市場調査レポート

短距離無線通信開発の前進:マーケティング・技術動向

Progress in Short-range Wireless Communications Developments: Marketing and Technological Trends

発行 Practel, Inc. 商品コード 259146
出版日 ページ情報 英文
納期: 即日から翌営業日
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短距離無線通信開発の前進:マーケティング・技術動向 Progress in Short-range Wireless Communications Developments: Marketing and Technological Trends
出版日: 2013年01月10日 ページ情報: 英文
概要

当レポートでは、短距離無線(最大送信距離30〜100フィート)および超短距離通信デバイス(最大送信距離5〜10センチ)の開発動向について技術別に分析しており、技術別の市場概要、市場推計および主要企業のプロファイルを含め、概略以下の構成でお届けします。

第1章 イントロダクション

第2章 短距離無線:技術と市場

  • ウルトラワイドバンド
    • 低迷
    • 概要:歴史
    • メリット
    • 定義
    • レート
    • スペクトル配分
    • 規制
    • 主な機能
    • 規格
    • 主なアプリケーション
    • 市場推計
    • 産業
  • Z-Wave
    • 概要
    • Z-Waveアライアンス
    • メリット
    • 詳細
    • ZigBeeとZ-Wave
    • 先進エネルギー管理の枠組み
    • サマリー
    • 主なベンダー
    • 価格
    • 市場推計:HAN向けZ-Wave技術
  • ZigBee
    • 概要
    • 詳細
    • デバイスタイプ
    • プロトコルスタック
    • 相互運用性
    • セキュリティ
    • プラットフォームの検討
    • バッテリー寿命
    • ZigBee 技術のメリットと限界
    • 標準化プロセス
    • 802.15.4 - ZigBee の基礎
    • アプリケーション仕様−プロファイル
    • 市場
    • 産業
  • IEEE 802.15.1 (Bluetooth-BT)
    • BTプロトコルスタック
    • プロファイル
    • Bluetoothのセキュリティ
    • ハイライト
    • 進化
    • 市場推計
    • BT産業−HDP
  • IEEE 802.11n WLAN
    • 主な機能強化
    • 特徴
    • 導入
    • メリット・アプリケーション
    • 市場
    • 産業

第3章 超短距離無線通信

  • NFC
    • 概要
    • 特徴
    • 標準化
    • シングルワイヤープロトコル
    • ホストコントローラーインターフェース
    • セキュリティ
    • 比較
    • アプリケーション
    • トライアル
    • NFC市場
    • 産業
    • 主な開発動向
  • TransferJet
    • 概要
    • 基礎
    • 技術
    • 主な機能
    • ECMA/ISO
    • アプリケーションと産業
    • 産業

第4章 結論

  • 付録?:NFCタグの種類

図表リスト

目次

This report reflects the progress in the development of short-range radio (with maximum transmission distance of 30-100 feet) and ultra-short-range communications devices (with maximum transmission distance of - 5-10 centimeters). The report updates and revises Practel reports issued in 2008-2012.

In particular, the following technologies and related markets were addressed:

  • Bluetooth (BT)
  • ZigBee
  • UWB
  • Z-Wave
  • IEEE802.11n
  • Near Field Communications
  • TransferJet.

The report emphasizes one of the important technological trends: advanced manufacturing methods and microminiaturization allow the creation of multimodal devices. Such devices implement several technologies on one chipset, which effectively integrates common elements serving different radios. The report also shows the role of ultra-short-range communications: used as an independent technique or together with short-range radios.

The report contains a detailed survey of WPAN/WLAN equipment vendors specializing in the production of the discussed communications equipment.

Table of Contents

1.0. Introduction

1.0. Introduction

  • 1.1. General
  • 1.2. NFC Specifics
  • 1.3. TransferJet
  • 1.4. Short-range Radio Specifics
  • 1.5. Report Structure
  • 1.6. Methodology
  • 1.7. Intended Audience

2.0. Short-reach Radio: Technologies and Markets

  • 2.1. Ultra Wideband
    • 2.1.1. Downturn
    • 2.1.2. General: History
    • 2.1.3. Benefits
    • 2.1.4. Definition
    • 2.1.5. Rates
    • 2.1.6. Spectrum Allocation
    • 2.1.7. Regulations
    • 2.1.8. Major Features
    • 2.1.9. Standards
      • 2.1.9.1. Multiband OFDM
      • 2.1.9.2. DS-UWB
      • 2.1.9.3. Groups
      • 2.1.9.4. ECMA
        • 2.1.9.4.1. PHY
      • 2.1.9.5. WiNET
      • 2.1.9.6. EC-ETSI
      • 2.1.9.7. IEEE 802.15.4a - 2007
      • 2.1.9.8. IEEE 802.15.4f
    • 2.1.10. Major Applications
      • 2.1.10.1. Example: Characteristics and Requirements: WSN-UWB
    • 2.1.11. Market Estimate
      • 2.1.11.1. General
      • 2.1.11.2. Geographical Segmentation
      • 2.1.11.3. Forecast
    • 2.1.12. Industry
      • Alereon (chipsets)
      • Camero (radar, equipment for first responders)
      • Decawave
      • Gefen (HDMI Extender)
      • General Atomics (Chipsets)
      • Gemtek
      • Multispectral (Zebra)-Sensors
      • Pulse~ Link (Chipsets)
      • RealTek (IC)
      • Samsung (WUSB)
      • Sensiotec (Sensor/Radar Health Care)
      • Time Domain (Chipsets-fusion of communications & radar)
      • TiaLinx (Sensor)
      • Ubisense (RFID-tracking)
      • Veebeam (Device)
      • Wisair (WUSB-chipsets)
  • 2.2. Z-Wave
    • 2.2.1. General
    • 2.2.2. Z-Wave Alliance
    • 2.2.3. Benefits
    • 2.2.4. Details
      • 2.2.4.1. General
      • 2.2.4.2. Characteristics
        • 2.2.4.2.1. ITU G.9959 (2/2012)
    • 2.2.5. ZigBee and Z-Wave
    • 2.2.6. Advanced Energy Control Framework
      • 2.2.6.1. Z-wave and Smart Metering
    • 2.2.7. Summary
    • 2.2.8. Selected Vendors
      • Aeon Labs (Aeotec)
      • Mi Casa Verde
      • Sigma Designs
      • There
    • 2.2.9. Pricing
    • 2.2.10. Market Estimate: Z-wave Products for HAN
      • 2.2.10.1. Model
      • 2.2.10.2. Results
  • 2.3. ZigBee
    • 2.3.1. General
    • 2.3.2. Details
      • 2.3.2.1. Major Features
    • 2.3.3. Device Types
    • 2.3.4. Protocol Stack
      • 2.3.4.1. Physical and MAC layers - IEEE802.15.4
      • 2.3.4.2. Frame
      • 2.3.4.3. Upper Layers
    • 2.3.5. Interoperability
    • 2.3.6. Security
    • 2.3.7. Platform Considerations
    • 2.3.8. Battery Life
    • 2.3.9. ZigBee Technology Benefits and Limitations
    • 2.3.10. Standardization Process
      • 2.3.10.1. ZigBee Alliance
      • 2.3.10.2. Objectives
      • 2.3.10.3. Smart Energy Profile-ICT for Smart Grid
        • 2.3.10.3.1. Further Developments
      • 2.3.10.4. Features-Energy Service Portal
      • 2.3.10.5. ZigBee IP
    • 2.3.11. 802.15.4 - ZigBee Basis
      • 2.3.11.1. IEEE 802.15.4 Radio - Details
    • 2.3.12. Application Specifics - Profiles
      • 2.3.12.1. Applications - General
      • 2.3.12.2. Home
      • 2.3.12.3. PC
      • 2.3.12.4. Manufacturing
      • 2.3.12.5. WSN-UGS and ZigBee
      • 2.3.12.6. “Green” ZigBee
    • 2.3.13. Market
      • 2.3.13.1. Expectations
      • 2.3.13.2. Segments
      • 2.3.13.3. Forecast
    • 2.3.14. Industry
      • Amber (RF Modules)
      • Atmel (Chipsets)
      • CEL (Modules)
      • Chipcon - TI (Chipsets)
      • Cirronet-RFM (Modules-Industrial Applications)
      • Digi (Radios, Routers, Energy Management)
      • Ember - Silicon Labs (Chipsets)
      • EnergyHub (Smart Home)
      • GreenPeak (WSN)
      • Helicomm (Modules)
      • Jennic - NXP (Chipsets-Modules)
      • Freescale (Chipsets)
      • Libelium (Router)
      • Nuri Telecom (AMR Application)
      • Renesas Electronics (Platforms, AMR)
      • Silicon Laboratories (Chipsets, Modules)
      • Synapse (Modules, Protocols)
      • Telegesis (Integrator, Modules)
      • TI (Chipsets)
  • 2.4. IEEE 802.15.1 (Bluetooth-BT)
    • 2.4.1. BT Protocol Stack
      • 2.4.1.1. Transport layer
        • 2.4.1.1.1. Radio Layer
        • 2.4.1.1.2. Baseband and Link Manager Layers
      • 2.4.1.2. Middleware Layer
    • 2.4.2. Profiles
      • 2.4.2.1. Power Consumption - ULP
      • 2.4.2.2. Medical Profile
    • 2.4.3. Bluetooth Security
    • 2.4.4. Highlights
      • 2.4.4.1. The Standard:
      • 2.4.4.2. The Technology:
    • 2.4.5. Evolution
      • 2.4.5.1. BT v2.1
      • 2.4.5.2. BT v3.0
      • 2.4.5.3. BT v4.0 and Up
    • 2.4.6. Market Estimate
    • 2.4.7. BT Industry-HDP
      • Bluegiga
      • Cambridge Consultants
      • CSR
      • iFoundry-Nestronics
      • Laird Technologies
      • Nonin
      • Nordic Semiconductor
      • Stollmann
  • 2.5. IEEE 802.11n WLAN
    • 2.5.1. Major Enhancements
      • 2.5.1.1. General
      • 2.5.1.2. MIMO
        • 2.5.1.2.1. “True MIMO”
        • 2.5.1.2.2. BeamFlex
        • 2.5.1.2.3. Atheros
      • 2.5.1.3. Spatial Division Multiplexing
      • 2.5.1.4. OFDM
      • 2.5.1.5. Channel Bonding
      • 2.5.1.6. Packet Aggregation
    • 2.5.2. Features
      • 2.5.2.1. Specifics
      • 2.5.2.2. Channel Bandwidth
    • 2.5.3. Adaptation
    • 2.5.4. Benefits and Applications
      • 2.5.4.1. Benefits
      • 2.5.4.2. Applications
    • 2.5.5. Market
      • 2.5.5.1. General Drivers
      • 2.5.5.2. Market Forecast
        • 2.5.5.2.1. Model Assumptions
        • 2.5.5.2.2. Forecast
          • 2.5.5.2.2.1. Chipsets
    • 2.5.6. Industry
      • Aerohive (AP)
      • Aruba (AP)
      • Buffalo (Router, AP)
      • Belkin (Router, Adaptor)
      • Broadcom (Chipsets; combo)
      • Cisco (AP)
      • CSR (Chips)
      • D-Link (Router, Adapter)
      • Encore (Adapter, router)
      • Edimax (Router, Adapter)
      • Extreme (AP)
      • Extricom (AP)
      • Gemtek (Router)
      • HP (AP)
      • Intel (Chipsets)
      • Marvell (Chipsets)
      • Meru (Family of Products)
      • Motorola (Tools, AP)
      • NEC (Router)
      • Netgear (Router, AP)
      • Qualcomm Atheros
      • RedPine (Chipsets)
      • Ruckus (AP)
      • Ralink (Chipsets)
      • Siemens (AP)
      • TrendNet (Routers, AP)
      • ZyXel (AP, Router, Adapter)

3.0. Ultra-short Reach Wireless Communications

  • 3.1. Near Field Communications
    • 3.1.1. General
    • 3.1.2. Characteristics
    • 3.1.3. Standardization
      • 3.1.3.1. General
      • 3.1.3.2. ECMA -340
      • 3.1.3.3. ISO
      • 3.1.3.4. NFC Forum
        • 3.1.3.4.1. General
        • 3.1.3.4.2. Specifications
      • 3.1.3.5. Summary
    • 3.1.4. Single Wire Protocol
    • 3.1.5. Host Controller Interface
    • 3.1.6. Security
    • 3.1.7. Comparison
      • 3.1.7.1. Bluetooth
      • 3.1.7.2. RFID
    • 3.1.8. Applications
      • 3.1.8.1. General
      • 3.1.8.2. Primary Users
      • 3.1.8.3. Mobile Phone - Major Application
        • 3.1.8.3.1. Example
      • 3.1.8.4. Danger
      • 3.1.8.5. WPAN Applications
      • 3.1.8.6. Smart Poster
      • 3.1.8.7. NFC and Wi-Fi
      • 3.1.8.8. NFC and UWB
    • 3.1.9. Trials
    • 3.1.10. NFC Market
      • 3.1.10.1. General
      • 3.1.10.2. Market Drivers
      • 3.1.10.3. Estimate
    • 3.1.11. Industry
      • Alvin
      • Arygon (Identive Technologies)
      • Infineon
      • Innovision
      • Inside Secure
      • Legic
      • Mocapay
      • Motorola Solutions
      • NEC
      • Nokia
      • Nexperts
      • NXP
      • OTI
      • Qualcomm Atheros
      • Reslink
      • STmicroelectronics
      • TI
      • Toppan Forms
      • Twinlinx
      • UPM Raflatac
      • Zenius
    • 3.1.12. Major Developmental Trends
  • 3.2. TransferJet
    • 3.2.1. General
    • 3.2.2. Basis
      • 3.2.2.1. Goal and Development
    • 3.2.3. Technology
    • 3.2.4. Major Features
    • 3.2.5. ECMA/ISO
    • 3.2.7. Applications and Industry
    • 3.2.8. Industry
      • Allion
      • Murata
      • SONY
      • Toshiba

4.0. Conclusions

  • Attachment I: NFC Tags Types

List of Figures:

  • Figure 1: Illustration - UWB Spectrum
  • Figure 2: Global Regulations
  • Figure 3: DS-UWB Spectrum Characteristics
  • Figure 4: Spectrum Regulations-UWB
  • Figure 5: ECMA - Architectural Reference Model
  • Figure 6: TAM: Global UWB IC Revenue ($B)
  • Figure 7: TAM: Global UWB IC (Unit Bil)
  • Figure 8: TAM: U.S. Small SH Z - Wave IC ($US Mil)
  • Figure 9: TAM: U.S. Large SH Z - Wave IC ($US Mil)
  • Figure 10: ZigBee Protocol Stack
  • Figure 11: Profiles
  • Figure 12: TAM: U.S. ZigBee Modules Sales ($B)
  • Figure 13: TAM: U.S. ZigBee Modules Sales (Mil. Units)
  • Figure 14: ZigBee Market Segmentation (2010)
  • Figure 15: ZigBee Market Segmentation (2014) - Projection
  • Figure 16: Bluetooth Protocol Stack
  • Figure 17: Piconets Illustration
  • Figure 18: BT ULP Layers
  • Figure 19: TAM: BT Modules Shipped (Bil. Units)
  • Figure 20: TAM: BT Modules Shipped ($B)
  • Figure 21: BT Market Geographical Segmentation
  • Figure 22: Two-antenna MIMO system with two-stream SDM example
  • Figure 23: 802.11 Protocol Family MAC Frame Structure
  • Figure 24: TAM: Worldwide Legacy Wi-Fi Chipsets Sales (Unit Bil)
  • Figure 25: TAM: 802.11n Chipsets Worldwide Sales (Unit Bil)
  • Figure 26: TAM: Wi-Fi Chipsets Worldwide Sales ($B)
  • Figure 27: Market Geography: IEEE 802.11n
  • Figure 28: Standardization
  • Figure 29: NFC ECMA and ISO Standards
  • Figure 30: ISO Protocols
  • Figure 31: NFC Forum Activities
  • Figure 32: Mobile Phone with NFC
  • Figure 33: TAM: Sales - Cell Phones with NFC Global (Mil. Units)
  • Figure 34: NFC-able Cell Phone Rate of Penetration (%)
  • Figure 35: TAM: Global Sales - NFC ICs ($B)
  • Figure 36: NFC Market Geography
  • Figure 37: TransferJet Communication Channel
  • Figure 38: TransferJet Applications

List of Tables:

  • Table 1: List of FCC Regulations
  • Table 2: China - Regulations
  • Table 3: Korea - Regulations
  • Table 4: Japan - Regulations
  • Table 5: Europe - Regulations
  • Table 6: MB-OFDM UWB Frequencies Designation
  • Table 7: Comparison: DS-UWB and MB-OFDM
  • Table 8: ETSI Documents
  • Table 9: Standard: Characteristics
  • Table 10: Z-Wave and ZigBee
  • Table 11: Z-wave Products Retail Pricing
  • Table 12: ZigBee Parameters
  • Table 13: ZigBee Smart Energy Profile Feature Set
  • Table 14: Bluetooth Profiles
  • Table 15: Wi-Fi Transfer Rates
  • Table 16: 802.11n Advantages
  • Table 17: Channels Utilization
  • Table 18: NFC Features
  • Table 19: NFC History
  • Table 20: NFC Development
  • Table 21: Bluetooth and NFC
  • Table 22: TransferJet Major Characteristics
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