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世界と中国のIC基板産業の分析

Global and China IC Substrate Industry Report, 2015

発行 ResearchInChina 商品コード 307705
出版日 ページ情報 英文 120 Pages
納期: 即日から翌営業日
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本日の銀行送金レート: 1USD=114.71円で換算しております。
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世界と中国のIC基板産業の分析 Global and China IC Substrate Industry Report, 2015
出版日: 2015年03月09日 ページ情報: 英文 120 Pages
概要

世界のIC基板産業は、PC需要(およびCPU用基板の需要)の低迷や、企業間の価格競争の激化に伴い、2012〜2013年にかけて苦しい状況が続きました。しかし、2014年以降は業績は回復に向かうと予想されています。その理由として、新たなICパッケージング技術の導入や、LTE 4Gネットワークの拡張に伴う基地局向け需要の増大、ウェアラブル・デバイスの登場によるSiPモジュール需要の拡大、超薄型携帯電話向け需要、PC業界の復活といった要素が挙げられます。世界のIC基板市場は日本・韓国・台湾企業が独占しており、中国企業は技術面でも市場構造の点でも立ち遅れています。

当レポートでは、世界と中国のIC基板産業の現状と将来展望について分析し、世界の半導体産業の現状を初め、IC基板の技術的特性、産業構造(関連産業とのつながり)、市場規模の実績値・予測値、世界と中国の主なIC基板メーカー・パッケージング企業の概要といった情報をお届けします。

第1章 世界の半導体産業

  • 産業概要
  • ICパッケージング
  • ICパッケージング・検査

第2章 IC基板

  • イントロダクション
  • フリップチップ式IC基板
  • 世界の携帯電話市場
  • 世界のスマートフォン市場
  • 中国の携帯電話市場
  • ノート型パソコン市場
  • CPU および GPU 市場
  • メモリ市場

第3章 IC基板市場・産業

  • IC基板市場
  • ワイドIO/HMC メモリ
  • 部品内蔵基盤
  • 配線内蔵基盤
  • ポータブルデバイス用ICパッケージング
  • SIPパッケージング
  • 2.5D パッケージング(シリコン/ガラス/有機樹脂 インターポ―ザ)
  • TSV (3D)パッケージング
  • FC-PoP パッケージング
  • IC基板産業

第4章 IC基板ベンダー

  • Unimicron
  • イビデン
  • Daeduck Electronics
  • SIMMTECH
  • LG INNOTEK
  • SEMCO
  • Nan Ya PCB
  • Kinsus
  • 新光電気工業
  • 京セラSLCテクノロジー
  • AT&S
  • ACCESS
  • EASTERN

第5章 IC基板パッケージング企業

  • ASE
  • Amkor
  • SPIL
  • STATS ChipPAC
  • 三菱ガス化学
  • 味の素

図表一覧

このページに掲載されている内容は最新版と異なる場合があります。詳細はお問い合わせください。

目次
Product Code: BXM079

‘Global and China IC Substrate Industry Report, 2015’ highlights the followings:

  • 1. Status quo of semiconductor and IC packaging industry
  • 2. Analysis on downstream market of IC substrate
  • 3. Development trend of IC substrate
  • 4. Analysis on IC substrate industry
  • 5. Research on 12 IC substrate vendors
  • 6. Research on 6 IC substrate peripheral companies

IC substrate industry may be in a predicament in 2015, rooted in two aspects: first, the maturing of FOWLP; second, the tablet sales decline and sluggish smartphone growth. In addition, the prosperity of IC substrate industry in 2013 stimulated large-scale expansion of enterprises in 2014, thus leading to an insufficient rate of capacity utilization.

For FC-CSP substrate with mobile phone and tablet PC as the core market facing strong competition from FOWLP that has overwhelming superiorities including low profile, higher speed, more I/O, higher integration, less processing step, especially needing no substrate which slashes cost as IC substrate accounts for more than half of the total cost of IC.

Although it is in its infancy without obvious cost advantage, FOWLP has been an irresistible trend, the traditional FC-CSP substrate will have to reduce the price to enter a competition, and the demand for the latter will be sharply reduced by more than 60% once FOWLP matures. So in 2015, FC-CSP substrate vendors have to substantially reduce the price to gain market advantage in advance. It is expected that in 2015 the IC substrate market will encounter a 7% scale-down to USD7.12 billion.

In the downstream market, large screen mobile phone squeezed the living space of tablet PC which declined significantly. And the single-functional tablet PC is mostly used as a toy for children with less demand for replacement. In the field of smartphone, China as the world's largest smartphone market declined in 2014.

SiP packaging substrate will be the highlight for IC substrate market in 2015 as core components of high-end smart watches must adopt SiP packaging. Both the two core processors built in Apple Watch use SiP packaging technology. The most important SiP substrate of Apple Watch calls for the most difficult production, priced 4-5 times higher than FCCSP applied to general ARM processor. The orders are shared by Nanya, Kinsus and other Taiwanese vendors. ASE undertakes Apple Watch's SI chip SiP packaging business.

The PC market is also likely to recover in 2015 for tablet PC slump means the recovery of laptop computer market. Laptop computer market saw the first growth in 2014 after three consecutive years of decline and is expected to continue the trend in 2015. And laptop discrete graphics card accounts for a zooming proportion, signifying GPU shipments boost.

Another excellent performer in IC substrate applications is the memory market.

Revenue of Major IC Substrate Vendors, 2012-2014(USD mln)

Table of Contents

1. Global Semiconductor Industry

  • 1.1. Overview
  • 1.2. IC Packaging
  • 1.3. IC Packaging and Testing

2. Downstream Market of IC Substrate

  • 2.1. Introduction to IC Substrate
  • 2.2. Flip Chip IC Substrate
  • 2.3. Global Mobile Phone Market
  • 2.4. Global Smartphone Market
  • 2.5. Chinese Mobile Phone Market
  • 2.6. Laptop Computer Market
  • 2.7. CPU and GPU Market
  • 2.8. Memory Market

3. IC Substrate Market and Industry

  • 3.1. IC Substrate Market
  • 3.2. Wide IO/HMC Memory
  • 3.3. Embedded Component Substrate
  • 3.4. Embedded Trace Substrate
  • 3.5. IC Packaging for Portable Devices
    • 3.5.1. Status Quo
    • 3.5.2. PoP Packaging
    • 3.5.3. FOWLP
  • 3.6. SIP Packaging
  • 3.7. 2.5D Packaging (SI/Glass/Organic Interposer)
    • 3.7.1. Introduction to 2.5D Packaging
    • 3.7.2. Application of 2.5D Packaging
    • 3.7.3. Market Size of 2.5D Interposer
    • 3.7.4. Suppliers of 2.5D Packaging
  • 3.8. TSV (3D) Packaging
    • 3.8.1. TSV Packaging Equipment
  • 3.9. FC-PoP Packaging
  • 3.10. IC Substrate Industry

4. IC Substrate Vendors

  • 4.1. Unimicron
  • 4.2. IBIDEN
  • 4.3. Daeduck Electronics
  • 4.4. SIMMTECH
  • 4.5. LG INNOTEK
  • 4.6. SEMCO
  • 4.7. Nan Ya PCB
  • 4.8. KINSUS
  • 4.9. SHINKO
  • 4.10. KYOCERA SLC
  • 4.11. AT&S
  • 4.12. ACCESS
  • 4.13. EASTERN

5. IC Substrate Packaging Companies

  • 5.1. ASE
  • 5.2. AMKOR
  • 5.3. SPIL
  • 5.4. STATS ChipPAC
  • 5.5. Mitsubishi Gas Chemical Company
  • 5.6. AJINOMOTO

Selected Charts:

  • Global Semiconductor Market Size, 1994-2019E
  • Global Semiconductor Market Growth Rate, 2015
  • Downstream Application of Global Semiconductor Market, 1998-2019E
  • Geographical Distribution of Global Semiconductor Market, 2009-2019E
  • Capital of Global Semiconductor Enterprises, 2000-2019E
  • Geographical Distribution of Global Semiconductor Equipment Market, 2012-2016E
  • Wafer Process Equipment Sales by Product, 2010-2019E
  • Top 30 of Global Semiconductor Industry by Revenue, 2014
  • IC Packaging Types Used by Major Electronic Products
  • Global IC Packaging and Testing Market Size, 2012-2017E
  • Global Outsourcing IC Packaging and Testing Market Size, 2012-2017E
  • Global IC Packaging Market Size, 2012-2017E
  • Global IC Testing Market Size, 2012-2017E
  • Revenue of Taiwan Packaging and Testing Industry, 2009-2013
  • Revenue of Top 10 Global Packaging Enterprises, 2013
  • Global Mobile Phone Shipments, 2007-2015E
  • Geographical Distribution of Global 3G/4G Mobile Phone Shipments, 2011-2014
  • Worldwide Mobile Phone Sales to End Users by Vendor in 2013
  • Shipments of Top 10 Global Mobile Phone Vendors, Q3 2014
  • Worldwide Smartphone Sales to End Users by Vendor in 2013
  • Worldwide Smartphone Sales to End Users by Operating System in 2013
  • Shipments of Top 13 Global Smartphone Vendors, 2013-2015E
  • Shipments of Major Smartphone Vendors, Q3 2014
  • Monthly Shipments of China Mobile Phone Market, 2013-2014
  • Market Share of Major Vendors in China Smartphone Market, 2014
  • Market Share of Major Vendors in China 4G Mobile Phone Market, 2014
  • Global Tablet PC Shipments, 2011-2016E
  • Top Five Tablet Vendors, Shipments Fourth Quarter 2014
  • Top Five Tablet Vendors, Shipments, Market Share, and Growth, Calendar Year 2014
  • CPU and GPU Shipments, 2008-2015E
  • Laptop Computer Shipments, 2008-2015E
  • Shipments of Major Global Laptop ODM Vendors, 2010-2014
  • Memory Market Size, 2012-2016E
  • IC Substrate Market Size, 2009-2016E
  • IC Substrate Market Size by Technology, 2009-2016E
  • Specific Application Products of IC Substrate
  • Mobile DRAM Trend
  • Advantages of WIDE IO
  • SK Hynix WIDE IO2 Roadmap
  • HMC Architecture
  • HMC BENEFITS
  • Advantages of Embedded Passive and Active Component Motherboard
  • Embedded Component Substrate Process
  • Comparison of Embedded Active & Passive Components
  • Roadmap of Embedded Passive Substrate
  • Structure Roadmap of Embedded Active Substrate
  • FOWLP and PLP Process Comparison
  • WHY EMBEDDED TRACE?
  • EMBEDDED TRACE Package Features
  • EMBEDDED TRACE Package Sweet Spot (for Wire Bonding)
  • EMBEDDED TRACE Package Sweet Spot (for FLIP CHIP)
  • Apple iPad 4 LTE A1459 IC Package Type List
  • Development Trend of PoP Packaging
  • 2.5D Interposer Manffacturing Revenue
  • Breakdown by Interposer Bulk Material, 2010-2017
  • Downstream Application of TSV
  • TSV Equipment Suppliers
  • Distribution of TSV Packaging Equipment, 2012-2017E
  • Revenue of Major IC Substrate Vendors, 2010-2014
  • Unimicron's Organizational Structure
  • Unimicron's Revenue and Gross Margin, 2003-2014
  • Unimicron's Revenue and Operating Margin, 2009-2014
  • Unimicron's Revenue and Gross Margin, Q1 2012-Q4 2014
  • Unimicron's Sales Breakdown by Technology, 2010-2014
  • Unimicron's Sales Breakdown by Application, 2010-2014
  • Unimicron's Capacity, 2010-2014
  • Unimicron's CAPEX, 2004-2013
  • Unimicron's M & A
  • IBIDEN's Revenue and Operating Margin, FY2006-FY2015
  • IBIDEN's Revenue Breakdown by Business, FY2006-FY2015
  • IBIDEN's Revenue Breakdown by Business, Q2 2012-Q2 2014
  • IBIDEN's Operating Income by Business, Q2 2012-Q2 2014
  • Ibiden Electronics' Revenue Breakdown by Product, FY2010-FY2015
  • IBIDEN's CAPEX and Depreciation, FY2010-FY2015
  • Daeduck Electronics' Revenue and Operating Margin, 2005-2014
  • Daeduck Electronics' Revenue by Business, 2009-2014
  • Daeduck GDS' Revenue and Operating Margin, 2005-2014
  • Daeduck GDS' Revenue Breakdown by Business, 2010-2014
  • SIMMTECH's Organizational Structure
  • SIMMTECH's Revenue and Operating Margin, 2004-2014
  • SIMMTECH's Revenue, Gross Margin and Net Profit Margin, 2009-2014
  • SIMMTECH's Balance Sheet, 2009-2013
  • SIMMTECH's Revenue Breakdown by Product, 2013-2015
  • SIMMTECH's Gross Margin and Operating Margin, Q1 2013-Q4 2014
  • SIMMTECH's Shipments, Q1 2013-Q4 2014
  • SIMMTECH's Shipments, 2012-2015E
  • SIMMTECH's Capacity Utilization, Q1 2013-Q4 2014
  • SIMMTECH's Capacity Utilization, 2012-2015E
  • SIMMTECH's Revenue by Application, 2008-2014
  • SIMMTECH's Substrate Revenue by Application, 2012-2014
  • SIMMTECH's Plants
  • LG INNOTEK's Revenue and Operating Margin, 2006-2015E
  • LG INNOTEK's Revenue and Operating Margin, Q1 2012-Q4 2014
  • LG INNOTEK's Revenue Breakdown by Business, 2011-2015E
  • LG INNOTEK's Operating Income by Business, 2011-2015E
  • SEMCO's Revenue and Operating Margin, 2009-2014
  • SEMCO's Revenue Breakdown by Department, 2010-2014
  • Revenue and Operating Margin of SEMCO's ACI Segment, Q1 2013-Q4 2014
  • SEMCO's HDI and PKG Revenue, Q1-Q4 2014
  • Nan Ya PCB's Organizational Structure
  • Nan Ya PCB's Revenue and Gross Margin, 2006-2014
  • Nan Ya PCB's Revenue and Operating Margin, 2009-2015E
  • Nan Ya PCB's Revenue and Growth Rate, Jan 2013-Jan 2015
  • Nan Ya PCB's Capacity and Global Distribution
  • KINSUS' Revenue and Gross Margin, 2004-2014
  • KINSUS' Revenue and Operating Margin, 2009-2015E
  • KINSUS' Revenue and Growth Rate, Jan 2013-Jan 2015
  • KINSUS' Revenue Breakdown by Product, 2011-2014
  • KINSUS' Revenue Breakdown by Application, 2011
  • KINSUS' Revenue by Application, Q1 2014
  • KINSUS' Revenue by Application, Q4 2014
  • Customer Distribution of KINSUS, 2013\2014
  • SHINKO's Revenue and Net Income, FY2007-FY2015
  • SHINKO's Revenue Breakdown by Business, FY2010-FY2015
  • AT&S and EBITDA Margin, FY2005-FY2015
  • Chongqing Substrate Plant Ramp of AT&S
  • AT&S' Revenue Breakdown by Business/Region, FY2014
  • AT&S' Revenue Breakdown by Business/Region, FY2015
  • Revenue of AT&S' Mobile Devices & Substrates Business, Q2/13-Q4/14
  • Main Customers of AT&S' Mobile Devices & Substrates Business
  • Revenue of AT&S' Industrial & Automotive Business, Q2/13-Q4/14
  • Main Customers of AT&S' Industrial & Automotive Business
  • AT&S' Employees, 2010-2015
  • AT&S' CAPEX, 2010-2015E
  • Financial Data of ACCESS, 2012-2013
  • Major Clients of ACCESS, 2011-2013
  • Revenue of Packaging Substrate of ACCESS, 2011-2013
  • Major Equipment of ACCESS
  • ASE's Organizational Structure
  • ASE's Revenue and Gross Margin, 2005-2015E
  • ASE's Revenue and Operating Margin, 2009-2015E
  • ASE's Revenue, Jan 2013-Jan 2015
  • ASE's Revenue Breakdown by Business, 2010-2014
  • Revenue and Gross Margin of ASE's Packaging Division, Q1 2013-Q4 2014
  • Revenue Breakdown of ASE's Packaging Division by Type, Q1 2013-Q4 2014
  • Revenue and Gross Margin of ASE's Materials Division, Q1 2013-Q4 2014
  • Revenue Breakdown of ASE's IC Business by Application, Q1 2013-Q4 2014
  • ASE's EMS Revenue and Gross Margin, Q1 2013-Q4 2014
  • ASE's EMS Revenue Breakdown, Q1 2013-Q4 2014
  • Amkor's Revenue, Gross Margin and Operating Margin, 2005-2014
  • Amkor's Revenue Breakdown by Packaging Type, 2007-2014
  • Amkor's Packaged Units, 2012-2014
  • Amkor's Revenue Breakdown by Application, 2012-2014
  • SPIL's Organizational Structure
  • SPIL's Revenue, Gross Margin and Operating Margin, 2003-2014
  • SPIL's Revenue, Jan 2013-Jan 2015
  • SPIL's Revenue, Gross Margin and Operating Margin, Q4 2012-Q4 2014
  • SPIL's Revenue Breakdown by Region, 2005-2014
  • SPIL's Revenue Breakdown by Application, 2005-2014
  • SPIL's Revenue Breakdown by Business, 2005-2014
  • SPIL's Capacity, 2006-2014
  • STATS ChipPAC's Revenue and Gross Margin, 2004-2014
  • STATS ChipPAC's Balance Sheet, 2014
  • STATS ChipPAC's Revenue Breakdown by Packaging Type, 2006-2013
  • STATS ChipPAC's Revenue Breakdown by Application, 2006-2013
  • STATS ChipPAC's Revenue Breakdown by Region, 2006-2013
  • Global Distribution of STATS ChipPAC
  • STATS ChipPAC's Revenue Breakdown by Region/Business, 2014
  • Mitsubishi Gas Chemical's Organization Chart
  • MGC's Revenue and Operating Income, FY2009-FY2015
  • MGC's Revenue by Segment, FY2009-FY2015
  • MGC's Operating Income by Segment, FY2009-FY2015
  • CAPEX and Depreciation of MGC's Information and Advanced Material Division, FY2009-FY2015
  • ABF Application
  • ABF Manufacturing Process
  • ABF Construction
  • Outline of Manufacturing Substrate Using ABF
  • Next Build-up Material in Demand
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