表紙:リニア抵抗器:世界市場・技術・機会 (2022年~2027年)
市場調査レポート
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1123563

リニア抵抗器:世界市場・技術・機会 (2022年~2027年)

Linear Resistors: World Markets, Technologies & Opportunities: 2022-2027

出版日: | 発行: Paumanok Publications, Inc. | ページ情報: 英文 288 Pages; 84 Tables & Graphs | 納期: 即日から翌営業日

価格
価格表記: USDを日本円(税抜)に換算
本日の銀行送金レート: 1USD=152.41円
リニア抵抗器:世界市場・技術・機会 (2022年~2027年)
出版日: 2022年09月06日
発行: Paumanok Publications, Inc.
ページ情報: 英文 288 Pages; 84 Tables & Graphs
納期: 即日から翌営業日
  • 全表示
  • 概要
  • 目次
概要

当レポートでは、世界のリニア抵抗器の市場について分析し、製品の技術的特徴や市場の基本構造、種類別 (厚膜、ニクロム、カーボン、薄膜ほか)・最終用途別 (工業、コンピュータ、通信、コンピュータ、ホームシアター、自動車、特殊用途)・地域別 (全3地域・18ヶ国) の市場動向、企業間の競合情勢と市場シェア構造、今後の市場動向の見通し (2027年まで) などを調査しております。

目次

第1章 イントロダクション

第2章 技術概要

第3章 エグゼクティブサマリー

第4章 抵抗器市場:種類別

第5章 抵抗器市場:最終用途別

第6章 世界の抵抗器市場:地域別・国別

第7章 競合情勢と市場シェア

第8章 将来予測 (2027年まで)

目次
Product Code: ISBN# 1-89-3211-38-X (2022)

This market study from Paumanok Publications, Inc. updates the 35-year commitment Paumanok has made to study the global market for linear resistors.

The study includes the following product lines:

PRODUCTS COVERED:

Paumanok has spent years analyzing global trade in the 8532 and 8533 HTS Codes for Capacitors, Resistors, Inductors and Circuit Protection Components, Publishing more than 300 digital assets on markets, technologies and opportunities and assisting the global supply chain in quantifying and qualifying opportunities by region and end-use market segment through product development, partnerships, mergers & acquisitions; technology advancement and supply chain visibility with an eye on Industry 4.0 and transparency from the finished product back down to engineered materials, ores and concentrates impacting multiple component and material ecosystems in fragmented end-use market segments.

Paumanok has also created its own taxonomy to best describe the actual trade of product, ands this coincides with the designations of the largest distributors of Passive Electronic Components in the world and reflects actual trade for consumption of these products. The more precise the taxonomy, the better the analytics, assessment, and forecasting. Paumanok covers 54 electronic component eco-systems and 14 materials supply chains for decades, collecting data each month and pushing it to our global clients- a verifiable who's who of the OEM and EMS high tech economy and their FinTech partners. This study on Linear Resistors, 35 years in the making, covers the global markets, technologies and opportunities for linear resistors and related materials as follows-

LINEAR RESISTORS:

The resistor big data sets include fixed resistors in these 21 individual types and sub-categories-

  • Thick Film Chip Resistors (0201 Case Size Ru02 Thick Film on 96% Alumina)
    • This "thick film chip resistor" TFCR has the physical dimension of 0.02 x 0.01 inches and is extremely small, no bigger than a grain of salt. This product is manufactured from ruthenium oxide resistive materials screen printed on a ceramic alumina substrate and terminated with solderable metal endcaps. This product enables portable technology and is largely consumed in wireless handsets and enables module circuitry. It is used for creating ohmic values in all electronics and is a ubiquitous product line, produced worldwide in the hundreds of billions of pieces.
  • Thick Film Chip Resistors (0402 Case Size Ru02 Thick Film on 96% Alumina)
    • This "thick film chip resistor" TFCR has the physical dimension of 0.04 x 0.02 inches and is extremely small,. This product is manufactured from ruthenium oxide resistive materials screen printed on a ceramic alumina substrate and terminated with solderable metal endcaps. This product enables portable technology and is largely consumed in wireless handsets, computers and TV sets. It is used for creating ohmic values in all electronics and is a ubiquitous product line, produced worldwide in the hundreds of billions of pieces. The 0402 is the largest volume chip resistor produced worldwide in terms of volume.
  • Thick Film Chip Resistors (0603 Case Size Ru02 Thick Film on 96% Alumina)
    • This "thick film chip resistor" TFCR has the physical dimension of 0.06 x 0.03 inches and is small. This product is manufactured from ruthenium oxide resistive materials screen printed on a ceramic alumina substrate and terminated with solderable metal endcaps. This product is largely consumed in computers, automobiles and TV sets. It is used for creating ohmic values in all electronics and is a ubiquitous product line, produced worldwide in the hundreds of billions of pieces.
  • Thick Film Chip Resistors (0805 Case Size Ru02 Thick Film on 96% Alumina)
    • This "thick film chip resistor" TFCR has the physical dimension of 0.08 x 0.05 inches and is small. This product is manufactured from ruthenium oxide resistive materials screen printed on a ceramic alumina substrate and terminated with solderable metal endcaps. This product is largely consumed in computers, automobiles and TV sets. It is used for creating ohmic values in all electronics and is a ubiquitous product line, produced worldwide in the hundreds of billions of pieces.
  • Thick Film Chip Resistors (1206 Case Size Ru02 Thick Film on 96% Alumina)
    • This "thick film chip resistor" TFCR has the physical dimension of 0.12 x 0.06 inches and is small. This product is manufactured from ruthenium oxide resistive materials screen printed on a ceramic alumina substrate and terminated with solderable metal endcaps. This product is largely consumed in computers and automobiles. It is used for creating ohmic values in all electronics and is a ubiquitous product line, produced worldwide in the hundreds of billions of pieces.
    • Thick Film Chip Resistors (1210-2512 Case Size Ru02 Thick Film on 96% Alumina)
    • This "thick film chip resistor" TFCR has the physical dimension of 0.12 x 0.10 to 0.25 x 0.12 inches and is large compared to other Components. This product is manufactured from ruthenium oxide resistive materials screen printed on a ceramic alumina substrate and terminated with solderable metal endcaps. This product is largely consumed in industrial electronics. It is used for creating ohmic values in all electronics and is a ubiquitous product line, produced worldwide in the tens of billions of pieces.
  • Carbon Film Resistor, Axial and Radial Leaded:
    • This is a legacy resistor product line that is constructed of carbon film deposited on a 96% alumina core. The product is consumed in consumer AV applications.
  • Metal Foil: (Nickel + Chromium Metal Foil in Axial, Radial and SMD Configurations):
    • This fixed resistor is a specialty resistor produced almost exclusively worldwide by Vishay Precision Group (VPG) and TDK Alpha Electronics. The product line is consumed in defense, oil & gas, instrumentation, space and laboratory electronics. Product line is sometimes referred to as Bulk Metal Foil. Invented by Dr. Felix Zandman founder of Vishay.
  • Tin-Oxide: (Antimony - 10 Resistive Element, also called Flameproof and High Voltage Resistors:
    • This resistor sold almost exclusively in axial leaded designs. This specialty resistor is sold primarily into high voltage and industrial end use markets.
  • Nichrome Film (Nickel + Chromium Deposited Metal Film on Ceramic Core):
    • This includes the MELF surface mount configurations; axial leaded and radial leaded designs. A large end-market in specialty resistors dominated by the Vishay-Dale and Beyschlag subsidiaries. The primary end-market is in automotive applications in Europe, including under-the-hood (MELF) and professional electronics in industrial markets.
  • Power Wirewound (Nickel + Chromium Wire wound on a Ceramic Core):
    • This resistor is available in axial, radial and molded chip surface mount designs) consumed in power electronics applications. A large market, also dominated worldwide by Vishay.
  • Resistor Network, The Multichip Array Network:
    • (Resistor network array in surface mount configuration manufactured from ruthenium oxide resistive paste on a ceramic 96% alumina substrate in a quad or octel package). The array is a "pick and place" solution whereby customers save money on pick and place costs by picking and placing four or eight chips in an array at once. This product is consumed in the computer markets.
    • Resistor Network, Coated SIP Network
    • (Resistor network array manufactured from ruthenium oxide resistive paste on a ceramic 96% alumina substrate in a Single-In-Line Package- radial type unique lead).
    • Resistor Network, SMD DIP Network:
    • (Resistor network array manufactured from ruthenium oxide resistive paste on a ceramic 96% alumina substrate in a Dual-In-Line Package in a surface mount molded chip with gull type metal leads). Consumed in computers and telecom infrastructure.
    • Resistor Network, Molded DIP Network
    • (Resistor network array manufactured from ruthenium oxide resistive paste on a ceramic 96% alumina substrate in a Dual-In-Line Package- a surface mount package). Consumed in computers.
    • Resistor Network, Molded SIP Network
    • (Resistor network array manufactured from ruthenium oxide resistive paste on a ceramic 96% alumina substrate in a Single-In-Line Molded Package- a radial mount package). Consumed in computers and telecom infrastructure.
  • Thin Film Chips 0402 Chips: Nickel + Chromium or Tantalum + Nitride Thin Films
    • This resistor is sputtered on silicon or ceramic substrate in traditional chip case sizes- competes with thick film chips but is a precision part that is more expensive. In the 0.04 x 0.02 inch EIA designated case size consumed in specialty electronics, computers and communications modules. For precision circuits. Ultras-small Chip.
    • Thin Film Chips 0603 Chips: Nickel + Chromium or Tantalum + Nitride Thin Films
    • This resistor is sputtered on silicon or ceramic substrate in traditional chip case sizes- competes with thick film chips but is a precision part that is more expensive. In the 0.06 x 0.03 inch EIA designated case size consumed in specialty electronics, computers and communications. For precision circuits
    • Thin Film Chips 0805 Chips: Nickel + Chromium or Tantalum + Nitride Thin Films:
    • This is sputtered on silicon or ceramic substrate in traditional chip case sizes- competes with thick film chips but is a precision part that is more expensive. In the 0.08 x 0.05 inch EIA designated case size consumed in specialty electronics, computers and communications. For precision circuits
    • Thin Film Chips 1206 Chips: Nickel + Chromium or Tantalum + Nitride Thin Films:
    • This resistor is sputtered on silicon or ceramic substrate in traditional chip case sizes- competes with thick film chips but is a precision part that is more expensive. In the 0.12 x 0.06 inch EIA designated case size consumed in specialty electronics, computers and communications. For precision circuits.
    • Thin Film Chips 1210-2512 Chips: Nickel + Chromium or Tantalum + Nitride Thin Films
    • This is sputtered on silicon or ceramic substrate in traditional chip case sizes- competes with thick film chips but is a precision part that is more expensive. In the 0.12 x 0.06 inch EIA designated case size consumed in specialty electronics, computers and communications. For precision circuits.
  • Ruthenium (For Resistor Inks):
    • This is an important precious metal as it is consumed as the primary resistive element in all thick film chip resistors and resistor networks. The consumption of ruthenium is almost 95% in resistors and therefore the price of ruthenium is directly impacted by the supply and demand of thick film chip resistors. Ruthenium is mined as a byproduct of platinum and is also impacted by the platinum mining industry. In the monthly report we track the price per troy ounce.

CONTENT OUTLINES

I. INTRODUCTION

  • Describes the methodology and scope of coverage- the basic definitions of linear resistors, and how linear resistors fit into the larger market for passive electronic components.

II. TECHNOLOGY OVERVIEW

  • This breaks down the linear resistor markets into to categories by resistive element, which are generally based upon thick and thin film materials such as ruthenium oxide, nichrome film and foil, nichrome wire and TaN films. Various case sizes and related markets and resistor configurations are also discussed. In the 2022 version of this study we have added the comparative technology analysis to include ohmic value range, voltage handling capability and resistor type and configuration to support our growth forecast through 2027. This section also discusses resistor integration technologies and transitioning from PGM based thick film to Nichr and TaN thin film alternatives and outlook to 2027.

III. EXECUTIVE SUMMARY

  • This section show detailed value, volume and pricing changes for the linear resistor products discussed in this report, with historical reference back to 2003.

IV. RESISTOR MARKETS BY TYPE

  • This section discusses linear resistor markets by type; thick film, nichrome, carbon, thin film- and by tolerance, power rating, voltage and case size.

V. RESISTOR MARKETS BY END-USE MARKET SEGMENT

  • The study addresses the global markets for linear resistors by end-use market segment and breaks down worldwide demand from the industrial, computer, telecommunications, computer, home theatre, automotive and specialty end-use market segments.

VI. RESISTOR MARKETS BY WORLD REGION AND COUNTRY

  • The study breaks out linear resistor consumption value in three primary regions and 18 different countries. This is based upon Paumanok's detailed analysis of 35 years of trade data.

VII. COMPETITION AND MARKET SHARES

  • The study offers detailed vendor market share information for thick film chips, wirewound, nichrome film, tin oxide and thin film resistors.

VIII. FORECASTS TO 2027

  • Global market forecasts are given in terms of value, volume and pricing for each resistor product by type and sub-category for each year to 2025. The study updates the global forecasts for consumption by end-use market segment based on impact of pandemic on supply chains, coupled with detailed forecasts for linear resistors by type consumed in the propulsion systems for electric vehicles; a high-growth and value-added market for key vendors described in this report over the next five years to meet production schedules.

TABLE OF CONTENTS

I. INTRODUCTION

II. TECHNOLOGY OVERVIEW

III. EXECUTIVE SUMMARY

IV. RESISTOR MARKETS BY TYPE

V. RESISTOR MARKETS BY END-USE MARKET SEGMENT

VI. RESISTOR MARKETS BY WORLD REGION AND COUNTRY

VII. COMPETITION AND MARKET SHARES

VIII. FORECASTS TO 2027