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市場調査レポート

世界のメモリーパッケージング市場 - 成長、動向、予測

Memory Packaging Market - Growth, Trends and Forecast (2019 - 2024)

発行 Mordor Intelligence LLP 商品コード 704879
出版日 ページ情報 英文 146 Pages
納期: 2-3営業日
価格
本日の銀行送金レート: 1USD=109.58円で換算しております。
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世界のメモリーパッケージング市場 - 成長、動向、予測 Memory Packaging Market - Growth, Trends and Forecast (2019 - 2024)
出版日: 2019年04月01日 ページ情報: 英文 146 Pages
概要

世界のメモリーパッケージ市場は、2017年に359億米ドルと評価され、2018年から2023年にかけては4.7%のCAGRで推移し、2023年までに473億米ドル規模の市場に成長することが予測されています。

当レポートでは、世界のメモリーパッケージング市場を調査し、市場の概要、プラットフォーム・用途・エンドユーザー・地域別の市場規模の推移と予測、市場動向、市場の成長要因および阻害要因の分析、競合情勢、主要企業のプロファイルなど、包括的な情報を提供しています。

目次

第1章 イントロダクション

  • 調査成果
  • 市場の定義
  • 調査の前提条件

第2章 調査方法

第3章 エグゼクティブサマリー

第4章 市場の分析

  • 市場概要
  • ファイブフォース分析
    • 買い手の交渉力
    • 供給企業の交渉力
    • 新規参入業者の脅威
    • 代替品の脅威
    • 競争企業間の敵対関係
  • 産業バリューチェーン分析
  • 技術ロードマップ

第5章 市場のダイナミクス

  • 市場の成長要因
    • 自動運転車と車載インフォテイメントの新たな動向
    • スマートフォンの需要増加
    • メモリ半導体事業の爆発的な成長
    • 高帯域メモリー(HBM)と再配線層(RDL)の継続的な開発
    • 空間の有効利用
  • 市場の課題
    • 自動車用途における厳格な信頼性の要件
    • 半導体後工程受託(OSAT)産業を取り巻く環境の変化

第6章 世界のメモリーパッケージング市場:セグメント別

  • プラットフォーム別
    • フリップチップ
    • リードフレーム
    • ウエハーレベルCSP(WLCSP)
    • スルーシリコンビア(TSV)
    • ワイヤボンド
  • 用途別
    • NAND型フラッシュパッケージング
    • NOR型フラッシュパッケージング
    • 3D TSVパッケージング
    • DRAMパッケージング
  • エンドユーザー別
    • IT・通信
    • 家電
    • 組込みシステム
    • 自動車
    • 軍事・航空宇宙
    • 医療
  • 地域別
    • 北米
    • 欧州
    • アジア太平洋
    • ラテンアメリカ
    • 中東・アフリカ

第7章 企業プロファイル

  • SK Hynix Inc.
  • Intel Corporation
  • Cisco Systems Inc.
  • Nanya Technology Corporation
  • Winbond Electronics Corporation
  • Micron Technology Inc.
  • 富士通セミコンダクター
  • Western Digital Corporation
  • Samsung Electronics Co. Ltd
  • Qualcomm Technologies Inc.
  • STMicroelectronics
  • IBM Corporation
  • Dell EMC
  • 東芝デバイス&ストレージ
  • Hana Micron Inc.
  • Apple Inc.
  • ASE Group

第8章 市場の投資分析

第9章 市場の将来展望

目次
Product Code: 63684

Market Overview

The memory packaging market was valued at USD 21.53 billion in 2018, and is expected to reach USD 29.41 billion by 2024, registering a CAGR of 5.5% during the forecast period of 2019 - 2024. Memory devices employ a broad range of the packaging technology from flip-chip, lead-frame, wire-bond, to through-silicon via (TSV). With the decrease in dimensions and increase in the chip functionality, a higher number of the electrical connections have to be made to the external circuit. Moreover, with changes in the package design, the wire-bond memory packaging platform continues to be used as the most preferred interconnection platform because of its flexibility, reliability, and low cost. In 2016, Flip-chip began making inroads in the DRAM memory packaging and is expected to grow due to its increased adoption in the DRAM PC/server, fueled by high bandwidth requirements.

  • The increasing penetration of smartphones and the rising demand for enhanced capabilities are projected to bolster the growth of the market studied. For instance, to accommodate high-definition (HD) displays and watching movies on mobile devices, mobile LP-DDR4 devices are being employed.
  • The increasing demand for memory devices, buoyed by the requirement of data centers for memory in the range of 10Mn GB to 20Mn GB server DRAM, on an average, is expected to continue to drive the demand for server DRAM, impacting the memory packaging demand to positive values.
  • The market is witnessing a demand for memory from mobile and the computing (mainly servers). On average, the DRAM memory capacity per smartphone is anticipated to rise more than threefold to reach around 6GB by 2022.
  • The innovation in the packaging technology is associated with the growth in the functional density of large system-on-chip (SoC) solutions. However, harsh reliability requirements in the automotive environment and changing landscape of the OSATs industry are anticipated to hamper the growth of the memory packaging market over the forecast period.

Scope of the Report

Memory packaging makes use of a small circuit board that contains memory chips. Single In-line Memory Module (SIMM), Dual In-Line Memory Module (DIMM), Small Outline Dual in-Line Memory Module (SODIMM), and Micro DIMM are some of the memory packages. These packages are a type of RAM chip. System-in-package (SiP) is a common approach for devices, where the package includes application specific control IC die for the signal conditioning and amplification. Stacked die and side-by-side configurations are widely used.

Key Market Trends

Consumer Electronics Segment is Expected to Have Significant Growth

  • The rapid growth in the consumer electronics industry is driving the growth of the memory packaging market. They are used in numerous electronic devices, such as smartphones, PCs, music players, laptops, netbooks, and tablets. Mobile-connected devices like smartphones and tablets have driven the growth in the consumer electronics industry while also eroding the demand for other portables, such as digital cameras and notebooks.
  • As the NAND flash memory delivers a cost-effective solution for applications demanding solid-state storage and high density, major manufacturing organizations, in the consumer electronics product segment, are adopting this memory device to fulfill the need for storage space. This has increased the demand for packaging, thereby contributing to the growth of the market. In mobile applications, memory packaging will mainly remain on the wire-bond platform but is also expected to move into the multi-chip package (ePoP) for high-end smartphone leading to the growth of the consumer electronics segment.
  • Moreover, according to the Consumer Technology Association, in 2013, almost 145 million people in the United States owned a smartphone, and this figure rose to 220 million by 2018. Additionally, the share of smartphones consumers in China was over 53.3% of the total mobile phone users in the country in 2016, which increased to over 56% in 2017. With this increase in the adoption of smartphones, the use of packaged memory chips is also increasing. Also, with the development of memory packaging techniques, the size of smartphones reduced, which may further augment the demand for the memory packing market.

Asia-Pacific Region Expected to Account for a Major Share

  • Asia-Pacific is expected to have the largest market share and is also expected to register the highest growth rate, over the forecast period, due to an increase in the demand for memory packaging from automotive and consumer electronics and other end-user industries, as the region has a large consumer base in the low and middle-income level population segment.
  • China is expected to have the highest market share in the Asia-Pacific segment. The dominance of China is due to the broader application areas of memory packaging in consumer electronics, such as smartphones and tablets and huge manufacturing base for electronics product in the country.
  • Moreover, an increase in fabrication activities in China, growing popularity of autonomous driving and in-car entertainment (ICE), and continuous improvements in high-bandwidth memory (HBM) and redistribution layer (RDL) are some of the primary factors boosting the growth of the APAC memory packaging market.
  • In Japan, autonomous cars are expected to contribute significantly, considering the region's substantial contribution to ADAS. Temperature grade LPDDR4 storage being an essential component in autonomous car design, is expected to have a significant impact on the memory packaging market during the forecast period.

Competitive Landscape

The memory packaging market is a consolidated market with dominant players present in the market. The memory packaging market is witnessing many mergers and acquisitions among regional players. In the past few years, acquisitions have been one of the major inorganic growth strategies of the companies to increase the revenue share in the market. Companies, such as Micron Technology Inc. have been forerunners in acquiring and merging with small regional and adjacent technology-based market peers.

  • June 2018 - Micron Technology announced a volume production for its 8GB GDDR6 memory. Targeting up to 64GB/s in one package, GDDR6 is set to bring a significant improvement over the fastest available GDDR5. This high level of single-chip performance, using proven and industry-standard BGA packaging is expected to give designers a powerful, cost-efficient, and low-risk solution using the most scalable and high-speed discrete memory available in the market.

Reasons to Purchase this report:

  • The market estimate (ME) sheet in Excel format
  • Report customization as per the client's requirements
  • 3 months of analyst support

Table of Contents

1 INTRODUCTION

  • 1.1 Study Deliverables
  • 1.2 Study Assumptions
  • 1.3 Scope Of The Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET INSIGHTS

  • 4.1 Market Overview
  • 4.2 Industry Attractiveness - Porter's Five Forces Analysis
    • 4.2.1 Bargaining Power of Suppliers
    • 4.2.2 Bargaining Power of Buyers/Consumers
    • 4.2.3 Threat of New Entrants
    • 4.2.4 Threat of Substitute Products
    • 4.2.5 Intensity of Competitive Rivalry
  • 4.3 Value Chain / Supply Chain Analysis
  • 4.4 Technology Snapshot

5 MARKET DYNAMICS

  • 5.1 Introduction To Market Dynamics
  • 5.2 Market Drivers
    • 5.2.1 Demand for Data Centers Driven By Cloud and HPC Applications
    • 5.2.2 Increase in Demand for Smartphones and Changing Technology have an Impact on Memory Packaging
    • 5.2.3 Need for Miniaturization of Semiconductor Devices and Effective Space Utilization
  • 5.3 Market Challenges
    • 5.3.1 Changing Landscape of the OSATs Industry

6 MARKET SEGMENTATION

  • 6.1 By Platform
    • 6.1.1 Flip-chip
    • 6.1.2 Lead-frame/Wafer-level Chip-scale Packaging
    • 6.1.3 Through-Silicon Via (TSV)
    • 6.1.4 Wire-bond
  • 6.2 By Application
    • 6.2.1 NAND Flash Packaging
    • 6.2.2 NOR Flash Packaging
    • 6.2.3 DRAM Packaging
    • 6.2.4 Other Applications
  • 6.3 By End User
    • 6.3.1 IT and Telecommunication
    • 6.3.2 Consumer Electronics
    • 6.3.3 Embedded Systems
    • 6.3.4 Automotive
    • 6.3.5 Other End Users
  • 6.4 Geography
    • 6.4.1 North America
    • 6.4.2 Europe
    • 6.4.3 Asia-Pacific
    • 6.4.4 Latin America
    • 6.4.5 Middle East & Africa

7 COMPETITIVE LANDSCAPE

  • 7.1 Company Profiles
    • 7.1.1 Tianshui Huatian Technology Co Ltd
    • 7.1.2 Hana Micron Inc.
    • 7.1.3 Lingsen Precision Industries Ltd
    • 7.1.4 Formosa Advanced Technologies Co. Ltd (FATC)
    • 7.1.5 Advanced Semiconductor Engineering Inc. (ASE Inc.)
    • 7.1.6 Amkor Technology Inc.
    • 7.1.7 Jiangsu Changjiang Electronics Technology Co. Ltd
    • 7.1.8 Powertech Technology
    • 7.1.9 King Yuan Electronics Corp. Ltd
    • 7.1.10 ChipMOS Technologies Inc.
    • 7.1.11 TongFu Microelectronics Co.
    • 7.1.12 Signetics Corporation

8 INVESTMENT ANALYSIS

9 MARKET OPPORTUNITIES AND FUTURE TRENDS

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