株式会社グローバルインフォメーション
TEL: 044-952-0102
表紙
市場調査レポート

先進ICパッケージング:技術・材料・市場

Advanced IC Packaging, Technologies, Materials and Markets - 2017 Edition: A Strategic Report Covering the Latest Technologies in IC Packaging, Enabling Portable and Other Electronics

発行 New Venture Research 商品コード 226112
出版日 ページ情報 英文 350 Pages
納期: 即日から翌営業日
価格
本日の銀行送金レート: 1USD=113.77円で換算しております。
Back to Top
先進ICパッケージング:技術・材料・市場 Advanced IC Packaging, Technologies, Materials and Markets - 2017 Edition: A Strategic Report Covering the Latest Technologies in IC Packaging, Enabling Portable and Other Electronics
出版日: 2017年07月31日 ページ情報: 英文 350 Pages
概要

当レポートでは、ICパッケージング産業の最新技術・市場動向について、最先端のパッケージング製品・ソリューションを中心に分析しており、各市場またはセグメントの量的分析と予測、主要技術のプロファイルとともに、お届け致します。

第1章 イントロダクション

第2章 エグゼクティブサマリー

第3章 世界のICパッケージング市場概要

  • 本章の概略
  • ICパッケージング群
  • ICパッケージング市場:数量・収益予測
  • ICデバイスの主要アプリケーション市場
  • 半導体部門の成長を促進する産業動向

第4章 先進シングルチップICパッケージング

  • 先進ICパッケージングの概要
  • ファンアウト型ウェハーレベルパッケージ
  • Multi-Row QFNパッケージ
  • マルチチップパッケージ技術の概要
    • マルチチップパッケージの種類
    • 積層パッケージのメリット・デメリット
    • マルチチップパッケージの課題・ソリューション
    • ウェハー薄化およびマルチチップパッケージ(MCP) 市場の動向・予測
  • 積層マルチチップパッケージ (MCP) 市場区分
    • 積層TSOP市場動向・予測
    • 積層QFNパッケージング市場動向・予測
    • 積層FBGAパッケージング市場動向・予測
    • 積層WLP市場動向・予測
  • システムインパッケージング(SiP)市場の概要
    • SiPの種類
    • SiPの主な特徴
    • SiP vs. システムオンチップソリューション
    • SiPの課題
    • 市場動向・予測
      • 市場全体
      • パッケージオンパッケージ
      • パッケージインパッケージ
      • マルチチップモジュール
      • SiPにおける積層WLPS
  • 回路基板
    • 市場概要
    • 市場動向・予測:材料別
    • 高密度配線
    • 埋め込み型コンポーネント

第5章 相互接続技術・ソリューション

  • 相互接続技術の概要
  • ワイヤーボンディング
    • ワイヤーボンディング実装法
    • ワイヤー材
    • ワイヤーボンディング材の市場動向・予測
  • フリップチップ (FC)
    • フリップチップ工法
    • FCパッケージング市場の動向・予測
    • FCパッケージデバイス市場の動向・予測
    • ベアダイFC市場の動向・予測
  • Si貫通電極 (TSV)
    • TSV統合の事例
    • TSV相互接続の位置付け
    • インターポーザおよび2.5次元
    • TSV市場予測:市場セグメント別

第6章 先進ICパッケージング企業のプロファイル

  • 本章の概要
  • 競合情勢の変化
  • 3D Plus, Inc.
  • Advanced Semiconductor Engineering, Inc.
  • Amkor Technology, Inc.
  • Carsem, Inc.
  • ChipMOS Technologies (Bermuda), Ltd.
  • CONNECTEC Japan Corporation
  • Deca Technologies
  • FlipChip International, LLC
  • HANA Micron Co., Ltd.
  • Interconnect Systems Inc. (ISI)
  • NANIUM, S.A.
  • Palomar Technologies
  • Powertech Technology, Inc.
  • 新光電気工業
  • Signetics Corporation
  • Siliconware Precision Industries Co.
  • SPEL Semiconductor, Ltd.
  • STATS ChipPAC, Ltd
  • Taiwan Semiconductor Manufacturing Co. Ltd.
  • United Test and Assembly Center, Ltd.
  • Xintec, Inc.

用語

図表

このページに掲載されている内容は最新版と異なる場合があります。詳細はお問い合わせください。

目次
Product Code: ap17

"Strategic Report Covering the Latest Technologies in IC Packaging, Enabling Portable and Other Electronics."

Synopsis:

The demand for consumer electronics and mobile communications devices that keep us connected is driving electronics manufacturers to deliver ever-more compact and portable products. Today's users ask for solutions that deliver more functionality, added performance, higher speed, and smaller form factors. Software systems and billions of networked devices are rapidly coalescing into a vast Internet of Things.

All of these forces are driving semiconductor companies to develop new advanced IC packaging technologies to provide greater silicon integration in increasingly miniaturized packages. The last decade has seen an explosion of new products including fan-out wafer-level packaging (FOWLPs), stacked IC packages and complex system-in-packages (SiPs), as well as advances in package substrates, flip chip interconnection and through-silicon vias. All these advances are enabling significant improvements in packaging density and opening new market opportunities for manufacturers.

This latest report from New Venture Research (NVR), ‘Advanced IC Packaging Technologies, Materials and Markets, 2017 Edition’, reveals the latest technology and market trends in the IC packaging industry by focusing on the most advanced packaging products and solutions-those critical to success in developing cutting-edge products and in maintaining technological leadership. Every market or application segment discussed in the report includes quantitative analysis based on the most current historical years, 2015 and 2016, as well as forecasts from 2017 through 2021. Each of the six chapters examines the market from a different perspective.

Chapter 3: Overview of Worldwide IC Packaging Markets, outlines the major IC packaging families and the latest market and application trends. This chapter also includes an overview of the major industry trends driving the semiconductor sector, including mergers and acquisitions, the Internet of Things, artificial intelligence and machine learning, and global economic trends. Total market forecasts include units, prices, packaging revenue, package types and device types.

Chapter 4: Advanced IC Packaging Markets provides an in-depth discussion of the technologies and market trends of the semiconductor industry's advanced packaging solutions:

  • Fan-out wafer-level packaging (FOWLP)
  • Multi-row QFN packaging (MRQFN)
  • Vertically stacked multichip packages: TSOPs, QFNs, FBGAs, and WLPs
  • System-in-packages (SiPs): package-on-packages, package-in-packages, multichip modules and stacked WLPs used as components in SiPs

This chapter analyzes the total market and individual market segments from a number of views, including their characteristics, functions, applications, technology, and the key challenges facing the various advanced packaging solutions. Numerous tables and figures provide detailed market data and forecasts for unit shipments, revenues, prices, I/O-count, and usage. The chapter ends with an examination of the substrate materials and embedded components used in SiP assembly. Forecasts include package units, area of shipped materials, and substrate revenues.

Chapter 5: Interconnection Technologies and Solutions, provides a comprehensive examination of wire bonding and flip chip technology and market trends, and includes in-depth analysis of flip chip markets in terms of specific devices and packaging types. The chapter also examines the market potential of through-silicon vias (TSVs) for 2.5D and 3D packaging. The chapter tables and figures present unit shipments and revenue forecasts for each market segment.

Chapter 6: Company Profiles presents profiles of twenty-one advanced packaging companies from across the IC packaging spectrum, including large and small competitors from among OSATs, foundries and IDMs. Each profile gives a short company background and presents examples of their advanced packaging products.

‘Advanced IC Packaging Technologies, Materials and Markets, 2017 Edition’ is an effective tool for companies determined to stay informed about the latest advances in IC packaging, and in assessing the future of this important industry.

Report Coverage:

  • Fan-out WLPs
  • Multi-row QFNs
  • Interconnection Technologies
  • Through-Silicon Vias (TSV)
  • 2.5D and 3D Integration
  • Stacked Packages
  • System-in-Package

Report Highlights:

  • Industry Outlook
  • Market Analysis and Forecasts,
  • 2015-2021
  • Multichip Packaging
  • Technology Trends
  • Key Application Forecasts
  • Company Profiles

About the Author:

Jerry Watkins is an independent senior analyst with more than 20 years of direct experience in the field of market research and consulting. He has worked for leading research companies such as Frost & Sullivan, Lucid Information Services, and NSI Research, both in management and as a writer. Mr. Watkins has authored many syndicated reports, previously in the telecommunications and office automation sectors and more recently in the semiconductor industry writing on subjects that include IC packaging and merchant embedded computing. He holds two university degrees, including a B.A. in History and an M.A. in International Studies, but he feels that market research best fulfills his life-long passion for inquiry into difficult subject matters and making it comprehensible to a wide audience. Mr. Watkins has lived and worked in Silicon Valley for most of his career.

Table of Contents

Chapter 1: Introduction

Chapter 2: Executive Summary

Chapter 3: Overview of Worldwide IC Packaging Markets

  • 3.1. Chapter Overview
  • 3.2. IC Packaging Families
  • 3.3. IC Packaging Market, Unit and Revenue Forecasts
    • Covers: Worldwide IC Packaging by I/O Count and by Device Type
  • 3.4. Key Applications Market for IC Devices
    • Includes: Cellular Handsets, Tablets, PCs, Servers, Workstations, Set-Top Boxes, and others
  • 3.5. Industry Trends Driving the Semiconductor Sector

Chapter 4: Advanced Single Chip IC Packaging

  • 4.1. Chapter Overview
    • Covers: Total by Major Market Segments, Forecasts of the Advanced IC Packaging Markets
  • 4.2. Fan-Out Wafer Level Packages
    • Covers: Market Overview, Trends and Forecasts
  • 4.3. Multi-Row QFN Packages
    • Covers: Market Overview, Trends and Forecasts
  • 4.4. Overview of Multichip Packaging Technology
    • Covers: Types of Multichip Packages, Benefits and Shortcomings, Packaging Challenges and Solutions, Wafer Thinning and MCP Market Trends/Forecasts
  • 4.5. Stacked Multichip Packaging Market Segments
    • Covers: Market Trends and Forecasts for Stacked TSOPs, Stacked QFNs, Stacked FBGAs, Stacked WLPs
  • 4.6. System-in-Packaging Market Overview
    • Covers: Types of SiPs, Key Features, SiPs vs. SoCs, Challenges, Market Trends and Forecasts for total Market Segment, Package-on-Packages, Package-in-Packages, Multichip Modules, Stacked WLPS in SiPs
  • 4.7. Substrates
    • Covers: Market Overview, Market Trends and Forecasts by Materials, High Density Interconnect, Embedded Components

Chapter 5: Interconnection Technologies and Solutions

  • 5.1. Interconnection Techniques Overview
  • 5.2. Wire Bonding
    • 5.2.1. Wire Bonding Methods
    • 5.2.2. Wire Materials
    • 5.2.3. Wire Bonding Material Trends and Forecasts
  • 5.3. Flip Chip
    • 5.3.1. The Flip Chip Process
    • 5.3.2. Flip Chip Packaging Market Trends and Forecasts
    • 5.3.3. Flip Chip Package Device Market Trends and Forecasts
    • 5.3.4. Bare Die Flip Chip Market Trends and Forecasts
  • 5.4. Through-Silicon Vias
    • 5.4.1. The Case for TSV Integration
    • 5.4.2. Status of TSV Interconnection
    • 5.4.3. Interposers and 2.5D
    • 5.4.4. Forecasts for TSV by Market Segment

Chapter 6: Advanced IC Packaging Company Profiles

  • 6.1. Chapter Overview
  • 6.2. 3D Plus, Inc.
  • 6.3. Advanced Semiconductor Engineering, Inc.
  • 6.4. Amkor Technology, Inc.
  • 6.5. Carsem, Inc.
  • 6.6. ChipMOS Technologies (Bermuda), Ltd.
  • 6.7. CONNECTEC Japan Corporation
  • 6.8. Deca Technologies
  • 6.9. FlipChip International, LLC
  • 6.10. HANA Micron Co., Ltd.
  • 6.11. Interconnect Systems Inc. (ISI)
  • 6.12. NANIUM, S.A.
  • 6.13. Palomar Technologies
  • 6.14. Powertech Technology, Inc.
  • 6.15. Shinko Electric Industries Co, Ltd
  • 6.16. Signetics Corporation
  • 6.17. Siliconware Precision Industries Co.
  • 6.18. SPEL Semiconductor, Ltd.
  • 6.19. STATS ChipPAC, Ltd
  • 6.20. Taiwan Semiconductor Manufacturing Co. Ltd.
  • 6.21. United Test and Assembly Center, Ltd.
  • 6.22. Xintec, Inc.

Glossary of Terms

List of Tables(Partial)

(all tables provide data for 2015 through 2021)

Chapter 3 - Tables: Worldwide IC Packaging Overview

  • Worldwide IC Packaging Unit Shipments by Market Segment
  • Worldwide IC Packaging Annual Revenue by Market Segment
  • Average IC Packaging Prices by Market Segment
  • IC Units, Revenue & Price of Various Application Markets, including: Cellular Phones, Tablets, PCs, Set-Top Boxes, Digital Cameras and Camcorders, and GPS Devices

Chapter 4 - Tables: Advanced Packaging Markets

  • Total Advanced IC Packaging Unit Shipments and Revenue
  • Wafer-Level Packages Unit Shipments by I/O Count and Pitch
  • Fan-Out WLPs by Units, Price, and Revenue
  • Multi-Row QFNs by Units, Price, and Revenue
  • Stacked TSOP Market by Unit Shipments, Price, and Revenue
  • Stacked FBGA Market by Unit Shipments, Price, and Revenue
  • Stacked QFN Market by Unit Shipments, Price, and Revenue
  • Stacked WLP Market by Unit Shipments, Price, and Revenue
  • System-in-package Market by Units, Price, Revenue
  • Market Segments and Total ICs
  • Package-on-Packages by Units, Price, Revenue and Total ICs
  • Package-in-Packages by Units, Price, Revenue and Total ICs
  • Multichip Modules by Units, Price, Revenue and Total ICs
  • Stacked WLPs Used in SiPs by Units, Price, and Revenue
  • Total Substrate Package Units and Revenue by Type of Substrate
  • MCP Market by Unit Shipments, IC Shipments, and Revenue
  • Total MCP Unit Shipments by Market Segment
  • Total MCP Revenue by Market Segment
  • Total Die in MCPs by Market Segment
  • MCP Unit Shipments by Application
  • MCP Units by Device Function
  • MCP Units by Interconnection Method

Chapter 5 - Tables: Interconnection Technologies and Solutions

  • Total Wire Bond Package Unit Shipments and Revenue, by Device Type and I/O Count
  • Total Flip Chip Package Units Shipments, Revenue and Average Price by Package Type and I/O Count
  • Individual IC Device Flip Chip Package Market Segments by Packaging Type Unit Shipments, Revenue and Share of Market
  • Through-Silicon Vias Unit Shipments by Type of MCP
Back to Top