市場調査レポート

ICTの発展 - スマートグリッド:進歩と課題

Smart Grid - Progress in ICT Development

発行 Practel, Inc. 商品コード 117170
出版日 ページ情報 英文
納期: 即日から翌営業日
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ICTの発展 - スマートグリッド:進歩と課題 Smart Grid - Progress in ICT Development
出版日: 2012年07月11日 ページ情報: 英文
概要

当レポートでは、スマートグリッド・インフラ支援のためのICTの役割や、関連技術の開発状況について分析し、全体的な市場動向や、現在開発中/開発済みの主要技術の詳細情報(IEEEの諸規格、LTE、DASH7など)を調査して、その結果を概略下記の構成でお届けいたします。

第1章 イントロダクション

第2章 全般的状況:スマートグリッド向けICT産業の活動

  • 努力
  • 構造
  • 必要条件:スマートグリッド・ネットワーク
  • 業界/ユーザーグループのプロジェクト(計22件)

第3章 スマートグリッド向けICTの状況

  • 全般的状況:スマートグリッド向けICT
  • 現在の状況
  • 現在の目的
  • 選択肢
  • スマートメーター
    • イントロダクション
    • 詳細
    • 機能
    • 構成部品
  • セキュリティ
  • プロジェクトの事例
  • 市場
    • 市場促進要因
    • 現実性
    • 市場の予測:スマートメーター
    • スマートグリッド向けICT:市場の推計
  • 業界動向(全32社分)

第4章 主な規格と技術

  • IEEEの諸グループ
  • IEEE 1900:DYSPAN
    • 背景事情
    • 範囲
    • DYSPAN WGs
  • IEEE 2030
  • IEEE-802.15.4g:スマート・ユーティリティ・ネットワーク
    • 全般的状況
    • 目的
    • 必要性
    • 価値
    • 概況PHY
    • 地域
    • 周波数割り当て
    • 詳細分析
    • サマリー
    • Wi-SUN
    • 事例:メーカー3社の場合(Accent、Analog Devices、Elster)
  • IEEE 802.22
    • 全般的状況
    • 現状
    • 発展
    • IEEE 802.22の現状(2011年)
    • IEEE 802.22の詳細
    • 認知機能
    • IEEE 802.22:スマートグリッドに向けたマーケティング上の考慮
    • サマリー
  • G3 PLC
    • 全般的状況
    • Maxim
    • G3 PLCアライアンス
    • ITU
    • 詳細分析
    • ベンダー情報(Infinion、Semitech、Yitran)
  • LTE (Long Term Evolution Technology) とスマートグリッド
    • 3GPPとLTE
    • LTEのタイムテーブル
    • ブロードバンド無線通信フェーズ
    • LTEの標準化:業界内の提携
    • LTEの主な機能
    • 利点
    • SAE/EPS (Evolved Packet System)
    • インターフェース
    • 市場
    • ベンダー情報(計25社)
    • LTEとスマートグリッド
  • DASH7技術とその用途
    • 全般的状況
    • 技術的明細
    • DASH7アライアンス
    • 仕様
    • ISO/IEC 18000-7
    • 使用分野と業界
    • DASH7とスマートグリッド

第5章 結論

付録I:IEEE802.15.4gの周波数割り当て

付録II:関連規制

図表一覧

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目次

The objectives of this report were to show the role of ICT to support the Smart Grid (SG) infrastructure; and to introduce some trends in the ICT development. The report also updates previous Practel reports published in 2009-2011.

The report emphasizes the importance of the SG networks optimization based on the set of standards that are developed or are in the development by a large group of standards organizations and the industry groups. The up-to-date standardization activities are addressed in this report.

The report covers several wireless and wireline SG networking technologies developments, including market statistics and the industry. It also concentrates on the LTE and DASH7 technologies that are addressed from a position of their applicability to the SG networking.

The report reflects the complex picture of the SG ICT standards introduction; and emphasizes the necessity of the uniform work through a large number of involved global organizations as well as a variety of industry groups and forums. So far, the industry reaction on plurality of technologies, in many cases, resulted in introduction of network elements that are based on Software Defined Radio; such platforms may allow multi-standards operation.

Table of Contents

1.0. Introduction

  • 1.1. General
    • 1.1.1. Smart Grid Definition
  • 1.2. Necessity
  • 1.3. Vision
  • 1.4. U.S.
  • 1.5. England
  • 1.6. Italy
  • 1.7. China
  • 1.8. Global Picture
  • 1.9. Scope
  • 1.10. Research Methodology
  • 1.11. Target Audience

2.0. General: SG ICT Industry Activities

  • 2.1. Efforts
  • 2.2. Structure
    • 2.2.1. Layers
  • 2.3. Requirements: SG Networking
    • 2.3.1. View
  • 2.4. Industry and User Groups Projects
    • 2.4.1. ETSI
    • 2.4.2. IEC
    • 2.4.3. IEEE
    • 2.4.4. Global Intelligent Utility Network Coalition
    • 2.4.5. Smart Networks Council (SNC)
    • 2.4.6. U-SNAP Alliance
      • 2.4.6.1. Specification and HAN
      • 2.4.6.2. Merge
    • 2.4.7. Accenture Intelligent City Network
    • 2.4.8. Advanced Grid Infrastructure Initiative
    • 2.4.9. NextGrid
    • 2.4.10. GridWise Alliance
    • 2.4.11. Appliances
    • 2.4.12. ESMIG
    • 2.4.13. Demand Response and Smart Grid Coalition (DRSG)
    • 2.4.14. EPRI (Electrical Power Research Institute)
    • 2.4.15. Hughes Broadband Alliance Program
    • 2.4.16. ZigBee and Wi-Fi Alliances
    • 2.4.17. NIST
    • 2.4.18. OpenHAN
    • 2.4.19. Federal Smart Grid Task Force
    • 2.4.20. Open Smart Grid Users Group (OSGUG)
    • 2.4.21. ITU
    • 2.4.22. OpenADR
    • 2.4.23. Comments

3.0. SG ICT Status

  • 3.1. General: SG ICT
  • 3.2. Current Status
  • 3.3. Current Objectives
  • 3.4. Choices
  • 3.5. Smart Meters
    • 3.5.1. Introduction
    • 3.5.2. Details
    • 3.5.3. Functions
    • 3.5.4. Components
      • 3.5.4.1. Communications
  • 3.6. Security
  • 3.7. Projects Examples
  • 3.8. Market
    • 3.8.1. Market Drivers
    • 3.8.2. Reality
    • 3.8.3. Market Projections: Smart Meters
    • 3.8.4. Smart Grid ICT- Market Estimate
  • 3.9. Industry
    • Aclara (Software and Systems, BPL)
    • Aeris (Wireless Network Provider)
    • Alcatel-Lucent (Infrastructure)
    • Analog Devices (RF Transceivers)
    • AT&T/SmartSynch (Network Services)
    • BPL Global (Software Platform)
    • Carlson Wireless (Radio Platforms)
    • Current Group (Systems, Sensors)
    • Cisco (IP-based Infrastructure, hardware)
    • Cooper Power Systems (Eka Systems (Network Nodes-Mesh) was Acquired by Cooper Power Systems in 2010)
    • Elster (AMI, AMR)
    • Echelon (Smart Metering System)
    • eMeter (Management Software)
    • GE (Hardware and Software-Smart Meters)
    • Google (SW)
    • GreenBox (Management Platform) - Acquired By Silver Spring Networks in 2010
    • GridPoint (Network Platform)
    • Grid Net (Network Management Software)
    • Infotility (Software)
    • Itron (Intelligent Metering)
    • Oracle (Software)
    • Landis+Gyr (Metering Devices)
    • Sensus Metering Systems (Data Collection and Metering)
    • SmartSynch (Networking)
    • Silver Spring Networks (Networking)
    • Siemens (Software)
    • Spinwave (Building Control, HAN)
    • Tantalus (Networking and Devices)
    • Tendril (System)
    • TransData (Wireless AMI/AMR Meter)
    • Trilliant (Intelligent Metering)
    • Tropos (Network)- Acquired by ABB Group in 2012

4.0. Major Standards and Technologies: SG ICT

  • 4.1. Groups - IEEE
  • 4.2. IEEE 1900 - DYSPAN
    • 4.2.1. Background
    • 4.2.2. Scope
    • 4.2.3. DYSPAN WGs
  • 4.3. IEEE 2030
  • 4.4. IEEE-802.15.4g-Smart Utility Networks
    • 4.4.1. General
    • 4.4.2. Purpose
    • 4.4.3. Need
    • 4.4.4. Value
    • 4.4.5. Overview - PHY
    • 4.4.6. Regions
      • 4.4.6.1. Frequencies Allocations
    • 4.4.7. Details
      • 4.4.7.1. Requirements: Major Characteristics
      • 4.4.7.2. Considerations
      • 4.4.7.3. Network Requirements
      • 4.4.7.4. PHY/MAC Modifications
      • 4.4.7.5. Market
    • 4.4.8. Summary
    • 4.4.9. Wi-SUN
    • 4.4.10. Examples: Manufacturers
      • Accent
      • Analog Devices
      • Elster
  • 4.5. IEEE 802.22
    • 4.5.1. General
    • 4.5.2. Status
      • 4.5.2.1. IEEE 802.22
      • 4.5.2.2. IEEE 802.22.1
      • 4.5.2.3. IEEE P802.22.2
      • 4.5.2.4. IEEE P802.22a
      • 4.5.2.5. IEEE P802.22b
    • 4.5.3. Developments
    • 4.5.4. IEEE 802.22-2011 Overview
      • 4.5.4.1. Major Characteristics - Overview
    • 4.5.5. IEEE 802.22 Details
      • 4.5.5.1. Physical Layer - Major Characteristics
        • 4.5.5.1.1. Major Applications
      • 4.5.5.2. MAC Layer
    • 4.5.6. Cognitive Functions
    • 4.5.7. IEEE 802.22 - Marketing Considerations for SG
    • 4.5.8. Summary
      • 4.5.8.1. Details - 802.22 and Smart Grid
      • 4.5.8.2. Usage Models
      • 4.5.8.3. Benefits
  • 4.6. G3 PLC
    • 4.6.1. General
      • 4.6.1.1. IEEE 1901.2 and G3 PLC
    • 4.6.2. Maxim
    • 4.6.3. G3 PLC Alliance
    • 4.6.4. ITU
    • 4.6.5. Details
      • 4.6.5.1. Specification
        • 4.6.5.1.1. PHY Layer
        • 4.6.5.1.2. MAC Layer
        • 4.6.5.1.3. Network and Transport Layers
        • 4.6.5.1.4. Application Layer
    • 4.6.6. Vendors
      • Infinion
      • Semitech
      • Yitran
  • 4.7. Long Term Evolution Technology (LTE) and SG
    • 4.7.1. 3GPP and LTE
    • 4.7.2. LTE Timetable
    • 4.7.3. Broadband Wireless Communications-Phases
    • 4.7.4. LTE Standardization-Industry Collaboration
      • 4.7.4.1. Industry Initiative
      • 4.7.4.2. Intellectual Property
    • 4.7.5. Key Features of LTE
      • 4.7.5.1. Details
      • 4.7.5.2. LTE Advanced
      • 4.7.5.3. SON
    • 4.7.6. Benefits
      • 4.7.6.1. Voice Support
  • 4.7.6.1.1. VoLTE
    • 4.7.7. SAE/EPS (Evolved Packet System)
      • 4.7.7.1. Functional Structure
    • 4.7.8. Interfaces
    • 4.7.9. Market
      • 4.7.9.1. Drivers
      • 4.7.9.2. Demand: Wireless Broadband
      • 4.7.9.3. LTE Market Projections
    • 4.7.10. Vendors
      • 4M Wireless
      • Agilent
      • Altair Semiconductor
      • Alcatel-Lucent-NEC
      • Altera
      • Aricent
      • Axis
      • Cisco
      • Commagility
      • Ericsson
      • Fujitsu
      • Infineon
      • Huawei
      • Lime Microsystems
      • mimoON
      • Motorola
      • Nokia Siemens Networks
      • NXP
      • picoChip (acquired by Mindspeed in 2012)
      • Qualcomm
      • Samsung
      • Sequans
      • Signalion
      • TI
      • ZTE
    • 4.7.1. 1LTE and Smart Grid
  • 4.8. DASH7 Technology and Applications
    • 4.8.1. General
    • 4.8.2. Specifics
    • 4.8.3. DASH7 Alliance
    • 4.8.4. Specification
      • 4.8.4.1. Physical Layer - PHY
      • 4.8.4.2. Data Layer
      • 4.8.4.3. Network Layer
      • 4.8.4.4. Higher Layers
      • 4.8.4.5. General Characteristics
      • 4.8.4.6. 433 MHz Transmission
    • 4.8.5. ISO/IEC 18000-7:2009 Information technology - Radio frequency identification for item management - Part 7: Parameters for active air interface communications at 433 MHz
    • 4.8.6. Applications and Industry
      • Agaidi
      • Evigia
      • Hi-G-Tek
      • Identec Solutions
      • Savi
      • TI
      • WiHart Systems
    • 4.8.7. DASH7 and SG

5.0. Summary and Conclusions

  • Appendix I: IEEE802.15.4g Frequency Allocation
  • Appendix II: Regulations
  • Figure 1: Smart Grid Networking
  • Figure 2: U.S. SG - NIST Conceptual Model
  • Figure 3: Organizations
  • Figure 4: Smart Grid and ICT
  • Figure 5: Smart Grid - Layered Structure
  • Figure 6: Layered Hierarchy - SG/ICT Standards
  • Figure 7: Interoperability Framework
  • Figure 8: Illustration
  • Figure 9: SG - ICT Infrastructure (Illustration)
  • Figure 10: Smart Grid Connectivity
  • Figure 11: U.S. Smart Meters Sale-TAM (Unit Mil.)
  • Figure 12: U.S. Smart Meters Sale - TAM ($M)
  • Figure 13: TAM: Global Smart Grid ICT ($B)
  • Figure 14: ComSoc Standards Board
  • Figure 15: IEEE 2030 Group
  • Figure 16: SUN Place
  • Figure 17: TAM Global SG SUN (IEEE802.15.4g) ($B)
  • Figure 18: IEEE 802.22 Network
  • Figure 19: Evolution Path
  • Figure 20: Towards Wireless Mobile Broadband
  • Figure 21: LTE - IP
  • Figure 22: Projection: Global Broadband Mobile Subscribers Base (M)
  • Figure 23: LTE Market-Subscribers' Base (M)
  • Figure 24: Projection: LTE Global Equipment Sale ($M)
  • Figure 25: Projection: LTE-able Devices Production (Mil)
  • Figure 26: Transmission Ranges
  • Table 1: Statistics (2008-2010)
  • Table 2: SG Related Standards: Examples
  • Table 3: SG ICT Market Components
  • Table 4: Major Characteristics: IEEE 802.22
  • Table 5: Rates of Transmission
  • Table 6: 3GPP Releases
  • Table 7: Major LTE Characteristics
  • Table 8: LTE Frequency Bands
  • Table 9: Release 8 Users Equipment Categories
  • Table 10: Mode 1 and Mode 2
  • Table 11: DASH7 - PHY
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