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世界のICパッケージング市場:2018年版

The Worldwide IC Packaging Market - 2018 Edition: The Most Comprehensive Report Available on the Global IC Packaging Industry

発行 New Venture Research 商品コード 275970
出版日 ページ情報 英文 500+ Pages
納期: 即日から翌営業日
価格
本日の銀行送金レート: 1USD=111.17円で換算しております。
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世界のICパッケージング市場:2018年版 The Worldwide IC Packaging Market - 2018 Edition: The Most Comprehensive Report Available on the Global IC Packaging Industry
出版日: 2018年04月30日 ページ情報: 英文 500+ Pages
概要

2017年における世界のICパッケージング市場規模は3580億米ドルを上回ると予測されています。

当レポートでは、世界のICパッケージングの市場を調査し、世界的な経済環境とエレクトロニクス産業の動向、デバイスタイプ・パッケージファミリー別の動向と市場規模の推移と予測、OSAT市場の動向と戦略分析、主要OSAT企業のプロファイルなどをまとめています。

第1章 イントロダクション

第2章 エグゼクティブサマリー

第3章 世界のエレクトロニクス産業展望

  • 世界の経済展望
    • 近年の経済動向
    • 世界のGDP
    • 半導体市場への影響
    • 注目動向
  • 世界のエレクトロニクス市場
    • 通信市場
      • セルラー端末
      • LAN
      • DSL・ケーブルモデム
      • キャリアクラス機器
    • コンピューター市場
      • PC
      • タブレット
      • サーバー
      • ストレージシステム
      • モニター
      • プリンター
    • 消費者向け製品市場
      • TV
      • セットトップボックス
      • デジタルカメラ
      • パーソナルナビゲーション機器
    • 産業向け製品市場
      • プロセス制御
      • 検査・測定
      • その他
    • 医療市場
      • 医療診断
      • 治療
      • モニタリング
      • 手術
    • 自動車市場
    • 民間航空・防衛・その他輸送市場

第4章 半導体デバイス市場分析

  • 世界の半導体デバイス市場
    • 総市場の予測
    • ICアプリケーション予測
    • 地域市場の動向
  • IC市場予測:世界の主要地域別
  • 市場予測:デバイスタイプ別
    • トランジスター
    • プロセッサーデバイス
      • MPU
      • MCU (4・8・16・32ビット〜)
      • DSP
    • メモリーデバイス
      • DRAM
      • SRAM
      • フラッシュ
      • ROM/EPROM
      • EEPROM
    • ロジックデバイス
      • デジタルバイポーラー
      • スタンダートロジック
      • ゲートアレイ
      • スタンダードセル&PLD
      • ディスプレイドライバー&タッチスクリーンコントローラー
      • 各種SPL
    • アナログデバイス
      • アンプ・コンパレーター
      • インターフェース
      • 電圧調整器・基準
      • データコンバーター
      • 各種専用アナログ

第5章 ICパッケージング市場分析

  • 概要
  • ICパッケージファミリー
  • 世界のICパッケージング
  • ICパッケージング総市場の予測
    • ICパッケージング市場:I/Oカウント別
    • パッケージ価格の動向
  • ICパッケージファミリーの予測
    • DIP
    • TOパッケージ
    • SOT
    • SOIC
    • TSOP
    • CC
    • QFP
    • DFN
    • QFN
    • PGA
    • BGA
    • FBGA
    • WLP
    • DCA
  • 先進ICパッケージング
    • MCP (マルチチップパッケージ)
    • FOWLP (Fan-Out Wafer-Level Package)
    • Multirow QFN パッケージ
    • フリップチップ接続
    • TSV接続

第6章 OSAT市場・戦略分析

  • 半導体市場におけるアウトソーシング
  • OSAT市場の予測
    • 出荷数
    • 収益
    • パッケージASP
  • OSAT市場のリーダー

第7章 OSAT企業のプロファイル

  • 3D Plus
  • Advotech
  • AIC Semiconductor
  • Amkor Technology
  • ANST China
  • ASE
  • Azimuth
  • Carsem
  • Chant World Technology
  • China Wafer Level CSP
  • ChipMOS
  • Cirtek
  • コネクテックジャパン
  • CORWIL Technology
  • Deca Technologies
  • FlipChip Int'l
  • Greatek Electronics
  • Hana Microelectronics
  • HANA Micron
  • Interconnect Systems
  • J-Devices
  • Jiangsu Changjiang Electronics
  • Lingsen Precision Industries
  • nepes Corp.
  • OSE
  • Palomar Technologies
目次
Product Code: PKG18

Synopsis

‘The Worldwide IC Packaging Market, 2018 Edition’, a new report from New Venture Research (NVR), examines the global marketplace of integrated circuits (Ics) and the many packaging designs developed for Ics. This comprehensive report presents detailed analysis of a vast and vibrant market that exceeded $358 billion in 2017. The nearly 500-page report provides insightful analysis of major market trends affecting the semiconductor industry, and presents dozens of tables and figures quantifying both the semiconductor device and IC packaging markets. The report provides extensive and detailed quantitative analysis with forecasts for unit shipments, revenues and package pricing for 31 separate semiconductor device types as well as 14 major packaging categories comprising 44 IC packaging market segments. Virtually every table presents two years of historical data for 2016 and 2017, and five-year forecasts from 2018 through 2022. In addition, numerous graphical figures provide an alternative perspective for understanding the underlying data.

The report is arranged into seven chapters focused on four major topics of discussion. Following an Introductory chapter (Chapter 1) and an Executive Summary (Chapter 2), Chapter 3, "Worldwide Electronics Industry Outlook," examines broad economic trends and the global electronics industry, specifically looking at products that are helping drive the expanding demand for semiconductors and IC packaging technologies. Markets covered includes communications products, computers and peripherals, and consumer products, as well as products for industrial, medical, automotive and commercial aviation and defense sectors.

In Chapter 4, "Semiconductor Device Market Analysis," the report analyzes each semiconductor device type with forecasts provided for unit shipments and revenues presented in terms of function, packaging types, applications and major world regions. Chapter 5, "IC Packaging Market Analysis," examines the IC packaging market in terms of unit shipments, revenues and package pricing for each packaging market segment in terms of semiconductor device type and I/O count. The chapter also provides a short overview of advanced packaging products adapted from NVR's companion report Advanced IC Packaging Technologies, Materials and Markets, 2017 Edition.

Chapter 6, "OSAT Market and Strategy Analysis," focuses on the outsourced semiconductor assembly and test (OSAT) company market segment, vendors who specialize in providing IC packaging and testing services to other companies in the industry. Consisting of more than 100 companies worldwide, the OSAT market segment accounts for a significant and growing sector of the semiconductor market. The report looks not only at the size of the OSAT market, but discusses the various strategies for success shared by the leading competitors. Finally, Chapter 7, "OSAT Company Profiles," presents concise profiles of 40 OSAT companies, providing a cross-section of both large and small competitors. Each profile includes an overview of the company, as well as details of their IC packaging product lines.

‘The Worldwide IC Packaging Market, 2018 Edition’ continues NVR's leadership position in analyzing semiconductor device markets and IC packaging products and technologies. This report is an effective and economical tool for any company interested in competing in the semiconductor industry as an aid in assessing the present and future of this dynamic industry.

Report Highlights

Industry Overview

  • Economic Overview
  • Semiconductor Industry Analysis

Worldwide Semiconductor Device Market Forecasts, 2016-2022

  • By Unit Shipments and Revenues
  • By Packaging Type
  • By Application
  • By Major World Region

Worldwide IC Packaging Market Forecasts, 2016-2022

  • By Unit Shipments, Revenues and ASP
  • By Semiconductor Product
  • By I/O Range

OSAT IC Packaging Market Forecasts, 2016-2022

  • IC Packaging Type by Unit Shipments, Revenues and ASP
  • Competitive Rankings
  • Company Profiles

About The Author

Jerry Watkins is an independent senior analyst with more than 20 years of direct experience in the field of market research and consulting. He has worked for leading research companies such as Frost & Sullivan, Lucid Information Services, and NSI Research, both in management and as a writer. Mr. Watkins has authored many syndicated reports, previously in the telecommunications and office automation sectors and more recently in the semiconductor industry, writing on subjects that include IC packaging and merchant embedded computing. He holds two university degrees, including a B.A. in History and an M.A. in International Studies, but he feels that market research best fulfills his lifelong passion for inquiry into difficult subject matter and making it comprehensible to a wide audience. Mr. Watkins has lived and worked in Silicon Valley for most of his career.

Table of Contents

Chapter 1: Introduction

Chapter 2: Executive Summary

Chapter 3: Worldwide Electronics Industry Outlook

  • Global Economic Outlook
    • Recent Economic Trends
    • World GDP
    • Impact on Semiconductor Market
    • Trends to Watch in 2018 and Beyond
  • Global Electronics Market
    • Communications Markets, including: Cellular Handsets, LANs, DSL & Cable Modems, Carrier-class Equipment
    • Computers Markets, including: PCs, Tablets, Servers, Storage Systems, Monitors, Printers
    • Consumer Markets, including: TVs, Settop Boxes, Digital Cameras, Personal Navigation Devices
    • Industrial Markets, including: Process Control, Test & Measurements, Other Industrial
    • Medical Markets, including: Medical Diagnostics, Therapeutic, Monitoring & Surgical
    • Automotive Markets
    • Commercial Aviation, Defense and Other Transportation Markets

Chapter 4: Semiconductor Device Market Analysis

  • Worldwide Semiconductor Device Market
    • Total Market Forecasts
    • IC Application Forecasts
    • Regional Market Trends

Covers: Consumer, Transportation, Computer Communications, Industrial & Other

  • IC Market Forecasts by Major World Regions
  • Market Forecasts by Device Type
    • Transistors
    • Processor Devices: MPUs, MCUs (4-bit, 8-bit, 16-bit, 32+-bit), DSPs
    • Memory Devices: DRAM, SRAM, Flash, ROM/EPROM, EEPROM
    • Logic Devices: Digital Bipolar, Standard Logic, Gate Arrays, Standard Cell & PLDs, Display Drivers & Touch Screen Controllers, Special Purpose Logic (Consumer, Computers, Communications, Automotive, Multipurpose & Other)
    • Analog Devices: Amplifiers & Comparators, Interfaces, Voltage Regulators & References, Data Converters, Application-Specific Analog (Consumer, Computers, Communications, Automotive, Industrial & Other)

Chapter 5: IC Packaging Market Analysis

  • Overview
  • IC Package Families
  • Worldwide IC Packaging Market
  • Total IC Packaging Market Forecasts
    • IC Packaging Market by I/O Count
    • Package Pricing Trends
  • IC Package Families Forecasts
    • Dual In-Line Package Markets (DIP)
    • Transistor Outline Package Markets (TO)
    • Small Outline Transistor Package Market (SOT)
    • Small Outline IC Markets (SOIC)
    • Thin Small Outline Package Markets (TSOP)
    • Chip Carrier Markets (CC)
    • Quad Flat Pack Markets (QFP)
    • Dual Flat Pack No Lead Markets (DFN)
    • Quad Flat Pack No Lead Markets (QFN)
    • Pin Grid Array Package Markets (PGA)
    • Ball Grid Array Package Markets (BGA)
    • Fine-Pitch Ball Grid Array Package Markets (FBGA)
    • Wafer-Level Packaging Markets (WLP)
    • Direct Chip Attached Markets (DCA)
  • Advanced IC Packaging
    • Multichip Packages
    • Fan-Out Wafer-Level Package (FOWLP)
    • Multirow QFN Packages
    • Flip Chip Interconnection
    • Through-Silicon Via Interconnect Solutions

Chapter 6: OSAT Market and Strategy Analysis

  • Outsourcing in the Semiconductor Market
  • OSAT Market Forecasts, including: Unit Shipments, Revenues, Package ASP

Chapter 7: OSAT Company Profiles

  • 3D Plus
  • Advotech
  • AIC Semiconductor
  • Amkor Technology
  • ANST China
  • ASE
  • Azimuth
  • Carsem
  • Chant World Technology
  • China Wafer Level CSP
  • ChipMOS
  • Cirtek
  • CONNECTEC Japan
  • CORWIL Technology
  • Deca Technologies
  • FlipChip Int'l
  • Greatek Electronics
  • Hana Microelectronics
  • HANA Micron
  • Interconnect Systems
  • J-Devices
  • Jiangsu Changjiang Electronics
  • Lingsen Precision Industries
  • nepes Corp.
  • OSE
  • Palomar Technologies
  • Powertech Technology
  • Shinko Electric
  • Signetics
  • Sigurd Microelectronics
  • SPiL
  • SPEL Semiconductor
  • STATS ChipPAC
  • Tera Probe
  • Tianshui Huatian Tech
  • TongFu Microelectronics
  • Unisem
  • UTAC
  • Walton Advanced Engineering
  • Xintec
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