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市場調査レポート

半導体材料の世界市場 - 成長性、動向、および将来予測

Semiconductor Materials Market - Growth, Trends, and Forecast (2019 - 2024)

発行 Mordor Intelligence LLP 商品コード 802361
出版日 ページ情報 英文 100 Pages
納期: 2-3営業日
価格
本日の銀行送金レート: 1USD=109.43円で換算しております。
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半導体材料の世界市場 - 成長性、動向、および将来予測 Semiconductor Materials Market - Growth, Trends, and Forecast (2019 - 2024)
出版日: 2019年03月01日 ページ情報: 英文 100 Pages
概要

当レポートでは、半導体材料の世界市場を取り上げ、市場成長促進要因、阻害要因、産業魅力度、また市場競争状況の広範な調査に基づいて現行市場の分析と将来予測とを行っています。さらに当レポートでは、この市場を材質別、用途別、エンドユーザ産業別、および地域別に分類し、それぞれ詳細な分析・予測を提供しています。

第1章 序論

  • 本調査の成果
  • 調査上の想定条件
  • 調査範囲

第2章 調査手法

第3章 エグゼクティブ・サマリー

第4章 市場ダイナミクス

  • 市場概要
  • 産業魅力度 - Porterのファイブフォース分析
    • 新規参入企業がもたらす脅威
    • 買い手/消費者の交渉力
    • 売り手の交渉力
    • 代替品がもたらす脅威
    • 企業間の競合度
  • 市場成長促進要因および阻害要因序論
  • 市場成長促進要因
    • 電子材料の製品イノベーションに伴う技術的進歩
    • 家電エレクトロニクス製品に対する需要の高まり
    • OSAT (半導体後工程請負企業)/パッケージ企業での需要拡大
  • 市場成長阻害要因
    • 生産工程の複雑さ

第5章 市場分類

  • 材質別
    • 炭化ケイ素
    • ガリウムマンガン砒素
    • セレン化銅インジウムガリウム
    • 二硫化モリブデン
    • テルル化ビスマス
  • 用途別
    • 製造
    • パッケージング
  • エンドユーザ産業別
    • 家電エレクトロニクス産業
    • 製造業
    • 自動車産業
    • エネルギーおよびユーティリティ産業
    • その他のエンドユーザ産業
  • 地域市場
    • 北米
    • 欧州
    • アジア太平洋地域
    • ラテンアメリカ
    • 中東・アフリカ地域

第6章 市場競争状況

  • 企業プロファイル
    • BASF SE
    • LG Chem Ltd
    • Indium Corporation
    • 日立化成株式会社
    • 京セラ株式会社
    • Henkel AG & Company KGAA
    • 住友化学株式会社
    • Dow Chemical Co.
    • International Quantum Epitaxy PLC.
    • 日亜化学工業株式会社
    • Intel Corporation
    • UTAC Holdings Ltd

第7章 投資分析

第8章 市場機会および将来動向

目次
Product Code: 65022

Market Overview

In 2018, the global semiconductor materials market was valued at USD 50.63 billion. The market is anticipated to witness a stimulating growth during the forecast period, owing to an increase in demand from various end-user industries. The ability of these materials to consume less power, along with broad temperature limits and high electron mobility, is projected to positively influence the global market.

Technical advancements, along with product innovation of the electronic materials, is primarily boosting the growth of the market.

Although other conductors are used in more specific applications, silicon is immensely popular due to factors, such as high mobility at room temperature, as well as high temperatures and faster transfer of electrical currents through silicon semiconductors, when compared to any other semiconductor.

In countries, like China, the government policies that boost the semiconductor industry are increasingly creating opportunities for the expansion of the semiconductor materials industry. For example, the policy framework released by the State Council of the People's Republic of China aims to make advanced semiconductor packaging solutions, a technology priority across the semiconductor industry.

Scope of the Report

Semiconductors are one of the most prominent innovations in modern electronics. By using elements, such as silicon, germanium, and gallium arsenide, companies were able to replace the traditional thermionic devices, such as vacuum tubes, that made electronics bulky and non-portable.

Key Market Trends

Substrates is Expected to hold Major Share

Over the past decade, the cost contribution of electronics to the automotive industry has increased from 18-20% to about 40-45%. In 2017, it was estimated that the automotive sector will account for about 9% of the worldwide semiconductor revenue. This has been a major driver for the growth of the semiconductor market in this industry. The growth of semiconductor content has been on a steady rise and the share of electronic systems in the vehicle cost may reach 50% of the total car cost by 2030.

This factor is attributed to the rapid advances in the development of leading-edge technologies, such as autonomous driving, advanced driver-assistance systems (ADAS), vehicle-to-everything communication, and power management in electric vehicles (EVs), including navigation, dashboard camera, and smart keys, as well as a widely anticipated image processor. It is predicted that smart vehicles capable of fully autonomous driving will employ up to 7,000 chips. Given this scenario, even a failure rate of 1ppm, already very low by any standard today, would lead to seven out of 1,000 cars with a safety risk.

Given the constraints of the automotive electronics market, semiconductor material qualification must follow extensive procedures. While a high degree of material purity is a prerequisite, manufacturing processes are actually much more sensitive to deviations of material quality, as they potentially lead to process recalibration. Thus, several quality excellence programs have been introduced by the automotive manufacturers, aimed at a zero defect target.

Asia-Pacific is Expected to Hold Major Share

Asia-Pacific is expected to hold the major share over the forecast period. According to the SEMI Materials Market Data, the total wafer fabrication materials and packaging materials were valued at USD 27.8 billion and USD 19.1 billion, respectively, in 2017. The wafer fabrication materials and packaging materials markets have recorded revenues of 12.7% and 5.4%, respectively, year-over-year increases, as compared to 2016. The increase in disposable income in these regions is anticipated to have a direct impact on the overall market growth.

Competitive Landscape

The semiconductor materials market is highly competitive and consists of several major players. In terms of market share, few of the major players currently dominate the market. However, with technological advancements and product innovations, mid-size to smaller companies are increasing their market presence by securing new contracts and by tapping new markets. For instance, in April 2018, Hitachi Chemical Co. revealed plans to construct a new factory to manufacture advanced functional laminate materials, on the site of Hitachi Chemical Electronic Materials (Taiwan) Co. Ltd, a Hitachi Chemical's subsidiary, in Taiwan. The company is expected to invest a total of approximately JPY 7.5 billion and the new factory is likely to begin operation by April 2020. Further, in Jun e 2018. Kyocera Corporation inaugurated a new plant at its Kagoshima Sendai manufacturing complex in Japan. The company aims to increase the production of ceramic microelectronic packages, in order to accommodate the robust demand and to expand related businesses in the future.

Reasons to Purchase this report:

  • The market estimate (ME) sheet in Excel format
  • Report customization as per the client's requirements
  • 3 months of analyst support

Table of Contents

1 INTRODUCTION

  • 1.1 Study Deliverables
  • 1.2 Study Assumptions
  • 1.3 Scope of the Study

2 RESEARCH METHODOLOGY

  • 2.1 Analysis Methodology
  • 2.2 Research Phases

3 EXECUTIVE SUMMARY

4 MARKET DYNAMICS

  • 4.1 Market Overview
  • 4.2 Industry Attractiveness - Porter's Five Forces Analysis
    • 4.2.1 Bargaining Power of Suppliers
    • 4.2.2 Bargaining Power of Consumers
    • 4.2.3 Threat of New Entrants
    • 4.2.4 Intensity of Competitive Rivalry
  • 4.3 Introduction to Market Drivers and Restraints
  • 4.4 Market Drivers
    • 4.4.1 Technical Advancement Along With Product Innovation of the Electronic Materials
    • 4.4.2 Rising Demand for Consumer Electronics Goods
    • 4.4.3 Increased Demand From Osat/Packaging Companies
  • 4.5 Market Restraints
    • 4.5.1 Complexity in the Manufacturing Process

5 MARKET SEGMENTATION

  • 5.1 By Material
    • 5.1.1 Silicon Carbide
    • 5.1.2 Gallium Manganese Arsenide
    • 5.1.3 Copper Indium Gallium Selenide
    • 5.1.4 Molybdenum Disulfide
    • 5.1.5 Bismuth Telluride
  • 5.2 By Application
    • 5.2.1 Fabrication
      • 5.2.1.1 Process Chemicals
      • 5.2.1.2 Photomasks
      • 5.2.1.3 Electronic Gases
      • 5.2.1.4 Photoresists Ancilliaries
      • 5.2.1.5 Sputtering Targets
      • 5.2.1.6 Silicon
      • 5.2.1.7 Other Fabrication Materials
    • 5.2.2 By Packaging
      • 5.2.2.1 Substrates
      • 5.2.2.2 Lead Frames
      • 5.2.2.3 Ceramic Packages
      • 5.2.2.4 Bonding Wire
      • 5.2.2.5 Encapsulation Resins (Liquid)
      • 5.2.2.6 Die Attach Materials
      • 5.2.2.7 Other Packaging Materials
  • 5.3 By End User
    • 5.3.1 Consumer Electronics
    • 5.3.2 Manufacturing
    • 5.3.3 Automotive
    • 5.3.4 Energy and Utility
    • 5.3.5 Other End Users
  • 5.4 Geography
    • 5.4.1 North America
      • 5.4.1.1 United States
      • 5.4.1.2 Canada
    • 5.4.2 Europe
      • 5.4.2.1 United Kingdom
      • 5.4.2.2 Germany
      • 5.4.2.3 France
      • 5.4.2.4 Rest of Europe
    • 5.4.3 Asia-Pacific
      • 5.4.3.1 China
      • 5.4.3.2 South Korea
      • 5.4.3.3 Japan
      • 5.4.3.4 Rest of Asia-Pacific
    • 5.4.4 Latin America
    • 5.4.5 Middle East & Africa

6 COMPETITIVE LANDSCAPE

  • 6.1 Company Profiles
    • 6.1.1 BASF SE
    • 6.1.2 LG Chem Ltd
    • 6.1.3 Indium Corporation
    • 6.1.4 Hitachi Chemical Co. Ltd
    • 6.1.5 KYOCERA Corporation
    • 6.1.6 Henkel AG & Company KGAA
    • 6.1.7 Sumitomo Chemical Co. Ltd
    • 6.1.8 Dow Chemical Co.
    • 6.1.9 International Quantum Epitaxy PLC.
    • 6.1.10 Nichia Corporation
    • 6.1.11 Intel Corporation
    • 6.1.12 UTAC Holdings Ltd

7 INVESTMENT ANALYSIS

8 MARKET OPPORTUNITIES AND FUTURE TRENDS

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