市場調査レポート

世界の3次元IC市場(MEMS・センサー、RF SiP、オプトエレクトロニクス・イメージング、メモリー、ロジック、HB LED)-産業分析・市場規模・シェア・成長・動向・予測

3D ICs (MEMS and sensors, RF SiP, Optoelectronics and imaging, Memories, Logic, HB LED) Market - Global Industry Analysis, Size, Share, Growth, Trends, and Forecast, 2013 - 2019

発行 Transparency Market Research 商品コード 294669
出版日 ページ情報 英文 83 Pages
納期: 即日から翌営業日
価格
本日の銀行送金レート: 1USD=101.51円で換算しております。
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世界の3次元IC市場(MEMS・センサー、RF SiP、オプトエレクトロニクス・イメージング、メモリー、ロジック、HB LED)-産業分析・市場規模・シェア・成長・動向・予測 3D ICs (MEMS and sensors, RF SiP, Optoelectronics and imaging, Memories, Logic, HB LED) Market - Global Industry Analysis, Size, Share, Growth, Trends, and Forecast, 2013 - 2019
出版日: 2014年01月15日 ページ情報: 英文 83 Pages
概要

世界の3次元IC(3D IC)市場は、技術の複雑さと低い認知度によって特徴づけられる時期にあります。この市場に関わっている産業は、技術進歩と生産量拡大との間で、効果的に支出のバランスを取る必要があります。3次元IC市場は、まだ十分に認知されていません。多様なエンドユーザー分野への普及の進展は、主に研究開発イニシアチブに依るものです。様々な地域において、その成長パターンは多様であり、これらの多様性は使われる技術と選ばれる用途に基づいています。

当レポートでは、世界の3次元IC(3D IC)市場の現状と見通しについて調査分析し、市場の推定実績および予測、市場成長促進要因・阻害要因の分析、エンドユース産業別・基板タイプ別・製造プロセス別・製品別・地域別の市場分析、主要企業のプロファイルをまとめるなど、概略以下の構成でお届けいたします。

第1章 はじめに

  • 調査の説明
    • 市場区分
  • 調査手法

第2章 エグゼクティブサマリー

第3章 3次元IC市場の概要

  • イントロダクション
  • 市場動態
  • 市場成長促進要因
    • 効率的なソリューションに対する需要の拡大
    • 携帯型デバイス数の増加
  • 市場成長阻害要因
    • 高いコスト、熱および検査の問題
  • 市場機会
    • Big Data(ビッグデータ)と予測的アナリティクス
  • 動向と将来展望
    • マルチチップパッケージング
    • IntSim
  • バリューチェーン分析
    • 購買物流
    • オペレーション
    • 出荷物流
    • マーケティング、販売およびサービス
  • ポーターのファイブフォース分析
  • 技術概要
    • 2.5次元IC技術から3次元ICへの移行
    • 3次元IC製造プロセス
    • 3次元IC生産の各段階における標準化の問題
    • 特許申請
  • 市場魅力分析
  • 競合分析
    • 主要企業の市場シェア(%)

第4章 世界の3次元IC市場、エンドユース産業別

  • 世界の3次元IC市場概要、エンドユース産業別(%)
  • 家電製品用3次元IC市場(100万米ドル)
  • 情報通信技術用3次元IC市場(100万米ドル)
  • 輸送(自動車・航空宇宙)用3次元IC市場(100万米ドル)
  • 軍用3次元IC市場(100万米ドル)
  • その他(生物医学アプリケーション・研究開発)用3次元IC市場(100万米ドル)

第5章 世界の3次元IC市場、基板タイプ別

  • 世界の3次元IC市場概要、基板タイプ別(%)
  • シリコンオンインシュレーター(SOI)3次元IC市場(100万米ドル)
  • バルクシリコン3次元IC市場(100万米ドル)

第6章 世界の3次元IC市場、製造プロセス別

  • 世界の3次元IC市場概要、製造プロセス別(%)
  • ビーム再結晶3次元IC市場(100万米ドル)
  • ウエハーボンディング(接合)3次元IC市場(100万米ドル)
  • シリコンエピタキシャル成長3次元IC市場(100万米ドル)
  • 固相結晶3次元IC市場(100万米ドル)

第7章 世界の3次元IC市場、製品別

  • 世界の3次元IC市場概要、製品別(%)
  • MEMS・センサー3次元IC市場(100万米ドル)
  • RF SiP 3次元IC市場(100万米ドル)
  • オプトエレクトロニクス・イメージング3次元IC市場(100万米ドル)
  • メモリー(3次元スタック)3次元IC市場(100万米ドル)
  • ロジック3次元IC市場(100万米ドル)
  • HB LED 3次元IC市場(100万米ドル)

第8章 世界の3次元IC市場、地域別

  • 世界の3次元IC市場概要、地域別(%)
  • 北米の3次元IC市場(100万米ドル)
  • 欧州の3次元IC市場(100万米ドル)
  • アジア太平洋の3次元IC市場(100万米ドル)
  • その他地域の3次元IC市場(100万米ドル)

第9章 企業プロファイル(企業概要、業績概要、事業戦略、最近の動向)

  • Taiwan Semiconductor Manufacturing Company, Ltd.
  • XILINX, Inc.
  • The 3M Company
  • STATS ChipPAC Ltd.
  • Tezzaron Semiconductor Corporation
  • United Microelectronics Corporation
  • Ziptronix, Inc.
  • エルピーダメモリ(Micron Technology, Inc.)
  • MonolithIC 3D Inc.

図表

目次

This report analyzes the 3D ICs market on a global basis, with further breakdown into various sub-segments. It provides cross-sectional analysis of the market based on parameters such as geography, system type, applications and networking technology. The analysis covers market estimates in terms of revenue and forecast for the period of 2013 to 2019.

The global 3D ICs market is going through a phase marked with complexity of technology and low awareness. Industries in this market need to effectively balance their expenditure between technology advancement and capacity expansion. The 3D ICs market is yet to achieve complete recognition. Its successful penetration into various end-user sectors is mainly administered by research and development initiatives. There are variations in growth pattern across different geographies. These variations exist in terms of technologies used and applications preferred. This report is thereby produced to give a detailed overview of the ongoing trends in the market. It includes a review of market dynamics with focus on market drivers, growth challenges (restraints), and opportunities. The value chain analysis and Porter's five forces analysis included in the report further help in assessing the market situation and competitiveness. Market attractiveness analysis highlights key segments of the market and their comparative attractiveness against other segments.

Apart from the detailed sub-segment analysis as mentioned below, this report also provides company profiles of key market players. The competitive profiling of these players includes company and financial overview, business strategies adopted by them, and their recent developments which can help in assessing competition in the market. Major companies included in this report are Taiwan Semiconductor Manufacturing Company, Ltd. (TSMC), Xilinx Inc., 3M Company, Micron Technology Inc., (Elpida Memory Inc.), Ziptronix, Inc., Tezzaron Semiconductor Corporation, MonolithIC 3D Inc., STATS ChipPAC Ltd. and United Microelectronics Corporation (UMC).

This report analyzes the global 3D ICs market in terms of revenue (USD million). The market has been segmented as follows:

3D ICs Market, By End-Use Sectors:

  • Consumer electronics
  • Information and communication technology
  • Transport (automotive and aerospace)
  • Military
  • Others(Biomedical applications and R&D)

3D ICs Market, By Substrate Type:

  • Silicon on insulator(SOI)
  • Bulk Silicon

3D ICs Market, By Fabrication Process:

  • Beam re-crystallization
  • Wafer bonding
  • Silicon epitaxial growth
  • Solid phase crystallization

3D ICs Market, By Product:

  • MEMS and Sensor
  • RF SiP
  • Optoelectronics and imaging
  • Memories (3D Stacks)
  • Logic (3D Sip/Soc)
  • HB LED

3D ICs Market, By Geography:

  • North America
  • Europe
  • Asia Pacific
  • Rest of World (RoW)

Table of Contents

Chapter 1 - Preface

  • 1.1. Report description and scope
    • 1.1.1. Market segmentation
  • 1.2. Research methodology

Chapter 2 - Executive Summary

  • 2.1. Global 3D ICs market snapshot, 2012 & 2019
  • 2.2. Global 3D ICs market, 2011 - 2019 (USD million)

Chapter 3 - 3D ICs Market Overview

  • 3.1. Introduction
  • 3.2. Market dynamics
    • 3.2.1. Drivers
      • 3.2.1.1. Growing demand for efficient solutions
      • 3.2.1.2. Rise in number of portable devices
    • 3.2.2. Restraints
      • 3.2.2.1. High cost, thermal and testing issues
    • 3.2.3. Opportunities
      • 3.2.3.1. Big Data and predictive analytics
  • 3.3. Trends and future outlook
    • 3.3.1. Multi-chip packaging
    • 3.3.2. IntSim
  • 3.4. Value chain analysis
    • 3.4.1. Inbound logistics
    • 3.4.2. Operations
    • 3.4.3. Out-bound logistics
    • 3.4.4. Marketing, sales and services
  • 3.5. Porter's five forces analysis
    • 3.5.1. Bargaining power of suppliers
    • 3.5.2. Bargaining power of buyers
    • 3.5.3. Threat of substitutes
    • 3.5.4. Threat of new entrants
    • 3.5.5. Degree of competition
  • 3.6. Technology overview
    • 3.6.1. Shift to 3D IC from 2.5D IC technology
    • 3.6.2. 3D IC fabrication processes
    • 3.6.3. Standards issues at different levels of 3D IC production
    • 3.6.4. Patent filings
  • 3.7. Market attractiveness analysis
  • 3.8. Competitive analysis
    • 3.8.1. Market share of key players, 2012 (%)

Chapter 4 - Global 3D ICs Market, by End-Use Industry

  • 4.1. Global 3D ICs market overview, by end-use industry, 2012 & 2019 (%)
  • 4.2. Consumer electronics 3D ICs market, 2011 - 2019 (USD million)
  • 4.3. Information and communication technology 3D ICs market, 2011 - 2019 (USD million)
  • 4.4. Transport (automotive and aerospace) 3D ICs market, 2011 - 2019 (USD million)
  • 4.5. Military 3D ICs market, 2011 - 2019 (USD million)
  • 4.6. Others (Biomedical applications and R&D) 3D ICs market, 2011 - 2019 (USD million)

Chapter 5 - Global 3D ICs Market, by Substrate Type

  • 5.1. Global 3D ICs market overview, by substrate type, 2012 & 2019 (%)
  • 5.2. Silicon on insulator (SOI) 3D ICs market, 2011 - 2019 (USD million)
  • 5.3. Bulk silicon 3D ICs market, 2011 - 2019 (USD million)

Chapter 6 - Global 3D ICs Market, by Fabrication Process

  • 6.1. Global 3D ICs market overview, by fabrication process, 2012 & 2019 (%)
  • 6.2. Beam re-crystallization 3D ICs market, 2011 - 2019 (USD million)
  • 6.3. Wafer bonding 3D ICs market, 2011 - 2019 (USD million)
  • 6.4. Silicon epitaxial growth 3D ICs market, 2011 - 2019 (USD million)
  • 6.5. Solid phase crystallization 3D ICs market, 2011 - 2019 (USD million)

Chapter 7 - Global 3D ICs Market, by Product

  • 7.1. Global 3D ICs market overview, by product, 2012 & 2019 (%)
  • 7.2. MEMS and sensors 3D ICs market, 2011 - 2019 (USD million)
  • 7.3. RF SiP 3D ICs market, 2011 - 2019 (USD million)
  • 7.4. Optoelectronics and imaging 3D ICs market, 2011 - 2019 (USD million)
  • 7.5. Memories (3D Stacks) 3D ICs market, 2011 - 2019 (USD million)
  • 7.6. Logic 3D SiP/SoC 3D ICs market, 2011 - 2019 (USD million)
  • 7.7. HB LED 3D ICs market, 2011 - 2019 (USD million)

Chapter 8 - Global 3D ICs Market, by Geography

  • 8.1. Global 3D ICs market overview, by geography, 2012 & 2019 (%)
  • 8.2. North America 3D ICs market, 2011 - 2019 (USD million)
  • 8.3. Europe 3D ICs market, 2011 - 2019 (USD million)
  • 8.4. Asia Pacific 3D ICs market, 2011 - 2019 (USD million)
  • 8.5. RoW 3D ICs market, 2011 - 2019 (USD million)

Chapter 9 - Company Profiles

  • 9.1. Taiwan Semiconductor Manufacturing Company, Ltd.
    • 9.1.1. Company overview
    • 9.1.2. Financial overview
    • 9.1.3. Business strategies
    • 9.1.4. Recent developments
  • 9.2. XILINX, Inc.
    • 9.2.1. Company overview
    • 9.2.2. Financial overview
    • 9.2.3. Business strategies
    • 9.2.4. Recent developments
  • 9.3. The 3M Company
    • 9.3.1. Company overview
    • 9.3.2. Financial overview
    • 9.3.3. Business strategies
    • 9.3.4. Recent developments
  • 9.4. STATS ChipPAC Ltd.
    • 9.4.1. Company overview
    • 9.4.2. Financial overview
    • 9.4.3. Business strategies
    • 9.4.4. Recent developments
  • 9.5. Tezzaron Semiconductor Corporation
    • 9.5.1. Company overview
    • 9.5.2. Financial overview
    • 9.5.3. Business strategies
    • 9.5.4. Recent developments
  • 9.6. United Microelectronics Corporation
    • 9.6.1. Company overview
    • 9.6.2. Financial overview
    • 9.6.3. Business strategies
    • 9.6.4. Recent developments
  • 9.7. Ziptronix, Inc.
    • 9.7.1. Company overview
    • 9.7.2. Financial overview
    • 9.7.3. Business strategies
    • 9.7.4. Recent developments
  • 9.8. Elpida Memory, Inc. (Micron Technology, Inc.)
    • 9.8.1. Company overview
    • 9.8.2. Financial overview
    • 9.8.3. Business strategies
    • 9.8.4. Recent developments
  • 9.9. MonolithIC 3D Inc.
    • 9.9.1. Company overview
    • 9.9.2. Financial overview
    • 9.9.3. Business strategies
    • 9.9.4. Recent developments

List of Figures

  • FIG. 1: Global 3D ICs market, 2011 - 2019 (USD million) and Y-o-Y growth (%)
  • FIG. 2: Global smartphone and tablet shipment forecast, 2010 - 2015 (million units)
  • FIG. 3: Value chain analysis
  • FIG. 4: Porter's five forces analysis
  • FIG. 5: Market attractiveness analysis, by end-use sectors, 2012
  • FIG. 6: Market share of key players, 2012 (%)
  • FIG. 7: Global 3D ICs market overview, by end-use industry, 2012 & 2019 (%)
  • FIG. 8: Consumer electronics 3D ICs market, 2011 - 2019 (USD million)
  • FIG. 9: Information and communication technology 3D ICs market, 2011 - 2019 (USD million)
  • FIG. 10: Transport (automotive and aerospace) 3D ICs market, 2011 - 2019 (USD million)
  • FIG. 11: Military 3D ICs market, 2011 - 2019 (USD million)
  • FIG. 12: Others (Biomedical applications and R&D) 3D ICs market, 2011 - 2019 (USD million)
  • FIG. 13: Global 3D ICs market overview, by substrate type, 2012 & 2019 (%)
  • FIG. 14: Silicon on insulator (SOI) 3D ICs market, 2011 - 2019 (USD million)
  • FIG. 15: Bulk silicon 3D ICs market, 2011 - 2019 (USD million)
  • FIG. 16: Global 3D ICs market overview, by fabrication process, 2012 & 2019 (%)
  • FIG. 17: Beam re-crystallization 3D ICs market, 2011 - 2019 (USD million)
  • FIG. 18: Wafer bonding 3D ICs market, 2011 - 2019 (USD million)
  • FIG. 19: Silicon epitaxial growth 3D ICs market, 2011 - 2019 (USD million)
  • FIG. 20: Solid phase crystallization 3D ICs market, 2011 - 2019 (USD million)
  • FIG. 21: Global 3D ICs market overview, by product, 2012 & 2019 (%)
  • FIG. 22: MEMS and sensors 3D ICs market, 2011 - 2019 (USD million)
  • FIG. 23: RF SiP 3D ICs market, 2011 - 2019 (USD million)
  • FIG. 24: Optoelectronics and imaging 3D ICs market, 2011 - 2019 (USD million)
  • FIG. 25: Memories (3D Stacks) 3D ICs market, 2011 - 2019 (USD million)
  • FIG. 26: Logic 3D SiP/SoC 3D ICs market, 2011 - 2019 (USD million)
  • FIG. 27: HB LED 3D ICs market, 2011 - 2019 (USD million)
  • FIG. 28: Global 3D ICs market overview, by geography, 2012 & 2019 (%)
  • FIG. 29: North America 3D ICs market, 2011 - 2019 (USD million)
  • FIG. 30: Europe 3D ICs market, 2011 - 2019 (USD million)
  • FIG. 31: Asia Pacific 3D ICs market, 2011 - 2019 (USD million)
  • FIG. 32: RoW 3D ICs market, 2011 - 2019 (USD million)
  • FIG. 33: Taiwan Semiconductor Manufacturing Company, Ltd. annual revenues, 2010 - 2012 (USD billion)
  • FIG. 34: Xilinx, Inc., annual revenues, 2010 - 2012 (USD billion)
  • FIG. 35: 3M Company annual revenues, 2010 - 2012 (USD billion)
  • FIG. 36: STATS ChipPAC Ltd., annual revenues, 2010 - 2012 (USD million)
  • FIG. 37: United Microelectronics Corporation annual revenues, 2010 - 2012 (USD billion)
  • FIG. 38: Micron Technology, Inc., annual revenues, 2010 - 2011 (USD billion)

List of Tables

  • TABLE 1: 3D ICs market segmentation
  • TABLE 2: Global 3D ICs market snapshot, 2012 & 2019
  • TABLE 3: Impact analysis of drivers
  • TABLE 4: Comparison for 2D and 3D designs for low density parity check (LDPC) code decoder
  • TABLE 5: Impact analysis of restraint
  • TABLE 6: Overview of different 3D IC fabrication processes
  • TABLE 7: Issues at different levels of 3D IC
  • TABLE 8: Patents by companies
  • TABLE 9: Geographical distribution of patents
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