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ICパッケージングおよびOSAT ICパッケージングの世界市場の予測:2019年版

Global IC Packaging Applications and Outsourced Semiconductor and Test (OSAT) Markets - 2019 Edition: A New Comprehensive Report Covering Critical Market Segments of the Global IC Packaging Industry

発行 New Venture Research 商品コード 914875
出版日 ページ情報 英文 300+ Pages
納期: 即日から翌営業日
価格
本日の銀行送金レート: 1USD=110.56円で換算しております。
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ICパッケージングおよびOSAT ICパッケージングの世界市場の予測:2019年版 Global IC Packaging Applications and Outsourced Semiconductor and Test (OSAT) Markets - 2019 Edition: A New Comprehensive Report Covering Critical Market Segments of the Global IC Packaging Industry
出版日: 2019年09月30日 ページ情報: 英文 300+ Pages
概要

当レポートでは、世界のICパッケージングおよびOSAT ICパッケージングの市場を調査し、世界のエレクトロニクス市場全体の動向および展望、半導体デバイス・ICパッケージングタイプ・用途別の出荷数・収益の予測、OSAT ICパッケージング市場の予測、主要OSAT事業者の戦略、企業プロファイルなどをまとめています。

第1章 イントロダクション

第2章 エグゼクティブサマリー

第3章 世界のエレクトロニクス市場の動向・予測

  • エレクトロニクス産業の近年の経済動向
  • 経済・政策の影響
  • 技術の影響
  • 世界のエレクトロニクス市場
  • コンピューター
  • 通信
  • CE製品
  • 自動車
  • 工業
  • 医療
  • 商用
  • 商用航空・防衛
  • その他の輸送
  • 家庭用/商用/行政用IoT
  • 工業用・その他のICデバイス

第4章 ICデバイス&パッケージング市場:概要

  • 半導体部門の動向
  • 世界のICデバイス市場
    • プロセッサー
    • ロジック
    • メモリー
    • アナログ
  • 世界のICパッケージング市場
    • DIP
    • TO・SOTパッケージ
    • SOPファミリー
    • チップキャリア
    • フラットパックパッケージ
    • PGAパッケージ
    • BGAパッケージ
    • WLパッケージ
    • DCA

第5章 ICデバイスの導入分析

  • 半導体デバイスの導入動向・予測:用途別
    • CE製品
    • 自動車
    • コンピューター
    • 通信
    • 工業
    • その他
  • ICデバイスの導入動向・予測
    • プロセッサー
    • その他ロジック
    • メモリー
    • アナログ
  • ICパッケージングの導入動向
    • DIP
    • TO・SOTパッケージ
    • SOPファミリー
    • チップキャリア
    • フラットパックパッケージ
    • PGAパッケージ
    • BGAパッケージ
    • WLパッケージ
    • DCA
  • フリップチップ相互接続の動向

第6章 OSAT市場・戦略分析

  • 半導体市場におけるアウトソーシング
  • 半導体産業の統合
  • OSAT市場の予測
    • 出荷数
    • 収益
    • 平均パッケージング価格
  • 成功戦略
  • 市場リーダーの戦略

第7章 OSAT企業のプロファイル

目次
Product Code: OSAT19

Report Highlights

Global Electronics Market Overview

  • Economic Overview
  • Semiconductor Industry Analysis

Electronics Summary Forecasts, 2018-2023

  • By Total Assembly Value
  • By Applications Market

Semiconductor Application Market Forecasts, 2018-2023

  • Unit Shipments and Revenue
  • By Semiconductor Device
  • By IC Packaging Type
  • By Application Segment

OSAT IC Packaging Market Forecasts, 2018-2023

  • IC Packaging Type by Unit Shipments, Revenues and ASP
  • Competitive Rankings
  • 39 Company Profiles

Synopsis

About the Author In the manufacturing of integrated circuits, the role played by the back-end assembly process has changed considerably over the decades. Once important only as a protective housing for the delicate IC devices, IC packages have come to be regarded as integral to the functioning of the ICs, and instrumental in determining the types of electronics we all will purchase in the future.

For more than twenty years, New Venture Research (NVR) has provided high quality, in-depth analysis of the IC packaging market. Continuing in that long tradition, NVR announces a new report for 2019: Global IC Packaging Applications and Outsourced Semiconductor and Test (OSAT) Markets. This report delves deeply into two critical market segments. The first focus is on the broad domain of applications for which ICs are developed, as well as the end-user electronics products that use ICs. The second focus of the report is on the category of companies known as outsourced semiconductor assembly and test companies, usually referred to by the acronym OSATs, and presents NVR's continuing coverage of this expanding sector of the semiconductor market.

The purpose of the report is to provide an analysis of the major application trends affecting the electronics industry, and detailed forecasts of the major application segments- Consumer, Computer, Communications, Automotive, and Industrial & Other. It also surveys numerous specific electronics product markets, such as smartphones, tablets, PCs, TVs and other consumer products, and automotive components. In addition, the report analyzes the strategies and IC packaging products shipped by OSATs, with forecasts of unit shipments, revenues and ASP. Every table in the report presents historical data for 2018 and forecasts the market for the five-year period, 2019 - 2023.

The 300-page report consists of seven chapters. Chapter 1, "Introduction," and Chapter 2, "Executive Summary." Chapter 3, "Global Electronics Market Trends and Forecasts" presents a critical industry analysis at the global economy today and the broad economic and market trends driving the semiconductor industry. It also details the key electronics products markets for IC devices. Forecast tables provide not only unit shipments of nearly 30 electronics market segments, but for many the unit shipments of ICs and IC revenues, as well. Chapter 4, "Overview of the Worldwide IC Packaging Market" describes in detail the many IC packaging market segments and provides forecasts of the worldwide market in terms of packaging types, I/O count and IC devices. This sets the stage for Chapter 5, "IC Applications Analysis," which examines semiconductor device applications and IC packaging applications in terms of unit shipments and revenues. In Chapter 6, "OSAT Market and Strategy Analysis," the report examines the history of outsourcing in the semiconductor market and the emergence of the OSAT contractors, as a major factor in the IC packaging market. The chapter presents the market shares for the leading OSATs and analyzes their product marketing strategies. Tables present forecasts of the OSAT market in terms of unit shipments, revenues and package pricing. Finally, Chapter 7, "OSAT Company Profiles" presents concise profiles of nearly 40 OSAT companies, providing a cross-section of both large and small competitors, as well as companies specializing in both conventional IC packaging and leading-edge advanced IC packaging products.

Global IC Packaging Applications and Outsourced Semiconductor and Test (OSAT) Markets - 2019 Edition is an effective and economical tool for any company interested in competing in the semiconductor industry as an aid in assessing the present and future of this dynamic industry. The report sells for $3995 and is delivered by email as a single-user PDF file. Extra single-user licenses sell for $500 each and a corporate license is available for an additional $1500. With the purchase of the report, an Excel spreadsheet containing every table and graphic may be obtained for an additional $1000 and a printed copy for $250.

About The Author

Jerry Watkins is an independent senior analyst with more than 20 years of direct experience in the field of market research and consulting. He has worked for leading research companies such as Frost & Sullivan, Lucid Information Services, and NSI Research, both in management and as a writer. Mr. Watkins has authored many syndicated reports, previously in the telecommunications and office automation sectors and more recently in the semiconductor industry, writing on subjects that include IC packaging and merchant embedded computing. He holds two university degrees, including a B.A. in History and an M.A. in International Studies, but he feels that market research best fulfills his lifelong passion for inquiry into difficult subject matter and making it comprehensible to a wide audience. Mr. Watkins has lived and worked in Silicon Valley for most of his career.

Table of Contents

Chapter 1: Introduction

Chapter 2: Executive Summary

Chapter 3: Global Electronics Market Trends and Forecasts

Recent Global Electronics Economic Trends Global Economy/Government Policy Impacts Technology Impacts Global Electronics Market Electronic Industry Summary Forecasts

Computers

  • Personal Computers, Tablets/E-readers, Servers, Workstations, Enterprise Storage Systems, Flash/Hard Drives, Monitors, Printers, Other Computer Applications

Communications

  • Cellular Handsets, Communications Infrastructure, Carrier Class Switches, Other Phones, DSL/Cable Modems, Other Communications Applications

Consumer

  • Digital Televisions, Set-top Boxes, Camcorders, DVD/DVR Players, Digital Cameras, Console Video Games, MP3/MP4 Players, Audio/Video and Smart Home Products, Consumer IoT Products, Other Consumer Applications

Automotive, Industrial, Medical, Commercial Aviation/Defense and Other Transportation, Home/Commercial/Government Internet of Things, and Industrial and Other IC Devices

Chapter 4: Overview of the IC Devices and Packaging Market

Semiconductor Sector Industry Trends

Worldwide IC Devices Market

  • Processors, Logic, Memory, Analog Worldwide IC Packaging Market
  • Dual In-Line Packages
  • Transistor Outline and Small Outline Transistor Packages
  • Small Outline Packaging Families
  • Chip Carriers
  • Flat Pack Packages
  • Pin Grid Array Packages
  • Ball Grid Array Packages
  • Wafer-Level Packages
  • Direct Chip Attach

Chapter 5: IC Applications Analysis

Semiconductor Devices Applications Trends

  • Overview, Total Application Market Forecast, and Consumer, Automotive, Computer, Communications, Industrial and Other Forecasts

IC Device Applications Market Analysis

  • Total Devices Market Segments, and Processor, Other Logic, Memory, Analog Devices Applications

IC Packaging Applications Market Analysis

  • Dual In-Line Packages, Transistor Outline and Small Outline Transistor Packages, Small Outline Packaging Families, Chip Carriers, Flat Pack Packages, Pin Grid Array Packages, Ball GridArray Packages, Wafer-Level Packages, Direct Chip Attach

Flip Chip Interconnection Application Trends

Chapter 6: OSAT Market and Strategy Analysis

Outsourcing in the Semiconductor Market

  • Emergence of Fabless Manufacturing
  • Outsourcing IC Packaging

Semiconductor Industry Consolidation

OSAT Market Forecasts

  • OSAT Unit Shipments
  • OSAT Revenues
  • OSAT Average Packaging Prices

Success Strategies for OSATs

Market Leaders Strategies

Chapter 7 OSAT Company Profiles

  • 3D Plus
  • Advotech
  • AIC Semiconductor
  • Amkor Technology
  • ANST China
  • ASE
  • Azimuth
  • Carsem
  • Chant World Technology
  • China Wafer Level CSP
  • ChipMOS
  • Cirtek
  • Deca Technologies
  • FlipChip Int'l
  • Greatek Electronics
  • Hana Microelectronics
  • HANA Micron
  • Integra Technologies
  • Interconnect Systems
  • Jiangsu Changjiang Electronics
  • Lingsen Precision Industries
  • nepes Corp.
  • OSE
  • Palomar Technologies
  • Shinko Electric
  • Signetics
  • Sigurd Microelectronics
  • SPiL
  • SPEL Semiconductor
  • Tera Probe
  • Tianshui Huatian Tech
  • TongFu Microelectronics
  • TSMC
  • Unisem
  • UTAC
  • Walton Advanced Engineering
  • Xintec
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