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ICパッケージングの世界市場:2016年版

The Worldwide IC Packaging Market - 2016 Edition: The Most Comprehensive Report Available on the Global IC Packaging Industry

発行 New Venture Research 商品コード 275970
出版日 ページ情報 英文 495 Pages
納期: 即日から翌営業日
価格
本日の銀行送金レート: 1USD=115.27円で換算しております。
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ICパッケージングの世界市場:2016年版 The Worldwide IC Packaging Market - 2016 Edition: The Most Comprehensive Report Available on the Global IC Packaging Industry
出版日: 2016年11月28日 ページ情報: 英文 495 Pages
概要

2015年における世界のIC製造・出荷数は約3800億と推計されており、今後5年にかけては4%超のCAGR (年間複合成長率) で推移すると予測されています。

当レポートでは、世界のICパッケージングの市場を調査し、世界的な経済環境とエレクトロニクス産業の動向、デバイスタイプ・パッケージファミリー別の動向と市場規模の推移と予測、OSAT市場の動向と戦略分析、主要OSAT企業のプロファイルなどをまとめています。

第1章 イントロダクション

第2章 エグゼクティブサマリー

第3章 経済の展望・世界的状況

  • エレクトロニクス産業の予測
  • 世界市場・半導体市場:概要
  • 不均等な経済回復
  • 世界のGDP
  • 世界のエレクトロニクス市場
  • エレクトロニクス産業:予測サマリー
    • 通信市場
      • セルラー端末
      • LAN
      • DSL・ケーブルモデム
      • キャリアクラス機器
    • コンピューター市場
      • PC
      • タブレット
      • サーバー
      • ストレージシステム
      • モニター
      • プリンター
    • 消費者向け製品市場
      • TV
      • セットトップボックス
      • デジタルカメラ
      • パーソナルナビゲーション機器
    • 産業向け製品市場
      • プロセス制御
      • 検査・測定
      • その他
    • 医療市場
      • 医療診断
      • 治療
      • モニタリング
      • 手術
    • 自動車市場
    • 民間航空・防衛・その他輸送市場

第4章 ICパッケージング市場の分析:半導体デバイス別

  • 世界の半導体デバイス市場
    • 総市場の予測
    • 機能別の予測
    • 用途別の動向
  • IC市場予測:地域別
  • 市場予測:デバイスタイプ別
  • トランジスター
  • プロセッサーデバイス
    • MPU
    • MCU (4・8・16・32ビット〜)
    • DSP
  • メモリーデバイス
    • DRAM
    • SRAM
    • フラッシュ
    • ROM/EPROM
    • EEPROM
  • ロジックデバイス
    • デジタルバイポーラー
    • スタンダートロジック
    • ゲートアレイ
    • スタンダードセル&PLD
    • ディスプレイドライバー&タッチスクリーンコントローラー
    • 各種SPL
  • アナログデバイス
    • アンプ・コンパレーター
    • インターフェース
    • 電圧調整器・基準
    • データコンバーター
    • 各種専用アナログ

第5章 ICパッケージング:概要・世界市場の分析

  • 概要
  • ICパッケージファミリー
  • 世界のICパッケージング
  • ICパッケージング市場の予測
    • ICパッケージング市場:I/Oカウント別
    • パッケージ価格の動向
  • ICパッケージファミリーの予測
    • TOパッケージ
    • DIP
    • SOT
    • SO
    • TSOP
    • CC
    • QFP
    • DFN
    • QFN
    • PGA
    • BGA
    • FBGA
    • WLP
    • DCA
  • 先進ICパッケージング
    • MCP (マルチチップパッケージ)
    • FOWLP (Fan-Out Wafer-Level Package)
    • Multirow QFN パッケージ
    • フリップチップ接続
    • TSV接続

第6章 OSAT市場・戦略分析

  • 半導体市場におけるアウトソーシング
  • OSAT市場の予測
    • 出荷数
    • 収益
    • パッケージASP
  • OSAT市場のリーダー

第7章 OSAT企業のプロファイル

  • 3D Plus
  • ASE
  • Advotech
  • AIC Semiconductor
  • Amkor Technology
  • Anst China
  • Azimuth
  • Carsem
  • Chant World Technology
  • China Wafer Level CSP
  • ChipMOS
  • Cirtek
  • コネクテックジャパン
  • CORWIL Technology
  • Deca Technologies
  • FlipChip Int'l
  • Greatek Electronics
  • Hana Microelectronics
  • HANA Micron
  • I2A Technologies
  • J-Devices
  • Jiangsu Changjiang Electronics
  • Lingsen Precision
  • NANIUM
  • Nantong Fujitsu
  • Nepes Corp.
  • OSE
  • Powertech
  • Shinko Electric
  • Signetics Corp.
  • Sigurd
  • SPiL
  • SPEL
  • STATS ChipPAC
  • Tera Probe
  • Tianshui Huatian Tech
  • Unisem
  • UTAC
  • Vigilant Technology
  • Walton Advanced Eng.
  • Xintec

このページに掲載されている内容は最新版と異なる場合があります。詳細はお問い合わせください。

目次
Product Code: PKG16

Report Highlights

Industry Overview

  • Economic Overview
  • Semiconductor Industry Analysis

Worldwide IC Packaging Market Forecasts, 2014-2020

  • Units
  • Package Prices
  • Packaging Revenue
  • By Semiconductor Product
  • By Package Family
  • By I/O Range

OSAT IC Packaging Market Forecasts, 2014-2020

  • Units
  • Package Prices
  • Packaging Revenue
  • Competitive Rankings
  • Company Profiles

Synopsis

Integrated circuits are beyond question one of the most significant inventions of the 20th Century. Billions of ICs are manufactured every year, and are used in a vast range of products. In 2015, nearly 380 billion ICs were manufactured and shipped by semiconductor companies across the globe, and over the next five years, it is expected that the market will expand at a compounded annual growth rate of more than 4%.

At one time, the methods and technologies used to package and protect delicate integrated circuits were relatively simple. However, as IC devices themselves have become more powerful, the sophistication and complexity of IC packaging have also matured. Today, there are dozens of different types of packages in hundreds, even thousands of variations.

The Worldwide IC Packaging Market, 2016 Edition, a new report from New Venture Research (NVR) provides in-depth analysis of semiconductor devices and the IC packaging industry. Using extensively researched historical and current market trend data, the report examines the global IC packaging market, providing 5-year forecasts from a number of perspectives, including packaging type, I/O count, and application. Forecasts are provided for unit shipments, annual revenues and packaging pricing for 31 separate IC device types, as well as 14 major packaging categories comprised of 44 market segments. The report also includes an economic and major product overview of the global electronics industry, as well as a focused analysis of the Outsourced Semiconductor Assembly and Test (OSAT) industry segment.

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The report is divided into seven chapters. Following an Introductory chapter (Chapter 1) and an Executive Summary (Chapter 2), the report presents an Economic Outlook and Worldwide Electronics Industry Forecast (Chapter 3). In Chapter 4, the report dives deeply into an examination of each Semiconductor product type, with forecasts provided in terms of packaging types, applications and major world regions. This is followed in Chapter 5 with detailed analysis of each packaging market segment, with forecasts provided in terms of IC device types and I/O count. The chapter also provides an overview of advanced packaging products and technologies. (For a much deeper analysis of advanced IC packaging markets and technologies, check out the companion report, Advanced IC Packaging Technologies, Materials and Markets, 2016 Edition.)

Chapter 6 extends NVR's long-term coverage of the OSAT market, a significant and significantly growing segment of the overall semiconductor market sector. This market segment is well worth targeted consideration. Already by 2015, the market penetration of OSATs was more than 50% of the total IC packaging market, and its dollar share is expected to expand to nearly two-thirds by 2020. To help you further assess this specialized group of companies, profiles of 41 OSAT competitors are provided in Chapter 7.

The Worldwide IC Packaging Market, 2016 Edition, continues NVRs leadership position in measuring the current status and future development of IC packaging. This report is an effective and economical tool for any company interested in competing in the semiconductor industry, as an aid in assessing these markets and for gaining an advantage in potential areas for their own growth.

Jerry Watkins is an independent senior analyst with nearly 30 years of market research and consulting experience in the high-tech industry. He has worked for leading research companies such as Frost & Sullivan, Lucid Information Services, and NSI Research both in management and as a writer. Mr. Watkins has authored many syndicated reports, previously in the office automation and telecommunications sectors and more recently in the merchant embedded computing and IC packaging industries. He holds two university degrees, a B.A. in History, as well as a M.A. in International Studies, and has lived and worked in the heart of Silicon Valley for over half of his adult life.

Table of Contents

1: Introduction

2: Executive Summary

3: Economic Outlook and Worldwide

  • Electronics Industry Forecast
  • World and Semiconductor Overview
  • Not All Economies Recovering Equally; Unrest Remains
  • World GDP
  • Global Electronics Market
  • Electronics Industry Summary Forecast
    • Communications Markets, including: Cellular Handsets, LANs, DSL & Cable Modems, Carrier-class Equipment
    • Computers Markets, including: PCs, Tablets, Servers, Storage Systems, Monitors, Printers
    • Consumer Markets, including: TVs, Settop Boxes, Digital Cameras, Personal Navigation Devices
    • Industrial Markets, including: Process Control, Test & Measurements, Other Industrial
    • Medical Markets, including: Medical Diagnostics, Therapeutic, Monitoring & Surgical
    • Automotive Markets
    • Commercial Aviation, Defense and Other Transportation Markets

4: IC Packaging Market Analysis by Semiconductor Device

  • Worldwide Semiconductor Device Market
    • Total Market Forecasts
    • IC Function Forecasts
    • IC Application Trends
  • Covers: Consumer, Transportation, Computer Communications, Industrial & Other
  • IC Market Forecasts by Major World Regions
  • Market Forecasts by Device Type
  • Transistors
  • Processor Devices: MPUs, MCUs (4-bit, 8-bit, 16-bit, 32+-bit), DSPs
  • Memory Devices: DRAM, SRAM, Flash, ROM/EPROM, EEPROM
  • Logic Devices: Digital Bipolar, Standard Logic, Gate Arrays, Standard Cell & PLDs, Display Drivers & Touch Screen Controllers, Special Purpose Logic (Consumer, Computers, Communications, Automotive, Multipurpose & Other)
  • Analog Devices: Amplifiers & Comparators, Interfaces, Voltage Regulators & References, Data Converters, Application-Specific Analog (Consumer, Computers, Communications, Automotive, Industrial & Other)

5: IC Packaging Overview and Total Worldwide Market Analysis

  • Overview
  • IC Package Families
  • Worldwide IC Packaging
  • Total IC Packaging Market Forecasts
    • IC Packaging Market by I/O Count
    • Package Pricing Trends
  • IC Package Families Forecasts
    • Transistor Outline Packaging Markets
    • Dual In-Line Package Markets
    • Small Outline Transistor Market
    • Small Outline Markets
    • Thin Small Outline Package Markets
    • Chip Carrier Markets
    • Quad Flat Pack Markets
    • Dual Flat Pack No Lead Markets
    • Quad Flat Pack No Lead Markets
    • Pin Grid Array Package Markets
    • Ball Grid Array Package Markets
    • Fine-Pitch Ball Grid Array Package Markets
    • Wafer-Level Packaging Markets
    • Direct Chip Attach Markets
  • Advanced IC Packaging
    • Multichip Packages
    • Fan-Out Wafer-Level Package (FOWLP)
    • Multirow QFN Packages
    • Flip Chip Interconnection
    • Through-Silicon Via Interconnect Solutions

6: OSAT Market and Strategy Analysis

  • Outsourcing in the Semiconductor Market
  • OSAT Market Forecasts, including: Unit Shipments, Revenues, Package ASP
  • OSAT Market Leaders

7 OSAT Company Profiles

  • 3D Plus
  • ASE
  • Advotech
  • AIC Semiconductor
  • Amkor Technology
  • Anst China
  • Azimuth
  • Carsem
  • Chant World Technology
  • China Wafer Level CSP
  • ChipMOS
  • Cirtek
  • CONNECTEC Japan
  • CORWIL Technology
  • Deca Technologies
  • FlipChip Int'l
  • Greatek Electronics
  • Hana Microelectronics
  • HANA Micron
  • I2A Technologies
  • J-Devices
  • Jiangsu Changjiang Electronics
  • Lingsen Precision
  • NANIUM
  • Nantong Fujitsu
  • Nepes Corp.
  • OSE
  • Powertech
  • Shinko Electric
  • Signetics Corp.
  • Sigurd
  • SPiL
  • SPEL
  • STATS ChipPAC
  • Tera Probe
  • Tianshui Huatian Tech
  • Unisem
  • UTAC
  • Vigilant Technology
  • Walton Advanced Eng.
  • Xintec
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