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フレキシブルプリント回路基板の世界市場:市況・市場規模・展望・動向・予測

Flexible Printed Circuit Board Market (By Type: Single Sided Flex Circuits, Double Sided Flex Circuits, Multi-Layer Flex Circuits, Rigid Flex Circuits; By Application; By Geography) Global Scenario, Market Size, Outlook, Trend and Forecast, 2015-2024

発行 Variant Market Research LLP 商品コード 537269
出版日 ページ情報 英文 140 Pages
納期: 2-3営業日
価格
本日の銀行送金レート: 1USD=108.98円で換算しております。
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フレキシブルプリント回路基板の世界市場:市況・市場規模・展望・動向・予測 Flexible Printed Circuit Board Market (By Type: Single Sided Flex Circuits, Double Sided Flex Circuits, Multi-Layer Flex Circuits, Rigid Flex Circuits; By Application; By Geography) Global Scenario, Market Size, Outlook, Trend and Forecast, 2015-2024
出版日: 2017年07月14日 ページ情報: 英文 140 Pages
概要

当レポートでは、世界のフレキシブルプリント回路基板の市場を調査し、市場の定義と概要、市場への各種影響因子および市場機会の分析、タイプ・用途・地域/主要国別の動向と市場規模の推移と予測、競合環境、主要企業のプロファイルなどをまとめています。

第1章 序章

第2章 エグゼクティブサマリー

第3章 市場概要

  • 市場の方向性・動向・展望・視点
  • 市場シェア分析:企業の競合状況
  • バリューチェーン分析
  • 市場力学
    • 成長推進因子
    • 成長抑制因子
    • 市場機会
  • ポーターのファイブフォース分析
  • 影響分析

第4章 市場分析・予測:タイプ別

  • 片面
    • 現在の動向・分析
    • 市場規模・予測
  • 両面
    • 現在の動向・分析
    • 市場規模・予測
  • 多層
    • 現在の動向・分析
    • 市場規模・予測
  • 硬質
    • 現在の動向・分析
    • 市場規模・予測
  • その他
    • 現在の動向・分析
    • 市場規模・予測

第5章 市場分析・予測:用途別

  • 計装・医療
    • 現在の動向・分析
    • 市場規模・予測
  • コンピューター&データストレージ
    • 現在の動向・分析
    • 市場規模・予測
  • CE製品
    • 現在の動向・分析
    • 市場規模・予測
  • 自動車
    • 現在の動向・分析
    • 市場規模・予測
  • 通信
    • 現在の動向・分析
    • 市場規模・予測
  • 防衛・航空宇宙
    • 現在の動向・分析
    • 市場規模・予測
  • 産業用エレクトロニクス
    • 現在の動向・分析
    • 市場規模・予測
  • その他
    • 現在の動向・分析
    • 市場規模・予測

第6章 市場分析・予測:地域別

  • 北米
    • 米国
    • カナダ
    • メキシコ
  • 欧州
    • ドイツ
    • フランス
    • 英国
    • イタリア
    • その他
  • アジア太平洋
    • 中国
    • インド
    • 日本
    • 韓国
    • その他
  • その他の地域
    • 中東
    • 南米
    • アフリカ

第7章 企業プロファイル

目次

Global Flexible Printed Circuit Board Market is estimated to reach $33 billion by 2024; growing at a CAGR of 10.6% from 2016 to 2024. Flexible printed circuit board (FPCB) is a technology of assembling printed electric circuits on a flexible substrate. FPCB are designed as a replacement for traditional wire harnesses. Rising research & development has led to the development of new FPCBs that have been constantly contributing to the improvement and evolution of people's modern life. FPCB has the ability to adapt easily to miniaturization, uniformity in production, eliminate wiring errors, compact & highly suitable for mass production. They are greatly used in laptops, cell phones, cameras, pacemakers, and cochlear implants, among others. Standards and specifications have been developed by Association Connecting Electronics Industries (IPC) to provide a common ground of understanding for manufacturers and users of FPCBs.

Major drivers of the global flexible printed circuit board market are growing demand for compact & flexible devices, increasing popularity for wearable devices, technological advancements & expanding performance requirements by end-users. However, high initial costs and lack of trained personal to operate may hinder the growth of the market. Furthermore, growing applications in automated robots, automotive sector and healthcare would provide growth opportunities in the coming years.

The global flexible printed circuit board market is segmented based on the type, application and geography. By type, it is segmented into single sided flex circuits, double sided flex circuits, multi-layer flex circuits rigid flex circuits and others. Furthermore, application is segmented into instrumentations & medical, computers & data storage, consumer electronics, automotive, telecommunications, defense & aerospace, industrial electronics and others.

By geography, the FPCB market is segmented into North America, Europe, Asia-Pacific and Rest of the World (RoW). The U.S., Canada and Mexico are covered under North America wherein Europe covers U.K., Italy, Germany, France and others. Asia-Pacific covers India, China, Japan, South Korea and others. Rest of the World (RoW) covers South America, Middle East and Africa.

Key market players include 3M Company, Nippon Mektron, Ltd., Interflex Co., Ltd., Sumitomo Electric Industries, Ltd., LG Innotek, Flexible Circuit Technologies, Inc., Nitto Denko Corp., Fujikura Ltd., Zhen Ding Technology Holding Limited and MFS Technology Ltd.

The key takeaways from the report

  • The report will provide detailed analysis of Flexible Printed Circuit Board market with respect to major segments such as type and application
  • The report will include the qualitative and quantitative analysis with market estimation over 2015-2024 and compound annual growth rate (CAGR) between 2016 and 2024
  • Comprehensive analysis of market dynamics including factors and opportunities will be provided in the report
  • An exhaustive regional analysis of Flexible Printed Circuit Board market will be included in the report
  • Profile of the key players of the Flexible Printed Circuit Board market, will be provided, which include key financials, product & services, new developments, and business strategies.

Scope of Flexible Printed Circuit Board Market

Type Segments

  • Single Sided Flex Circuits
  • Double Sided Flex Circuits
  • Multi-Layer Flex Circuits
  • Rigid Flex Circuits
  • Others

Application Segments

  • Instrumentations & Medical
  • Computers & Data Storage
  • Consumer Electronics
  • Automotive
  • Telecommunications
  • Defense & Aerospace
  • Industrial Electronics
  • Others

Geography Segments

  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • U.K.
    • Italy
    • Germany
    • France
    • Others
  • Asia-Pacific
    • India
    • China
    • Japan
    • South Korea
    • Others
  • RoW
    • South America
    • Middle East
    • Africa

Table of Contents

Chapter 1 Prefix

  • 1.1 Market Scope
  • 1.2 Report Description
  • 1.3 Research Methodology
    • 1.3.1 Primary Research
    • 1.3.2 Secondary Research
    • 1.3.3 In-house Data Modeling

Chapter 2 Executive Summary

Chapter 3 Market Outline

  • 3.1 Market Inclination, Trend, Outlook and Viewpoint
  • 3.2 Market Share Analysis: Company's Competitive Scenario
  • 3.3 Value Chain Analysis
  • 3.4 Market Dynamics
    • 3.4.1 Drivers
      • 3.4.1.1 Impact Analysis
    • 3.4.2 Restraints
      • 3.4.2.1 Impact Analysis
    • 3.4.3 Opportunities
  • 3.5 Porter's five forces analysis
    • 3.5.1 Factors Impact Analysis

Chapter 4 Flexible Printed Circuit Board Market by Type: Market Size and Forecast, 2015 - 2024

  • 4.1 Single Sided Flex Circuits
    • 4.1.1 Current Trend and Analysis
    • 4.1.2 Market Size and Forecast
  • 4.2 Double Sided Flex Circuits
    • 4.2.1 Current Trend and Analysis
    • 4.2.2 Market Size and Forecast
  • 4.3 Multi-Layer Flex Circuits
    • 4.3.1 Current Trend and Analysis
    • 4.3.2 Market Size and Forecast
  • 4.4 Rigid Flex Circuits
    • 4.4.1 Current Trend and Analysis
    • 4.4.2 Market Size and Forecast
  • 4.5 Other Types
    • 4.5.1 Current Trend and Analysis
    • 4.5.2 Market Size and Forecast

Chapter 5 Flexible Printed Circuit Board Market by Application: Market Size and Forecast, 2015 - 2024

  • 5.1 Instrumentation & Medical
    • 5.1.1 Current Trend and Analysis
    • 5.1.2 Market Size and Forecast
  • 5.2 Computers & Data Storage
    • 5.2.1 Current Trend and Analysis
    • 5.2.2 Market Size and Forecast
  • 5.3 Consumer Electronics
    • 5.3.1 Current Trend and Analysis
    • 5.3.2 Market Size and Forecast
  • 5.4 Automotive
    • 5.4.1 Current Trend and Analysis
    • 5.4.2 Market Size and Forecast
  • 5.5 Telecommunications
    • 5.5.1 Current Trend and Analysis
    • 5.5.2 Market Size and Forecast
  • 5.6 Defense & Aerospace
    • 5.6.1 Current Trend and Analysis
    • 5.6.2 Market Size and Forecast
  • 5.7 Industrial Electronics
    • 5.7.1 Current Trend and Analysis
    • 5.7.2 Market Size and Forecast
  • 5.8 Other Applications
    • 5.8.1 Current Trend and Analysis
    • 5.8.2 Market Size and Forecast

Chapter 6 Flexible Printed Circuit Board Market by Geography: Market Size and Forecast, 2015 - 2024

  • 6.1 North America
    • 6.1.1 Current Trend and Analysis
    • 6.1.2 Market Size and Forecast
    • 6.1.3 US
    • 6.1.4 Canada
    • 6.1.5 Mexico
  • 6.2 Europe
    • 6.2.1 Current Trend and Analysis
    • 6.2.2 Market Size and Forecast
    • 6.2.3 Germany
    • 6.2.4 France
    • 6.2.5 United Kingdom
    • 6.2.6 Italy
    • 6.2.7 Others
  • 6.3 Asia-Pacific
    • 6.3.1 Current Trend and Analysis
    • 6.3.2 Market Size and Forecast
    • 6.3.3 China
    • 6.3.4 India
    • 6.3.5 Japan
    • 6.3.6 South Korea
    • 6.3.7 Others
  • 6.4 RoW
    • 6.4.1 Current Trend and Analysis
    • 6.4.2 Market Size and Forecast
    • 6.4.3 Middle East
    • 6.4.4 South America
    • 6.4.5 Africa

Chapter 7 Company Profiles

  • 7.1 3M Company
  • 7.2 Nippon Mektron, Ltd.
  • 7.3 Interflex Co., Ltd.
  • 7.4 Sumitomo Electric Industries, Ltd.
  • 7.5 LG Innotek
  • 7.6 Flexible Circuit Technologies, Inc.
  • 7.7 Nitto Denko Corp.
  • 7.8 Fujikura Ltd.
  • 7.9 Zhen Ding Technology Holding Limited
  • 7.10 MFS Technology Ltd
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