市場調査レポート

世界と中国のIC製造業の分析(2011〜2012年)

Global and China IC Manufacturing Industry Report, 2011-2012

発行 ResearchInChina 商品コード 242703
出版日 ページ情報 英文 111 Pages
納期: 即日から翌営業日
価格
本日の銀行送金レート: 1USD=102.06円で換算しております。
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世界と中国のIC製造業の分析(2011〜2012年) Global and China IC Manufacturing Industry Report, 2011-2012
出版日: 2012年05月01日 ページ情報: 英文 111 Pages
概要

当レポートでは、世界と中国のIC製造業(メモリベンダー・垂直統合型デバイスメーカー・ファウンドリ)について分析し、基本的な産業動向・構造や、各部門の製造能力と市場シェア、主要企業のプロファイルといった情報を盛り込んで、概略以下の構成でお届けします。

第1章 世界の半導体産業

  • 概要
  • IC設計産業
  • ICパッケージング・検査産業の概要
  • 中国のIC市場

第2章 半導体産業

  • アナログ半導体
  • MCU
  • DRAM産業
    • DRAM産業の概要
    • DRAMベンダーの市場占有率
    • モバイル機器用DRAMベンダーの市場占有率
  • NAND
  • 化合物半導体産業

第3章 IC製造業

  • IC製造能力
  • ウェハーのファウンドリ
  • MEMSのファウンドリ
  • 中国のウェハー・ファウンドリ産業
  • ウェハー・ファウンドリ市場
    • 世界の携帯電話市場の規模
    • 携帯電話ブランドの市場占有率
    • スマートフォン市場・産業
    • PC市場
  • IC製造・パッケージング・検査装置市場
  • 半導体素材市場

第4章 主な半導体ベンダー

  • TSMC
  • Samsung
  • Intel
  • UMC
  • SMIC
  • Micron
  • TowerJazz
  • VIS
  • Texas Instruments
  • GlobalFoundries
  • Dongbu HiTek
  • Magnachip
  • ASMC
  • Hua Hong NEC
  • Shanghai Huali Microelectronics
  • Powerchip

図表一覧

目次
Product Code: ZYW109

Abstract

The IC manufacturing industry mainly involves memory vendors, IDMs and foundries. By technology, IC can be divided into analog, digital and mixed signal. Most digital IC businesses are IC design houses and, analog signal businesses commonly refer to IDMs. But it is not the case for Japanese manufacturers, which have long been applying vertical supply chain system and bringing the whole link of the supply chain under control. Thus, nearly all the semiconductor manufacturers in Japan are IDMs.

The foundries fall into two types, one produces high-volume digital IC and the other produces low-volume analog IC, high-voltage IC and mixed signal IC. For high-volume digital IC foundries, they are required to ceaselessly improve the IC process technology by CAPEX at least USD1 billion annually, more than 50% of which are earmarked for equipment depreciation and R&D; for the later, they are much smaller by operation scale, with each annual revenue no more than 700 million USD.

For digital IC foundries, efficiency is the top priority, since only those that can develop the most advanced process technology in the shortest duration can come out top in the cut-throat competition. For instance, the R&D cost is likely to recover within one year provided a company makes the initiative to develop the world's first 90-nm process technology within six months at a cost of USD1 billion. However, if a company develops the same technology by investing the same amount two years later than the pioneer, it means that there is little chance for it to recover its R&D cost, for the less advanced technology is no longer a magnet for customers. Therefore, there is, in general, only one lucrative in digital IC foundries, and one with meager profit, while the rest are either loss-making or with a narrow margin of profit.

TSMC is the biggest player among wafer foundries worldwide, with the market occupancy approximating 48% and its profit making up roughly 85% in the whole industry. The market capitalization of TSMC is as high as USD68 billion, as opposed to the NO.4 SMIC whose market cap is less than USD1.5 billion.

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TSMC, UMC and SMIC are among digital IC foundries, while VIS, TowerJazz, Dongbu HiTek and ASMC are among analog IC, high-voltage IC and mixed-signal foundries. For UMC, its considerable profit is yielded from the investment in a series of well performing IC design houses, such as Mediatek, Novatek and Sunplus, all of which are loyal customers of UMC. Analog foundries have suffered hefty loss for many years, which largely attributed that all its customers are small analog IC designers that are very sensitive to economic climate.

Among foundries in Chinese Mainland, SMIC enjoys absolute dominance. It is the only that has 12-inch wafer fab, comparing to HHNEC and Grace Semiconductor, which were merged by SMIC in late 2011, that only have three 8-inch wafer fabs. Both state-run enterprises, HHNEC and Grace Semiconductor monopolize government-related IC business, which makes them possible to reap lucrative profit. However, both feature laggard of technologies and are hard to face real tough competition. Another case is Shanghai Huali Microelectronics, the investment of which amounts to RMB14.5 billion, by and large backed by the government. In terms of competitiveness, all these businesses far lag behind SMIC

Although Samsung embarked on wafer foundry business as early in 2007, no remarkable achievements have been made over the past five years. In 2007, Samsung's revenue from foundry business reported USD370 million, and the figure in 2011 rose to USD470 million excluding that brought by Apple, the sole big customer of Samsung. Being involved in intellectual property issue, Apple is forced to commission Samsung as its OEM. For Samsung, it sets foot in wafer foundry business with the aim of transferring the excessive capacity. Unlike Samsung, Intel has no intention at all to develop wafer foundry business.

It is worth mentioning that, Taiwan-based DRAMs have been struggling to make the tough choice of transformation or closedown after suffering heavy losses for many years. For instance, Powerchip has shifted its business to foundry. In Q4 2011, 60% revenue of Powerchip was from foundry business. In 2011, Powerchip's revenue from foundry business hit USD431 million, against USD149 million in 2010, marking the fastest developed foundry.

Table of Contents

1. Global Semiconductor Industry

  • 1.1 Overview
  • 1.2 IC Design Industry
  • 1.3 Overview of IC Packaging and Testing Industry
  • 1.4 China IC Market

2. Semiconductor Industry

  • 2.1 Analog Semiconductor
  • 2.2 MCU
  • 2.3 DRAM Industry
    • 2.3.1 Current Status of DRAM Industry
    • 2.3.2 Market Occupancy of DRAM Vendors
    • 2.3.3 Market Occupancy of Mobile DRAM Vendors
  • 2.4 NAND
  • 2.5 Compound Semiconductor Industry

3. IC Manufacturing Industry

  • 3.1 IC Manufacturing Capacity
  • 3.2 Wafer Foundry
  • 3.3 MEMS Foundry
  • 3.4 China Wafer Foundry Industry
  • 3.5 Wafer Foundry Market
    • 3.5.1 Global Mobile Phone Market Size
    • 3.5.2 Market Occupancy of Mobile Phone Brands
    • 3.5.3 Smartphone Market and Industry
    • 3.5.4 PC Market
  • 3.6 IC Manufacturing and Packaging & Testing Equipment Market
  • 3.7 Semiconductor Material Market

4. Major Semiconductor Vendors

  • 4.1 TSMC
  • 4.2 Samsung
  • 4.3 Intel
  • 4.4 UMC
  • 4.5 SMIC
  • 4.6 Micron
  • 4.7TowerJazz
  • 4.8 VIS
  • 4.9 Texas Instruments
  • 4.10 GlobalFoundries
  • 4.11 Dongbu HiTek
  • 4.12 Magnachip
  • 4.13 ASMC
  • 4.14 Hua Hong NEC
  • 4.15 Shanghai Huali Microelectronics
  • 4.16 Powerchip

Selected Charts

  • Semiconductor Industry and GDP Growth Worldwide, 2000-2016
  • Annual CAPEX in Semiconductor Industry, 1990-2011
  • Global Wafer Capacity (200mm Equivalent), 2000-2012
  • Global Top 25 Semiconductor Manufacturers by Sales, 2011
  • Market Occupancy of OSAT Enterprises Worldwide, 2011
  • Revenue of Taiwan's IC Packaging and Testing Industry, 2007-2011
  • Revenue of Semiconductor Packaging Material Manufacturers Worldwide, 2010-2013
  • China IC Market Scale, 2007-2011
  • Product Distribution of China IC Market, 2011
  • Application Distribution of China IC Market, 2011
  • Market Occupancy of Major IC Manufacturers in China, 2011
  • Market Occupancy of Major Analog Semiconductor Manufacturers, 2011
  • Market Occupancy of Catalog Analog Semiconductor Manufacturers, 2011
  • Ranking of Top 10 Analog Semiconductor Manufacturers, 2011
  • Ranking of MCU Manufacturers, 2011
  • CAPEX in DRAM Industry, 2000-2012
  • Global DRAM Shipment, 2000-2013
  • DRAM Contract Price Fluctuation, Oct.2009-Jan.2012
  • Revenue of DRAM Manufacturers Worldwide, 2005Q1-2012Q4
  • Global DRAM Wafer Shipment, 2010Q1-2012Q4
  • RAM Demand, 2001-2013
  • Ranking of DRAM Brand Manufacturers by Revenue, 2011Q4
  • GaAs Industry Chain
  • Major Manufacturers in GaAs Industry Chain
  • Ranking of GaAs Manufacturers Worldwide by Revenue, 2011-2012
  • Capacity of 12-Inch Wafer Worldwide, 2011
  • Capacity of 12-Inch Wafer Manufacturers Worldwide by Region, 1999-2012
  • Global Wafer Equipment Expenditure by Region, 2010-2012
  • Ranking of Wafer Foundries Worldwide by Sales, 2005-2011
  • Operating Margin of Major Wafer Foundries Worldwide, 2005-2011
  • Ranking of Global Top 30 MEMS Enterprises by Revenue, 2011
  • Ranking of Global Top 20 MEMS Wafer Foundries, 2011
  • Sales of Wafer Foundries from Chinese Customers, 2011
  • Global Mobile Phone Shipment, 2007-2014
  • Quarterly Mobile Phone Shipment Worldwide and Annual Growth Rate, 2009Q1-2011Q4
  • 3G/4G Mobile Phone Shipment by Region, 2010-2012
  • Quarterly Shipment of Major Mobile Phone Brands Worldwide, 2010-2011
  • Shipment of Major Mobile Phone Manufacturers Worldwide, 2010-2011
  • Smartphone Shipment of Major Mobile Phone Manufacturers Worldwide, 2010-2011
  • Market Occupancy of Smartphone Operating Systems, 2011
  • Global Shipment of CPU and GPU for PC, 2008-2013
  • Shipment of Netbook, iPad and Tablet PC, 2008-2012
  • Global Investment in Wafer Equipment, 2007-2016
  • CAPEX of Global Semiconductor Manufacturers, 2011-2016
  • WLP Packaging Equipment Expenditure Worldwide, 2011-2016
  • Die Packaging Equipment Expenditure Worldwide, 2011-2016
  • Automatic Checkout Equipment Expenditure Worldwide, 2011-2016
  • CAPEX of Global Top 10 Semiconductor Manufacturers, 2011-2012
  • Global Semiconductor Material Market by Region, 2010-2013
  • Semiconductor Rear-end Equipment Expenditure Worldwide by Region, 2010-2012
  • Structure of TSMC
  • Revenue and Operating Margin of TSMC, 2004-2011
  • Shipment and Capacity Utilization of TSMC, 2004-2011
  • Quarterly Revenue and Operating Margin of TSMC, 2009Q1-2011Q4
  • Quarterly Shipment and Operating Margin of TSMC, 2009Q1-2011Q4
  • Application of TSMC Products, 2005-2011Q4
  • Revenue of TSMC by Node, 2008Q3-2011Q4
  • Installed Capacity of TSMC by Plant, 2010-2012Q1
  • Installed Capacity of TSMC by Plant, 2008-2012
  • Revenue from System LSI Division of Samsung, 2011Q1-2012Q4
  • Revenue and Operating Margin from System LSI Division of Samsung, 2011Q1-2012Q4
  • Revenue and Operating Margin from NAND Business of Samsung, 2011Q1-2012Q4
  • Revenue and Operating Margin from DRAM Business of Samsung, 2011Q1-2012Q4
  • Revenue and Gross Margin of Intel, 2004-2011
  • Revenue and Operating Margin of Intel, 2004-2011
  • Revenue and Net Profit Margin of Intel, 2004-2011
  • Revenue of Intel by Region, 2006-2011Q4
  • Revenue of Intel by Product, 2006-2008
  • Revenue of Intel by Product, 2008-2010
  • CPU Technology Roadmap of Intel
  • Intel Bases Worldwide
  • Intel Wafer Fab List
  • Revenue and Operating Margin of UMC, 2003-2011
  • Shipment and Capacity Utilization of UMC, 2003-2011
  • Quarterly Revenue and Gross Margin of UMC, 2010Q1-2012Q1
  • Quarterly Revenue of UMC by Region, 2010Q1-2012Q1
  • Quarterly Revenue of UMC by Node, 2010Q1-2012Q1
  • Quarterly Revenue of UMC by Application, 2010Q1-2012Q1
  • Quarterly Shipment and Capacity Utilization of UMC, 2010Q1-2012Q1
  • Revenue and Operating Margin of SMIC, 2005-2012
  • Revenue and Gross Margin of SMIC, 2009Q1-2011Q4
  • Revenue of SMIC by Application, 2009Q1-2011Q4
  • Revenue of SMIC by Region, 2009Q1-2011Q4
  • Quarterly Revenue of SMIC by Node, 2009Q1-2011Q4
  • Shipment and Capacity Utilization of SMIC, 2009Q1-2011Q4
  • Capacity of SMIC by Plant, 2010Q1-2011Q4
  • Distribution of SMIC Plants
  • Major Customers of SMIC
  • Revenue and Operating Margin of Micron, FY2007-FY2012
  • Revenue of Micron by Division, FY2009-FY2012
  • Revenue of Micron by Application, 2007-2012Q1
  • Revenue of Micron by Technology, 2007-2012Q1
  • Micron Bases Worldwide
  • Revenue and Gross Margin of TowerJazz, 2003-2011
  • Revenue of TowerJazz by Technology, 2009-2011
  • Revenue of TowerJazz by Region, 2006-2011
  • Revenue and Operating Margin of VIS, 2005-2012
  • Revenue and Gross Margin of VIS, 2010Q1-2012Q1
  • Revenue of VIS by Node, 2010Q1-2012Q1
  • Revenue of VIS by Application, 2010Q1-2012Q1
  • Revenue of VIS by Product, 2009Q1-2012Q1
  • Shipment and Capacity Utilization of VIS, 2010Q2-2012Q1
  • Revenue and Operating Income of Texas Instruments, 2007-2011
  • Revenue of Texas Instruments by Division, 2009-2011
  • Revenue of Texas Instruments by Region, 2009-2011
  • Revenue of Texas Instruments by Product, 2006\2011\2012Q1
  • Production Bases of Texas Instruments Worldwide
  • Global Presence of GlobalFoundries
  • Technical Strength of GlobalFoundries
  • Revenue and Operating Margin of Dongbu HiTek, 2005-2012
  • Capacity and Output of Dongbu HiTek, 2006Q1-2011Q4
  • Capacity Utilization of Dongbu HiTek, 2006Q1-2011Q4
  • Overview of Dongbu HiTek
  • Capacity of Dongbu HiTek, 2007-2011
  • Technology Distribution of Dongbu HiTek
  • Major Customers of Dongbu HiTek
  • Technology Roadmap of Dongbu HiTek
  • Revenue and Gross Margin of Magnachip, 2001-2011
  • Revenue of Magnachip by Business, 2004-2011
  • Revenue of Magnachip by Region, 2009-2011
  • Wafer Foundry Technology Roadmap of Magnachip
  • Revenue from Wafer Foundry Business of Magnachip, 2011
  • Wafer Plants of Magnachip
  • ASMC's Current Shareholding Structure
  • Gross Margin of ASMC, 2003-2011
  • Revenue of ASMC by Wafer Plant, 2010Q1-2011Q4
  • Revenue of ASMC by Application, 2010Q1-2011Q4
  • Revenue of ASMC by Customer Type, 2010Q1-2011Q4
  • Revenue of ASMC by Region, 2010Q1-2011Q4
  • Quarterly Capacity Utilization of ASMC, 2009Q1-2011Q4
  • Capacity Utilization of ASMC by Water Plant, 2010Q1-2011Q4
  • Revenue of Hua Hong NEC, 2003-2010
  • Roadmap of Hua Hong NEC
  • Revenue of Grace, 2004-2010
  • Overview of Powerchip Fab
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