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市場調査レポート

世界におけるICパッケージング市場

The Worldwide IC Packaging Market - 2015 Edition

発行 New Venture Research 商品コード 275970
出版日 ページ情報 英文 450+ Pages
納期: 即日から翌営業日
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世界におけるICパッケージング市場 The Worldwide IC Packaging Market - 2015 Edition
出版日: 2015年08月07日 ページ情報: 英文 450+ Pages
概要

半導体の出荷数および収益の成長率はいくらか減退するものの、今後5年間の市場は4〜5%というまずまずの複利成長率を記録すると予測されています。

当レポートでは、世界の半導体産業とICパッケージングの市場について調査し、経済および産業概要、ICの出荷数および収益の予測、半導体デバイス・パッケージングファミリーの詳細分析、半導体組立検査受託(OSAT:Outsourced Semiconductor Assembly and Test)市場の分析、主要企業のプロファイルなどを詳細にまとめています。

第1章 イントロダクション

第2章 エグゼクティブサマリー

第3章 産業の状況

  • 世界のエレクトロニクス産業の展望
  • 世界のエレクトロニクス市場

第4章 世界のICパッケージング市場の分析・予測

  • パッケージタイプ
    • DIP
    • SOT
    • SO
    • TSOP
    • DFN
    • CC
    • QFP
    • QFN
    • PGA
    • BGA
    • FBGA
    • WLP
    • DCA
  • I/Oカウント範囲
    • 004-018
    • 020-032
    • 034-100
    • 104-304
    • 308-999
    • 1,000+

第5章 ICパッケージ市場の分析・予測:半導体デバイス別

第6章 ICパッケージ市場の分析・予測:パッケージングファミリー別

  • 概要
  • デュアルインラインパッケージ市場
  • 小型トランジスター市場
  • 小型市場
  • 薄型・小型パッケージ市場
  • デュアルフラットパック無鉛市場
  • チップキャリア市場
  • クワッドフラットパック市場
  • クワッドフラットパック無鉛市場
  • ピングリッドアレイパッケージ市場
  • ボールグリッドアレイパッケージ市場
  • 微細ボールグリッドアレイパッケージ市場
  • ウエハレベルパッケージング市場
  • ダイレクトチップアタッチ市場

第7章 半導体組立検査受託(OSAT:Outsourced Semiconductor Assembly and Test)市場の分析・予測

  • 市場概要
  • 請負事業者のランキング
  • 出荷数・収益・価格の予測:パッケージファミリー別
  • OSATランキング

第8章 企業プロファイル

付録

このページに掲載されている内容は最新版と異なる場合があります。詳細はお問い合わせください。

目次
Product Code: PKG15

The Most Comprehensive Report Available On The Global IC Packaging Industry.

Synopsis

While the integrated circuit (IC) market tends to be cyclical in nature, the general trend is for more ICs to be integrated into more products over time. The market is being driven by demand for handheld consumer devices as well as advanced computing products. All product segments (consumer, computer, communications, transportation, industrial) are benefiting and leading to new product innovation.

Following an unexpectedly robust year of growth (9.2%), in 2014, the semiconductor industry moderated its expansion in the first half 2015. While the rate of growth for both semiconductors shipped and worldwide revenues will decline somewhat in the second half of 2016 (election year), the market is expected to post a respectable CAGR of 4.2% over the next five years.

New Venture Research (NVR), in the 2015 Edition of The Worldwide IC Packaging Market, analyzes the semiconductor industry and uses this analysis to forecast the future of the global IC packaging market by package type and application. The report begins with an economic and industry overview, then examines the historic and future unit and revenue IC growth.

Total IC Packaging Revenue by Semiconductor Device ($B)

                        Source: SIA and NVR estimates

Following this high-level review, the report presents forecasts for the total worldwide IC packaging marketplace (Chapter 4), and explains the market segmentation defined by NVR. Next, the report dives deeply into an analysis of each semiconductor product type (Chapter 5), and segments these products by package family, I/O count range and general market application. The analysis returns to the individual package families (Chapter 6) and presents each in terms of semiconductor devices and I/O count. In all tables, unit shipments and revenue figures are displayed for each segment.

Next, the report presents NVR's continuing coverage of the outsourced semiconductor assembly and test (OSAT) market. These companies already comprise a significant share of the worldwide IC packaging market and will continue to grow in importance in the coming years. The report presents the total OSAT market in terms of both unit shipments and revenues. To help you further assess this group of companies, the report profiles the activities of the leading OSAT companies and the packages they offer.

The Worldwide IC Packaging Market, 2015 Edition continues NVR's leadership position in assessing the status and future of IC packaging. This report is an effective and economical tool for any company associated in the semiconductor industry to aid in assessing their own markets and potential areas of growth.

Report Highlights

Industry Overview

  • Economic Overview
  • Semiconductor Industry Analysis

Worldwide IC Packaging Market Forecasts,

  • Units
  • Package Prices
  • Packaging Revenue
  • By Semiconductor Product
  • By Package Family
  • By I/O Range

OSAT IC Packaging Market Forecasts,

  • Units
  • Package Prices
  • Packaging Revenue
  • Competitive Rankings
  • Company Profiles

About the Author

Jerry Watkins is an independent senior analyst with more than 17 years of experience in the field of market research and consulting. He has worked for leading research companies such as Frost & Sullivan, Lucid Information Services, and NSI Research both in management and as a writer. Mr. Watkins has authored many syndicated reports, previously in the telecommunications sector and more recently in the computing and merchant embedded computing industry. He holds three university degrees including a B.A. in History, as well as a M.A. in International Studies.

Table of Contents

Chapter 1 - Introduction

  • 1.1. Objectives of the Report
  • 1.2. Scope of the Report
  • 1.3. Report Organization
    • 1.3.1. Methodology
    • 1.3.2. Chapter Outline

Chapter 2 - Executive Summary

  • 2.1. Introduction
  • 2.2. The Worldwide Market for Integrated Circuits
  • 2.3. IC Packaging Trends
  • 2.4. Outsourced Semiconductor Markets
  • 2.5. Advanced Packaging Technology Trends

Chapter 3 - Economic Outlook and Worldwide Electronics Industry Forecast

  • 3.1. World and Semiconductor Overview
  • 3.2. Not All Economies Recovering Equally; Unrest Remains
  • 3.3. World GDP
  • 3.4. Global Electronics Market
  • 3.5. Electronics Industry Summary Forecast
    • 3.5.1. Communications
      • 3.5.1.1. Cellular Handsets
      • 3.5.1.2. Cellular Infrastructure
      • 3.5.1.3. Other Phones
      • 3.5.1.4. Enterprise LANs
      • 3.5.1.5. Wireless LANs
      • 3.5.1.6. DSL and Cable Modems
      • 3.5.1.7. PBX/Other CPE
      • 3.5.1.8. Carrier-Class Equipment
      • 3.5.1.9. Other Communications Equipment
    • 3.5.2. Computers
      • 3.5.2.1. Personal Computers
      • 3.5.2.2. Tablets
      • 3.5.2.3. Servers
      • 3.5.2.4. Workstations
      • 3.5.2.5. Storage Systems
      • 3.5.2.6. Flash Drives
      • 3.5.2.7. Monitors
      • 3.5.2.8. Printers
      • 3.5.2.9. E-Readers
    • 3.5.3. Consumer
      • 3.5.3.1. Televisions
      • 3.5.3.2. Set-Top Boxes
      • 3.5.3.3. DVD Players/Recorders
      • 3.5.3.4. Digital Cameras
      • 3.5.3.5. Console Video Games
      • 3.5.3.6. MP3 Players
      • 3.5.3.7. Personal Navigation Devices
    • 3.5.4. Industrial
    • 3.5.5. Medical
    • 3.5.6. Automotive
    • 3.5.7. Commercial Aviation, Defense, and Other Transportation

Chapter 4 - IC Packaging Overview and Total Worldwide Market Analysis

  • 4.1. Chapter Overview
  • 4.2. IC Package Families
    • 4.2.1. A Word about Semiconductor Devices
    • 4.2.2. Dual In-Line Package (DIP) Family
    • 4.2.3. Small Outline (SO) Package Families
    • 4.2.4. Dual Flat Pack No Lead (DFN) Package Family
    • 4.2.5. Chip Carrier (CC) Family
    • 4.2.6. Quad Flat Pack (QFP) Family
    • 4.2.7. Quad Flat Pack No Lead (QFN) Family
    • 4.2.8. Pin Grid Array (PGA) Family
    • 4.2.9. Ball Grid Array (BGA) Family
    • 4.2.10. Wafer-Level Package (WLP) Family
    • 4.2.11. Direct Chip Attach (DCA) Family
  • 4.3. Worldwide IC Packaging Revenue and Unit Forecasts
    • 4.3.1. Total Market
    • 4.3.2. Market by I/O Count
  • 4.4. Package Pricing

Chapter 5 - IC Packaging Market Analysis by Semiconductor Device

  • 5.1. Chapter Overview
  • 5.2. Worldwide Semiconductor Device Revenue and Unit Forecasts
    • 5.2.1. Total Market
    • 5.2.2. Function
    • 5.2.3. Applications
  • 5.3. Microprocessors (MPUs)
  • 5.4. Microcontrollers (MCUs)
    • 5.4.1. 4-Bit MCUs
    • 5.4.2. 8-Bit MCUs
    • 5.4.3. 16-Bit MCUs
    • 5.4.4. 32-Bit and Up MCUs
  • 5.5. Digital Signal Processors (DSPs)
  • 5.6. Memory Devices
    • 5.6.1. Dynamic Random Access Memory (DRAM)
      • 5.6.1.1. Overview of DRAM
      • 5.6.1.2. Double Data Rate (DDR) DRAM
      • 5.6.1.3. Graphics DDR
      • 5.6.1.4. Extreme Data Rate (XDR) DRAM
      • 5.6.1.5. Low Power DDR (LPDDR)
      • 5.6.1.6. Wide I/O Mobile DRAM
    • 5.6.2. Static Random Access Memory (SRAM)
    • 5.6.3. Flash Memory
    • 5.6.4. Read-Only Memory (ROM)/Erasable Programmable ROM (EPROM)
    • 5.6.5. Electrically Erasable Programmable ROM (EEPROM) and Other Memory
  • 5.7. Logic Devices
    • 5.7.1. Digital Bipolar Devices
    • 5.7.2. Standard Logic
    • 5.7.3. Gate Arrays
    • 5.7.4. Standard Cell and Programmable Logic Devices (PLDs)
    • 5.7.5. Display Drivers
    • 5.7.6. Special-Purpose Logic - Consumer Applications
    • 5.7.7. Special-Purpose Logic - Computers and Peripherals Applications
    • 5.7.8. Special-Purpose Logic - Communications Applications
    • 5.7.9. Special-Purpose Logic - Automotive Applications
    • 5.7.10. Special-Purpose Logic - Multipurpose and Other Applications
  • 5.8. Analog Devices
    • 5.8.1. Analog Devices - Amplifiers and Comparators
    • 5.8.2. Analog Devices - Interfaces
    • 5.8.3. Analog Devices - Voltage Regulators and References
    • 5.8.4. Analog Devices - Data Converters
    • 5.8.5. Application-Specific Analog Devices - Consumer
    • 5.8.6. Application-Specific Analog Devices - Computers and Peripherals
    • 5.8.7. Application-Specific Analog Devices - Communications
    • 5.8.8. Application-Specific Analog Devices - Automotive
    • 5.8.9. Application-Specific Analog Devices - Industrial and Other
  • 5.9. Device Application Trends
    • 5.9.1. Overview of Applications
    • 5.9.2. Consumer Applications Forecasts
    • 5.9.3. Transportation Applications Forecasts
    • 5.9.4. Computer Applications Forecasts
    • 5.9.5. Communications Applications Forecasts
    • 5.9.6. Industrial and Other Applications Forecasts

Chapter 6 - IC Packaging Market Analysis by Package Family

  • 6.1. Chapter Overview
  • 6.2. IC Package Families Forecasts
    • 6.2.1. Dual In-Line Package Markets
    • 6.2.2. Small Outline Transistor Market
    • 6.2.3. Small Outline Markets
    • 6.2.4. Thin Small Outline Package Markets
    • 6.2.5. Dual Flat Pack No Lead Markets
    • 6.2.6. Chip Carrier Markets
    • 6.2.7. Quad Flat Pack Markets
    • 6.2.8. Quad Flat Pack No Lead Markets
    • 6.2.9. Pin Grid Array Package Markets
    • 6.2.10. Ball Grid Array Package Markets
    • 6.2.11. Fine-Pitch Ball Grid Array Package Markets
    • 6.2.12. Wafer-Level Packaging Markets
    • 6.2.13. Direct Chip Attach Markets
  • 6.3. Advanced IC Packaging
    • 6.3.1. Multichip Packages
    • 6.3.2. Fan-Out Wafer-Level Package (FOWLP)
    • 6.3.3. Multirow QFN Packages
    • 6.3.4. Flip Chip Interconnection
    • 6.3.5. Through-Silicon Via Interconnect Solutions

Chapter 7 - OSAT Market and Strategy Analysis

  • 7.1. Outsourcing in the Semiconductor Market
    • 7.1.1. Emergence of Fabless Manufacturing
    • 7.1.2. Outsourcing IC Packaging
  • 7.2. OSAT Market Forecasts
    • 7.2.1. OSAT Unit Shipments
    • 7.2.2. OSAT Revenues
    • 7.2.3. OSAT Average Packaging Prices
  • 7.3. Success Strategies for OSATs
  • 7.4. OSAT Market Leaders

Chapter 8 - OSAT Company Profiles

  • 8.1. Overview of Profiled Companies
    • 3D Plus, Inc.
    • Advanced Semiconductor Engineering, Inc.
    • Advotech Company, Inc.
    • AIC Semiconductor Sdn. Bhd.
    • Amkor Technology, Inc.
    • ANST - Wuxi China Resource Micro-Assembly Technology Co., Ltd.
    • Azimuth Semiconductor Assembly
    • Carsem, Inc.
    • Chant World Technology, Inc.
    • China Wafer Level CSP Co., Ltd.
    • ChipMOS Technologies (Bermuda), Ltd.
    • Cirtek Electronics Corporation
    • CONNECTEC Japan Corporation
    • CORWIL Technology Corporation
    • Deca Technologies
    • FlipChip International, LLC
    • Greatek Electronics, Inc.
    • Hana Microelectronics Public Company, Ltd.
    • HANA Micron Co., Ltd.
    • i2a Technologies, Inc.
    • J-Devices Corporation
    • Jiangsu Changjiang Electronics Technology Co., Ltd.
    • Lingsen Precision Industries, Ltd.
    • NANIUM S.A.
    • Nantong Fujitsu Microelectronics Co., Ltd.
    • Orient Semiconductor Electronics
    • Powertech Technology, Inc.
    • Shinko Electric Industries Co., Ltd.
    • Signetics Corporation
    • Sigurd Microelectronics Corporation
    • Siliconware Precision Industries Co., Ltd.
    • SPEL Semiconductor, Ltd.
    • STATS ChipPAC, Ltd.
    • Tera Probe, Inc.
    • Tianshui Huatian Technology Co., Ltd.
    • Unisem Group
    • United Test and Assembly Center, Ltd.
    • Vigilant Technology Co., Ltd.
    • Walton Advanced Engineering, Inc.
    • Xintec, Inc.

Appendix. IC Packaging/Device Matrix, 2014

Glossary of Packaging Terms

List of Figures and Tables(PARTIAL)

  • IC Unit Forecast
  • IC Revenue Forecast
  • IC Packaging Revenue Forecast
  • IC Packaging by Segment and I/O
  • Price per I/O by Package Family
  • Package Price Forecasts
  • IC Product Forecasts
    • MPU
    • MCU
    • DSP
    • DRAM
    • Flash
    • SRAM
    • ROM and EPROM
    • EEPROM/Other Memory
    • Digital Bipolar
    • Standard Logic
    • Gate Arrays
    • Cell-Based and PLD
    • Display Drivers
    • Special Purpose Logic
    • Amplifiers
    • Interfaces
    • Voltage Regulators
    • Data Converters
    • Application Specific Analog
    • Dual In-Line Packages by Device
    • DIP Forecasts-3 I/O Ranges
    • Small Outline Transistor Packages by Device
    • SOT Forecasts-3 I/O Ranges
    • SO Forecasts
    • Thin Small Outline Packages
    • TSOP Forecasts-3 I/O Ranges
    • Dual Flat Pack No Lead Packages
    • DFN Forecasts-2 I/O Ranges
    • Chip Carrier Packages by Device
    • Chip Carrier Forecasts-2 I/O Ranges
    • Quad Flat Packs by Device
    • QFP Forecasts-2 I/O Ranges
    • Quad Flat Pack by Device
    • QFN Forecasts-4 I/O Ranges
    • Pin Grid Arrays by Device
    • PGA Forecasts-2 I/O Ranges
    • Ball Grid Array Packages by Device
    • BGA Forecasts-4 I/O Ranges
    • Fine Pitch Ball Grid Array by Device
    • FBGA Forecasts-6 I/O Ranges
    • Wafer Level Packages by Device
    • WLP Forecasts-4 I/O Ranges
    • Direct Chip Attach ICs by Device
  • OSAT Total Forecast
  • Packaging OSAT Rankings
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