features, 2010 & 2013 (% of Dollar Volume Shipments)
  • Exhibit I-12 PC/104 Family CPU Modules, Operating System Inclusion, 2010 & 2013 (% of Dollar Volume Shipments)
  • Exhibit I-13 PC/104 Family CPU Modules, Estimated Operating System Use, 2010 & 2013 (% of Dollar Volume Shipments)
  • Exhibit I-14 PC/104 Family CPU Modules (All PC/104 Architectures), Vertical Markets, 2010 & 2013 (% of Dollar Volume Shipments)
  • Exhibit I-15 "PC/104 Family CPU Modules (All PC/104 Architectures), Communications Market Sub-Segments, 2010 & 2013
  • Exhibit I-16 PC/104 Family Expansion Modules, PC/104 Architectures, 2010 & 2013 (% of Dollar Volume Shipments)
  • Exhibit I-17 PC/104 Family Expansion Modules (All PC/104 Architectures), Functional Types, 2010 & 2013 (% of Dollar Volume Shipments)
  • Exhibit I-18 PC/104 Family Expansion Modules (All PC/104 Architectures), Vertical Markets, 2010 & 2013 (% of Dollar Volume Shipments)
  • Exhibit I-19 "PC/104 Family Expansion Modules (All PC/104 Architectures), Communications Market Sub-Segments, 2010 & 2013 (% of Dollar Volume Shipments)"
  • Exhibit I-20 PC/104 Family Modules, Leading Vendors, 2010 Total: US$ 200.8 Million

Other Stackables

  • Exhibit II-1 Total Global Market, Other Stackables, 2010-2015 (US$ in Millions)
  • Exhibit II-2 Other Stackables, Normalized Growth Curve, 2010-2015 (Dollar Volume Shipments normalized to 2010 levels)
  • Exhibit II-3 Other Stackables, Vertical Markets, 2010 & 2013 (% of Dollar Volume Shipments)
  • Exhibit II-4 Other Stackables, Communications Market Sub-Segments, 2010 & 2013 (% of Dollar Volume Shipments)
  • Exhibit II-5 Other Stackable Form Factors, 2010-2015 (US$ in Millions)
  • Exhibit II-6 Other Stackable Form Factors, Normalized Growth Curves, 2010-2015 (Dollar Volume Shipments normalized to 2010 levels)
  • Exhibit II-7 Other Stackable Form Factors, 2009 & 2012 (% of Dollar Volume Shipments)
  • Exhibit II-8 Other Stackables, Estimated Operating System Use, 2010 & 2013 (% of Dollar Volume Shipments)
  • Exhibit II-9 Other Stackables, CPU Types, 2010 & 2013 (% of Dollar Volume Shipments)
  • Exhibit II-10 Other Stackables, Number of CPU Cores, 2010 & 2013 (% of Dollar Volume Shipments)
  • Exhibit II-11 Other Stackables, Number of Discrete Processors, 2010 & 2013 (% of Dollar Volume Shipments)
  • Exhibit II-12 Other Stackables, Expansion Buses, 2009 & 2012 (% of Dollar Volume Shipments)
  • Exhibit II-13 Other Stackables, Integrated Features, 2009 & 2012 (% of Dollar Volume Shipments)
  • Exhibit II-14 Other Stackables, Leading Vendors by Estimated Market Share, 2010 2010 Total: US$ 292.2 Million
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