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MLCC (積層セラミックチップコンデンサ) の不足:ティアツーティア戦略と代替的リファレンスデザインソリューション

MLCC Shortages: FY 2019 Tier-to-Tier Strategies and Alternative Reference Design Solutions

発行 Paumanok Publications, Inc. 商品コード 586190
出版日 ページ情報 英文
納期: 即日から翌営業日
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本日の銀行送金レート: 1USD=114.47円で換算しております。
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MLCC (積層セラミックチップコンデンサ) の不足:ティアツーティア戦略と代替的リファレンスデザインソリューション MLCC Shortages: FY 2019 Tier-to-Tier Strategies and Alternative Reference Design Solutions
出版日: 2018年11月11日 ページ情報: 英文
概要

当レポートでは、MLCC (積層セラミックチップコンデンサ) の供給不足の現況と各種対策について調査し、MLCCの供給不足の状況とエンドユーズ市場への影響、製造能力の拡大に向けた取り組み、MLCCの代替品の市場・技術・市場機会の分析、主要地域・国別のセラミックコンデンサー製造量および主要MLCC製造工場、主要各社によるティアツーティアソリューションの概要などをまとめています。

MLCCの不足

ティアツーティア戦略と代替的リファレンスデザインソリューション

MLCCの不足:ティアツーティア&代替的リファレンスデザインソリューション:世界市場の分析

第1章 イントロダクション:受動電子部品の市場・技術・市場機会

  • 調査範囲
  • 調査手法
  • 固定コンデンサーとサブカテゴリー
  • 受動部品 サプライチェーン
  • サマリー・総論、など

第2章 MLCCの不足の見通し

  • 予測分析・ビッグデータの利用
  • イントロダクション
  • データセットの概要
    • 29製品区分別
    • 不足による問題
    • ビッグデータセットによる過去のサイクルのモデリング、など

第3章 MLCCの不足:複数のエンド市場における課題

  • イントロダクション
  • 供給不足のシナリオの管理戦略
  • 超小型ケースサイズコンテンツ
  • 静電容量要件
  • MLCCサプライチェーンにおけるボトルネックと顧客による克服手段、など

第4章 世界のMLCC市場における製造能力の拡大:問題の解決

  • 世界のセラミックコンデンサー産業における製造能力の拡大
  • 2007年のアップサイクルとの類似性
  • サマリー・総論:CAPEX、など

第5章 世界の総静電容量の最新動向

  • イントロダクション・算出手法
  • 静電容量要件の大幅な拡大
  • MLCC構造:スタッカブルセラミックレイヤー
  • 静電容量要件と誘電体
  • 静電容量の拡大
  • 将来の展望、など

第6章 過去の部品不足の比較

  • X5R MLCC:技術評価・ロードマップの比較
  • X7R MLCC:技術評価・ロードマップの比較
  • サマリー・総論、など

第7章 MLCCの代替

  • MLCCの代替品市場・技術・市場機会
  • MLCCと超小型次世代コンポーネントにおける技術ロードマップ
  • 薄膜チップ抵抗器・フェライトビーズ
  • 先進超小型部品の類似性
  • 固体受動コンポーネントの技術的ブレークスルー
  • タンタルコンデンサー
  • ポリマーアルミニウムの限界
  • 超小型受動:数十億ドルの産業
  • 静電容量の拡大とケースサイズの縮小
  • 超小型受動コンポーネントの成長推進因子、など

第8章 MLCCの不足:ケースサイズ別

  • イントロダクション
  • 動向分析:ケースサイズ別
  • 小型化
  • ティアツーティア戦略
  • その他の考察
  • サマリー・総論、など

セクションII:ソリューション

第9章 MLCCにおけるティアツーティアソリューション

  • ティアツーティア戦略
  • 新規供給量:地域・国別のMLCC工場およびトランスプラント
    • 日本:セラミックコンデンサー製造量・主要MLCC製造工場
    • 韓国:セラミックコンデンサー製造量・主要MLCC製造工場
    • 中国:セラミックコンデンサー製造量・主要MLCC製造工場
    • フィリピン:セラミックコンデンサー製造量・主要MLCC製造工場
    • シンガポール:セラミックコンデンサー製造量・主要MLCC製造工場
    • 南北アメリカ:セラミックコンデンサー製造量・主要MLCC製造工場
    • メキシコ:セラミックコンデンサー製造量・主要MLCC製造工場
    • マレーシア:セラミックコンデンサー製造量・主要MLCC製造工場
    • 欧州・その他の地域:セラミックコンデンサー製造量・主要MLCC製造工場
  • 主要セラミックコンデンサー製造業者
    • MLCCベンダー:ケースサイズ別
    • MLCCの移行:ケースサイズ別
    • MLCC消費量:ケースサイズ別
    • MLCC動向、など

第10章 実行可能なティアツーティアソリューション

  • ACAP
  • AMC
  • ATC
  • AVX
  • AFM MICRO
  • CALRAMIC
  • CANARYTEC
  • CKE
  • COMPEX
  • DALICAP
  • DARFON
  • DIELECTRIC LABS
  • EUROFARAD
  • EXXELIA
  • EYANG
  • FENG HUA
  • GREATBATCH, INC.
  • HIGH ENERGY
  • HOLYSTONE
  • JOHANSON
  • KEKON
  • KEMET
  • KNOWLES
  • 京セラ
  • MARUWA
  • MORGAN
  • 村田製作所
  • NOVACAP
  • PRESIDIO
  • SPECTRUM CONTROL
  • SRT-MC
  • SYFER
  • セムコ
  • 太陽誘電
  • TEAM YOUNG
  • TDK
  • TECDIA
  • TEKNIS
  • TEMEX
  • TRS
  • TUSONIX
  • UNION TECHNOLOGY
  • VALLEY DESIGN
  • VISHAY
  • WALSIN
  • WRIGHT
  • YAGEO
  • ZONKAS

第11章 MLCCの代替:リファレンスデザインの変化

  • 代替誘電体と代替ケースサイズの比較
  • 静電容量の増加とケースサイズの縮小
  • タンタルソリューション
  • タンタルコンデンサー:規模の経済
  • MLCCコンデンサーの比較消費予測:ケースサイズ別
  • DCフィルムチップソリューション
  • プラスチックフィルムコンデンサー製造業者:売上・市場シェア
  • サマリー:代替誘電体ソリューション、など
目次
Product Code: ISBN #:1-893211-99-1 (MLCCSHORT2018)

This global market study offers a fresh look (as of November 2018) at the current market shortage in multilayered ceramic chip capacitors (MLCC) and offers the reader solutions based upon a tier-to-tier analysis of all known MLCC vendors by Case Size; followed by additional suggestions for solutions to the MLCC shortage based upon alternative MLCC case sizes or dielectrics for alternative reference designs. Multiple capacitor vendors are noted in this study in the MLCC, Polymer Tantalum, Polymer Aluminum and DC Film Chip market segments. This study also contains the latest Paumanok Slide Presentation on the State of The Passive Components Industry as of November 2018.

Table of Contents

MLCC SHORTAGES FY 2019

TIER-TO-TIER STRATEGIES AND ALTERNATIVE REFERENCE DESIGN SOLUTIONS

MLCC SHORTAGES; TIER-TO-TIER AND ALTERNATIVE REFERENCE DESIGN SOLUTIONS: GLOBAL MARKET STUDY FY 2019

1.0. INTRODUCTION TO PASSIVE ELECTRONIC COMPONENT MARKETS, TECHNOLOGIES & OPPORTUNITIES: 2018

  • 1.1. SCOPE OF REPORT COVERAGE:
  • 1.2. RESEARCH METHODOLOGY:
    • 1.2.1. Government Data Collection and Resources:
    • 1.2.2. Secondary Published Sources:
    • 1.2.3. Primary Intelligence Gathering:
  • 1.3. FIXED CAPACITORS AND THEIR RESPECTIVE SUB-CATEGORIES: FY 2018
  • 1.4. THE PASSIVE COMPONENT SUPPLY CHAIN:
    • 1.4.1. Mining of Raw Materials:
      • 1.4.1. (A) Electronic Materials Are Usually Mined As Ore In The Following Countries
    • 1.4.2. Raw Materials Processing:
      • 1.4.2. (A) Key Technology platforms required for Passive Component Production
    • 1.4.3. Component Manufacturing:
      • 1.4.3. (A) Direct Versus PLP Manufacturing:
    • 1.4.4. Component Distribution:
      • 1.4.4. (A) OEM, EMS and Disti Explained
    • 1.4.5. End-Market Consumption:
      • 1.4.5. (A) Primary End Use Markets
      • 1.4.5. (B) Primary Consuming End- Product Lines
      • 1.4.5. (C) Automotive and Industrial: Specialty Requirements
      • 1.4.5. (D) Specialty End-Use Markets: Key Consuming Product Markets
      • 1.4.6. Recycling of Critical Materials:
  • 1.5. THE TECHNICAL ECONOMIC MAXIMS ASSOCIATED WITH PASSIVE ELECTRONIC COMPONENTS:
  • 1.6. THE TWO KEY TECHNICAL ECONOMIC MAXIMS ASSOCIATED WITH PASSIVE ELECTRONIC COMPONENTS:
    • 1.6.1. Ubiquitous Nature of Passive Electronic Components In Electrical and Electronic Circuits:
    • 1.6.2. Fixed Capacitors and Their Respective Sub-Categories: FY 2019
    • 1.6.3. Relationship Between Performance and Available Surface Area:
  • 1.7. SUMMARY AND CONCLUSIONS:

2.0. THE MLCC SHORTAGE OF FY 2019- AN UPDATE

  • 2.1. USING PREDICTIVE ANALYTICS AND BIG DATA TO MODEL PARTS SHORTAGES IN PASSIVE ELECTRONIC COMPONENTS
  • 2.2. Introduction:
  • 2.3. DESCRIPTION OF THE DATA SET:
    • 2.3.1. The 29 Products Covered by Paumanok Research (Zogbi Reports)
      • 1. Axial Leaded Al203:
      • 2. EDLC Supercapacitors (Carbon)
      • 3. SMD V-Chip (Al203)
      • 4. Organic H-Chip (Al203)
      • 5. Radial Leaded (Al203)
      • 6. Snap-In (Al203):
      • 7. Large Can (Al203)
      • 8. Ceramic 0201 MLCC (Chips (0201 BaTI02):
      • 9. Ceramic 0402 MLCC (Chips (0402 BaTI02):
      • 10. Ceramic 0603 MLCC (Chips (0603 BaTI02):
      • 11. Ceramic 0805 MLCC (Chips (0805 BaTI02):
      • 12. Ceramic 1206 MLCC (Chips (1206 BaTI02):
      • 13. Ceramic 1210-1225 MLCC (Chips (1210-1225 BaTI02):
      • 14. Ceramic High-CV MLCC (Chips All Sizes BaTI02 In Hydrothermal, alk-oxide or sol-gel):
      • 15. Ceramic Specialty Capacitors
      • 16. Tantalum, Molded Chip A Case (Manganese Cathode)-
      • 17. Tantalum, Molded Chip B Case (Manganese Cathode)-
      • 18. Tantalum, Molded Chip C Case (Manganese Cathode)-
      • 19. Tantalum, Molded Chip D Case (Manganese Cathode)-
      • 20. Tantalum, Molded Chip E/X Case (Manganese Cathode)-
      • 21. Tantalum, Molded Chip A Case (Polymer Cathode)-
      • 22. Tantalum, Molded Chip B Case (Polymer Cathode)-
      • 23. Tantalum, Molded Chip C Case (Polymer Cathode)-
      • 24. Tantalum, Molded Chip D Case (Polymer Cathode)-
      • 25. Tantalum, Molded Chip E/X Case (Polymer Cathode)-
      • 26. Plastic Film; Axial Leaded Plastic Film (Polyethylene Terephthalate Plastic Film Dielectric)
      • 27. Plastic Film: Film Chips (PPS, PEN and PET Films)
      • 28. Plastic Film: Radial Leaded Plastic Film (PET Plastic Film
      • 29. Plastic Film: Suppression Film (Snubber/X&Y)
    • 2.3.2. WHY ALL PARTS MATTER IN A SHORTAGE
    • 2.3.3. USING BIG DATA SETS TO MODEL PAST CYCLES:
    • 2.3.3. (A) March of 2010 through January of 2012-.
    • 2.3.3. (B) March of 2011 Through June of 2012-
    • 2.3.3. (C ) July 2012 Through April of 2013
    • 2.3.3. (D) May of 2013 Through May of 2017
    • 2.3.3. (E) June of 2016 Through June of 2017
    • 2.3.3. (F) July of 2017 Through June of 2018- Parts Shortages-
  • 2.4. USING BIG DATA SETS TO MODEL PAST CYCLES:

3.0 MLCC SHORTAGES ARE CREATING CHALLENGES IN MULTIPLE END-MARKETS IN 2018

  • 3.1. INTRODUCTION TO THE 2018 MLCC SHORTAGES-
    • Limited Capacity To Stack Ceramic Dielectric Will Extend MLCC Shortages To 2020 and beyond.
  • 3.2. STRATEGIES FOR MANAGING SHORT SUPPLY SCENARIOS-
  • 3.3. THE ULTRA-SMALL CASE SIZE CONTENT
    • MLCC Content in Apple Phone and Tesla EV Migration
  • 3.4. CAPACITANCE REQUIREMENTS PER PERSON:
  • 3.5. WHERE THE BOTTLENECK IN THE MLCC SUPPLY CHAIN EXISTS AND WHAT CUSTOMERS ARE DOING TO OVERCOME IT-
    • 3.5.1. Increasing Capacitance While Decreasing Case Size Trends
    • 3.5.2. Technology Hurdles Keep Competition Minimal, Customers Have Limited Transparency, Think All MLCC Are The Same
    • 3.5.2. (A) Limited Competition In X5R O6O3 and O8O5 MLCC
    • 3.5.3. Why The Shortage of MLCC May Last 5 Years:
    • 3.5.4. Applications of Nano-Technology Into MLCC Technology Advancement Can Take Up To 90 Months {BOX- JENKINS ANALYSIS}
    • 3.5.5. How MLCC Shortages Might Impact Demand For Other Dielectrics: FY 2019-2023

4.0. CAPACITY EXPANSION IN THE GLOBAL MLCC MARKETS: FIXING THE PROBLEM

  • 4.1. CAPACITY EXPANSION IN THE GLOBAL CERAMIC CAPACITOR INDUSTRY: CALENDAR-YEAR 2018-2019:
  • 4.2. WHY THE 2018 UP-CYCLE RESEMBLES THE 2007 UP-CYCLE:
    • 4.2.1. When The Market Goes South...
      • 4.2.1. (A) MLCC Expansion Strategy Analysis-
      • 4.2.1. (A1) ROI Equations Over Time Show Yields Lower Over Time
      • 4.2.1. (A2)
        • Regional Expansion Analysis:
      • 4.2.1. (A3)
        • Supply Chain Analysis: Materials Availability:
      • 4.2.1. (A4) High Cap Versus Low Cap Revenue Analysis:
      • 4.2.1. (A5) Market Share Analysis: Maintenance and Roadmaps:
      • 4.2.1. (A6) Where Capacity Expansion Is Expected: MLCC Dielectric Chemistry:
    • 4.2.3. Additional Markets Impacted By Capex In MLCC
      • 4.2.3. (A) Gas Stabilized Furnace Vendors:
      • 4.2.3. (B) Integration and Modularization Markets Outlook-
  • 4.3. SUMMARY AND CONCLUSION: CAPEX

5.0. AN UPDATE ON INSTALLED GLOBAL CAPACITANCE: IS THIS A FAD OR A SHIFT?

  • 5.1. Introduction and Methodology for Calculating Installed Global Capacitance
  • 5.2. Substantial Increases in Capacitance Requirements Over Time
    • 5.2.1. The First Shift: Makes Things Smaller (The Pioneer)
    • 5.2.2. The Second Shift: Makes Things Portable (The Early Settler)
    • 5.2.3. The Third Shift- Connects Them All Together (The Infrastructure)
  • 5.3. The Structure of an MLCC Showing Stackable Ceramic Layers
  • 5.4. Certain Dielectrics Impact The Annual Capacitance Requirements More Than Others:
  • 5.5. The Growth In Capacitance Value Per Person:
    • 5.5.1. The Growth in World Populations:
    • 5.5.2. The Growth in Capacitance Value Per Person:
    • 5.5.3. Critical Breakthroughs in Ceramics Processing Adds To Installed Capacitance Base:
  • 5.6. WHAT THE FUTURE HOLDS:

6.0. COMPARING PRIOR PARTS SHORTAGES: 2005, 2013 AND 2018...

  • 6.1. TECHNOLOGY ASSESSMENT OF THE HIGH CAPACITANCE X5R MLCC MARKET SEGMENT: 2005, 2013, 2018 COMPARISONS OF THE ROADMAP:
  • 6.2. X5R MLCC MARKET IMPACTED BY ACQUISITIONS AND SLOW ADOPTION OF TECHNOLOGY: 2005-2013-2018
    • Competitive Environment In X5R High Capacitance MLCC Markets By Maximum μF: 2005-2013-2018
  • 6.3. TECHNOLOGY ASSESSMENT OF THE HIGH CAPACITANCE X7R MLCC MARKET SEGMENT: 2005, 2013, 2018 COMPARISONS OF THE ROADMAP:
  • 6.4. X7R MLCC MARKET IMPACTED BY LACK OF INVESTMENT IN HIGH CAPACITANCE VARIATIONS: 2005-2013-2018
    • 6.4.1. Competitive Environment In X7R High Capacitance MLCC Markets By Maximum μF: 2005-2013-2018
  • 6.5. SUMMARY AND CONCLUSIONS: MLCC ARE HARD TO MAKE

7.0. ALTERNATIVES TO MLCC:

  • 7.1. MLCC SUBSTITUTION MARKETS, TECHNOLOGIES AND OPPORTUNITIES: 2018
  • 7.2 MLCC Sets The Tone for The Technology Roadmap in Ultra-Small Next Generation Components
  • 7.3. Thick Film Chip Resistors and Ferrite Beads Keep Up With Trends
  • 7.4. Leading Edge Ultra-Small Component Similarities
  • 7.5. Solid Passive Components about To Make a Breakthrough in Technology
  • 7.6. Tantalum Capacitors Making Technology Leaps As Well
  • 7.7. Polymer Aluminum Limitations
  • 7.8. Components Holding Back Technology (Limitations on Maximum Volumetric Efficiency)
  • 7.9. ULTRA-SMALL PASSIVES: A MULTIBILLION INDUSTRY
    • 7.9.1. Global Markets By Case Size:
    • 7.9.2. The Leading Edge Markets- 01005 and 008004:
    • 7.9.3. The Core Value Markets- 0201 to 0805
    • 7.9.4. The Large Case Electrolytic Markets In Tantalum and Aluminum
  • 7.10. INCREASING CAPACITANCE WHILE DECREASING CASE SIZE- THE TECHNOLOGY GAME IN PASSIVES
    • 7.10.1 MLCC and Tantalum- Major Competition Coming
  • 7.11. MARKET DRIVERS FOR ULTRA-SMALL PASSIVE COMPONENTS: FY 2017-2022
    • 7.11.1. The Real Products Driving Volumetric Efficiency
      • Market Drivers for Ultra-Small Passive Components

8.0 MLCC SHORTAGES BY CASE SIZE: 2018

  • 8.1. INTRODUCTION:
  • 8.2. TREND ANALYSIS BY CASE SIZE:
  • 8.3. MINIATURIZATION: DRIVEN BY AND FOR THE MARKET:
  • 8.4. A SEPARATE OUTLOOK:
  • 8.5. TIER-TO-TIER STRATEGY IN MLCC:
  • 8.6. OTHER CONSIDERATIONS WHEN CHOOSING AN MLCC
  • 8.7. SUMMARY AND CONCLUSIONS-

SECTION II- SOLUTIONS

9.0. TIER TO TIER SOLUTIONS IN MLCC

  • 9.1. TIER-TO-TIER STRATEGY IN MLCC:
  • 9.2. PROXIMITY TO NEW SUPPLY: MLCC FACTORIES AND TRANSPLANTS BY COUNTRY AND WORLD REGION-
    • 9.2.1. Japanese Production Output of Ceramic Capacitors for 2018
      • 9.2.1. (A) Top 15 Factories Producing Ceramic Capacitors In Japan
    • 9.2.2. Korean Production Output of Ceramic Capacitors in 2018
      • 9.2.2. (A1) Top 4 Factories Producing MLCC In Korea ROK
    • 9.2.3. Chinese Production Output of Ceramic Capacitors: FY 2018
      • 3.10.3. (A) Top 36 Factories Producing MLCC In China
    • 9.2.4. Philippines Production Output Of Ceramic Capacitors: FY 2018
      • 3.10.4. (A) Top 2 Factories Producing MLCC In Philippines
    • 9.2.5. Singapore Production Output Of Ceramic Capacitors: FY 2018
      • 9.2.5. (A) Top Factory Producing MLCC In Singapore
    • 3.10.6. Americas Production Of Ceramic Capacitors: FY 2018
      • 9.2.6. (A) Top 20 Factories Producing MLCC In the United States
    • 3.10.7. Mexico Production Of Ceramic Capacitors: FY 2018
      • 9.2.7. (A) Top Factories Producing Ceramic Capacitors In Mexico: 2018
    • 3.10.8. Malaysia Production of Ceramic Capacitors: FY 2018
      • 9.2.8. (A) Top Factories Producing Ceramic Capacitors In Malaysia: 2018
    • 9.2.9. European and ROW Production of Ceramic Capacitors: FY 2018
      • 3.10.9. (A) Top Factories Producing MLCC In Europe and Israel: 2018
  • 9.3. ALL KNOWN CERAMIC CAPACITOR MANUFACTURERS: FY 2018
    • 9.3.1 MLCC Vendors by Case Size Showing Limited Vendors in Larger Sets
    • 9.3.2 MLCC Consumption by Case Size Showing Unit Output Over Time in Real Data
    • 9.3.4 MLCC Shifts by Case Size Over Time- Handsets Drive Demand
    • 9.3.5 MLCC Consumption by Case Size
    • 9.3.6 MLCC TRENDS TO CONSIDER-
      • 9.3.6.(A) Handsets Drive MLCC R&D
      • 9.3.6. (B) Smaller Case Sizes Are The Continual Trend
      • 9.3.6. (C) Alternative Solutions Lack The Required Economies of Scale

10.0. A VIABLE TIER-TO-TIER SOLUTION

  • 10.1. ACAP
    • ACAP CORPORATION (PRIVATE)
  • 10.2. AMC
    • ADVANCED MONOLYTHIC CERAMICS (A JOHANSON DIELECTRICS, INC. COMPANY)
  • 10.3. ATC
    • AMERICAN TECHNICAL CERAMICS (AN AVX COMPANY)
  • 10.4. AVX
    • AVX/KYOCERA CORPORATION (NYSE: AVX : RIC 6971:):
  • 10.5. AFM MICRO
    • AFM MICROELECTRONICS, INC. (PRIVATE)
  • 10.6. CALRAMIC
    • CALRAMIC TECHNOLOGIES LLC (PRIVATE)
  • 10.7. CANARYTEC
    • CANARYTEC COMPANY LIMITED (PRIVATE)
  • 10.8. CKE
    • CKE (INCLUDES DEAN TECHNOLOGY, HV POWER ASSOCIATES AND HV POWER SOLUTIONS)
  • 10.9. COMPEX
    • COMPEX CORPORATION (PRIVATE)
  • 10.10. DALICAP
    • DALIAN DALICAP CO., LTD. (PRIVATE)
  • 10.11. DARFON
    • DARFON ELECTRONICS CORP (PUBLIC, TPE:8163)
  • 10.12. DIELECTRIC LABS
    • DIELECTRIC LABORATORIES, INC. (A KNOWLES COMPANY)
  • 10.13. EUROFARAD
    • EUROFARAD (AN EXXELIA COMPANY)
  • 10.14. EXXELIA
    • EXXELIA GROUP
  • 10.15. EYANG
    • EYANG HOLDINGS (GROUP) COMPANY LTD. (PUBLIC, HKG:0117)
  • 10.16. FENG HUA
    • GUANGDONG FENGHUA ADV. TECH. (HLDG) CO (PUBLIC, SHE:000636)
  • 10.17. GREATBATCH, INC.
    • GREATBATCH, INC. (PUBLIC: NYSE: GB)
  • 10.18. HIGH ENERGY
    • HIGH ENERGY CORPORATION (INDUCTOTHERM)
  • 10.20. HOLYSTONE
    • HOLY STONE ENTERPRISE CO., LTD. (PUBLIC, TPE:3026)
  • 10.21. JOHANSON
    • JOHANSON DIELECTRICS (JOHANSON TECHNOLOGY, ADVANCED MONOLYTHIC CAPACITORS)
  • 10.22. KEKON
    • KEKON CERAMIC CAPACITORS
  • 10.23. KEMET
    • KEMET ELECTRONICS (NYSE: KEM):
  • 10.24. KNOWLES
    • KNOWLES CAPACITORS (PUBLIC, NYSE: KN) {NOVACAP, DLI AND SYFER}
  • 10.25. KYOCERA
    • KYOCERA CORPORATION (TYO:6971
  • 10.26. MARUWA
    • MARUWA CO., LTD. (PUBLIC, TYO:5344)
  • 10.27. MORGAN
    • MORGAN TECHNICAL CERAMICS (ELECTROCERAMICS, RUABON DIVISION)
  • 10.28. MURATA
    • MURATA MANUFACTURING COMPANY LIMITED (RIC: 6981):
  • 10.29. NOVACAP
    • NOVACAP (A KNOWLES COMPANY)
  • 10.30. PRESIDIO
    • PRESIDIO COMPONENTS, INC. (PRIVATE)
  • 10.32. SPECTRUM CONTROL
    • SPECTRUM ADVANCED SPECIALTY PRODUCTS GROUP
  • 10.33. SRT-MC
    • SRT MICRO-CERAMIQUE
  • 10.34. SYFER
    • SYFER TECHNOLOGY LIMITED (A KNOWLES SUBSIDIARY)
  • 10.31. SEMCO
    • SAMSUNG ELECTRO-MECHANICAL (KSE: 009150):
  • 10.35. TAIYO YUDEN
    • TAIYO YUDEN COMPANY LIMITED (RIC: 6976):
  • 10.36. TEAM YOUNG
    • TEAM YOUNG ADVANCED CERAMICS COMPANY LTD. (5345:R.O.C)
  • 10.37. TDK
    • TDK CORPORATION (RIC: 6762):
  • 10.38. TECDIA
    • TECDIA
  • 10.39. TEKNIS
    • TEKNIS CERAMIC PRODUCTS
  • 10.40. TEMEX
    • TEMEX-CERAMICS (EXXELIA)
  • 10.41. TRS
    • TRS TECHNOLOGIES, INC. (INCLUDES CENTRE CAPACITOR)
  • 10.42. TUSONIX
    • TUSONIX (CTS CORP.)
  • 10.43. UNION TECHNOLOGY
    • UNION TECHNOLOGY CORPORATION
  • 10.44. VALLEY DESIGN
    • VALLEY DESIGN CORPORATION
  • 10.45. VISHAY
    • VISHAY INTERTECHNOLOGY (NYSE:VSH)
  • 10.46. WALSIN
    • WALSIN TECHNOLOGY CORPORATION (2492):
  • 10.47. WRIGHT
    • WRIGHT CAPACITORS, INC. (PRIVATE)
  • 10.48. YAGEO
    • YAGEO CORPORATION (TW 2327):
  • 10.49. ZONKAS
    • ZONKAS ELECTRONIC COMPANY LIMITED

11.0. ALTERNATIVES TO MLCC: CHANGING THE REFERENCE DESIGN-

  • 11.1. COMPARING ALTERNATIVE DIELECTRICS AND THEIR ALTERNATIVE CASE SIZES:
    • 11.1.1. MLCC Sets The Tone for The Technology Roadmap in Ultra-Small Next Generation Components
    • 11.1.2. Tantalum Capacitor Case Size Alternatives
    • 11.1.3. Polymer Aluminum Capacitor Case Sizes
    • 11.1.4. Plastic Film Chip Case Sizes
  • 11.2. INCREASING CAPACITANCE WHILE DECREASING CASE SIZE
    • 11.2.1. Capacitance Overlap
  • 11.3. THE TANTALUM SOLUTION-
    • 11.3.1. Major Vendors and Market Shares For Molded Chip Conductive Polymer Capacitors Polymer Aluminum and Polymer Tantalum: FY 2018
  • 11.4. TANTALUM CAPACITOR ECONOMIES OF SCALE
  • 11.5. COMPARATIVE FORECASTS FOR CONSUMPTION: MLCC CAPACITORS BY CASE SIZE TO 2022- ECONOMIES OF SCALE REQUIRED
  • 11.6. THE DC FILM CHIP SOLUTION
    • 11.6.1. Plastic Surface Mount Film Chip Capacitors:
    • 11.6.1. Polyethylene Terephthalate:
    • 11.6.2. Polyphenylene Sulfide:
    • 11.6.3. Polyethylene Naphthalate:
    • 11.6.4. Available Thickness:
    • 11.6.5. SMD Film Chip Capacitor Markets (PEN, PET, PPS): FY 2017
  • 11.7. Plastic Film Capacitor Manufacturers: FY 2018 Sales & Market Shares
    • 11.7.1. Major Vendors and Market Shares For SMD Film Chip Type Plastic Film Capacitors: FY 2018
  • 11.8. SUMMARY OF ALTERNATIVE DIELECTRIC SOLUTIONS TO MLCC
    • 1.7.1. ALTERNATIVES TO TRADITIONAL DIELECTRICS:
      • 1.7.1. (A) Miniaturization:
      • 1.7.2. (B) Enhanced Performance:
      • 1.7.2. (C) Integration:

Table of Figures

  • Figure 1: Paumanok Research Methodology
  • Figure 2: Fixed Capacitor Market Breakdown by Sub-Category: FY 2018
  • Figure 3: The Passive Electronic Component Supply Chain
  • Figure 4: The Technical Economic Maxims Associated With Passive Electronic Components
  • Figure 5: 75 Months of Lead Time Data for 29 Types of Capacitors
  • Figure 6: MLCC Content in Smartphone and Electric Vehicles
  • Figure 7: Capacitance Requirement Trends Per Person
  • Figure 8: Increasing Capacitance While Decreasing Capacitor Case Size
  • Figure 9: LImited Competition in X5R 0603 and 0805 MLCC
  • Figure 10: Applications of Nano-Technology Into MLCC Over Time: 2004-2018
  • Figure 11: Impact of the MLCC Parts Shortage of 2018 on Peripheral Components
  • Figure 12: Annual Capacitance Consumed in The Global High Technology Economy: 1990-2018
  • Figure 13: Cumulative Capacitance Consumed in The Global High Technology Economy: 1990-2018
  • Figure 14: Competitive Environment in X5R High Capacitance MLCC Markets by Maximum Capacitance Value in Microfarads: 2005-2013-2018 Comparison
  • Figure 15: Competitive Environment in X7R High Capacitance MLCC Markets By Maximum Capacitance Value: 2005-2013-2018 Comparison
  • Figure 16: MLCC Leads Way in Passive Component Volumetric Efficiency
  • Figure 17: Ultra-Small Passives: A $15 Billion Industry
  • Figure 18: Increasing Capacitance While Decreasing Case Size
  • Figure 19: Market Drivers for Ultra-Small Passive Components
  • Figure 20: Global Production Volume Trends By Case Size: 1991-2017
  • Figure 21: MLCC Vendors by Case Size: 2018
  • Figure 22: MLCC- So Simple, Yet So Complicated
  • Figure 23: MLCC Vendors by Case Size: 2018
  • Figure 24: Top 15 Factories Producing MLCC In Japan: 2018
  • Figure 25: Top 4 Factories Producing MLCC In Korea ROK: 2018
  • Figure 26: Top 36 Factories Producing MLCC In China: 2018
  • Figure 27: Top 2 Factories Producing MLCC In Philippines: 2018
  • Figure 28: Top Factory Producing MLCC In Singapore: 2018
  • Figure 29: Top 20 Factories Producing MLCC in the United States
  • Figure 30: Top Factories Producing MLCC in Mexico
  • Figure 31: Top Factories Producing MLCC in Malaysia
  • Figure 32: Top Factories Producing MLCC in Europe and ROW: 2018
  • Figure 33: MLCC Manufacturers by Case Size Showing Limited Vendors in Larger MLCC Case Sizes
  • Figure 34: Global Consumption Volume for MLCC By Case Size: 1991-2017 by Year With FY 2018 Forecasts
  • Figure 35: Global Consumption Volume for MLCC By Case Size: 1991-2017 by Year With FY 2018 Forecasts As a Percentage of Overall Ceramic Capacitor Sales
  • Figure 36: Global Consumption Volume for MLCC By Case Size: 2017
  • Figure 37: MLCC Leads Way in Passive Component Volumetric Efficiency
  • Figure 38: Increasing Capacitance While Decreasing Case Size
  • Figure 39: Competition by Case Size in Conductive Polymer Capacitors by Dielectric
  • Figure 40: Global Consumption Volume for Tantalum Chip Capacitors By Case Size: 1995-2017 by Year With FY 2018 Forecasts
  • Figure 41: Global Consumption Volume for MLCC Capacitors By Case Size: FY 2018-2022
  • Figure 42: SMD Film Chip Capacitors: End-Use Markets: FY 2017
  • Figure 43: SMD Film Chip Capacitors: Consumption Value of Demand By End-Use Market Segment: FY 2018
  • Figure 44: DC Plastic Film Capacitor Manufacturers: FY 2017 Market Shares (Metallized PET)
  • Figure 45: SMD Film Chip Vendors by Dielectric and Targeted End-Use Market Segment: FY 2018 SMD Film
  • Figure 46: Global Manufacturers of SMD Film Chip Capacitors: FY 2018 Global Sales and Market Shares
  • Figure 47: Summary of Alternative Solutions To MLCC Shortages
  • Figure 48: Operating Margins and Value-Added Ceramic Capacitor Markets: FY 2019
  • Figure 49: Operating Margins and Value-Added Ceramic Capacitor Markets: FY 2019
  • Figure 50: Value-Added and Application Specific Ceramic Capacitor Consumption Value by Type: 2018 (In Millions of USD)
  • Figure 50: Competitive Environment: MLCC Vendors With Flexible Terminations: FY 2018
  • Figure 52: Value-Added & Application Specific Ceramic Capacitor Vendors: FY 2018 Estimated Sales & Market Shares
  • Figure 53: Value-Added and Application Specific Ceramic Capacitor Demand By End-Use Market Segment: FY 2018
  • Figure 54: FY 2018 Global Consumption Value for Value-Added and Application Specific Ceramic Capacitors By Type and End-Use Market Segment
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