Product Code: TIPRE00005443
The system in package (SiP) technology market was valued at US$ 13,756.20 billion in 2019 and is projected to reach US$ 22,013.45 billion by 2027. The system in package (SiP) technology market is expected to grow at a CAGR of 8.4% during the forecast period of 2020 to 2027.
The global system in package (SiP) technology market has been segmented into four major regions-North America, Europe, APAC and rest of the word. In 2019, APAC led the global system in package (SiP) technology market with 49.7% revenue share. The North America region has strong penetration of advanced electronics devices compatible with advanced networking systems to connect network services of 5G, 4G and VoLTE. Also, Asian market witnesses' massive growth in system in package (SiP) technologies about an increased adoption of smartphones and wearables devices. In developing nations of India and China market is driven by the growing population of techno savvy persons. Therefore, the adoption of system in package technology to miniaturize the electronic devices and small form factor based electronic demand is rising. China is one of the major countries which has a significant market share in the system in package (SiP) technology. Market driven by increasing smartphone and 5G network adoption. European countries such as UK, Italy, France and others shifting towards digitalization and automation which is driving the market growth.
In North America, the US is the most developed country. The U.S. country is an early adopter of technologies, the scope of the newly developed compact electronics is high in the North America region. More adoption of 5G network as well as compatible smartphones and other devices is witnessed in the US compared to other North American countries. This factor encourages system in package (SiP) technology providers to increased their focus to develop or innovate system in package technology for wide range of application.
The overall system in package (SiP) technology market size has been derived using both primary and secondary sources. To begin the research process, exhaustive secondary research has been conducted using internal and external sources to obtain qualitative and quantitative information related to the system in package (SiP) technology market. The process also serves the purpose of obtaining an overview and forecast for the system in package (SiP) technology market with respect to all the segments. It also provides the overview and forecast for the global system in package (SiP) technology market based on all the segmentation provided with respect to four major regions-North America, Europe, Asia Pacific, and rest of the World. Also, primary interviews were conducted with industry participants and commentators to validate data as well as to gain more analytical insights into the topic. Participants of this process include industry experts, such as VPs, business development managers, market intelligence managers, and national sales managers, along with external consultants, such as valuation experts, research analysts and key opinion leaders specializing in the system in package (SiP) technology market.
Reasons to Buy:
Highlights key business priorities in order to assist companies to realign their business strategies.
The key findings and recommendations highlight crucial progressive industry trends in the system-in-packager market, thereby allowing players to develop effective long term strategies.
Develop/modify business expansion plans by using substantial growth offering developed and emerging markets.
Scrutinize in-depth global market trends and outlook coupled with the factors driving the market, as well as those hindering it.
Enhance the decision-making process by understanding the strategies that underpin commercial interest with respect to packaging technology, packaging type, interconnection technology, and end-user industry.
Table Of Contents
1. Introduction
- 1.1 Scope of the Study
- 1.2 The Insight Partners Research Report Guidance
- 1.3 Market Segmentation
- 1.3.1 Global System in Package (SiP) Technology Market - By Packaging Technology
- 1.3.2 Global System in Package (SiP) Technology Market - By Packaging Type
- 1.3.3 Global System in Package (SiP) Technology Market - By Interconnection Technology
- 1.3.4 Global System in Package (SiP) Technology Market - By End-User Industry
- 1.3.5 Global System in Package (SiP) Technology Market - By Geography
2. Key Takeaways
3. Research Methodology
- 3.1 Coverage
- 3.2 Secondary Research
- 3.3 Primary Research
4. SiP Technology - Market Landscape
- 4.1 Market Overview
- 4.2 PEST Analysis
- 4.2.1 North America
- 4.2.2 Europe
- 4.2.3 Asia-Pacific
- 4.2.4 Rest of the World
- 4.3 Ecosystem Analysis
5. SiP Technology -Market Dynamics
- 5.1 Key Market Drivers
- 5.1.1 Growing Demand for Miniaturization of Electronic
- 5.1.2 Rising Development in Network Services- 5G Network
- 5.2 Key Market Restraints
- 5.2.1 Technical Issues and Availability Alternative Solution
- 5.3 Key Market Opportunities
- 5.3.1 Rising Demand to Enhance Smartphone and PC performance
- 5.4 Future Trends
- 5.4.1 Rapid Growth in Wearable technology and the IoT
- 5.5 Impact Analysis of Drivers and Restraints
6. SiP Technology Market - Global Analysis
- 6.1 Global System in Package (SiP) Technology Market Overview
- 6.2 Global System in Package (SiP) Technology Market Revenue Forecast and Analysis
- 6.3 Market Positioning - Five Key Players
7. SiP Technology Market Analysis - by Packaging Technology
- 7.1 Overview
- 7.2 SiP Technology Market Breakdown, by packaging technology, 2017 & 2027
- 7.3 2D IC
- 7.3.1 Overview
- 7.3.2 2D IC Market Forecast and Analysis
- 7.4 2.5D IC
- 7.4.1 Overview
- 7.4.2 2.5D IC Market Forecast and Analysis
- 7.5 3D IC
- 7.5.1 Overview
- 7.5.2 3D IC Market Forecast and Analysis
8. SiP Technology Market Analysis - Packaging Type
- 8.1 Overview
- 8.2 Global SiP Technology Market Breakdown, By Packaging Type, 2017 &2027
- 8.3 Flip-Chip/Wire-Bond SiP Market
- 8.3.1 Overview
- 8.3.2 Flip-Chip/Wire-Bond SiP Market Forecast and Analysis
- 8.4 Fan-Out SiP Market
- 8.4.1 Overview
- 8.4.2 Fan-Out SiP Market Forecast and Analysis
- 8.5 Embedded SiP Market
- 8.5.1 Overview
- 8.5.2 Embedded SiP Market Forecast and Analysis
9. SiP Technology Market Analysis - By Interconnection Technique
- 9.1 Overview
- 9.2 SiP technology Market Breakdown, By Interconnection Technique, 2017 &2027
- 9.3 Small Outline
- 9.3.1 Overview
- 9.3.2 Small Outline Market Forecast and Analysis
- 9.4 Flat Packages
- 9.4.1 Overview
- 9.4.2 Flat Packages Market Forecast and Analysis
- 9.5 Pin Grid Arrays
- 9.5.1 Overview
- 9.5.2 Pin Grid Arrays Market Forecast and Analysis
- 9.6 Surface Mount
- 9.6.1 Overview
- 9.6.2 Surface Mount Market Forecast and Analysis
- 9.7 Others
- 9.7.1 Overview
- 9.7.2 Others Market Forecast and Analysis
10. SiP Technology Market Analysis - By End-User Industry
- 10.1 Overview
- 10.2 SiP technology Market Breakdown, By END-USER INDUSTRY, 2017 &2027
- 10.3 Automotive
- 10.3.1 Overview
- 10.3.2 Automotive Market Forecast and Analysis
- 10.4 Aerospace & Defense
- 10.4.1 Overview
- 10.4.2 Aerospace and Defense Market Forecast and Analysis
- 10.5 Consumer Electronics
- 10.5.1 Overview
- 10.5.2 Consumer Electronics
- 10.6 Telecommunications
- 10.6.1 Overview
- 10.6.2 Telecommunication Market Forecast and Analysis
- 10.7 Others
- 10.7.1 Overview
- 10.7.2 Others Market Forecast and Analysis
11. SiP Technology Market - Geographic Analysis
- 11.1 Overview
- 11.2 North America: SiP Technology Market
- 11.2.1 North America: SiP technology Market - Revenue and Forecast to 2027 (US$ Million)
- 11.2.2 North America: SiP technology Market, By Country
- 11.2.3 North America: SiP technology Market, By Packaging Technology
- 11.2.4 North America: SiP technology Market, By Packaging Type
- 11.2.5 North America: SiP Technology Market, By Interconnection Technology
- 11.2.6 North America: SiP Technology Market, By End-user Industry
- 11.2.7 United States: SiP technology Market - Revenue and Forecast to 2027 (US$ Million)
- 11.2.7.1 United States System in Package (SiP) Technology Market, by Packaging Technology
- 11.2.7.2 United States System in Package (SiP) Technology Market, by Packaging Type
- 11.2.7.3 United States System in Package (SiP) Technology Market, by Interconnection Technology
- 11.2.7.4 United States System in Package (SiP) Technology Market, by End-user Industry
- 11.2.8 Canada: SiP technology Market - Revenue and Forecast to 2027 (US$ Million)
- 11.2.8.1 Canada System in Package (SiP) Technology Market, by Packaging Technology
- 11.2.8.2 Canada System in Package (SiP) Technology Market, by Packaging Type
- 11.2.8.3 Canada System in Package (SiP) Technology Market, by Interconnection Technology
- 11.2.8.4 Canada System in Package (SiP) Technology Market, by End-user
- 11.2.9 Mexico: SiP technology Market - Revenue and Forecast to 2027 (US$ Million)
- 11.2.9.1 Mexico System in Package (SiP) Technology Market, by Packaging Technology
- 11.2.9.2 Mexico System in Package (SiP) Technology Market, by Packaging
- 11.2.9.3 Mexico System in Package (SiP) Technology Market, by Interconnection Technology
- 11.2.9.4 Mexico System in Package (SiP) Technology Market, by End-user Industry
- 11.3 Europe SiP Technology Market Breakdown by Key Countries
- 11.3.1 Europe: SiP technology Market - Revenue and Forecast to 2027 (US$ Million)
- 11.3.2 Europe: SiP technology Market, By Country
- 11.3.3 Europe: SiP Technology Market, By Packaging Technology
- 11.3.4 Europe: SiP Technology Market, By Packaging Type
- 11.3.5 Europe: SiP Technology Market, By Interconnection Technology
- 11.3.6 Europe: SiP Technology Market, By End-user Industry
- 11.3.7 France SiP Technology System Market Revenue and Forecasts to 2027 (US$ million)
- 11.3.7.1 France System in Package (SiP) Technology Market, by Packaging Technology
- 11.3.7.2 France System in Package (SiP) Technology Market, by Packaging Type
- 11.3.7.3 France System in Package (SiP) Technology Market, by Interconnection Technology
- 11.3.7.4 France System in Package (SiP) Technology Market, by End-user Industry
- 11.3.8 Germany SiP Technology Market Revenue and Forecast to 2027 (US$ million)
- 11.3.8.1 Germany System in Package (SiP) Technology Market, by Packaging Technology
- 11.3.8.2 Germany System in Package (SiP) Technology Market, by Packaging
- 11.3.8.3 Germany System in Package (SiP) Technology Market, by Interconnection Technology
- 11.3.8.4 Germany System in Package (SiP) Technology Market, by End-user Industry
- 11.3.9 Italy SiP Technology System Market Revenue and Forecasts to 2027 (US$ million)
- 11.3.9.1 Italy System in Package (SiP) Technology Market, by Packaging Technology
- 11.3.9.2 Italy System in Package (SiP) Technology Market, by Packaging Type
- 11.3.9.3 Italy System in Package (SiP) Technology Market, by Interconnection
- 11.3.9.4 Italy System in Package (SiP) Technology Market, by End-user Industry
- 11.3.10 United Kingdom: SiP technology Market Revenue and Forecasts to 2027 (US$ million)
- 11.3.10.1 United Kingdom System in Package (SiP) Technology Market, by Packaging Technology
- 11.3.10.2 United Kingdom System in Package (SiP) Technology Market, by Packaging Type
- 11.3.10.3 United Kingdom System in Package (SiP) Technology Market, by Interconnection Technology
- 11.3.10.4 United Kingdom System in Package (SiP) Technology Market, by End-User Industry
- 11.3.11 Russia SiP Technology Market Revenue and Forecasts to 2027 (US$ million)
- 11.3.11.1 Russia System in Package (SiP) Technology Market, by Packaging Technology
- 11.3.11.2 Russia System in Package (SiP) Technology Market, by Packaging Type
- 11.3.11.3 Russia System in Package (SiP) Technology Market, by Interconnection Technology
- 11.3.11.4 Russia System in Package (SiP) Technology Market, by End-User
- 11.3.12 Rest of Europe SiP Technology Market Revenue and Forecasts to 2027 (US$ million)
- 11.3.12.1 Rest of Europe System in Package (SiP) Technology Market, by Packaging Technology
- 11.3.12.2 Rest of Europe System in Package (SiP) Technology Market, by Packaging Type
- 11.3.12.3 Rest of Europe System in Package (SiP) Technology Market, by Interconnection Technology
- 11.3.12.4 Rest of Europe System in Package (SiP) Technology Market, by End-user Industry
- 11.4 Asia Pacific in SiP Technology Market Breakdown by Key Countries
- 11.4.1 Asia Pacific: SiP technology Market - Revenue and Forecast to 2027 (US$ Million)
- 11.4.2 Asia Pacific: SiP technology Market, By Country
- 11.4.3 Asia Pacific: SiP Technology Market, By Packaging Technology
- 11.4.4 Asia Pacific: SiP Technology Market, By Packaging Type
- 11.4.5 Asia Pacific: SiP Technology Market, By Interconnection Technology
- 11.4.6 Asia Pacific: SiP Technology Market, By End-user Industry
- 11.4.7 China SiP Technology System Market Revenue and Forecasts to 2027 (US$ million)
- 11.4.7.1 China System in Package (SiP) Technology Market, by Packaging Technology
- 11.4.7.2 China System in Package (SiP) Technology Market, by Packaging Type
- 11.4.7.3 China System in Package (SiP) Technology Market, by Interconnection Technology
- 11.4.7.4 China System in Package (SiP) Technology Market, by End-User Industry
- 11.4.8 Japan SiP Technology Market Revenue and Forecast to 2027 (US$ million)
- 11.4.8.1 Japan System in Package (SiP) Technology Market, by Packaging Technology
- 11.4.8.2 Japan System in Package (SiP) Technology Market, by Packaging
- 11.4.8.3 Japan System in Package (SiP) Technology Market, by Interconnection Technology
- 11.4.8.4 Japan System in Package (SiP) Technology Market, by End-user Industry
- 11.4.9 Australia SiP Technology System Market Revenue and Forecasts to 2027 (US$ million)
- 11.4.9.1 Australia System in Package (SiP) Technology Market, by Packaging Technology
- 11.4.9.2 Australia System in Package (SiP) Technology Market, by Packaging Type
- 11.4.9.3 Australia System in Package (SiP) Technology Market, by Interconnection Technology
- 11.4.9.4 Australia System in Package (SiP) Technology Market, by End-user Industry
- 11.4.10 India SiP Technology Market Revenue and Forecasts to 2027 (US$ million)
- 11.4.10.1 India System in Package (SiP) Technology Market, by Packaging Technology
- 11.4.10.2 India System in Package (SiP) Technology Market, by Packaging Type
- 11.4.10.3 India System in Package (SiP) Technology Market, by Interconnection Technology
- 11.4.10.4 India System in Package (SiP) Technology Market, by End-User Industry
- 11.4.11 South Korea SiP Technology Market Revenue and Forecasts to 2027 (US$ million)
- 11.4.11.1 South Korea System in Package (SiP) Technology Market, by Packaging Technogym
- 11.4.11.2 South Korea System in Package (SiP) Technology Market, by Packaging Type
- 11.4.11.3 South Korea System in Package (SiP) Technology Market, by Interconnection Technology
- 11.4.11.4 South Korea System in Package (SiP) Technology Market, by End-user Industry
- 11.4.12 Rest of Asia Pacific SiP Technology Market Revenue and Forecasts to 2027 (US$ million)
- 11.4.12.1 Rest of Asia-Pacific System in Package (SiP) Technology Market, by Packaging Technology
- 11.4.12.2 Rest of Asia-Pacific System in Package (SiP) Technology Market, by Packaging
- 11.4.12.3 Rest of Asia-Pacific System in Package (SiP) Technology Market, by Interconnection Technology
- 11.4.12.4 Rest of Asia-Pacific System in Package (SiP) Technology Market, by End-user Industry
- 11.5 Rest of world SiP Technology Market
- 11.5.1 Rest of World: System in Package (SiP) Technology Market - Revenue and Forecast to 2027 (US$ Million)
- 11.5.2 RoW: System in Package (SiP) Technology Market, By Country
- 11.5.3 RoW: SiP technology Market, By Packaging Technology
- 11.5.4 RoW: SiP technology Market, By Packaging Type
- 11.5.5 RoW SiP Technology Market, By Interconnection Technology
- 11.5.6 RoW: SiP technology Market, By End-user Industry
- 11.5.7 MEA: System in Package (SiP) Technology Market - Revenue and Forecast to 2027 (US$ Million)
- 11.5.7.1 MEA System in Package (SiP) Technology Market, by Packaging Technology
- 11.5.7.2 MEA System in Package (SiP) Technology Market, by Packaging Type
- 11.5.7.3 MEA System in Package (SiP) Technology Market, by Interconnection Technology
- 11.5.7.4 MEA System in Package (SiP) Technology Market, by End-user Industry
- 11.5.8 SAM: System in Package (SiP) Technology Market - Revenue and Forecast to 2027 (US$ Million)
- 11.5.8.1 SAM System in Package (SiP) Technology Market, by Packaging Technology
- 11.5.8.2 SAM System in Package (SiP) Technology Market, by Packaging Type
- 11.5.8.3 SAM System in Package (SiP) Technology Market, by Interconnection Technology
- 11.5.8.4 SAM System in Package (SiP) Technology Market, by End-user Industry
12. SiP Technology Market - COVID-19 Impact Analysis
- 12.1 Overview
- 12.1.1 North America: Impact Assessment of COVID-19 Pandemic
- 12.1.2 Europe: Impact Assessment of COVID-19 Pandemic
- 12.1.3 Asia-Pacific: Impact Assessment of COVID-19 Pandemic
- 12.1.4 Rest of the World: Impact Assessment of COVID-19 Pandemic
13. Industry Landscape
- 13.1 Overview
- 13.2 Market Initiative
14. Company Profiles
- 14.1 Amkor Technology, Inc.
- 14.1.1 Key Facts
- 14.1.2 Business Description
- 14.1.3 Products and Services
- 14.1.4 Financial Overview
- 14.1.5 SWOT Analysis
- 14.1.6 Key Developments
- 14.2 ASE Technology Holding Co. Ltd
- 14.2.1 Key Facts
- 14.2.2 Business Description
- 14.2.3 Products and Services
- 14.2.4 Financial Overview
- 14.2.5 SWOT Analysis
- 14.2.6 Key Developments
- 14.3 ChipMOS TECHNOLOGIES INC.
- 14.3.1 Key Facts
- 14.3.2 Business Description
- 14.3.3 Products and Services
- 14.3.4 Financial Overview
- 14.3.5 SWOT Analysis
- 14.3.6 Key Developments
- 14.4 GS Nanotech
- 14.4.1 Key Facts
- 14.4.2 Business Description
- 14.4.3 Products and Services
- 14.4.4 Financial Overview
- 14.4.5 SWOT Analysis
- 14.4.6 Key Developments
- 14.5 JCET Group Co., Ltd.
- 14.5.1 Key Facts
- 14.5.2 Business Description
- 14.5.3 Products and Services
- 14.5.4 SWOT Analysis
- 14.5.5 Key Developments
- 14.6 QUALCOMM INCORPORATED
- 14.6.1 Key Facts
- 14.6.2 Business Description
- 14.6.3 Products and Services
- 14.6.4 Financial Overview
- 14.6.5 SWOT Analysis
- 14.6.6 Key Developments
- 14.7 Samsung
- 14.7.1 Key Facts
- 14.7.2 Business Description
- 14.7.3 Products and Services
- 14.7.4 Financial Overview
- 14.7.5 SWOT Analysis
- 14.7.6 Key Developments
- 14.8 Renesas Electronics Corporation
- 14.8.1 Key Facts
- 14.8.2 Business Description
- 14.8.3 Products and Services
- 14.8.4 Financial Overview
- 14.8.5 SWOT Analysis
- 14.8.6 Key Developments
- 14.9 Texas Instruments Incorporated
- 14.9.1 Key Facts
- 14.9.2 Business Description
- 14.9.3 Products and Services
- 14.9.4 Financial Overview
- 14.9.5 SWOT Analysis
- 14.9.6 Key Developments
- 14.10 Taiwan Semiconductor Manufacturing Company, Limited
- 14.10.1 Key Facts
- 14.10.2 Business Description
- 14.10.3 Products and Services
- 14.10.4 Financial Overview
- 14.10.5 SWOT Analysis
- 14.10.6 Key Developments
15. Appendix
- 15.1 About The Insight Partners
- 15.2 Glossary of Terms
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