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LEDinside:マイクロLED次世代ディスプレイ (2019年) :主要技術レポート

LEDinside: 2019 Micro LED Next Generation Display Key Technology Report

発行 TrendForce 商品コード 752366
出版日 ページ情報 英文 219 Pages
納期: 即日から翌営業日
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本日の銀行送金レート: 1USD=110.43円で換算しております。
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LEDinside:マイクロLED次世代ディスプレイ (2019年) :主要技術レポート LEDinside: 2019 Micro LED Next Generation Display Key Technology Report
出版日: 2019年01月31日 ページ情報: 英文 219 Pages
概要

当レポートでは、世界のマイクロLEDの市場を調査し、市場および製品の概要、市場の発展の推移、市場規模の推移と予測、応用製品と開発動向、特許動向、主要技術区分別のボトルネック・課題の分析、主要企業による技術開発の動向などをまとめています。

第1章 マイクロLED:定義・市場規模

  • 製品の定義
  • 市場規模の分析・予測
  • 出荷数の分析
  • 普及率の分析

第2章 マイクロLEDの応用製品・開発動向

  • マイクロLED製品の概要
  • ヘッドマウントデバイス
  • ウェアラブルデバイス
  • ハンドヘルドデバイス
  • ITデバイス
  • ITディスプレイ
  • 自動車 ディスプレイ
  • TV
  • LEDディスプレイ

第3章 マイクロLEDの特許分析

第4章 マイクロLED技術のボトルネックとソリューション

  • 技術概要
  • 製造プロセス
  • LEDエピタキシー・チップ製造プロセス
  • トランスファー技術/ボンディング技術/駆動・バックプレーン技術

第5章 エピタキシー技術:ボトルネックと課題

  • ソリューション
  • エピタキシャルウエハ構造・発光の原理
  • エピタキシー発光レイヤー材料・視感効果度
  • リークの課題
  • 機器技術の分類
  • 機器技術の比較
  • エピタキシャルウエハ:主要技術の分類
  • 適用分析、など

第6章 チップ製造プロセス技術:ボトルネック・課題の分析

  • LEDチップの小型化
  • LEDチップ製造プロセス
  • ラテラルチップ・フリップチップ・バーティカルチップの構造上の違い
  • 小型LEDチップ (サファイア基板を含む) クライビング技術
  • 小型LEDチップ (サファイア基板を省く) クライビング技術
  • レーザーアブレーション
  • 構造的な脆弱さと絶縁層
  • トランスファーヘッドの設計
  • 従来型LEDとマイクロLEDのチップ製造プロセスの違い、など

第7章 マストランスファー技術:ボトルネック・課題の分析

  • マストランスファー技術の分類
  • 薄膜マストランスファー技術の分類
  • ピック&プレース技術
  • UPHへの影響因子
  • Apple (LuxVue)
  • Samsung
  • X:Celeprint
  • ITRI
  • MikroMesa
  • AUO
  • VueReal
  • Rohinni
  • eLux
  • PlayNitride
  • ソニー
  • QMAT
  • Uniqarta
  • OPTOVATE
  • KIMM
  • マイクロLEDますマストランスファー技術の7種の主要課題
  • 適用分析、など

第8章 検査技術:ボトルネック・課題の分析

  • マイクロLED技術のボトルネック&ソリューション:概要 - 検査技術
  • PL検査技術
  • デジタルカメラ光電検査
  • 接触型光電検査
  • 非接触型光電検査技術
  • 非接触EL検査技術
  • 紫外線照射型光電検査
  • 各種技術の比較、など

第9章 修復技術:ボトルネック・課題の分析

  • マイクロLED技術のボトルネック&ソリューション:概要 - 修復技術
  • 紫外線照射
  • レーザー溶接
  • 選択的ピック
  • 選択的レーザー
  • バックアップ回路設計ソリューション、など

第10章 フルカラーテクニカルソリューション:ボトルネック・課題の分析

  • フルカラーテクニカルソリューションの各種タイプ
  • RGBチップのカラライゼーション技術
  • 色変換
  • 量子ドット色変換技術・用途
  • QW色変換技術
  • 適用分析、など

第11章 ボンディング技術:ボトルネック・課題の分析

  • 技術的分類
  • SMTソリューション
  • 共晶ウェーブはんだ付け
  • 異方性導電接着剤 (ACF) ソリューション
  • 異方性はんだペースト (SAP) ソリューション
  • ウエハボンディング技術ソリューション
  • ウエハボンディングの困難さの分析
  • マイクロTUBEソリューション
  • フィージビリティ分析、など

第12章 駆動スキーム:ボトルネック・課題の分析

  • 駆動スキームのタイプ
  • ドライバーICの重要性
  • スイッチモードドライバーの各種タイプ
  • アクティブ vs パッシブマトリックス駆動の比較
  • ディスプレイ駆動スキーム
  • 薄膜トランジスター
  • OLED駆動スキーム
  • マイクロLED駆動スキーム
  • OLED vs マイクロLED:パワーモジュールの比較、など

第13章 バックプレーン技術:ボトルネック・課題の分析

  • ディスプレイバックプレーンの構造
  • バックプレーン材料の各種タイプ
  • 集積バックプレーン:ガラス基板・画素スイッチコンポーネントの動作原理
  • 集積バックプレーン:ガラス基板・画素スイッチコンポーネントの特徴
  • 集積バックプレーン:ガラス基板画素スイッチコンポーネントの製造プロセス
  • 集積バックプレーン:ガラス基板画素スイッチコンポーネントの解像度の比較
  • 集積バックプレーン:ガラス基板画素スイッチコンポーネントの消費電力の比較
  • 集積バックプレーン:ガラス基板画素スイッチコンポーネントのリーケージの比較
  • 集積バックプレーン:フレキシブル基板・画素スイッチコンポーネントの特徴
  • 集積バックプレーン:フレキシブル基板の製造プロセス
  • 集積バックプレーン:フレキシブル基板材料の特徴
  • 集積バックプレーン:シリコン基板の構造
  • 集積バックプレーン:シリコン基板の製造プロセス
  • 集積バックプレーン:シリコン基板材料の特徴
  • 非集積バックプレーン:PCB基板の比較
  • 非集積バックプレーン:PCB製造の課題
  • 非集積バックプレーン:PCBのサイズ上の制約
  • バックプレーン技術の比較
  • 適用分析、など

第14章 マイクロLEDのサプライチェーン・企業別の技術開発の分析

目次

Analysis and Prediction of Micro LED Market Value

The market value of Micro LED doesn't include mass transfer and other cost but includes LED epitaxyand chip.

Due to the high unit price of wafer used in Micro LED Display, it will contribute to the market value in the short term although there are only a few quantities. As the technology matures, the wafer price has gradually declined. It is estimated that the price will drop to 29% of CAGR in 2018-2023.

Remark:

This report makes further classification for different application fields.

  • Head mounted display (HMD) includes AR/VR product application.
  • IT display contains NB and MNT.
  • Mobile display embeds in smart phone and tablet.
  • TV display and Micro LED will be self-emitting display modes. As for Mini LED, it is mainly used for backlight. Both of them wil lcompete with OLED TV in the high-end market.
  • Video Wall with size larger than 100" are mainly used in commercial display areas. Currently, Micro LED display application is represented by the CLEDS solution of SONY.

Overview Analysis

At present, there are six bottlenecks, including epitaxyand chip, transfer, full color, power drive, backplane, and inspection and repairing technologies.

Table of Contents

Chapter 1: Definition and Market Scale of Micro LED

  • Product Definition of Micro LED
  • Analysis and Prediction of Micro LED Market Value
  • Analysis and Prediction of Micro LED Output Volume
  • Estimation of Micro LED Display Penetration Rate

Chapter 2: Micro LED Applications and Technology Development

  • Micro LED Product Overview
  • Micro LED Product Specifications Overview
  • Micro LED Applications-Specifications of Head Mounted Device
  • Micro LED Applications-Cost of Head Mounted Device
  • Micro LED Applications-Shipment Volume of Head Mounted Device
  • Micro LED Applications-Specifications of Wearable Device
  • Micro LED Applications-Cost of Wearable Device
  • Micro LED Applications-Shipment Volume of Wearable Device
  • Micro LED Applications-Specifications of Handheld Device
  • Micro LED Application-Cost of Handheld Device
  • Micro LED Application-Shipment Volume of Handheld Device
  • Micro LED Application-Specifications of IT Device
  • Micro LED Application-Cost of IT Display
  • Micro LED Application-Shipment Volume of IT Device
  • Micro LED Application-Specification of Automotive Display
  • Micro LED Application-Cost of Automotive Display
  • Micro LED Application-Shipment Volume of Automotive Display
  • Micro LED Application-Specifications of TV
  • Micro LED Application-Cost of TV
  • Micro LED Application-Shipment Volume of TV
  • Micro LED Application-Specifications of LED Display
  • Micro LED Application-Cost of LED Display
  • Micro LED Application-Shipment Volume of LED Display

Chapter 3: Micro LED Patent Analysis

  • 2000-2018 Micro LED Patent Layout-Patent Family Analysis
  • 2000-2018 Micro LED Patent Layout-Region Analysis
  • 2000-2018 Micro LED Patent Layout-Technology Analysis
  • 2000-2018 Micro LED Patent Layout-Manufacturer Analysis
  • 2001-2018 Micro LED Patent Layout-Mass Transfer Technology Patent Family Analysis
  • Mass Transfer Technology-Patent Technology Overview
  • Mass Transfer Technology-Patent Technology Classification
  • 2001-2018 Micro LED Patent Layout-Mass Transfer Technology Patent Family Analysis
  • Mass Transfer Technology-Brand Manufacturer Technology Layout Analysis
  • Mass Transfer Technology-Start-up and Research Institution Technology Layout Analysis

Chapter 4: Micro LED Technology Bottleneck and Solution

  • Micro LED Industry Technology Overview Analysis
  • Micro LED Technology Bottleneck and Solution Overview-Manufacturing Process
  • Micro LED Technology Bottleneck and Solution Overview-LED Epitaxy and Chip Manufacturing Process
  • Micro LED Technology Bottleneck and Solution Overview-Transfer Technology/Bonding Technology/Drive and Backplane Technology

Chapter 5: EpitaxyTechnology Bottleneck and Challenge Analysis

  • Epitaxy Technology-Solution
  • Epitaxy Technology-Epitaxial Wafer Structure and Light Emitting Principle
  • Epitaxy Technology-Epitaxy Emissive Layer Material and Luminous Efficacy
  • EpitaxyTechnology-The Leakage Problem of Chip Miniaturization Causes the Drop of Luminous Efficacy
  • EpitaxyTechnology-Equipment Technology Classification
  • EpitaxyTechnology-Equipment Technology Comparison
  • EpitaxyTechnology-Epitaxial Wafer Key Technology Classification
  • EpitaxyTechnology-Epitaxial Wafer Key Technology Classification-Wavelength Uniformity
  • EpitaxyTechnology-Epitaxial Wafer Key Technology Classification-Defect Control
  • EpitaxyTechnology-Epitaxial Wafer Key Technology Classification-Increase of Utilization of Epitaxial Wafer
  • Epitaxy Technology-Applicability Analysis

Chapter 6: Chip Manufacturing Process Technology Bottleneck and Challenge Analysis

  • Chip Manufacturing Process Technology-Development of LED Chip Miniaturization
  • Chip Manufacturing Process Technology-LED Chip Production Process
  • Chip Manufacturing Process Technology-Structural Differences between Lateral Chip, Flip Chip and Vertical Chip
  • Chip Manufacturing Process Technology-Miniaturized LED Chip (Including Sapphire Substrate) Scribing Technology
  • Chip Manufacturing Process Technology-Miniaturized LED Chip (Excluding Sapphire Substrate) Scribing Technology
  • Chip Manufacturing Process Technology-Laser Ablation
  • Chip Manufacturing Process Technology-Structural Weakening and Insulating Layer
  • Chip Manufacturing Process Technology-Design of Structural Weakening
  • Chip Manufacturing Process Technology-Design of Transfer Head
  • Chip Manufacturing Process Technology-Differences between Traditional LED and Micro LED Chip Manufacturing Processes

Chapter 7: Mass Transfer Technology Bottleneck and Challenge Analysis

  • Mass Transfer Technology-Transfer Technology Classification
  • Mass Transfer Technology-Thin Film Transfer Technology Classification
  • Mass Transfer Technology-Thin Film Transfer Technology-Pick & Place Technology
  • Mass Transfer Technology-Thin Film Transfer Technology-Non-selective Pick Technology
  • Mass Transfer Technology-Thin Film Transfer Technology-Selective Pick Technology will Increase Wafer Utilization
  • Mass Transfer Technology-Thin Film Transfer Technology-Selective Pick Technology in Repair Application
  • Mass Transfer Technology-Thin Film Transfer Technology-Factors that Affect UPH
  • Mass Transfer Technology-Thin Film Transfer Technology-Solution of Increasing UPH for Large Transfer Head
  • Mass Transfer Technology-Thin Film Transfer Technology-Higher Transfer Head Accuracy Requirement
  • Mass Transfer Technology-Thin Film Transfer Technology-Comparison between Transfer Times and Wafer Utilization
  • Mass Transfer Technology-Thin Film Transfer Technology-Comparison between Cycle Time and UPH
  • Mass Transfer Technology-Thin Film Transfer Technology: Apple (LuxVue)
    • Electrostatic Adsorption + Phase Change Transfer
  • Mass Transfer Technology-Thin Film Transfer Technology: Samsung
    • Chip Transfer and Flip
  • Mass Transfer Technology-Thin Film Transfer Technology-Van der Waals Force Introduction
  • Mass Transfer Technology-Thin Film Transfer Technology: X-Celeprint
    • Van der Waals Force
  • Mass Transfer Technology-Thin Film Transfer Technology: ITRI
    • Electromagnetic Adsorption
  • Mass Transfer Technology-Thin Film Transfer Technology: MikroMesa
    • Adhesion and Reaction Force
  • Mass Transfer Technology-Thin Film Transfer Technology: AUO
    • Electrostatic Adsorption and Reaction Force
  • Mass Transfer Technology-Thin Film Transfer Technology: VueReal
    • Solid Printing
  • Mass Transfer Technology-Thin Film Transfer Technology: Rohinni
    • Alignment Pin
  • Mass Transfer Technology-Thin Film Transfer Technology-Fluidic Assembly Technology
  • Mass Transfer Technology-Thin Film Transfer Technology: eLux
    • Fluidic Assembly
  • Mass Transfer Technology-Thin Film Transfer Technology: PlayNitride
    • Fluidic Transfer
  • Mass Transfer Technology-Thin Film Transfer Technology-Laser Transfer
  • Mass Transfer Technology-Thin Film Transfer Technology-Laser Transfer Classification
  • Mass Transfer Technology-Thin Film Transfer Technology: Sony
    • Laser Transfer
  • Mass Transfer Technology-Thin Film Transfer Technology: QMAT
    • BAR(Beam-Addressed Release) Mass Transfer
  • Mass Transfer Technology-Thin Film Transfer Technology: Uniqarta
    • Multi-Beam Transfer
  • Mass Transfer Technology-Thin Film Transfer Technology: OPTOVATE
    • Laser Lift-off (δ-LLO)Technology
  • Mass Transfer Technology-Thin Film Transfer Technology-Roll to Roll Transfer
  • Mass Transfer Technology-Thin Film Transfer Technology: KIMM
    • Roll to Roll Transfer
  • Mass Transfer Technology-Seven Major Challenges of Micro LED Mass Transfer Technology
  • Mass Transfer Technology-Transfer Yield Depends on the Control of Manufacturing Capability
  • Mass Transfer Technology-Applicability Analysis

Chapter 8: Testing Technology Bottleneck and Challenge Analysis

  • Micro LED Technology Bottleneck and Solution Overview-Testing Technology
  • Testing Technology-Testing Method
  • Testing Technology-Electrical Properties
  • Testing Technology-EL
  • Testing Technology-Light Properties
  • Testing Technology-PL
  • Testing Technology-Overview of Mass Testing Technology
  • Mass Testing Method-PL Testing Technology
  • Mass Testing Method-Digital Camera Photoelectric Testing Technology
  • Mass Testing Method-Contact Photoelectric Testing Technology
  • Mass Testing Method-Contactless Photoelectric Testing Technology
  • Mass Testing Method-Contactless EL Testing Technology
  • Mass Testing Method-Ultraviolet Irradiation Photoelectric Testing Technology
  • Mass Testing Technology Difference Comparison

Chapter 9: Repairing Technology Bottleneck and Challenge Analysis

  • Micro LED Technology Bottleneck and Solution Overview-Repairing Technology
    • Micro LED Repairing Technology Solution
  • Repairing Technology Solution-Ultraviolet Irradiation Repairing Technology
    • Repairing Process of Micro LED Dead Pixel
  • Repairing Technology Solution-Ultraviolet Irradiation Repairing Technology
    • Dead Pixel Repairing Technology Analysis
  • Repairing Technology Solution-Ultraviolet Irradiation Repairing Technology
    • Transfer Head Pickup Process
  • Repairing Technology Solution-Laser Welding Repairing Technology
  • Repairing Technology Solution-Selective Pick Repairing Technology
  • Repairing Technology Solution-Selective Laser Repairing Technology
  • Repairing Technology Solution-Backup Circuit Design Solution
    • Micro LED Active Defect Detection Design

Chapter 10: Full Color Technical Bottleneck and Challenge Analysis

  • Full Color Technical Solution Types
  • Full Color Technical Solution -RGB Chip Colorization Technique
  • Full Color Technical Solution -RGB's QantumPhotonic Imager on the Same Wafer
  • Full Color Technical Solution -Color Conversion Technology
  • Full Color Technical Solution -QunatumDot Color Conversion Technology and Application
  • Full Color Technical Solution -Quantum Well (QW) Color Conversion Technology
  • Full Color Technical Solution -Overview
  • Full Color Technical Solution -Applicability Analysis

Chapter 11: Bonding Technical Bottleneck and Challenge Analysis

  • Bonding Technology -Technical Classification
  • Bonding Technology -SMT Solution
  • Bonding Technology -Eutectic Wave Soldering Assembly Technical Solution
  • Bonding Technology -Anisotropic Conductive Adhesive (ACF) Solution
  • Bonding Technology -Anisotropic Solder Paste (SAP) Solution
  • Bonding Technology -Wafer Bonding Technical Solution
  • Bonding Technology -Wafer Bonding Difficulty Analysis
  • Bonding Technology -Micro TUBE Solution
  • Bonding Technology -Technical Difficulty Analysis
  • Bonding Technology -Feasibility Analysis

Chapter 12: Analysis of driving scheme bottlenecks and challenges

  • Driving Technology-driving scheme types
  • Driving Technology-the importance of driver IC
  • Driving Technology-Relationship Between V-I Characteristics and Luminance of LED
  • Driving Technology-Types of Switch Mode Driver
  • Driving Technology-Relationship between PWM and Duty Cycle
  • Driving Technology-Comparison between Active and Passive Matrix Driving
  • Driving Technology-Display Driving Scheme-Scanning Behavior and Refresh Rate
  • Driving Technology-Display Driving Scheme-Fine-pitch Display Analysis
  • Driving Technology-Thin Film Transistor-Driving Matrix of LCD displays
  • Driving Technology-Thin Film Transistor-Active Matrix (AM) V.S. Passive Matrix (PM)
  • Driving Technology-Thin Film Transistor-Analysis of Quality-affecting Factors
  • Driving Technology-OLED Driving Scheme-Photoelectric Properties of OLED
  • Driving Technology-OLED Driving Scheme-PMOLED
  • Driving Technology-OLED Driving Scheme-AMOLED
  • Driving Technology-Micro LED Driving Scheme-PM Micro LED
  • Driving Technology-Micro LED Driving Scheme-AM Micro LED
  • OLED V.S. Micro LED: Power Module Comparison

Chapter 13: Analysis of Backplane Technology Bottlenecks and Challenges

  • Backplane Technology-Structure of Display Backplane
  • Backplane Technology-Types of Backplane Material
  • Backplane Technology-Integrated Backplane: Operating Principles of Glass Substrate and Pixel Switch Components
  • Backplane Technology-Integrated Backplane: Features of Glass Substrate and Pixel Switch Components
  • Backplane Technology-Integrated Backplane: Size Development of Glass Substrate
  • Backplane Technology-Integrated Backplane: Thermal Expansion Challenges of Glass Substrate
  • Backplane Technology-Integrated Backplane: Application of Glass Substrate with Switch Components
  • Backplane Technology-Integrated Backplane: Structure of Pixel Switch Components for Glass Substrate
  • Backplane Technology-Integrated Backplane: Manufacturing Process of a-Si Pixel Switch Components for Glass Substrate
  • Backplane Technology-Integrated Backplane: Manufacturing Process of IGZO Pixel Switch Components for Glass Substrate
  • Backplane Technology-Integrated Backplane: Manufacturing Process of LTPS Pixel Switch Components for Glass Substrate
  • Backplane Technology-Integrated Backplane: Resolution Comparison of Pixel Switch Components for Glass Substrate
  • Backplane Technology-Integrated Backplane: Power Consumption Comparison of Pixel Switch Components for Glass Substrate
  • Backplane Technology-Integrated Backplane: Leakage Comparison of Pixel Switch Components for Glass Substrate
  • Backplane Technology-Integrated Backplane: Features of Flexible Substrate and Pixel Switch Components
  • Backplane Technology-Integrated Backplane: Manufacturing Process of Flexible Substrate
  • Backplane Technology-Integrated Backplane: Features of Flexible Substrate Materials
  • Backplane Technology-Integrated Backplane: Structure of Silicon Substrate
  • Backplane Technology-Integrated Backplane: Manufacturing Process of Silicon Substrate
  • Backplane Technology-Integrated Backplane: Features of Silicon Substrate Materials
  • Backplane Technology-Non-integrated Backplane: Outward Structure of PCB
  • Backplane Technology-Non-integrated Backplane: Inward Structure of PCB
  • Backplane Technology-Non-integrated Backplane: Thermal Effect of PCB
  • Backplane Technology-Non-integrated Backplane: Comparison of PCB Substrates
  • Backplane Technology-Non-integrated Backplane: Challenges of Manufacturing PCB
  • Backplane Technology-Non-integrated Backplane: Size Limit of PCB
  • Comparison of Backplane Technologies
  • Backplane Technology-Applicability Analysis

Chapter 14: Analysis of Micro LED Supply Chain and Technology Developments by Company

  • Analysis of Major Micro LED Developers (in the Supply Chain)
  • Analysis of Product Strategies and Technology Developments by Region-Taiwan
  • Analysis of Product Strategies and Technology Developments by Region-China
  • Analysis of Product Strategies and Technology Developments by Region-Korea
  • Analysis of Product Strategies and Technology Developments by Region-Japan
  • Analysis of Product Strategies and Technology Developments by Region-EU & the US
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