市場調査レポート

スマートハウスICT:マーケティングと技術分析

Smart Houses ICT: Marketing and Technical Analysis

発行 Practel, Inc. 商品コード 205858
出版日 ページ情報 英文 218 Pages
納期: 即日から翌営業日
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スマートハウスICT:マーケティングと技術分析 Smart Houses ICT: Marketing and Technical Analysis
出版日: 2013年09月06日 ページ情報: 英文 218 Pages
概要

当レポートでは、無線ICT(Z-wave、ZigBee/IEEE 802.15.4、DECT、Bluetooth)・有線技術(HomePlug、HomePNA、G.hn、MOCA)の各市場の分析を提供し、スマートハウス環境における有線/無線ICTに対する技術・マーケティング特性と応用について検証して、概略以下の構成でお届けいたします。

第1章 イントロダクション

第2章 概要:スマートハウス

  • レベル
  • 構成要素
  • 利益

第3章 SH:有線ICT

  • PLC - スマートハウス HomePlug
    • 概要
    • HomePlug 提携
    • HomePlug 1.0
    • HomePlug Command & Control
    • HomePlug AV
    • HomePlug GP
    • 利点
    • 標準化機構
    • HomePlug - SH 市場セグメント
  • ITU G.hn - HomePNA
    • HomePNA 提携
    • ITU 活動
    • ベンダーの例
  • MOCA
    • 概要
    • パートナーシップ
    • 詳細
    • ベンダーの例

第4章 スマートハウス:無線ICT

  • Z-Wave
  • ZigBee
  • IEEE 802.15.1 (Bluetooth-BT)
  • DECT

第5章 ホームエリアネットワーク(HAN)

  • 概要 - 利点
  • 選択
  • 産業活動:仕様
  • HAN市場
  • 主要企業:例

第6章 スマート家電

  • 技術
  • 新しい標準
  • 市場

第7章 スマートメーター

  • 進捗状況
  • 特徴
  • ベンダー例
  • 市場の特徴

第8章 結論

図表

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目次

This report continues the Practel project on the Smart Grid development and evolution. In particular, it is detailing technological and marketing characteristics and applications for wireline and wireless ICT (Information and Communications Technologies) in the Smart Houses environments.

With each year, Smart Houses communications technologies are becoming more and more affordable and efficient on the industry-wide scale for multiple applications; though the concept was originated in the 80th of the last Century. The importance of Smart Houses proliferation is now tied up with the Smart Grid deployments, and Smart Houses communications networks will eventually be a part of a large country-wide project, such as centralized and intelligent automation system, which integrates utilities and consumers.

As per the report discussion, within the home, multiple technologies target the transport layer of the home-area network in order to carry out home automation. These include wireless technologies such as ZigBee, Z-wave, Bluetooth, and DECT and other; as well as wireline technologies such as power-line transport (e.g., HomePlug) and coax/wire-based (e.g., MoCA, HPNA) technologies. The fact that so many wireline and wireless technologies are targeting home automation indicates that this market is just scratching the surface in terms of potential, and there are no clear 'winners' as of yet.

The report provides the analysis of wireless ICT (Z-wave, ZigBee/IEEE802.15.4, DECT, and Bluetooth); and wireline technologies (HomePlug, HomePNA, G.hn, MoCA); and respective markets.

The emphasis is made on applications of these technologies for HANs (Home Area Networks) in the Smart Houses environment.

The report also addresses the Smart Appliances initiatives, related technologies and markets and the role of Smart Meters in the evolving Smart Houses development.

The U.S. market for ICT in Smart Houses (with a base of private houses reaching more than 100 million) is huge; it also has support of the government, which is involved in the Smart Grid project.

Research Methodology

Considerable research was done using the Internet. Information from various Web sites was studied and analyzed. Evaluation of publicly available marketing and technical publications was conducted. Telephone conversations and interviews were held with industry analysts, technical experts and executives. In addition to these interviews and primary research, secondary sources were used to develop a more complete mosaic of the market landscape, including industry and trade publications, conferences and seminars.

The overriding objective throughout the work has been to provide valid and relevant information. This has led to a continual review and update of the information content.

Table of Contents

1.0. Introduction

  • 1.1. General
  • 1.2. Scope
  • 1.3. Research Methodology
  • 1.4. Target Audience

2.0. General: Smart Houses

  • 2.1. Levels
  • 2.2. Components
  • 2.3. Benefits

3.0. SH: Wireline ICT

  • 3.1. PLC - HomePlug in Smart Houses
    • 3.1.1. General
    • 3.1.2. HomePlug Alliance
      • 3.1.2.1. Goal
      • 3.1.2.2. Timetable
    • 3.1.3. HomePlug 1.0
    • 3.1.4. HomePlug Command and Control
    • 3.1.5. HomePlug AV
      • 3.1.5.1. Major Features
      • 3.1.5.2. Major Applications
      • 3.1.5.3. HomePlug AV2
    • 3.1.6. HomePlug GP
      • 3.1.6.1. Applications
      • 3.1.6.2. Specifics
      • 3.1.6.3. Developments
      • 3.1.6.4. ZigBee/HomePlug Smart Energy (SEP 2)
    • 3.1.7. Advantages
    • 3.1.8. Standard Organizations Work
      • 3.1.8.1. IEEE
        • 3.1.8.1.1. IEEE 1901
        • 3.1.8.1.2. IEEE P1901.2
        • 3.1.8.1.3. IEEE 1905.1-2013
      • 3.1.8.2. TIA
      • 3.1.8.3. ETSI
      • 3.1.8.4. ITU
    • 3.1.9. HomePlug - SH Market Segment
      • 3.1.9.1. General
      • 3.1.9.2. Estimation
      • 3.1.9.3. Vendors
        • ActionTec
        • Ariane
        • Atheros - Qualcomm Atheros
        • Asoka
        • Broadcom
        • Cisco
        • Corinex
        • Devolo AG
        • GigaFast
        • Insteon
        • MStar
        • Netgear
        • Siemens
        • Sigma Design
        • Yitran
        • Zyxel
  • 3.2. ITU G.hn - HomePNA
    • 3.2.1. HomePNA Alliance
      • 3.2.1.1. HomePNA: Major Characteristics
      • 3.2.1.2. Major Benefits
    • 3.2.2. ITU Activity
      • 3.2.2.1. General
        • 3.2.2.1.1. ITU Recommendation G.9960
        • 3.2.2.1.2. ITU Recommendation G.9961
        • 3.2.2.1.3. G.hn Details
      • 3.2.2.2. HomeGrid Forum - ITU-T G.hn
      • 3.2.2.3. Mixed Reaction
      • 3.2.2.4. Acceptance
      • 3.2.2.5. Documentation
    • 3.2.3. Samples of Vendors
      • Marvell
      • Sigma Designs
      • NetSys
  • 3.3. MOCA (Multimedia over Coax Alliance)
    • 3.3.1. General
    • 3.3.2. Partnerships
    • 3.3.3. Details
      • 3.3.3.1. MoCA 2.0
        • 3.3.3.1.1. MOCA 2.0 Technical Highlights
        • 3.3.3.1.2. Comparison
    • 3.3.4. Samples of Vendors
      • Actioncable
      • Broadcom
      • CommScope
      • Entropic
      • Netgear

4.0 Smart House: Wireless ICT

  • 4.1. Z-Wave
    • 4.1.2. Z-Wave Alliance
    • 4.1.3. Benefits
    • 4.1.4. Details
      • 4.1.4.1. General
      • 4.1.4.2. Characteristics
        • 4.1.4.2.1. ITU G.9959 (2/2012)
      • 4.1.4.3. ZigBee and Z-Wave
    • 4.1.5. Advanced Energy Control Framework
      • 4.1.5.1. SH: Z-wave and Smart Metering
    • 4.1.6. Selected Vendors
      • Aeon Labs
      • Mi Casa Verde
      • Sigma Designs
      • There
    • 4.1.7. Pricing
    • 4.1.8. Market Estimate: Z-wave Products for Smart Houses
      • 4.1.8.1. Model
      • 4.1.8.2. Results
  • 4.2. ZigBee
    • 4.2.1. General
    • 4.2.2. ZigBee Foundations: IEEE 802.15.4 Radio and Alliance Specifications
      • 4.2.2.1. General
      • 4.2.2.2. Objectives
      • 4.2.2.3. Specifications
      • 4.2.2.4. Feature Sets
      • 4.2.2.5. Application Specifics - Profiles
        • 4.2.2.5.1. Smart Energy Profile-ICT for Smart Grid
        • 4.2.2.5.2. Enhancements - SEP 2.0
        • 4.2.2.5.3. Features-Energy Service Portal
        • 4.2.2.5.4. “Green” ZigBee
      • 4.2.2.6. ZigBee IP
      • 4.2.2.7. ZigBee: Major Technology Features
        • 4.2.2.7.1. Device Types
        • 4.2.2.7.2. Protocol Stack
          • 4.2.2.7.2.1. Physical and MAC layers - IEEE802.15.4
          • 4.2.2.7.2.2. Upper Layers
        • 4.2.2.7.3. Security
        • 4.2.2.7.4. Applications - General
          • 4.2.2.7.4.1. Home
          • 4.2.2.7.4.2. PC
          • 4.2.2.7.4.3. Manufacturing
          • 4.2.2.7.4.4. WSN-UGS and ZigBee
    • 4.2.3. 802.15.4 - ZigBee Radio
    • 4.2.4. ZigBee Technology Benefits and Limitations
    • 4.2.5. Market
      • 4.2.5.1. Expectations
      • 4.2.5.2. Segments
      • 4.2.5.3. Forecast
      • 4.2.5.4. Industry
        • Amber (RF Modules)
        • Atmel (Chipsets)
        • CEL (Modules)
        • Cirronet-RFM (Modules-Industrial Applications)
        • Digi (Radios, Routers, Energy Management)
        • Ember - Silicon Labs (Chipsets)
        • EnergyHub (Smart Home)
        • GreenPeak (WSN)
        • Freescale (Chipsets)
        • Libelium (Router)
        • Nuri Telecom (AMR Application)
        • NXP
        • Renesas Electronics (Platforms, AMR)
        • Silicon Laboratories (Chipsets, Modules)
        • Synapse (Modules, Protocols)
        • Telegesis (Integrator, Modules)
        • TI (Chipsets)
  • 4.3. IEEE 802.15.1 (Bluetooth-BT)
    • 4.3.1. BT Protocol Stack
      • 4.3.1.1. Transport layer
        • 4.3.1.1.1. Radio Layer
        • 4.3.1.1.2. Baseband and Link Manager Layers
      • 4.3.1.2. Middleware Layer
    • 4.3.2. Profiles
      • 4.3.2.1. ULP - BLE and BT Smart
    • 4.3.3. Bluetooth Security
    • 4.3.4. Highlights
      • 4.3.4.1. The Standard:
      • 4.3.4.2. The Technology:
    • 4.3.5. Evolution
      • 4.3.5.1. BT v2.1
      • 4.3.5.2. BT v3.0
      • 4.3.5.3. BT v4.0 and Up
    • 4.3.6. Market Estimate
  • 4.4. DECT
    • 4.4.1. DECT - ETSI Standard
      • 4.4.1.1. Popularity
      • 4.4.1.2. Spectrum
      • 4.4.1.3. Layered Structure and Major Characteristics
        • 4.4.1.3.1. DECT in SH: Requirements
    • 4.4.2. DECT ULE
      • 4.4.2.1. General
      • 4.4.2.2. Major Markets
      • 4.4.2.3. Major Characteristics
        • 4.4.2.3.1. Summary: ULE Advantages
        • 4.4.2.3.2. Summary: Applications
    • 4.4.3. DECT CAT-iq
      • 4.4.3.1. General
      • 4.4.3.2. Approval
      • 4.4.3.3. Highlights
    • 4.4.4. Market
    • 4.4.5. Vendors Samples
      • Dialog Semiconductor
      • DSP Group
      • Lantiq
      • Mindspeed - DSP

5.0. Home Area Networks

  • 5.1. General - Advantages
  • 5.2. Choices
  • 5.3. Industry Activity: Specifications
    • 5.3.1. OpenHAN
    • 5.3.2. U-SNAP
    • 5.3.3. Wireless Standard
  • 5.4. HAN Market
    • 5.4.1. Drivers
    • 5.4.2. Nodes
    • 5.4.3. Geography
    • 5.4.4. Technologies
    • 5.4.5. Market Size
  • 5.5. Major Players: Samples
    • Control4
    • Insteon
    • NXP
    • Sigma Designs
    • SyChip

6.0. Smart Appliances

  • 6.1. Technologies
    • 6.1.1. LG Thinq
      • 6.1.1.1. Details
      • 6.1.1.2. Plans
    • 6.1.2. Whirlpool
    • 6.1.3. GE - 'Nucleus energy manager' and Other
      • 6.1.3.1. ZigBee Certified
      • 6.1.3.2. Nucleus Energy Manager
      • 6.1.3.3. Brillion
  • 6.2. New Standards
  • 6.3. Market

7.0. Smart Meters

  • 7.1. Progress
  • 7.2. Characteristics
    • 7.2.1. Standards Development
      • 7.2.1.1. SMMAA
  • 7.3. Vendors Samples
    • Echelon
    • Itron
    • SmartSynch
  • 7.4. Market Characteristics

8.0. Conclusions

List of Figures:

  • Figure 1: Simplified Block-diagram
  • Figure 2: HomePlug C&C
  • Figure 3: Advanced Features
  • Figure 4: TAM: Global HomePlug-Equipped Products Shipped (Mil. Units)
  • Figure 5: TAM: Global HomePlug-Equipped Products Shipped ($B)
  • Figure 6: HomePNA - Spectrum Allocation
  • Figure 7: TAM Estimate: U.S. Small SH Z-Wave IC ($M)
  • Figure 8: TAM Estimate: U.S. Large SH Z-Wave IC ($US Mil)
  • Figure 9: Profiles
  • Figure 10: ZigBee Protocol Stack
  • Figure 11: TAM: U.S. ZigBee Modules Sales ($B)
  • Figure 12: TAM: U.S. ZigBee Modules Sales (Mil. Units)
  • Figure 13: ZigBee Market Segmentation (2012)
  • Figure 14: ZigBee Market Segmentation (2017) - Projection
  • Figure 15 Bluetooth Protocol Stack
  • Figure 16: Piconets Illustration
  • Figure 17: BT ULP Layers
  • Figure 18: TAM: Global BT Modules Shipped (Bil. Units)
  • Figure 19: TAM: Global BT Modules Shipped ($B)
  • Figure 20: BT Market Geographical Segmentation
  • Figure 21: CAT-iq Development
  • Figure 22: TAM: Global DECT ULE Equipment Shipping (Mil. Units)
  • Figure 23: TAM: Global DECT ULE Equipment Shipping ($B)
  • Figure 24: TAM: Global DECT CAT-iq Gateways Shipping (Mil. Units)
  • Figure 25: TAM: Global DECT CAT-iq Gateways Shipping ($B)
  • Figure 26: Dynamic of HAN Size Growth as Percentage of Total Deployed
  • Figure 27: HAN Market Geography (Percentage from total market)
  • Figure 28: HAN Radio Technologies Shares (As a percentage of total market)
  • Figure 29: TAM: U.S. HAN Equipment Sales (Million Units)
  • Figure 30: TAM U.S. HAN Equipment Sales ($B)
  • Figure 31: TAM: Global Households Large Appliances ($B)
  • Figure 32: TAM: Global Households Large Smart Appliances ($B)
  • Figure 33: Smart Meters Development Stages
  • Figure 34: TAM: Global Smart Meter Shipping ($B)
  • Figure 35: TAM: Global Smart Meter Shipping (Mil. Units)

List of Tables:

  • Table 1: HomePlug Major Milestones
  • Table 2: HomePlug C&C Characteristics
  • Table 3: HomePlug AV Characteristics
  • Table 4: HomePlug GP Features
  • Table 5: HomePlug GP - PHY Data
  • Table 6: HomePNA Development
  • Table 7: ITU and HomePNA
  • Table 8: Comparative Characteristics
  • Table 9: Z-Wave and ZigBee
  • Table 10: Z-wave Products Retail Pricing
  • Table 11: ZigBee Smart Energy Profile Feature Set
  • Table 12: ZigBee Parameters
  • Table 13: Bluetooth Profiles
  • Table 14: HAN IP-based (Percentage of total networks)
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