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ダイボンダー機器-世界市場見通し(2019年~2027年)

Die Bonder Equipment - Global Market Outlook (2019-2027)

出版日: | 発行: Stratistics Market Research Consulting | ページ情報: 英文 150+ Pages | 納期: 2-3営業日

価格
価格表記: USDを日本円(税抜)に換算
本日の銀行送金レート: 1USD=104.53円
ダイボンダー機器-世界市場見通し(2019年~2027年)
出版日: 2020年10月01日
発行: Stratistics Market Research Consulting
ページ情報: 英文 150+ Pages
納期: 2-3営業日
  • 全表示
  • 概要
  • 図表
  • 目次
概要

世界のダイボンダー機器の市場規模は2019年に8億2,000万米ドルとなりました。同市場は、予測期間中に5.5%のCAGRで拡大し、2027年までに12億5,844万米ドルに達すると予測されています。小型電子部品の需要の高まりとIOTデバイスでのスタックダイテクノロジーの採用拡大は、市場の成長を推進する主な要因となっています。ただし、高い所有コストが市場の成長を抑制しています。さらに、3D半導体アセンブリおよびパッケージングの需要の増加は、市場の成長のための十分な機会を提供する可能性があります。

当レポートでは、世界のダイボンダー機器市場について調査し、市場の概要とともに、サプライチェーン参入者別、タイプ別、デバイス別、ボンディング技術別、製品別、用途別、地域別の動向、および市場に参入する企業のプロファイルなどを提供しています。

目次

第1章 エグゼクティブサマリー

第2章 序文

第3章 市場動向分析

  • イントロダクション
  • 促進要因
  • 抑制要因
  • 市場機会
  • 脅威
  • 製品分析
  • 用途分析
  • 新興市場
  • Covid-19の影響

第4章 ポーターズファイブフォース分析

第5章 世界のダイボンダー機器市場:サプライチェーン参入者別

  • イントロダクション
  • IDM(統合型デバイスメーカー)企業
  • OSAT(アウトソーシングされた半導体アセンブリおよび検査)企業

第6章 世界のダイボンダー機器市場:タイプ別

  • イントロダクション
  • 全自動ダイボンダー
  • 手動ダイボンダー
  • 半自動ダイボンダー

第7章 世界のダイボンダー機器市場:デバイス別

  • イントロダクション
  • MEMS・MOEMS
  • オプトエレクトロニクス
  • パワーデバイス

第8章 世界のダイボンダー機器市場:ボンディング技術別

  • イントロダクション
  • エポキシ
  • 共晶
  • フリップチップダイボンダー
  • ソフトはんだ

第9章 世界のダイボンダー機器市場:製品別

  • イントロダクション
  • 高速配置機
  • 中速配置機
  • 超高速配置機

第10章 世界のダイボンダー機器市場:用途別

  • イントロダクション
  • 航空宇宙・防衛
  • 自動車
  • 家電
  • ヘルスケア
  • 工業
  • 電気通信

第11章 世界のダイボンダー機器市場:地域別

  • イントロダクション
  • 北米
    • 米国
    • カナダ
    • メキシコ
  • 欧州
    • ドイツ
    • 英国
    • イタリア
    • フランス
    • スペイン
    • その他
  • アジア太平洋地域
    • 日本
    • 中国
    • インド
    • オーストラリア
    • ニュージーランド
    • 韓国
    • その他
  • 南米
    • アルゼンチン
    • ブラジル
    • チリ
    • その他
  • 中東とアフリカ
    • サウジアラビア
    • アラブ首長国連邦
    • カタール
    • 南アフリカ
    • その他

第12章 主な発展

  • 契約、提携、連携、合弁
  • 買収と合併
  • 新製品の発売
  • 拡張
  • その他の重要な戦略

第13章 企業プロファイル

  • Anza Technology Inc
  • ASM Pacific Technology Ltd
  • Be Semiconductor Industries N.V.
  • Dias Automation (Hk) Ltd
  • Dr. Tresky Ag
  • Fasford Technology Co Ltd
  • Finetech GmbH & Co Kg
  • Four Technos Co Ltd
  • Hybond Inc
  • Kulicke & Soffa
  • Microassembly Technologies Ltd
  • Mycronic AB
  • Palomar Technologies Inc
  • Paroteq GmbH
  • Shibuya Corporation
  • Shinkawa Ltd
  • Smart Equipment Technology
  • Tpt Wire Bonder GmbH & Co Kg
  • Tresky GmbH
  • Unitemp GmbH
  • West Bond Inc
図表

List of Tables

  • Table 1 Global Die Bonder Equipment Market Outlook, By Region (2018-2027) ($MN)
  • Table 2 Global Die Bonder Equipment Market Outlook, By Supply Chain Participant (2018-2027) ($MN)
  • Table 3 Global Die Bonder Equipment Market Outlook, By IDM(Integrated Device Manufacturers) Firms (2018-2027) ($MN)
  • Table 4 Global Die Bonder Equipment Market Outlook, By OSAT(Outsourced Semiconductor Assembly and Test) Companies (2018-2027) ($MN)
  • Table 5 Global Die Bonder Equipment Market Outlook, By Type (2018-2027) ($MN)
  • Table 6 Global Die Bonder Equipment Market Outlook, By Fully Automatic Die Bonders (2018-2027) ($MN)
  • Table 7 Global Die Bonder Equipment Market Outlook, By Manual Die Bonders (2018-2027) ($MN)
  • Table 8 Global Die Bonder Equipment Market Outlook, By Semiautomatic Die Bonders (2018-2027) ($MN)
  • Table 9 Global Die Bonder Equipment Market Outlook, By Device (2018-2027) ($MN)
  • Table 10 Global Die Bonder Equipment Market Outlook, By MEMS and MOEMS (2018-2027) ($MN)
  • Table 11 Global Die Bonder Equipment Market Outlook, By Optoelectronics (2018-2027) ($MN)
  • Table 12 Global Die Bonder Equipment Market Outlook, By Power Devices (2018-2027) ($MN)
  • Table 13 Global Die Bonder Equipment Market Outlook, By Bonding Technique (2018-2027) ($MN)
  • Table 14 Global Die Bonder Equipment Market Outlook, By Epoxy (2018-2027) ($MN)
  • Table 15 Global Die Bonder Equipment Market Outlook, By Eutectic (2018-2027) ($MN)
  • Table 16 Global Die Bonder Equipment Market Outlook, By Flip Chip Die Bonder (2018-2027) ($MN)
  • Table 17 Global Die Bonder Equipment Market Outlook, By Soft Solder (2018-2027) ($MN)
  • Table 18 Global Die Bonder Equipment Market Outlook, By Product (2018-2027) ($MN)
  • Table 19 Global Die Bonder Equipment Market Outlook, By High Speed Placement Machine (2018-2027) ($MN)
  • Table 20 Global Die Bonder Equipment Market Outlook, By Medium Speed Placement Machine (2018-2027) ($MN)
  • Table 21 Global Die Bonder Equipment Market Outlook, By Ultra High Speed Placement Machine (2018-2027) ($MN)
  • Table 22 Global Die Bonder Equipment Market Outlook, By Application (2018-2027) ($MN)
  • Table 23 Global Die Bonder Equipment Market Outlook, By Aerospace & Defense (2018-2027) ($MN)
  • Table 24 Global Die Bonder Equipment Market Outlook, By Automotive (2018-2027) ($MN)
  • Table 25 Global Die Bonder Equipment Market Outlook, By Consumer Electronics (2018-2027) ($MN)
  • Table 26 Global Die Bonder Equipment Market Outlook, By Healthcare (2018-2027) ($MN)
  • Table 27 Global Die Bonder Equipment Market Outlook, By Industrial (2018-2027) ($MN)
  • Table 28 Global Die Bonder Equipment Market Outlook, By Telecommunications (2018-2027) ($MN)
  • Table 29 North America Die Bonder Equipment Market Outlook, By Country (2018-2027) ($MN)
  • Table 30 North America Die Bonder Equipment Market Outlook, By Supply Chain Participant (2018-2027) ($MN)
  • Table 31 North America Die Bonder Equipment Market Outlook, By IDM(Integrated Device Manufacturers) Firms (2018-2027) ($MN)
  • Table 32 North America Die Bonder Equipment Market Outlook, By OSAT(Outsourced Semiconductor Assembly and Test) Companies (2018-2027) ($MN)
  • Table 33 North America Die Bonder Equipment Market Outlook, By Type (2018-2027) ($MN)
  • Table 34 North America Die Bonder Equipment Market Outlook, By Fully Automatic Die Bonders (2018-2027) ($MN)
  • Table 35 North America Die Bonder Equipment Market Outlook, By Manual Die Bonders (2018-2027) ($MN)
  • Table 36 North America Die Bonder Equipment Market Outlook, By Semiautomatic Die Bonders (2018-2027) ($MN)
  • Table 37 North America Die Bonder Equipment Market Outlook, By Device (2018-2027) ($MN)
  • Table 38 North America Die Bonder Equipment Market Outlook, By MEMS and MOEMS (2018-2027) ($MN)
  • Table 39 North America Die Bonder Equipment Market Outlook, By Optoelectronics (2018-2027) ($MN)
  • Table 40 North America Die Bonder Equipment Market Outlook, By Power Devices (2018-2027) ($MN)
  • Table 41 North America Die Bonder Equipment Market Outlook, By Bonding Technique (2018-2027) ($MN)
  • Table 42 North America Die Bonder Equipment Market Outlook, By Epoxy (2018-2027) ($MN)
  • Table 43 North America Die Bonder Equipment Market Outlook, By Eutectic (2018-2027) ($MN)
  • Table 44 North America Die Bonder Equipment Market Outlook, By Flip Chip Die Bonder (2018-2027) ($MN)
  • Table 45 North America Die Bonder Equipment Market Outlook, By Soft Solder (2018-2027) ($MN)
  • Table 46 North America Die Bonder Equipment Market Outlook, By Product (2018-2027) ($MN)
  • Table 47 North America Die Bonder Equipment Market Outlook, By High Speed Placement Machine (2018-2027) ($MN)
  • Table 48 North America Die Bonder Equipment Market Outlook, By Medium Speed Placement Machine (2018-2027) ($MN)
  • Table 49 North America Die Bonder Equipment Market Outlook, By Ultra High Speed Placement Machine (2018-2027) ($MN)
  • Table 50 North America Die Bonder Equipment Market Outlook, By Application (2018-2027) ($MN)
  • Table 51 North America Die Bonder Equipment Market Outlook, By Aerospace & Defense (2018-2027) ($MN)
  • Table 52 North America Die Bonder Equipment Market Outlook, By Automotive (2018-2027) ($MN)
  • Table 53 North America Die Bonder Equipment Market Outlook, By Consumer Electronics (2018-2027) ($MN)
  • Table 54 North America Die Bonder Equipment Market Outlook, By Healthcare (2018-2027) ($MN)
  • Table 55 North America Die Bonder Equipment Market Outlook, By Industrial (2018-2027) ($MN)
  • Table 56 North America Die Bonder Equipment Market Outlook, By Telecommunications (2018-2027) ($MN)
  • Table 57 Europe Die Bonder Equipment Market Outlook, By Country (2018-2027) ($MN)
  • Table 58 Europe Die Bonder Equipment Market Outlook, By Supply Chain Participant (2018-2027) ($MN)
  • Table 59 Europe Die Bonder Equipment Market Outlook, By IDM(Integrated Device Manufacturers) Firms (2018-2027) ($MN)
  • Table 60 Europe Die Bonder Equipment Market Outlook, By OSAT(Outsourced Semiconductor Assembly and Test) Companies (2018-2027) ($MN)
  • Table 61 Europe Die Bonder Equipment Market Outlook, By Type (2018-2027) ($MN)
  • Table 62 Europe Die Bonder Equipment Market Outlook, By Fully Automatic Die Bonders (2018-2027) ($MN)
  • Table 63 Europe Die Bonder Equipment Market Outlook, By Manual Die Bonders (2018-2027) ($MN)
  • Table 64 Europe Die Bonder Equipment Market Outlook, By Semiautomatic Die Bonders (2018-2027) ($MN)
  • Table 65 Europe Die Bonder Equipment Market Outlook, By Device (2018-2027) ($MN)
  • Table 66 Europe Die Bonder Equipment Market Outlook, By MEMS and MOEMS (2018-2027) ($MN)
  • Table 67 Europe Die Bonder Equipment Market Outlook, By Optoelectronics (2018-2027) ($MN)
  • Table 68 Europe Die Bonder Equipment Market Outlook, By Power Devices (2018-2027) ($MN)
  • Table 69 Europe Die Bonder Equipment Market Outlook, By Bonding Technique (2018-2027) ($MN)
  • Table 70 Europe Die Bonder Equipment Market Outlook, By Epoxy (2018-2027) ($MN)
  • Table 71 Europe Die Bonder Equipment Market Outlook, By Eutectic (2018-2027) ($MN)
  • Table 72 Europe Die Bonder Equipment Market Outlook, By Flip Chip Die Bonder (2018-2027) ($MN)
  • Table 73 Europe Die Bonder Equipment Market Outlook, By Soft Solder (2018-2027) ($MN)
  • Table 74 Europe Die Bonder Equipment Market Outlook, By Product (2018-2027) ($MN)
  • Table 75 Europe Die Bonder Equipment Market Outlook, By High Speed Placement Machine (2018-2027) ($MN)
  • Table 76 Europe Die Bonder Equipment Market Outlook, By Medium Speed Placement Machine (2018-2027) ($MN)
  • Table 77 Europe Die Bonder Equipment Market Outlook, By Ultra High Speed Placement Machine (2018-2027) ($MN)
  • Table 78 Europe Die Bonder Equipment Market Outlook, By Application (2018-2027) ($MN)
  • Table 79 Europe Die Bonder Equipment Market Outlook, By Aerospace & Defense (2018-2027) ($MN)
  • Table 80 Europe Die Bonder Equipment Market Outlook, By Automotive (2018-2027) ($MN)
  • Table 81 Europe Die Bonder Equipment Market Outlook, By Consumer Electronics (2018-2027) ($MN)
  • Table 82 Europe Die Bonder Equipment Market Outlook, By Healthcare (2018-2027) ($MN)
  • Table 83 Europe Die Bonder Equipment Market Outlook, By Industrial (2018-2027) ($MN)
  • Table 84 Europe Die Bonder Equipment Market Outlook, By Telecommunications (2018-2027) ($MN)
  • Table 85 Asia Pacific Die Bonder Equipment Market Outlook, By Country (2018-2027) ($MN)
  • Table 86 Asia Pacific Die Bonder Equipment Market Outlook, By Supply Chain Participant (2018-2027) ($MN)
  • Table 87 Asia Pacific Die Bonder Equipment Market Outlook, By IDM(Integrated Device Manufacturers) Firms (2018-2027) ($MN)
  • Table 88 Asia Pacific Die Bonder Equipment Market Outlook, By OSAT(Outsourced Semiconductor Assembly and Test) Companies (2018-2027) ($MN)
  • Table 89 Asia Pacific Die Bonder Equipment Market Outlook, By Type (2018-2027) ($MN)
  • Table 90 Asia Pacific Die Bonder Equipment Market Outlook, By Fully Automatic Die Bonders (2018-2027) ($MN)
  • Table 91 Asia Pacific Die Bonder Equipment Market Outlook, By Manual Die Bonders (2018-2027) ($MN)
  • Table 92 Asia Pacific Die Bonder Equipment Market Outlook, By Semiautomatic Die Bonders (2018-2027) ($MN)
  • Table 93 Asia Pacific Die Bonder Equipment Market Outlook, By Device (2018-2027) ($MN)
  • Table 94 Asia Pacific Die Bonder Equipment Market Outlook, By MEMS and MOEMS (2018-2027) ($MN)
  • Table 95 Asia Pacific Die Bonder Equipment Market Outlook, By Optoelectronics (2018-2027) ($MN)
  • Table 96 Asia Pacific Die Bonder Equipment Market Outlook, By Power Devices (2018-2027) ($MN)
  • Table 97 Asia Pacific Die Bonder Equipment Market Outlook, By Bonding Technique (2018-2027) ($MN)
  • Table 98 Asia Pacific Die Bonder Equipment Market Outlook, By Epoxy (2018-2027) ($MN)
  • Table 99 Asia Pacific Die Bonder Equipment Market Outlook, By Eutectic (2018-2027) ($MN)
  • Table 100 Asia Pacific Die Bonder Equipment Market Outlook, By Flip Chip Die Bonder (2018-2027) ($MN)
  • Table 101 Asia Pacific Die Bonder Equipment Market Outlook, By Soft Solder (2018-2027) ($MN)
  • Table 102 Asia Pacific Die Bonder Equipment Market Outlook, By Product (2018-2027) ($MN)
  • Table 103 Asia Pacific Die Bonder Equipment Market Outlook, By High Speed Placement Machine (2018-2027) ($MN)
  • Table 104 Asia Pacific Die Bonder Equipment Market Outlook, By Medium Speed Placement Machine (2018-2027) ($MN)
  • Table 105 Asia Pacific Die Bonder Equipment Market Outlook, By Ultra High Speed Placement Machine (2018-2027) ($MN)
  • Table 106 Asia Pacific Die Bonder Equipment Market Outlook, By Application (2018-2027) ($MN)
  • Table 107 Asia Pacific Die Bonder Equipment Market Outlook, By Aerospace & Defense (2018-2027) ($MN)
  • Table 108 Asia Pacific Die Bonder Equipment Market Outlook, By Automotive (2018-2027) ($MN)
  • Table 109 Asia Pacific Die Bonder Equipment Market Outlook, By Consumer Electronics (2018-2027) ($MN)
  • Table 110 Asia Pacific Die Bonder Equipment Market Outlook, By Healthcare (2018-2027) ($MN)
  • Table 111 Asia Pacific Die Bonder Equipment Market Outlook, By Industrial (2018-2027) ($MN)
  • Table 112 Asia Pacific Die Bonder Equipment Market Outlook, By Telecommunications (2018-2027) ($MN)
  • Table 113 South America Die Bonder Equipment Market Outlook, By Country (2018-2027) ($MN)
  • Table 114 South America Die Bonder Equipment Market Outlook, By Supply Chain Participant (2018-2027) ($MN)
  • Table 115 South America Die Bonder Equipment Market Outlook, By IDM(Integrated Device Manufacturers) Firms (2018-2027) ($MN)
  • Table 116 South America Die Bonder Equipment Market Outlook, By OSAT(Outsourced Semiconductor Assembly and Test) Companies (2018-2027) ($MN)
  • Table 117 South America Die Bonder Equipment Market Outlook, By Type (2018-2027) ($MN)
  • Table 118 South America Die Bonder Equipment Market Outlook, By Fully Automatic Die Bonders (2018-2027) ($MN)
  • Table 119 South America Die Bonder Equipment Market Outlook, By Manual Die Bonders (2018-2027) ($MN)
  • Table 120 South America Die Bonder Equipment Market Outlook, By Semiautomatic Die Bonders (2018-2027) ($MN)
  • Table 121 South America Die Bonder Equipment Market Outlook, By Device (2018-2027) ($MN)
  • Table 122 South America Die Bonder Equipment Market Outlook, By MEMS and MOEMS (2018-2027) ($MN)
  • Table 123 South America Die Bonder Equipment Market Outlook, By Optoelectronics (2018-2027) ($MN)
  • Table 124 South America Die Bonder Equipment Market Outlook, By Power Devices (2018-2027) ($MN)
  • Table 125 South America Die Bonder Equipment Market Outlook, By Bonding Technique (2018-2027) ($MN)
  • Table 126 South America Die Bonder Equipment Market Outlook, By Epoxy (2018-2027) ($MN)
  • Table 127 South America Die Bonder Equipment Market Outlook, By Eutectic (2018-2027) ($MN)
  • Table 128 South America Die Bonder Equipment Market Outlook, By Flip Chip Die Bonder (2018-2027) ($MN)
  • Table 129 South America Die Bonder Equipment Market Outlook, By Soft Solder (2018-2027) ($MN)
  • Table 130 South America Die Bonder Equipment Market Outlook, By Product (2018-2027) ($MN)
  • Table 131 South America Die Bonder Equipment Market Outlook, By High Speed Placement Machine (2018-2027) ($MN)
  • Table 132 South America Die Bonder Equipment Market Outlook, By Medium Speed Placement Machine (2018-2027) ($MN)
  • Table 133 South America Die Bonder Equipment Market Outlook, By Ultra High Speed Placement Machine (2018-2027) ($MN)
  • Table 134 South America Die Bonder Equipment Market Outlook, By Application (2018-2027) ($MN)
  • Table 135 South America Die Bonder Equipment Market Outlook, By Aerospace & Defense (2018-2027) ($MN)
  • Table 136 South America Die Bonder Equipment Market Outlook, By Automotive (2018-2027) ($MN)
  • Table 137 South America Die Bonder Equipment Market Outlook, By Consumer Electronics (2018-2027) ($MN)
  • Table 138 South America Die Bonder Equipment Market Outlook, By Healthcare (2018-2027) ($MN)
  • Table 139 South America Die Bonder Equipment Market Outlook, By Industrial (2018-2027) ($MN)
  • Table 140 South America Die Bonder Equipment Market Outlook, By Telecommunications (2018-2027) ($MN)
  • Table 141 Middle East & Africa Die Bonder Equipment Market Outlook, By Country (2018-2027) ($MN)
  • Table 142 Middle East & Africa Die Bonder Equipment Market Outlook, By Supply Chain Participant (2018-2027) ($MN)
  • Table 143 Middle East & Africa Die Bonder Equipment Market Outlook, By IDM(Integrated Device Manufacturers) Firms (2018-2027) ($MN)
  • Table 144 Middle East & Africa Die Bonder Equipment Market Outlook, By OSAT(Outsourced Semiconductor Assembly and Test) Companies (2018-2027) ($MN)
  • Table 145 Middle East & Africa Die Bonder Equipment Market Outlook, By Type (2018-2027) ($MN)
  • Table 146 Middle East & Africa Die Bonder Equipment Market Outlook, By Fully Automatic Die Bonders (2018-2027) ($MN)
  • Table 147 Middle East & Africa Die Bonder Equipment Market Outlook, By Manual Die Bonders (2018-2027) ($MN)
  • Table 148 Middle East & Africa Die Bonder Equipment Market Outlook, By Semiautomatic Die Bonders (2018-2027) ($MN)
  • Table 149 Middle East & Africa Die Bonder Equipment Market Outlook, By Device (2018-2027) ($MN)
  • Table 150 Middle East & Africa Die Bonder Equipment Market Outlook, By MEMS and MOEMS (2018-2027) ($MN)
  • Table 151 Middle East & Africa Die Bonder Equipment Market Outlook, By Optoelectronics (2018-2027) ($MN)
  • Table 152 Middle East & Africa Die Bonder Equipment Market Outlook, By Power Devices (2018-2027) ($MN)
  • Table 153 Middle East & Africa Die Bonder Equipment Market Outlook, By Bonding Technique (2018-2027) ($MN)
  • Table 154 Middle East & Africa Die Bonder Equipment Market Outlook, By Epoxy (2018-2027) ($MN)
  • Table 155 Middle East & Africa Die Bonder Equipment Market Outlook, By Eutectic (2018-2027) ($MN)
  • Table 156 Middle East & Africa Die Bonder Equipment Market Outlook, By Flip Chip Die Bonder (2018-2027) ($MN)
  • Table 157 Middle East & Africa Die Bonder Equipment Market Outlook, By Soft Solder (2018-2027) ($MN)
  • Table 158 Middle East & Africa Die Bonder Equipment Market Outlook, By Product (2018-2027) ($MN)
  • Table 159 Middle East & Africa Die Bonder Equipment Market Outlook, By High Speed Placement Machine (2018-2027) ($MN)
  • Table 160 Middle East & Africa Die Bonder Equipment Market Outlook, By Medium Speed Placement Machine (2018-2027) ($MN)
  • Table 161 Middle East & Africa Die Bonder Equipment Market Outlook, By Ultra High Speed Placement Machine (2018-2027) ($MN)
  • Table 162 Middle East & Africa Die Bonder Equipment Market Outlook, By Application (2018-2027) ($MN)
  • Table 163 Middle East & Africa Die Bonder Equipment Market Outlook, By Aerospace & Defense (2018-2027) ($MN)
  • Table 164 Middle East & Africa Die Bonder Equipment Market Outlook, By Automotive (2018-2027) ($MN)
  • Table 165 Middle East & Africa Die Bonder Equipment Market Outlook, By Consumer Electronics (2018-2027) ($MN)
  • Table 166 Middle East & Africa Die Bonder Equipment Market Outlook, By Healthcare (2018-2027) ($MN)
  • Table 167 Middle East & Africa Die Bonder Equipment Market Outlook, By Industrial (2018-2027) ($MN)
  • Table 168 Middle East & Africa Die Bonder Equipment Market Outlook, By Telecommunications (2018-2027) ($MN)
目次

According to Stratistics MRC, the Global Die Bonder Equipment Market is accounted for $820.00 million in 2019 and is expected to reach $1,258.44 million by 2027 growing at a CAGR of 5.5% during the forecast period. Growing demand for miniature electronic components and increasing adoption of stacked die technology in IOT devices are the major factors driving the market growth. However, high cost of ownership is restraining the market growth. Moreover, increasing demand for 3D semiconductor assembly and packaging may provide ample opportunities for the market growth.

Die bonding, alternatively known as die attaching is the process of bonding or attaching a chip either to a package or to some substrate. Thus, die bonder equipment is used extensively in the fabrication process of semiconductor devices. Die bonder equipment performs various functions including picking the die from waffle tray or wafer and attaching it to the substrate. The most commonly used technique of die bonding is to push the targeted die from the tape with the help of a pin.

Based on application, the consumer electronics segment is likely to have a huge demand. The growth of this segment is attributed to the high demand for miniaturized consumer electronic products, such as smartphones, wearables, and white goods that provide advantages such as compactness and durability.

By geography, Asia Pacific is going to have a lucrative growth during the forecast period due to the presence of a large number of OSAT companies in the region. These OSAT companies use die bonding equipment in the semiconductor fabrication process. Additionally, an increasing number of IDMs in the region is expected to boost the market growth in the near future.

Some of the key players profiled in the Die Bonder Equipment Market include Anza Technology Inc, ASM Pacific Technology Ltd, Be Semiconductor Industries N.V., Dias Automation (Hk) Ltd, Dr. Tresky Ag, Fasford Technology Co Ltd, Finetech GmbH & Co Kg, Four Technos Co Ltd, Hybond Inc, Kulicke & Soffa, Microassembly Technologies Ltd, Mycronic AB, Palomar Technologies Inc, Paroteq GmbH, Shibuya Corporation, Shinkawa Ltd, Smart Equipment Technology, Tpt Wire Bonder GmbH & Co Kg, Tresky GmbH, Unitemp GmbH and West Bond Inc.

Supply Chain Participants Covered:

  • IDM(Integrated Device Manufacturers) Firms
  • OSAT(Outsourced Semiconductor Assembly and Test) Companies

Types Covered:

  • Fully Automatic Die Bonders
  • Manual Die Bonders
  • Semiautomatic Die Bonders

Devices Covered:

  • MEMS and MOEMS
  • Optoelectronics
  • Power Devices

Bonding Techniques Covered:

  • Epoxy
  • Eutectic
  • Flip Chip Die Bonder
  • Soft Solder

Products Covered:

  • High Speed Placement Machine
  • Medium Speed Placement Machine
  • Ultra High Speed Placement Machine

Applications Covered:

  • Aerospace & Defense
  • Automotive
  • Consumer Electronics
  • Healthcare
  • Industrial
  • Telecommunications

Regions Covered:

  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • Italy
    • France
    • Spain
    • Rest of Europe
  • Asia Pacific
    • Japan
    • China
    • India
    • Australia
    • New Zealand
    • South Korea
    • Rest of Asia Pacific
  • South America
    • Argentina
    • Brazil
    • Chile
    • Rest of South America
  • Middle East & Africa
    • Saudi Arabia
    • UAE
    • Qatar
    • South Africa
    • Rest of Middle East & Africa

What our report offers:

  • Market share assessments for the regional and country-level segments
  • Strategic recommendations for the new entrants
  • Covers Market data for the years 2018, 2019, 2020, 2024 and 2027
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic analysis: Drivers and Constraints, Product/Technology Analysis, Porter's five forces analysis, SWOT analysis, etc.
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

  • Company Profiling
    • Comprehensive profiling of additional market players (up to 3)
    • SWOT Analysis of key players (up to 3)
  • Regional Segmentation
    • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
  • Competitive Benchmarking

Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

  • 2.1 Abstract
  • 2.2 Stake Holders
  • 2.3 Research Scope
  • 2.4 Research Methodology
    • 2.4.1 Data Mining
    • 2.4.2 Data Analysis
    • 2.4.3 Data Validation
    • 2.4.4 Research Approach
  • 2.5 Research Sources
    • 2.5.1 Primary Research Sources
    • 2.5.2 Secondary Research Sources
    • 2.5.3 Assumptions

3 Market Trend Analysis

  • 3.1 Introduction
  • 3.2 Drivers
  • 3.3 Restraints
  • 3.4 Opportunities
  • 3.5 Threats
  • 3.6 Product Analysis
  • 3.7 Application Analysis
  • 3.8 Emerging Markets
  • 3.9 Impact of Covid-19

4 Porters Five Force Analysis

  • 4.1 Bargaining power of suppliers
  • 4.2 Bargaining power of buyers
  • 4.3 Threat of substitutes
  • 4.4 Threat of new entrants
  • 4.5 Competitive rivalry

5 Global Die Bonder Equipment Market, By Supply Chain Participant

  • 5.1 Introduction
  • 5.2 IDM(Integrated Device Manufacturers) Firms
  • 5.3 OSAT(Outsourced Semiconductor Assembly and Test) Companies

6 Global Die Bonder Equipment Market, By Type

  • 6.1 Introduction
  • 6.2 Fully Automatic Die Bonders
  • 6.3 Manual Die Bonders
  • 6.4 Semiautomatic Die Bonders

7 Global Die Bonder Equipment Market, By Device

  • 7.1 Introduction
  • 7.2 MEMS and MOEMS
  • 7.3 Optoelectronics
  • 7.4 Power Devices

8 Global Die Bonder Equipment Market, By Bonding Technique

  • 8.1 Introduction
  • 8.2 Epoxy
  • 8.3 Eutectic
  • 8.4 Flip Chip Die Bonder
  • 8.5 Soft Solder

9 Global Die Bonder Equipment Market, By Product

  • 9.1 Introduction
  • 9.2 High Speed Placement Machine
  • 9.3 Medium Speed Placement Machine
  • 9.4 Ultra High Speed Placement Machine

10 Global Die Bonder Equipment Market, By Application

  • 10.1 Introduction
  • 10.2 Aerospace & Defense
  • 10.3 Automotive
  • 10.4 Consumer Electronics
  • 10.5 Healthcare
  • 10.6 Industrial
  • 10.7 Telecommunications

11 Global Die Bonder Equipment Market, By Geography

  • 11.1 Introduction
  • 11.2 North America
    • 11.2.1 US
    • 11.2.2 Canada
    • 11.2.3 Mexico
  • 11.3 Europe
    • 11.3.1 Germany
    • 11.3.2 UK
    • 11.3.3 Italy
    • 11.3.4 France
    • 11.3.5 Spain
    • 11.3.6 Rest of Europe
  • 11.4 Asia Pacific
    • 11.4.1 Japan
    • 11.4.2 China
    • 11.4.3 India
    • 11.4.4 Australia
    • 11.4.5 New Zealand
    • 11.4.6 South Korea
    • 11.4.7 Rest of Asia Pacific
  • 11.5 South America
    • 11.5.1 Argentina
    • 11.5.2 Brazil
    • 11.5.3 Chile
    • 11.5.4 Rest of South America
  • 11.6 Middle East & Africa
    • 11.6.1 Saudi Arabia
    • 11.6.2 UAE
    • 11.6.3 Qatar
    • 11.6.4 South Africa
    • 11.6.5 Rest of Middle East & Africa

12 Key Developments

  • 12.1 Agreements, Partnerships, Collaborations and Joint Ventures
  • 12.2 Acquisitions & Mergers
  • 12.3 New Product Launch
  • 12.4 Expansions
  • 12.5 Other Key Strategies

13 Company Profiling

  • 13.1 Anza Technology Inc
  • 13.2 ASM Pacific Technology Ltd
  • 13.3 Be Semiconductor Industries N.V.
  • 13.4 Dias Automation (Hk) Ltd
  • 13.5 Dr. Tresky Ag
  • 13.6 Fasford Technology Co Ltd
  • 13.7 Finetech GmbH & Co Kg
  • 13.8 Four Technos Co Ltd
  • 13.9 Hybond Inc
  • 13.10 Kulicke & Soffa
  • 13.11 Microassembly Technologies Ltd
  • 13.12 Mycronic AB
  • 13.13 Palomar Technologies Inc
  • 13.14 Paroteq GmbH
  • 13.15 Shibuya Corporation
  • 13.16 Shinkawa Ltd
  • 13.17 Smart Equipment Technology
  • 13.18 Tpt Wire Bonder GmbH & Co Kg
  • 13.19 Tresky GmbH
  • 13.20 Unitemp GmbH
  • 13.21 West Bond Inc
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