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フレキシブルエレクトロニクス向けマテリアルにおけるイノベーション

Innovations in Materials for Flexible Electronics (TechVision)

発行 Frost & Sullivan 商品コード 375812
出版日 ページ情報 英文 67 Pages
納期: 即日から翌営業日
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フレキシブルエレクトロニクス向けマテリアルにおけるイノベーション Innovations in Materials for Flexible Electronics (TechVision)
出版日: 2016年09月30日 ページ情報: 英文 67 Pages
概要

当レポートでは、フレキシブルエレクトロニクス産業に影響を及ぼす、既存および新興の基板マテリアルについて分析しており、各基板マテリアルの考察、主要ステークホルダーのイニシアチブ、フレキシブルエレクトロニクス産業に影響を及ぼす基板マテリアルの評価、技術開発状況、および将来の技術動向分析などを提供しています。

第1章 エグゼクティブサマリー

第2章 技術スナップショット

  • フレキシブルエレクトロニクスの概要
  • フレキシブルエレクトロニクスのアプリケーション区分
  • フレキシブル基板:技術概要
  • フレキシブル基板マテリアルに対するエンドユーザー要件
  • 現在使用されている基板マテリアル:ポリマー基板が幅広く使用され、金属基板が続く

第3章 フレキシブルエレクトロニクス基板に使用されているマテリアル

  • ガラス基板:技術概要
  • ガラス基板:主なイノベーション
  • 金属基板:技術概要
  • 金属基板:主なイノベーション
  • ポリマー基板:技術概要
  • ポリマー基板の概要
  • ポリマー基板:主なイノベーション
  • エンドユーザーギャップ分析
  • 新しい基板マテリアル
  • 新しいマテリアル:主なイノベーション

第4章 産業概要

  • 技術促進因子
  • 技術抑制因子
  • 技術バリューチェーン
  • 主な技術ステークホルダー
  • 近年のR&Dイニシアチブ

第5章 技術開発・IP動向

  • 世界の技術開発可能性
  • 世界の技術導入可能性
  • 特許動向:国別のチャート
  • 特許動向:全基板マテリアルのこれまでのチャート
  • 特許動向:ポリマー基板マテリアルのこれまでのチャート

第6章 フレキシブルエレクトロニクス向けマテリアルの技術ベンチマーキング

  • フレキシブル基板マテリアルの機会戦略評価 (OSE)
  • OSEグリッドによる考察:マテリアルディベロッパーにとっての機会の拡大

第7章 技術ロードマップ

  • 技術ロードマップ - 将来動向の評価:技術開発状況
  • 技術ロードマップ - 説明:高性能PI基板および生体適合性基板が主なイノベーション

第8章 主な特許

  • 主な特許:USPTO
  • 主な特許:EPO
  • 主な特許:WIPO

第9章 主な契約

第10章 付録

第11章 Frost & Sullivanについて

目次
Product Code: D6DE

Analysis of Current and Emerging Materials Used for Flexible Electronic Substrates

Flexible electronics are highly popular owing to their high usage convenience, novel display attributes, high reliability, and lightweight. These devices find high potential for adoption in a range of high-end application sectors, which includes consumer electronics, automotive, healthcare, energy, defense, and textiles. However, flexible electronics need to address several key challenges in their performance before they can satisfy high mass volume demand. Flexible substrate materials used for the development of flex circuits have been identified as key enabling components that determine the performance of flexible electronics. Flexible substrate materials that provide high device efficiency, optimal production costs, superior display attributes, and long lifetime need to be developed and further enhanced to pave the path for next-generation flexible electronics. This research study provides an analysis of the existing and emerging substrate materials that influence the flexible electronics industry. This includes glass, metal, polymers, paper, stretchable, and hybrid substrates to name the key ones. The research service also provides insights into each substrate materials and highlights the key stakeholder initiatives, while assessing the substrate material impact on the flexible electronics industry. The technology development scenario in the form of a technology roadmap maps the future direction expected from each flexible substrate material.

Table of Contents

1.0. EXECUTIVE SUMMARY

  • 1.1. Research Scope
  • 1.2. Research Process and Methodology
  • 1.3. Key Findings: Low-cost and Highly Optically Transparent Substrates Will Lead Adoption in Future

2.0. TECHNOLOGY SNAPSHOT

  • 2.1. Flexible Electronics - An Overview: An Emerging Product Concept Designed to Meet Consumer Demand for Novel Properties in Devices
  • 2.2. Flexible Electronics - Application Segmentation: High Promise in the Consumer Electronics Sector
  • 2.3. Flexible Substrates-Technology Snapshot: Enabling Technologies that Determine the Performance of Flexible Electronics
  • 2.4. End User Requirements for Flexible Substrate Materials: Need for Stable Substrates that Facilitate High Performance of Devices
  • 2.5. Currently Used Substrate Materials: Polymer Substrates Are Widely Adopted Followed by Metal Substrates

3.0. MATERIALS USED FOR FLEXIBLE ELECTRONIC SUBSTRATES

  • 3.1. Glass Substrates - Technology Snapshot: Highly Stable but Unsuitable for Mass Processing
  • 3.2. Glass Substrates - Key Innovations: Large Volume Production of Ultrathin Glass
  • 3.3. Metal Substrates-Technology Snapshot: High Impermeability and Lightweight Attributes
  • 3.4. Metal Substrates - Key Innovations: Developments Include Flexible Solar Cells and OLEDs
  • 3.5. Polymer Substrates - Technology Snapshot: Low Cost and Variations in Performance Properties
  • 3.6. Overview of Polymer Substrates: PET and PEN Are the Most Widely Used Polymer Materials
  • 3.7. Overview of Polymer Substrates: PI is Showing Promise in Adoption for Flexible Substrates
  • 3.8. Overview of Polymer Substrates: PC Films Are Used in High Durability Applications
  • 3.9. Polymer Substrates - Key Innovations: Applications Focused on Organic Electronics
  • 3.10. End-user Gap Analysis: Unmet End-user Requirements Creates Demand for Novel Substrate Materials
  • 3.11. Emerging Substrate Materials: Biocompatible and Stretchable Substrate Materials Are Being Developed
  • 3.12. Emerging Materials - Key Innovations: Low-cost Substrate Materials with High Optical Performance

4.0. INDUSTRY OVERVIEW

  • 4.1. Technology Drivers: Superior Printability and Lightweight Properties Drive Adoption
  • 4.2. Technology Restraints: High Competition from Rigid Substrates and Lack of Materials That Provide Long Operation Lifetime Hinders Adoption
  • 4.3. Technology Value Chain: Highly Integrated Industry with Increasing Contribution from Coating Developers
  • 4.4. Key Technology Stakeholders: Technology Developers Are Spread across North America, Europe, and Asia-Pacific
  • 4.5. Recent R&D Initiatives: Government Funding Contributes Significantly to Technology Development

5.0. TECHNOLOGY DEVELOPMENT AND IP TRENDS

  • 5.1. Global Technology Development Potential: North America Leads in Technology Development
  • 5.2. Global Technology Adoption Potential: Mass Volume Production Methods Facilitate High Adoption in North America
  • 5.3. Patent Trends - Country-wise Charts: US Leads Number of Granted Patents
  • 5.4. Patent Trends - Historical Charts for All Substrate Materials: Main Focus Among Granted Patents Is on Polymer Substrates
  • 5.5. Patent Trends - Historical Charts for Polymer Substrate Materials: Highest Innovations on PET Substrates, Followed by PI

6.0. TECHNOLOGY BENCHMARKING OF MATERIALS FOR FLEXIBLE ELECTRONICS

  • 6.1. Opportunity Strategy Evaluation (OSE) of Flexible Substrate Materials
  • 6.2. Insights from the OSE Grid: Increasing Opportunities for Material Developers

7.0. TECHNOLOGY ROADMAP

  • 7.1. Technology Roadmap - Assessment of Future Trends: Technology Development Scenario 2016-2020
  • 7.2. Technology Roadmap - Explanation: High Performance PI Substrates and Biocompatible Substrates Are Key Innovations Expected in 2020

8.0. KEY PATENTS

  • 8.1. Key Patents - USPTO
  • 8.2. Key Patents - EPO
  • 8.3. Key Patents - WIPO

9.0. KEY CONTACTS

  • 9.1. Key Contacts

10.0. APPENDIX

  • 10.1. Appendix A - OSE Grid: Definition of Criteria Used for Evaluation
  • 10.2. Appendix A - OSE Grid: Explanation of Quadrant Placement in the Matrix
  • 10.3. Appendix A - OSE Grid: Criteria-based Evaluation of Currently Used Substrate Materials
  • 10.4. Appendix A - OSE Grid: Criteria-based Evaluation of Emerging Substrate Materials
  • Legal Disclaimer

11.0. THE FROST & SULLIVAN STORY

  • 11.1. The Frost & Sullivan Story
  • 11.2. Value Proposition: Future of Your Company and Career
  • 11.3. Global Perspective
  • 11.4. Industry Convergence
  • 11.5. 360° Research Perspective
  • 11.6. Implementation Excellence
  • 11.7. Our Blue Ocean Strategy
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