According to Stratistics MRC, the Global Flexible Printed Circuit Boards Market is accounted for $17.40 billion in 2019 and is expected to reach $47.93 billion by 2027 growing at a CAGR of 13.5% during the forecast period. Rising demand for consumer electronic goods and the growing use of flex circuits in electronic wearables are some of the major factors propelling the growth of the market. However, the high initial cost associated with flexible PCBs is restraining the growth of the market.
Flexible printed circuit boards are highly resourceful interconnectivity solutions used for a wide range of electronic devices with complex circuitry. These PCBs are traces of conductive material on a flexible substrate and are used to shun complex structuring of wiring and other connections. Flexible PCBs are also utilized for efficient interconnection between electronic components such as integrated circuits, capacitors, and resistors. Advantages include frivolous and economical nature, simple structuring, and design freedom drive the growth of the flexible PCBs market.
Based on the type, the multilayer flex segment is going to have a lucrative growth during the forecast period due to the rising adoption in industry-specific applications and high-functioning electronics. Multilayer PCBs are extremely high-density assemblies making it more powerful and durable as compared to others and thus are expected to witness strong growth in the forthcoming years.
By geography, Asia Pacific is expected to grow at a significant market share during the forecast period owing to the huge consumer electronics market. Countries such as China, Taiwan, Japan, and South Korea are semiconductor hubs and produce almost 80% of PCB production worldwide. Large scale investments in flexible printed circuit board manufacturing technology by semiconductor manufacturers are anticipated to boost the Asia Pacific FPCBs market growth.
Some of the key players profiled in the Flexible Printed Circuit Boards Market include Fujikura Ltd., Interflex Co., Ltd., Young Poong, Career Technology, FLEXium Interconnect, Inc., Multi-Fineline Electronix, Inc., ICHIA Technologies Inc., Nitto Denko Corp., SEMCO, Ibiden, Daeduck, Tripod, and Unimicron.
Types Covered:
- Multilayer Flex
- Rigid-Flex
- Double-Sided Flex
- Single-Sided Flex
- Double Access Flex
- Back-bared Flex
- Sculptured Flex
End Users Covered:
- Consumer Electronics
- Automotive Electronics
- Industrial Electronics
- Manufacturing
- Aerospace & Defense
- Medical Devices
- Wearables
- IT & Telecom
- Computers & Data Storage
- Instrumentation
Regions Covered:
- North America
- Europe
- Germany
- UK
- Italy
- France
- Spain
- Rest of Europe
- Asia Pacific
- Japan
- China
- India
- Australia
- New Zealand
- South Korea
- Rest of Asia Pacific
- South America
- Argentina
- Brazil
- Chile
- Rest of South America
- Middle East & Africa
- Saudi Arabia
- UAE
- Qatar
- South Africa
- Rest of Middle East & Africa
What our report offers:
- Market share assessments for the regional and country-level segments
- Strategic recommendations for the new entrants
- Covers Market data for the years 2018, 2019 2020, 2024, and 2027
- Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
- Strategic recommendations in key business segments based on the market estimations
- Competitive landscaping mapping the key common trends
- Company profiling with detailed strategies, financials, and recent developments
- Supply chain trends mapping the latest technological advancements
Free Customization Offerings:
All the customers of this report will be entitled to receive one of the following free customization options:
- Company Profiling
- Comprehensive profiling of additional market players (up to 3)
- SWOT Analysis of key players (up to 3)
- Regional Segmentation
- Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
- Competitive Benchmarking
- Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances
Table of Contents
1 Executive Summary
2 Preface
- 2.1 Abstract
- 2.2 Stake Holders
- 2.3 Research Scope
- 2.4 Research Methodology
- 2.4.1 Data Mining
- 2.4.2 Data Analysis
- 2.4.3 Data Validation
- 2.4.4 Research Approach
- 2.5 Research Sources
- 2.5.1 Primary Research Sources
- 2.5.2 Secondary Research Sources
- 2.5.3 Assumptions
3 Market Trend Analysis
- 3.1 Introduction
- 3.2 Drivers
- 3.3 Restraints
- 3.4 Opportunities
- 3.5 Threats
- 3.6 End User Analysis
- 3.7 Emerging Markets
- 3.8 Impact of Covid-19
4 Porters Five Force Analysis
- 4.1 Bargaining power of suppliers
- 4.2 Bargaining power of buyers
- 4.3 Threat of substitutes
- 4.4 Threat of new entrants
- 4.5 Competitive rivalry
5 Global Flexible Printed Circuit Boards Market, By Type
- 5.1 Introduction
- 5.2 Multilayer Flex
- 5.3 Rigid Flex
- 5.4 Double-Sided Flex
- 5.5 Single-Sided Flex
- 5.6 Double Access Flex
- 5.7 Back-bared Flex
- 5.8 Sculptured Flex
6 Global Flexible Printed Circuit Boards Market, By End User
- 6.1 Introduction
- 6.2 Consumer Electronics
- 6.3 Automotive Electronics
- 6.4 Industrial Electronics
- 6.5 Manufacturing
- 6.6 Aerospace & Defense
- 6.7 Medical Devices
- 6.8 Wearables
- 6.9 IT & Telecom
- 6.10 Computers & Data Storage
- 6.11 Instrumentation
7 Global Flexible Printed Circuit Boards Market, By Geography
- 7.1 Introduction
- 7.2 North America
- 7.2.1 US
- 7.2.2 Canada
- 7.2.3 Mexico
- 7.3 Europe
- 7.3.1 Germany
- 7.3.2 UK
- 7.3.3 Italy
- 7.3.4 France
- 7.3.5 Spain
- 7.3.6 Rest of Europe
- 7.4 Asia Pacific
- 7.4.1 Japan
- 7.4.2 China
- 7.4.3 India
- 7.4.4 Australia
- 7.4.5 New Zealand
- 7.4.6 South Korea
- 7.4.7 Rest of Asia Pacific
- 7.5 South America
- 7.5.1 Argentina
- 7.5.2 Brazil
- 7.5.3 Chile
- 7.5.4 Rest of South America
- 7.6 Middle East & Africa
- 7.6.1 Saudi Arabia
- 7.6.2 UAE
- 7.6.3 Qatar
- 7.6.4 South Africa
- 7.6.5 Rest of Middle East & Africa
8 Key Developments
- 8.1 Agreements, Partnerships, Collaborations and Joint Ventures
- 8.2 Acquisitions & Mergers
- 8.3 New Product Launch
- 8.4 Expansions
- 8.5 Other Key Strategies
9 Company Profiling
- 9.1 Fujikura Ltd.
- 9.2 Interflex Co., Ltd.
- 9.3 Young Poong
- 9.4 Career Technology
- 9.5 FLEXium Interconnect, Inc.
- 9.6 Multi-Fineline Electronix, Inc.
- 9.7 ICHIA Technologies Inc.
- 9.8 Nitto Denko Corp.
- 9.9 SEMCO
- 9.10 Ibiden
- 9.11 Daeduck
- 9.12 Tripod
- 9.13 Unimicron
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