半導体ボンディング市場の2028年までの予測と世界分析- タイプ別（ダイボンダー、ウエハーボンダー、フリップチップボンダー）、技術別（RFデバイス、MEMSとセンサー、LED、CMOSイメージセンサー、3D NAND）

半導体ボンディングの市場規模は、2028年には10億7682万米ドルに達すると予測されており、2022年から2028年にかけてCAGR8.2％で成長すると推測されています。

半導体産業の成長の背景には、メモリ、グラフィックスプロセッシングユニット、5Gチップセットなどが、超大型携帯電話、PC、タブレット、5Gサービスなどに使用されていることが挙げられます。しかし、2020年にはCOVID-19のパンデミックの発生により、産業用＆車載用エレクトロニクス産業は半導体需要の減少を経験しました。半導体産業協会（SIA）によると、半導体の世界売上高は2000年の2044億米ドルから2020年には4404億米ドルに増加し、この20年間でおよそ2倍となりました。メモリーチップなど各種チップの低価格化、スマートフォンやサーバー、PCの需要減少、米国と中国の貿易摩擦などが市場成長の妨げになっています。さらに、米国は国家安全保障上の懸念から、中国企業に対していくつかの制限を課しています。例えば、中国企業であるファーウェイに対する米国の制裁措置の直接的な結果として、同社の半導体事業に悪影響が及んでいます。その結果、SIAによれば、半導体産業における中国のシェアは2020年の6.7%から2021年には6.5%に低下しました。

いくつかの半導体接合プレーヤーは、競争上の優位性を得るために様々な有機的および無機的な戦略を採用しています。例えば、ASM Pacific Technologyは2021年4月、X-CeleprintのMicro Transfer PrintingとASM AMICRAの高精度ダイボンディング技術で、超薄型ダイの大量異種集積を可能にする3つの新しい製造システムを発表しました。

COVID-19パンデミックの北米半導体ボンディング市場成長への影響

北米の半導体企業は、コストやリードタイムの増加、供給不足に対応しながら、消費者の需要に応えています。米国商務省によると、米国は半導体生産の世界市場シェアの50%を占めています。北米の主要な半導体部品の需要は、COVID-19の出現により大幅に減少しました。例えば、2020年、世界の半導体産業は、2019年と比較して5～15%の減少に直面しました。COVID-19のパンデミックは、米国の半導体企業にも悪影響を及ぼしました。また、米国の半導体産業は、パンデミック発生前に中国からの原材料と労働力のアウトソーシングに大きく依存していました。さらに、メキシコでは、通信と自動車の分野で成長が見られ、半導体ボンディング市場のプレーヤーに有利な機会を提供することが期待されています。中国の国境閉鎖は、工場の閉鎖や生産の制限、輸送コストの増加、生産能力の補完的な制約につながりました。その結果、国内生産が増加し、全体的なコストが上昇する一方で、米国はサプライチェーン全体をコントロールできるようになっています。さらに、2020年8月、米国政府は中国の多国籍企業であるHuaweiへの半導体チップの販売を禁止しました。これらの取り組みにより、米国の半導体産業が活性化し、半導体ボンディングの市場規模が拡大すると期待されています。

北米地域は、米国、カナダ、メキシコに区分されます。2021年の半導体ボンディング市場シェアは米国が最大であり、カナダは最も高いCAGRで成長すると予測されています。政府当局は、半導体産業を促進するために多くのイニシアチブをとっており、その結果、同産業への投資件数が増加しています。北米は、3D半導体アセンブリおよびパッケージングソリューションの巨大な需要があります。自動車分野を中心に、IoTや人工知能などの先進技術を導入する企業が増えています。Robert Bosch GmbH、Allegro MicroSystems, Inc、Texas Instruments Incorporated、Qualcomm Technologies, Inc、InvenSense、Honeywell International Inc.などは、半導体ボンディング市場の著名な企業の一部です。この地域ではMEMSやセンサーの需要が高まっており、ダイボンダ、ウエハボンダ、フリップチップボンダの製造に携わる市場リーダーに多くの機会を提供しています。

半導体接合は、民生用電子機器、自動車、医療機器、その他さまざまな用途で使用されており、その需要は大幅に増加しているため、米国における半導体接合市場の成長を牽引しています。さらに、米国における高い自動車販売台数は、2021年の同国の半導体ボンディング市場全体の分析に影響を与えました。大手自動車メーカーがEVやAVへの数十億米ドル規模の投資を発表。GMは2025年までに350億米ドルの投資を発表しました。また、2022年9月には、米国政府が米国の半導体産業の確立のために500億米ドルを投資すると発表し、この投資計画を通じて半導体の中国依存度を下げることも狙っています。さらに、2022年8月にはアリゾナ州政府が台湾を訪問し、日常的な電子機器向けの半導体に注目しました。このように、半導体産業への政府投資の拡大は、半導体ボンディングの需要を促進します。

カナダでは人口の増加により、一戸建てから高層マンションまで住宅需要が増加します。その結果、家庭用電化製品の需要が、同国の半導体需要を後押しします。また、スマートフォンやタブレット端末、テレビ、パソコンなどの普及が進んでいます。カナダにおける家電製品の需要の高まりは、半導体ボンディング市場の成長を後押ししています。また、カナダは、半導体チップメーカーに15の自由貿易協定へのアクセスを提供しており、消費者数は15億人、GDPの合計は49兆3,000億米ドルにのぼります。さらに、同国にはTSMC、サムスン電子、AMD、クアルコム、インテルなど、さまざまな半導体企業が拠点を置いています。このように、スマート電子機器の需要の高まりとカナダ政府による取り組みが、同国の半導体ボンディング市場の成長を後押ししています。

Palomar Technologies、パナソニック株式会社、東レ株式会社、Kulicke &Soffa Industries, Inc、HUTEM、DIAS Automation（HK）Ltd、ASMPT Ltd（旧ASM Pacific Technology Ltd）、EV Group、ヤマハ株式会社（Yamaha Robotics Holdings）、WestBond, Inc.などは、半導体接着市場で事業を行う著名企業のいくつか例です。

半導体ボンディング市場全体は、一次情報および二次情報の両方を用いて導き出されています。半導体ボンディング市場の分析を始めるにあたり、半導体ボンディング市場に関連する質的・量的情報を得るために、内外の情報源を用いて徹底的な二次調査を実施しました。このプロセスは、すべての市場セグメントに関して、市場成長の概要と市場予測を得るという目的も兼ねています。また、データを検証し、テーマについてより分析的な洞察を得るために、業界関係者やコメンテーターへの複数の一次インタビューが実施されました。このプロセスの参加企業には、副社長、事業開発マネージャー、市場情報マネージャー、国内営業マネージャーなどの業界専門家や、半導体ボンディング市場に特化した評価専門家、研究アナリスト、キーオピニオンリーダーなどの外部コンサルタントが含まれています。

目次

第1章 イントロダクション

• 調査範囲
• インサイトパートナーズの調査報告書ガイダンス
• 市場セグメンテーション

第2章 重要なポイント

第3章 調査手法

• 対象範囲
• 2次調査
• 1次調査

第4章 半導体ボンディング市場の情勢

• 市場概要
• PEST分析
  • 北米
  • 欧州
  • APAC
  • MEA
  • SAM
• エコシステム分析
• 専門家の見解

第5章 半導体ボンディング市場- 主な市場力学

• 市場促進要因
  • IoTデバイスにおける積層ダイ技術の採用の増加
  • 半導体ボンディングソリューションに関連する製品発売、パートナーシップ、協業の増加
• 市場抑制要因
  • 半導体部品の価格変動
• 市場機会
  • ハイブリッドボンディングの需要拡大
• 今後の動向
  • 通信分野でのダイボンディングの採用
• 促進要因と抑制要因の影響分析

第6章 半導体ボンディング市場- 世界市場分析

• 半導体ボンディングの世界市場概要
• 半導体ボンディングの世界市場収益と予測・分析
• 市場のポジショニング-主要5社
• 競合ベンチマーキング
• 成長マトリクス
• 半導体ボンディング装置-企業一覧
  • 全自動V/S卓上装置ユーザー
• 現在のアプリケーション動向
  • ロシア・ウクライナ戦争別半導体産業への影響
  • 自動車産業
  • 航空宇宙・防衛産業
  • 民生用電子機器
  • IT・通信分野
  • チップ不足の課題
• 半導体ボンディング事業における新興企業、中堅企業、大企業に関する分析

第7章 半導体ボンディング市場の収益と2028年までの予測-タイプ別

• 半導体ボンディング市場、タイプ別（2021年、2028年）
• ダイボンダー
• ウエハーボンダー
• フリップチップボンダ

第8章 半導体ボンディング市場の収益と2028年までの予測- アプリケーション編

• 半導体ボンディング市場、アプリケーション別（2021年、2028年）
• RFデバイス
• MEMSとセンサー
• LED
• 3次元NAND
• CMOSイメージセンサ

第9章 半導体ボンディング市場-地域別分析

• 北米
  • 米国
  • カナダ
  • メキシコ
• 欧州
  • フランス
  • ドイツ
  • イタリア
  • 英国
  • ロシア
  • その他欧州
• APAC
  • オーストラリア
  • 中国
  • インド
  • 日本
  • 韓国
  • APACのその他諸国
• MEA
  • 南アフリカ
  • サウジアラビア
  • UAE
  • MEAの残りの地域
• 南米
  • ブラジル
  • アルゼンチン
  • その他の南米地域

第10章 半導体ボンディング市場-COVID-19影響度分析

• 北米
• 欧州
• アジア太平洋地域
• MEA
• 南米COVID-19のパンデミック別影響度評価

第11章 業界の情勢

• 市場の取り組み
• 新製品発売

第12章 企業プロファイル

• Palomar Technologies
• Panasonic Corporation
• Toray Industries Inc
• Kulicke & Soffa Industries, Inc.
• DIAS Automation（HK）Ltd.
• ASMPT
• Yamaha Motor Corporation
• HUTEM
• EV Group
• WestBond, Inc.

第13章 付録

• The Insight Partners について
• 単語索引

List Of Tables

• Table 1. Global Semiconductor Bonding Market Revenue and Forecast to 2028 (US$ Million)
• Table 2. North America: Semiconductor Bonding Market, by Type- Revenue and Forecast to 2028 (US$ Million)
• Table 3. North America: Semiconductor Bonding Market, by Application - Revenue and Forecast to 2028 (US$ Million)
• Table 4. US: Semiconductor Bonding Market, by Type-Revenue and Forecast to 2028 (US$ Million)
• Table 5. US: Semiconductor Bonding Market, by Application-Revenue and Forecast to 2028 (US$ Million)
• Table 6. Canada: Semiconductor Bonding Market, by Type- Revenue and Forecast to 2028 (US$ Million)
• Table 7. Canada: Semiconductor Bonding Market, by Application - Revenue and Forecast to 2028 (US$ Million)
• Table 8. Mexico: Semiconductor Bonding Market, by Type- Revenue and Forecast to 2028 (US$ Million)
• Table 9. Mexico: Semiconductor Bonding Market, by Application - Revenue and Forecast to 2028 (US$ Million)
• Table 10. Europe: Semiconductor Bonding Market, by Type- Revenue and Forecast to 2028 (US$ Million)
• Table 11. Europe: Semiconductor Bonding Market, by Application- Revenue and Forecast to 2028 (US$ Million)
• Table 12. France: Semiconductor Bonding Market, by Type - Revenue and Forecast to 2028 (US$ Million)
• Table 13. France: Semiconductor Bonding Market, by Application- Revenue and Forecast to 2028 (US$ Million)
• Table 14. Germany: Semiconductor Bonding Market, by Type- Revenue and Forecast to 2028 (US$ Million)
• Table 15. Germany: Semiconductor Bonding Market, by Application- Revenue and Forecast to 2028 (US$ Million)
• Table 16. Italy: Semiconductor Bonding Market, by Type - Revenue and Forecast to 2028 (US$ Million)
• Table 17. Italy: Semiconductor Bonding Market, by Application- Revenue and Forecast to 2028 (US$ Million)
• Table 18. UK: Semiconductor Bonding Market, by Type - Revenue and Forecast to 2028 (US$ Million)
• Table 19. UK: Semiconductor Bonding Market, by Application- Revenue and Forecast to 2028 (US$ Million)
• Table 20. Russia: Semiconductor Bonding Market, by Type- Revenue and Forecast to 2028 (US$ Million)
• Table 21. Russia: Semiconductor Bonding Market, by Application- Revenue and Forecast to 2028 (US$ Million)
• Table 22. Rest of Europe: Semiconductor Bonding Market, by Type- Revenue and Forecast to 2028 (US$ Million)
• Table 23. Rest of Europe: Semiconductor Bonding Market, by Application- Revenue and Forecast to 2028 (US$ Million)
• Table 24. APAC: Semiconductor Bonding Market, by Type - Revenue and Forecast to 2028 (US$ Million)
• Table 25. APAC: Semiconductor Bonding Market, by Application - Revenue and Forecast to 2028 (US$ Million)
• Table 26. Australia: Semiconductor Bonding Market, by Type- Revenue and Forecast to 2028 (US$ Million)
• Table 27. Australia: Semiconductor Bonding Market, by Application - Revenue and Forecast to 2028 (US$ Million)
• Table 28. China: Semiconductor Bonding Market, by Type- Revenue and Forecast to 2028 (US$ Million)
• Table 29. China: Semiconductor Bonding Market, by Application - Revenue and Forecast to 2028 (US$ Million)
• Table 30. India: Semiconductor Bonding Market, by Type- Revenue and Forecast to 2028 (US$ Million)
• Table 31. India: Semiconductor Bonding Market, by Application - Revenue and Forecast to 2028 (US$ Million)
• Table 32. Japan: Semiconductor Bonding Market, by Type - Revenue and Forecast to 2028 (US$ Million)
• Table 33. Japan: Semiconductor Bonding Market, by Application- Revenue and Forecast to 2028 (US$ Million)
• Table 34. South Korea: Semiconductor Bonding Market, by Type- Revenue and Forecast to 2028 (US$ Million)
• Table 35. South Korea: Semiconductor Bonding Market, by Application - Revenue and Forecast to 2028 (US$ Million)
• Table 36. Rest of APAC: Semiconductor Bonding Market, by Type - Revenue and Forecast to 2028 (US$ Million)
• Table 37. Rest of APAC: Semiconductor Bonding Market, by Application - Revenue and Forecast to 2028 (US$ Million)
• Table 38. MEA: Semiconductor Bonding Market, by Type - Revenue and Forecast to 2028 (US$ Million)
• Table 39. MEA: Semiconductor Bonding Market, by Application- Revenue and Forecast to 2028 (US$ Million)
• Table 40. South Africa: Semiconductor Bonding Market, by Type - Revenue and Forecast to 2028 (US$ Million)
• Table 41. South Africa: Semiconductor Bonding Market, by Application- Revenue and Forecast to 2028 (US$ Million)
• Table 42. Saudi Arabia: Semiconductor Bonding Market, by Type - Revenue and Forecast to 2028 (US$ Million)
• Table 43. Saudi Arabia: Semiconductor Bonding Market, by Application - Revenue and Forecast to 2028 (US$ Million)
• Table 44. UAE: Semiconductor Bonding Market, by Type- Revenue and Forecast to 2028 (US$ Million)
• Table 45. UAE: Semiconductor Bonding Market, by Application- Revenue and Forecast to 2028 (US$ Million)
• Table 46. Rest of MEA: Semiconductor Bonding Market, by Type- Revenue and Forecast to 2028 (US$ Million)
• Table 47. Rest of MEA: Semiconductor Bonding Market, by Application - Revenue and Forecast to 2028 (US$ Million)
• Table 48. SAM: Semiconductor Bonding Market, by Type- Revenue and Forecast to 2028 (US$ Million)
• Table 49. SAM: Semiconductor Bonding Market, by Application- Revenue and Forecast to 2028 (US$ Million)
• Table 50. Brazil: Semiconductor Bonding Market, by Type- Revenue and Forecast to 2028 (US$ Million)
• Table 51. Brazil: Semiconductor Bonding Market, by Application - Revenue and Forecast to 2028 (US$ Million)
• Table 52. Argentina: Semiconductor Bonding Market, by Type- Revenue and Forecast to 2028 (US$ Million)
• Table 53. Argentina: Semiconductor Bonding Market, by Application - Revenue and Forecast to 2028 (US$ Million)
• Table 54. Rest of SAM: Semiconductor Bonding Market, by Type - Revenue and Forecast to 2028 (US$ Million)
• Table 55. Rest of SAM: Semiconductor Bonding Market, by Application - Revenue and Forecast to 2028 (US$ Million)
• Table 56. List of Abbreviation

List Of Figures

• Figure 1. Semiconductor Bonding Market Segmentation
• Figure 2. Semiconductor Bonding Market Segmentation - By Geography
• Figure 3. Global Semiconductor Bonding Market Overview
• Figure 4. Semiconductor Bonding Market, by Type
• Figure 5. Semiconductor Bonding Market, by Application
• Figure 6. Semiconductor Bonding Market, by Geography
• Figure 7. North America - PEST Analysis
• Figure 8. Europe - PEST Analysis
• Figure 9. APAC - PEST Analysis
• Figure 10. MEA - PEST Analysis
• Figure 11. SAM - PEST Analysis
• Figure 12. Semiconductor Bonding Market- Ecosystem Analysis
• Figure 13. Semiconductor Bonding Market Impact Analysis of Drivers and Restraints
• Figure 14. Geographic Overview of Semiconductor Bonding Market
• Figure 15. Global Semiconductor Bonding Market Revenue Forecast and Analysis (US$ Million)
• Figure 16. Competitive Benchmarking
• Figure 17. Competitive Benchmarking
• Figure 18. Growth Matrix
• Figure 19. Analysis on start-ups, mid-size, and large size companies
• Figure 20. Semiconductor Bonding Market, By Type (2021 and 2028)
• Figure 21. Die Bonder: Semiconductor Bonding Market Revenue and Forecast to 2028 (US$ Million)
• Figure 22. Wafer Bonder: Semiconductor Bonding Market Revenue and Forecast to 2028 (US$ Million)
• Figure 23. Flip Chip Bonder: Semiconductor Bonding Market Revenue and Forecast to 2028 (US$ Million)
• Figure 24. Semiconductor Bonding Market, By Application (2021 and 2028)
• Figure 25. RF Devices: Semiconductor Bonding Market Revenue and Forecast to 2028 (US$ Million)
• Figure 26. MEMS and Sensors: Semiconductor Bonding Market Revenue and Forecast to 2028 (US$ Million)
• Figure 27. LED: Semiconductor Bonding Market Revenue and Forecast to 2028 (US$ Million)
• Figure 28. 3D NAND: Semiconductor Bonding Market Revenue and Forecast to 2028 (US$ Million)
• Figure 29. CMOS Image Sensors: Semiconductor Bonding Market Revenue and Forecast to 2028 (US$ Million)
• Figure 30. Global Semiconductor Bonding Market Revenue Share, by Region (2021 and 2028)
• Figure 31. North America: Semiconductor Bonding Market - Revenue and Forecast to 2028 (US$ Million)
• Figure 32. North America: Semiconductor Bonding Market Revenue Share, by Type (2021 and 2028)
• Figure 33. North America: Semiconductor Bonding Market Revenue Share, by Application (2021 and 2028)
• Figure 34. North America: Semiconductor Bonding Market Revenue Share, by Key Country (2021 and 2028)
• Figure 35. US: Semiconductor Bonding Market - Revenue and Forecast to 2028 (US$ Million)
• Figure 36. Canada: Semiconductor Bonding Market - Revenue and Forecast to 2028 (US$ Million)
• Figure 37. Mexico: Semiconductor Bonding Market - Revenue and Forecast to 2028 (US$ Million)
• Figure 38. Europe: Semiconductor Bonding Market - Revenue and Forecast to 2028 (US$ Million)
• Figure 39. Europe: Semiconductor Bonding Market Revenue Share, by Type (2021 and 2028)
• Figure 40. Europe: Semiconductor Bonding Market Revenue Share, by Application (2021 and 2028)
• Figure 41. Europe: Semiconductor Bonding Market Revenue Share, by Key Country (2021 and 2028)
• Figure 42. France: Semiconductor Bonding Market - Revenue and Forecast to 2028 (US$ Million)
• Figure 43. Germany: Semiconductor Bonding Market - Revenue and Forecast to 2028 (US$ Million)
• Figure 44. Italy: Semiconductor Bonding Market - Revenue and Forecast to 2028 (US$ Million)
• Figure 45. UK: Semiconductor Bonding Market - Revenue and Forecast to 2028 (US$ Million)
• Figure 46. Russia: Semiconductor Bonding Market - Revenue and Forecast to 2028 (US$ Million)
• Figure 47. Rest of Europe: Semiconductor Bonding Market - Revenue and Forecast to 2028 (US$ Million)
• Figure 48. APAC: Semiconductor Bonding Market - Revenue and Forecast to 2028 (US$ Million)
• Figure 49. APAC: Semiconductor Bonding Market Revenue Share, by Type (2021 and 2028)
• Figure 50. APAC: Semiconductor Bonding Market Revenue Share, by Application (2021 and 2028)
• Figure 51. APAC: Semiconductor Bonding Market Revenue Share, by Key Country (2021 and 2028)
• Figure 52. Australia: Semiconductor Bonding Market - Revenue and Forecast to 2028 (US$ Million)
• Figure 53. China: Semiconductor Bonding Market - Revenue and Forecast to 2028 (US$ Million)
• Figure 54. India: Semiconductor Bonding Market - Revenue and Forecast to 2028 (US$ Million)
• Figure 55. Japan: Semiconductor Bonding Market - Revenue and Forecast to 2028 (US$ Million)
• Figure 56. South Korea: Semiconductor Bonding Market - Revenue and Forecast to 2028 (US$ Million)
• Figure 57. Rest of APAC: Semiconductor Bonding Market - Revenue and Forecast to 2028 (US$ Million)
• Figure 58. MEA: Semiconductor Bonding Market - Revenue and Forecast to 2028 (US$ Million)
• Figure 59. MEA: Semiconductor Bonding Market Revenue Share, by Type (2021 and 2028)
• Figure 60. MEA: Semiconductor Bonding Market Revenue Share, by Application (2021 and 2028)
• Figure 61. MEA: Semiconductor Bonding Market Revenue Share, by Key Country (2021 and 2028)
• Figure 62. South Africa: Semiconductor Bonding Market - Revenue and Forecast to 2028 (US$ Million)
• Figure 63. Saudi Arabia: Semiconductor Bonding Market - Revenue and Forecast to 2028 (US$ Million)
• Figure 64. UAE: Semiconductor Bonding Market - Revenue and Forecast to 2028 (US$ Million)
• Figure 65. Rest of MEA: Semiconductor Bonding Market - Revenue and Forecast to 2028 (US$ Million)
• Figure 66. SAM: Semiconductor Bonding Market - Revenue and Forecast to 2028 (US$ Million)
• Figure 67. SAM: Semiconductor Bonding Market Revenue Share, by Type (2021 and 2028)
• Figure 68. SAM: Semiconductor Bonding Market Revenue Share, by Application (2021 and 2028)
• Figure 69. SAM: Semiconductor Bonding Market Revenue Share, by Key Country (2021 and 2028)
• Figure 70. Brazil: Semiconductor Bonding Market - Revenue and Forecast to 2028 (US$ Million)
• Figure 71. Argentina: Semiconductor Bonding Market - Revenue and Forecast to 2028 (US$ Million)
• Figure 72. Rest of SAM: Semiconductor Bonding Market - Revenue and Forecast to 2028 (US$ Million)
• Figure 73. Impact of COVID-19 Pandemic on North America Country Markets
• Figure 74. Impact of COVID-19 Pandemic on Europe Country Markets
• Figure 75. Impact of COVID-19 Pandemic on Asia Pacific Country Markets
• Figure 76. Impact of COVID-19 Pandemic on MEA Country Markets
• Figure 77. Impact of COVID-19 Pandemic on South America Country Markets

The semiconductor bonding market size is expected to reach US$ 1,076.82 million by 2028; it is estimated to grow at a CAGR of 8.2% from 2022 to 2028.

The semiconductor industry's growth is attributed to the use of memories, graphics processing units, and 5G chipsets in hyperscale mobile phones, PCs, tablets, and 5G services. However, in 2020, the industrial & automotive electronics industries experienced a decline in the demand for semiconductors due to the onset of the COVID-19 pandemic. According to the Semiconductor Industry Association (SIA), the global sales of semiconductors increased from US$ 204.4 billion in 2000 to US$ 440.4 billion in 2020, which approximately doubled in the last two decades. Low prices of various chip types, such as memory chips; decreasing demand for smartphones, servers, and PCs; and a trade dispute between the US and China are hampering the market growth. Moreover, the US has imposed several restrictions on Chinese businesses because of national security concerns. For instance, the direct result of US sanctions against Huawei, the Chinese company, has adversely affected the company's semiconductor business. As a result, China's share of the semiconductor industry dropped from 6.7% in 2020 to 6.5% in 2021, according to SIA.

Several semiconductor bonding players are adopting various organic and inorganic strategies to gain a competitive advantage. For instance, in April 2021, ASM Pacific Technology introduced three new manufacturing systems with X-Celeprint's Micro Transfer Printing and ASM AMICRA's high precision die bonding technology to allow high volume heterogeneous integration of ultra-thin dies.

Impact of COVID-19 Pandemic on North America Semiconductor Bonding Market Growth

Semiconductor companies in North America are adapting to increased costs, lead time, and a shortage of supplies while catering to consumer demand. According to the United States Department of Commerce, the US constitutes ~50% of the global market share of semiconductor production. The demand for major semiconductor components in North America witnessed a significant decline due to the emergence of the COVID-19 pandemic. For example, in 2020, the global semiconductor industry faced a decline of 5-15% compared to 2019. The COVID-19 pandemic has had a negative impact on semiconductor companies in the US. In addition, the US semiconductor industry relied heavily on outsourcing raw materials and labor from China before the onset of the pandemic. Further, In Mexico, growth is observed in telecom & automotive sectors which is also expected to offer lucrative opportunities for semiconductor bonding market players. The shutdown of China's border led to the shutdown of factories or limited production, an increase in shipping costs, and supplementary capacity constraints. As a result, domestic production increased, which increased overall costs while allowing the US to control the entire supply chain. Further, in August 2020, the US government banned the sale of semiconductor chips to Huawei, the Chinese multinational corporation. These initiatives are expected to boost the US semiconductor industry, which, in turn, is expected to boost the semiconductor bonding market size.

The North America region is segmented into the US, Canada, and Mexico. The US held the largest semiconductor bonding market share in 2021, whereas Canada is projected to grow at the highest CAGR. Government authorities have taken many initiatives to promote the semiconductor industry, which has increased the number of investments in the industry. North America has a huge demand for 3D semiconductor assembly and packaging solutions. An increasing number of companies, majorly in the automotive sector, are adopting advanced technologies such as IoT and artificial intelligence. Robert Bosch GmbH; Allegro MicroSystems, Inc.; Texas Instruments Incorporated; Qualcomm Technologies, Inc.; InvenSense; and Honeywell International Inc. are a few of the prominent semiconductor bonding market players. The rising demand for MEMS and sensors in the region has provided many opportunities for market leaders engaged in the manufacturing of die bonders, wafer bonders, and flip-chip bonders.

Semiconductor bonding is used in manufacturing consumer electronic devices, automotive, medical devices, and various other applications, which is significantly increasing its demand, thereby driving the semiconductor bonding market growth in the US. Further, high automotive sales in the US impacted the country's overall semiconductor bonding market analysis in 2021. Major automakers announced multibillion-dollar investments in EVs and AVs. GM announced an investment of US$ 35 billion by 2025. In addition, in September 2022, the US government announced that they would be investing US$ 50 billion in the establishment of the US semiconductor industry; they are also aiming to lower the dependency on China for semiconductors through this investment plan. Moreover, in August 2022, the Arizona government visited Taiwan, focusing on semiconductors for everyday electronic devices. Thus, the growing government investment in the semiconductor industry will fuel the demand for semiconductor bonding.

A rise in the population in Canada will increase the demand for housing units, from single-family homes to high-rise condominiums. As a result, the demand for household electronic goods is fueling the need for semiconductors in the country. In addition, The use of smartphones, tablets, television, personal computers, and other devices is increasing tremendously. The rising demand for consumer electronic devices in Canada is boosting the semiconductor bonding market growth. Also, the country has provided semiconductor chip manufacturers access to 15 free trade agreements with 51 countries with ~1.5 billion consumers and a combined GDP of US$ 49.3 trillion. Furthermore, the country is home to various semiconductor companies such as TSMC, Samsung Electronics, AMD, Qualcomm, and Intel. Thus, the rising demand for smart electronic devices and the initiative by the Canadian government are propelling the growth of the semiconductor bonding market in the country.

Palomar Technologies; Panasonic Corporation; Toray Industries Inc; Kulicke & Soffa Industries, Inc.; HUTEM; DIAS Automation (HK) Ltd; ASMPT Ltd (formerly ASM Pacific Technology Ltd.); EV Group; Yamaha Motor Corporation (Yamaha Robotics Holdings); and WestBond, Inc. are a few of the prominent players operating in the semiconductor bonding market.

The overall semiconductor bonding market has been derived using both primary and secondary sources. To begin the semiconductor bonding market analysis, exhaustive secondary research has been conducted using internal and external sources to obtain qualitative and quantitative information related to the semiconductor bonding market. The process also serves the purpose of obtaining an overview and market forecast of the market growth with respect to all market segments. Also, multiple primary interviews with industry participants and commentators have been conducted to validate the data and gain more analytical insights about the topic. Participants of this process include industry experts such as VPs, business development managers, market intelligence managers, national sales managers, and external consultants-such as valuation experts, research analysts, and key opinion leaders-specializing in the semiconductor bonding market.

Reasons to Buy:

Save and reduce time carrying out entry-level research by identifying the growth, size, leading players, and segments in the semiconductor bonding market

Highlights key business priorities in order to assist companies to realign their business strategies

The key findings and recommendations highlight crucial progressive industry trends in the semiconductor bonding market thereby allowing players across the value chain to develop effective long-term strategies

Develop/modify business expansion plans by using substantial growth offering developed and emerging markets

Scrutinize in-depth global market trends and outlook coupled with the factors driving the market, as well as those hindering it

Enhance the decision-making process by understanding the strategies that underpin commercial interest with respect to client products, segmentation, pricing, and distribution

Table Of Contents

1. Introduction

• 1.1 Study Scope
• 1.2 The Insight Partners Research Report Guidance
• 1.3 Market Segmentation

2. Key Takeaways

3. Research Methodology

• 3.1 Coverage
• 3.2 Secondary Research
• 3.3 Primary Research

4. Semiconductor Bonding Market Landscape

• 4.1 Market Overview
• 4.2 PEST Analysis
  • 4.2.1 North America
  • 4.2.2 Europe
  • 4.2.3 APAC
  • 4.2.4 MEA
  • 4.2.5 SAM
• 4.3 Ecosystem Analysis
• 4.4 Expert Opinions

5. Semiconductor Bonding Market - Key Market Dynamics

• 5.1 Market Drivers
  • 5.1.1 Rising Adoption of Stacked Die Technology in IoT Devices
  • 5.1.2 Growing Number of Product Launches, Partnerships, and Collaborations Related to Semiconductor Bonding Solutions
• 5.2 Market Restraints
  • 5.2.1 Fluctuation in the Price of Semiconductor Components
• 5.3 Market Opportunities
  • 5.3.1 Rising Demand for Hybrid Bonding
• 5.4 Future Trends
  • 5.4.1 Adoption of Die Bonding in Telecommunication
• 5.5 Impact Analysis of Drivers and Restraints

6. Semiconductor Bonding Market - Global Market Analysis

• 6.1 Global Semiconductor Bonding Market Overview
• 6.2 Global Semiconductor Bonding Market Revenue Forecast and Analysis
• 6.3 Market Positioning - Five Key Players
• 6.4 Competitive Benchmarking
• 6.5 Growth Matrix
• 6.6 Semiconductor Bonding Machines - Companies List
  • 6.6.1 Fully Automatic V/S Tabletop Equipment Users
• 6.7 Current Application Trends
  • 6.7.1 Impact of Russia Ukraine War on Semiconductor Industry
  • 6.7.2 Automotive Industry
  • 6.7.3 Aerospace & Defence Industry
  • 6.7.4 Consumer Electronics
  • 6.7.5 IT & Telecom Sector
  • 6.7.6 Chip Shortages Challenges
• 6.8 Analysis on start-ups, mid-size, and large size companies in semiconductor bonding business

7. Semiconductor Bonding Market Revenue and Forecast to 2028 - Type

• 7.1 Overview
• 7.2 Semiconductor Bonding Market, By Type (2021 And 2028)
• 7.3 Die Bonder
  • 7.3.1 Overview
  • 7.3.2 Die Bonder: Semiconductor Bonding Market Revenue and Forecast To 2028 (US$ Million)
• 7.4 Wafer Bonder
  • 7.4.1 Overview
  • 7.4.2 Wafer Bonder: Semiconductor Bonding Market Revenue and Forecast To 2028 (US$ Million)
• 7.5 Flip Chip Bonder
  • 7.5.1 Overview
  • 7.5.2 Flip Chip Bonder: Semiconductor Bonding Market Revenue and Forecast To 2028 (US$ Million)

8. Semiconductor Bonding Market Revenue and Forecast to 2028 - Application

• 8.1 Overview
• 8.2 Semiconductor Bonding Market, By Application (2021 And 2028)
• 8.3 RF Devices
  • 8.3.1 Overview
  • 8.3.2 RF Devices: Semiconductor Bonding Market Revenue and Forecast To 2028 (US$ Million)
• 8.4 MEMS and Sensors
  • 8.4.1 Overview
  • 8.4.2 MEMS and Sensors: Semiconductor Bonding Market Revenue and Forecast To 2028 (US$ Million)
• 8.5 LED
  • 8.5.1 Overview
  • 8.5.2 LED: Semiconductor Bonding Market Revenue and Forecast To 2028 (US$ Million)
• 8.6 3D NAND
  • 8.6.1 Overview
  • 8.6.2 3D NAND: Semiconductor Bonding Market Revenue and Forecast To 2028 (US$ Million)
• 8.7 CMOS Image Sensors
  • 8.7.1 Overview
  • 8.7.2 CMOS Image Sensors: Semiconductor Bonding Market Revenue and Forecast To 2028 (US$ Million)

9. Semiconductor Bonding Market - Geographic Analysis

• 9.1 Overview
• 9.2 North America: Semiconductor Bonding Market
  • 9.2.1 North America: Semiconductor Bonding Market - Revenue and Forecast to 2028 (US$ Million)
  • 9.2.2 North America: Semiconductor Bonding Market, by Type
  • 9.2.3 North America: Semiconductor Bonding Market, by Application
  • 9.2.4 North America: Semiconductor Bonding Market, by Key Country
    • 9.2.4.1 US: Semiconductor Bonding Market - Revenue and Forecast to 2028 (US$ Million)
      • 9.2.4.1.1 US: Semiconductor Bonding Market, by Type
      • 9.2.4.1.2 US: Semiconductor Bonding Market, by Application
    • 9.2.4.2 Canada: Semiconductor Bonding Market - Revenue and Forecast to 2028 (US$ Million)
      • 9.2.4.2.1 Canada: Semiconductor Bonding Market, by Type
      • 9.2.4.2.2 Canada: Semiconductor Bonding Market, by Application
    • 9.2.4.3 Mexico: Semiconductor Bonding Market - Revenue and Forecast to 2028 (US$ Million)
      • 9.2.4.3.1 Mexico: Semiconductor Bonding Market, by Type
      • 9.2.4.3.2 Mexico: Semiconductor Bonding Market, by Application
• 9.3 Europe: Semiconductor Bonding Market
  • 9.3.1 Europe: Semiconductor Bonding Market - Revenue and Forecast to 2028 (US$ Million)
  • 9.3.2 Europe: Semiconductor Bonding Market, by Type
  • 9.3.3 Europe: Semiconductor Bonding Market, by Application
  • 9.3.4 Europe: Semiconductor Bonding Market, by Key Country
    • 9.3.4.1 France: Semiconductor Bonding Market - Revenue and Forecast to 2028 (US$ Million)
      • 9.3.4.1.1 France: Semiconductor Bonding Market, by Type
      • 9.3.4.1.2 France: Semiconductor Bonding Market, by Application
    • 9.3.4.2 Germany: Semiconductor Bonding Market - Revenue and Forecast to 2028 (US$ Million)
      • 9.3.4.2.1 Germany: Semiconductor Bonding Market, by Type
      • 9.3.4.2.2 Germany: Semiconductor Bonding Market, by Application
    • 9.3.4.3 Italy: Semiconductor Bonding Market - Revenue and Forecast to 2028 (US$ Million)
      • 9.3.4.3.1 Italy: Semiconductor Bonding Market, by Type
      • 9.3.4.3.2 Italy: Semiconductor Bonding Market, by Application
    • 9.3.4.4 UK: Semiconductor Bonding Market - Revenue and Forecast to 2028 (US$ Million)
      • 9.3.4.4.1 UK: Semiconductor Bonding Market, by Type
      • 9.3.4.4.2 UK: Semiconductor Bonding Market, by Application
    • 9.3.4.5 Russia: Semiconductor Bonding Market - Revenue and Forecast to 2028 (US$ Million)
      • 9.3.4.5.1 Russia: Semiconductor Bonding Market, by Type
      • 9.3.4.5.2 Russia: Semiconductor Bonding Market, by Application
    • 9.3.4.6 Rest of Europe: Semiconductor Bonding Market - Revenue and Forecast to 2028 (US$ Million)
      • 9.3.4.6.1 Rest of Europe: Semiconductor Bonding Market, by Type
      • 9.3.4.6.2 Rest of Europe: Semiconductor Bonding Market, by Application
• 9.4 APAC: Semiconductor Bonding Market
  • 9.4.1 APAC: Semiconductor Bonding Market - Revenue and Forecast to 2028 (US$ Million)
  • 9.4.2 APAC: Semiconductor Bonding Market, by Type
  • 9.4.3 APAC: Semiconductor Bonding Market, by Application
  • 9.4.4 APAC: Semiconductor Bonding Market, by Key Country
    • 9.4.4.1 Australia: Semiconductor Bonding Market - Revenue and Forecast to 2028 (US$ Million)
      • 9.4.4.1.1 Australia: Semiconductor Bonding Market, by Type
      • 9.4.4.1.2 Australia: Semiconductor Bonding Market, by Application
    • 9.4.4.2 China: Semiconductor Bonding Market - Revenue and Forecast to 2028 (US$ Million)
      • 9.4.4.2.1 China: Semiconductor Bonding Market, by Type
      • 9.4.4.2.2 China: Semiconductor Bonding Market, by Application
    • 9.4.4.3 India: Semiconductor Bonding Market - Revenue and Forecast to 2028 (US$ Million)
      • 9.4.4.3.1 India: Semiconductor Bonding Market, by Type
      • 9.4.4.3.2 India: Semiconductor Bonding Market, by Application
    • 9.4.4.4 Japan: Semiconductor Bonding Market - Revenue and Forecast to 2028 (US$ Million)
      • 9.4.4.4.1 Japan: Semiconductor Bonding Market, by Type
      • 9.4.4.4.2 Japan: Semiconductor Bonding Market, by Application
    • 9.4.4.5 South Korea: Semiconductor Bonding Market - Revenue and Forecast to 2028 (US$ Million)
      • 9.4.4.5.1 South Korea: Semiconductor Bonding Market, by Type
      • 9.4.4.5.2 South Korea: Semiconductor Bonding Market, by Application
    • 9.4.4.6 Rest of APAC: Semiconductor Bonding Market - Revenue and Forecast to 2028 (US$ Million)
      • 9.4.4.6.1 Rest of APAC: Semiconductor Bonding Market, by Type
      • 9.4.4.6.2 Rest of APAC: Semiconductor Bonding Market, by Application
• 9.5 MEA: Semiconductor Bonding Market
  • 9.5.1 MEA: Semiconductor Bonding Market - Revenue and Forecast to 2028 (US$ Million)
  • 9.5.2 MEA: Semiconductor Bonding Market, by Type
  • 9.5.3 MEA: Semiconductor Bonding Market, by Application
  • 9.5.4 MEA: Semiconductor Bonding Market, by Key Country
    • 9.5.4.1 South Africa: Semiconductor Bonding Market - Revenue and Forecast to 2028 (US$ Million)
      • 9.5.4.1.1 South Africa: Semiconductor Bonding Market, by Type
      • 9.5.4.1.2 South Africa: Semiconductor Bonding Market, by Application
    • 9.5.4.2 Saudi Arabia: Semiconductor Bonding Market - Revenue and Forecast to 2028 (US$ Million)
      • 9.5.4.2.1 Saudi Arabia: Semiconductor Bonding Market, by Type
      • 9.5.4.2.2 Saudi Arabia: Semiconductor Bonding Market, by Application
    • 9.5.4.3 UAE: Semiconductor Bonding Market - Revenue and Forecast to 2028 (US$ Million)
      • 9.5.4.3.1 UAE: Semiconductor Bonding Market, by Type
      • 9.5.4.3.2 UAE: Semiconductor Bonding Market, by Application
    • 9.5.4.4 Rest of MEA: Semiconductor Bonding Market - Revenue and Forecast to 2028 (US$ Million)
      • 9.5.4.4.1 Rest of MEA: Semiconductor Bonding Market, by Type
      • 9.5.4.4.2 Rest of MEA: Semiconductor Bonding Market, by Application
• 9.6 SAM: Semiconductor Bonding Market
  • 9.6.1 SAM: Semiconductor Bonding Market - Revenue and Forecast to 2028 (US$ Million)
  • 9.6.2 SAM: Semiconductor Bonding Market, by Type
  • 9.6.3 SAM: Semiconductor Bonding Market, by Application
  • 9.6.4 SAM: Semiconductor Bonding Market, by Key Country
    • 9.6.4.1 Brazil: Semiconductor Bonding Market - Revenue and Forecast to 2028 (US$ Million)
      • 9.6.4.1.1 Brazil: Semiconductor Bonding Market, by Type
      • 9.6.4.1.2 Brazil: Semiconductor Bonding Market, by Application
    • 9.6.4.2 Argentina: Semiconductor Bonding Market - Revenue and Forecast to 2028 (US$ Million)
      • 9.6.4.2.1 Argentina: Semiconductor Bonding Market, by Type
      • 9.6.4.2.2 Argentina: Semiconductor Bonding Market, by Application
    • 9.6.4.3 Rest of SAM: Semiconductor Bonding Market - Revenue and Forecast to 2028 (US$ Million)
      • 9.6.4.3.1 Rest of SAM: Semiconductor Bonding Market, by Type
      • 9.6.4.3.2 Rest of SAM: Semiconductor Bonding Market, by Application

10. Semiconductor Bonding Market - Covid-19 Impact Analysis

• 10.1 Overview
• 10.2 North America: Impact Assessment of COVID-19 Pandemic
• 10.3 Europe: Impact Assessment of COVID-19 Pandemic
• 10.4 Asia Pacific: Impact Assessment of COVID-19 Pandemic
• 10.5 MEA: Impact Assessment of COVID-19 Pandemic
• 10.6 South America Impact Assessment of COVID-19 Pandemic

11. Industry Landscape

• 11.1 Overview
• 11.2 Market Initiative
• 11.3 New Product Launch

12. Company Profiles

• 12.1 Palomar Technologies
  • 12.1.1 Key Facts
  • 12.1.2 Business Description
  • 12.1.3 Products and Services
  • 12.1.4 Financial Overview
  • 12.1.5 SWOT Analysis
  • 12.1.6 Key Developments
• 12.2 Panasonic Corporation
  • 12.2.1 Key Facts
  • 12.2.2 Business Description
  • 12.2.3 Products and Services
  • 12.2.4 Financial Overview
  • 12.2.5 SWOT Analysis
  • 12.2.6 Key Developments
• 12.3 Toray Industries Inc
  • 12.3.1 Key Facts
  • 12.3.2 Business Description
  • 12.3.3 Products and Services
  • 12.3.4 Financial Overview
  • 12.3.5 SWOT Analysis
  • 12.3.6 Key Developments
• 12.4 Kulicke & Soffa Industries, Inc.
  • 12.4.1 Key Facts
  • 12.4.2 Business Description
  • 12.4.3 Products and Services
  • 12.4.4 Financial Overview
  • 12.4.5 SWOT Analysis
  • 12.4.6 Key Developments
• 12.5 DIAS Automation (HK) Ltd.
  • 12.5.1 Key Facts
  • 12.5.2 Business Description
  • 12.5.3 Products and Services
  • 12.5.4 Financial Overview
  • 12.5.5 SWOT Analysis
  • 12.5.6 Key Developments
• 12.6 ASMPT
  • 12.6.1 Key Facts
  • 12.6.2 Business Description
  • 12.6.3 Products and Services
  • 12.6.4 Financial Overview
  • 12.6.5 SWOT Analysis
  • 12.6.6 Key Developments
• 12.7 Yamaha Motor Corporation
  • 12.7.1 Key Facts
  • 12.7.2 Business Description
  • 12.7.3 Products and Services
  • 12.7.4 Financial Overview
  • 12.7.5 SWOT Analysis
  • 12.7.6 Key Developments
• 12.8 HUTEM
  • 12.8.1 Key Facts
  • 12.8.2 Business Description
  • 12.8.3 Products and Services
  • 12.8.4 Financial Overview
  • 12.8.5 SWOT Analysis
  • 12.8.6 Key Developments
• 12.9 EV Group
  • 12.9.1 Key Facts
  • 12.9.2 Business Description
  • 12.9.3 Products and Services
  • 12.9.4 Financial Overview
  • 12.9.5 SWOT Analysis
  • 12.9.6 Key Developments
• 12.10 WestBond, Inc.
  • 12.10.1 Key Facts
  • 12.10.2 Business Description
  • 12.10.3 Products and Services
  • 12.10.4 Financial Overview
  • 12.10.5 SWOT Analysis
  • 12.10.6 Key Developments

13. Appendix

• 13.1 About The Insight Partners
• 13.2 Word Index