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世界のメモリーパッケージング市場:プラットフォーム、用途(NAND型フラッシュパッケージング、NOR型フラッシュパッケージング、3D TSVパッケージング、DRAMパッケージング)、エンドユーザー、地域別(2018年~2023年)

Global Memory Packaging Market - Segmented by Platform, Application (NAND Flash Packaging, NOR Flash Packaging, 3D TSV Packaging, and DRAM Packaging), End User, and Region - Growth, Trends, and Forecast (2018 - 2023)

発行 Mordor Intelligence LLP 商品コード 704879
出版日 ページ情報 英文 101 Pages
納期: 即日から翌営業日
価格
本日の銀行送金レート: 1USD=112.89円で換算しております。
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世界のメモリーパッケージング市場:プラットフォーム、用途(NAND型フラッシュパッケージング、NOR型フラッシュパッケージング、3D TSVパッケージング、DRAMパッケージング)、エンドユーザー、地域別(2018年~2023年) Global Memory Packaging Market - Segmented by Platform, Application (NAND Flash Packaging, NOR Flash Packaging, 3D TSV Packaging, and DRAM Packaging), End User, and Region - Growth, Trends, and Forecast (2018 - 2023)
出版日: 2018年08月18日 ページ情報: 英文 101 Pages
概要

世界のメモリーパッケージ市場は、2017年に359億米ドルと評価され、2018年から2023年にかけては4.7%のCAGRで推移し、2023年までに473億米ドル規模の市場に成長することが予測されています。

当レポートでは、世界のメモリーパッケージング市場を調査し、市場の概要、プラットフォーム・用途・エンドユーザー・地域別の市場規模の推移と予測、市場動向、市場の成長要因および阻害要因の分析、競合情勢、主要企業のプロファイルなど、包括的な情報を提供しています。

目次

第1章 イントロダクション

  • 調査成果
  • 市場の定義
  • 調査の前提条件

第2章 調査方法

第3章 エグゼクティブサマリー

第4章 市場の分析

  • 市場概要
  • ファイブフォース分析
    • 買い手の交渉力
    • 供給企業の交渉力
    • 新規参入業者の脅威
    • 代替品の脅威
    • 競争企業間の敵対関係
  • 産業バリューチェーン分析
  • 技術ロードマップ

第5章 市場のダイナミクス

  • 市場の成長要因
    • 自動運転車と車載インフォテイメントの新たな動向
    • スマートフォンの需要増加
    • メモリ半導体事業の爆発的な成長
    • 高帯域メモリー(HBM)と再配線層(RDL)の継続的な開発
    • 空間の有効利用
  • 市場の課題
    • 自動車用途における厳格な信頼性の要件
    • 半導体後工程受託(OSAT)産業を取り巻く環境の変化

第6章 世界のメモリーパッケージング市場:セグメント別

  • プラットフォーム別
    • フリップチップ
    • リードフレーム
    • ウエハーレベルCSP(WLCSP)
    • スルーシリコンビア(TSV)
    • ワイヤボンド
  • 用途別
    • NAND型フラッシュパッケージング
    • NOR型フラッシュパッケージング
    • 3D TSVパッケージング
    • DRAMパッケージング
  • エンドユーザー別
    • IT・通信
    • 家電
    • 組込みシステム
    • 自動車
    • 軍事・航空宇宙
    • 医療
  • 地域別
    • 北米
    • 欧州
    • アジア太平洋
    • ラテンアメリカ
    • 中東・アフリカ

第7章 企業プロファイル

  • SK Hynix Inc.
  • Intel Corporation
  • Cisco Systems Inc.
  • Nanya Technology Corporation
  • Winbond Electronics Corporation
  • Micron Technology Inc.
  • 富士通セミコンダクター
  • Western Digital Corporation
  • Samsung Electronics Co. Ltd
  • Qualcomm Technologies Inc.
  • STMicroelectronics
  • IBM Corporation
  • Dell EMC
  • 東芝デバイス&ストレージ
  • Hana Micron Inc.
  • Apple Inc.
  • ASE Group

第8章 市場の投資分析

第9章 市場の将来展望

目次
Product Code: 63684

The Memory packaging market was valued at USD 35.9 billion in 2017 and is expected to reach USD 47.3 billion by 2023 registering a CAGR of 4.7%, during the forecast period 2018 - 2023.

The scope of the report includes the study of memory packaging with respect to platform, application, and end users. Regions considered under the scope of the report include North America, Europe, Asia-Pacific, Middle East & Africa, and Latin America. Various players offering memory packaging solutions in the market are SK Hynix Inc., Micron Technology Inc., ASE Group, and Winbond Electronics Corporation, among others.

Like processors, memory is made from small semiconductor chips and must be packaged into less fragile and smaller chips to be integrated with the rest of the system. There are many different memory device packaging options available, used in a wide range of packaging technologies, ranging from the low pin-count SOP packages to high pin-count TSV options, depending on product requirements, like performance, density, and cost. One such packaging platform is the wire bond-BGA. Easy changeovers, comprehensible program adjustments, and low engineering costs are driving the demand for wire-bond memory packaging solutions. Even with variations in the package design, the wire-bond memory packaging platform is the most the preferred interconnection platform because of its flexibility, reliability, and low cost. Also, the automotive market, which generally uses low density (low-MB) memory, may observe an increase in the acceptance of DRAM memory, led by the emerging trend of autonomous driving and in-vehicle infotainment. This is expected to fuel the growth of the memory packaging market.

Increase in the Demand for Smartphones

The highest demand for memory can be observed in the smartphones market. On an average, the DRAM memory capacity per smartphone may increase more than threefold to reach around 6GB, by 2022. DRAM cost per smartphone signifies >10% of the bill of materials of the smartphone and is anticipated to increase further. The NAND capacity per smartphone may increase more than fivefold to reach >150GB by 2022. In mobile applications, the focus of memory packaging is expected to be on the wire-bond BGA platform. It may also start to move into the multi-chip package (ePoP) for high-end smartphones.

According to the Consumer Technology Association, in 2013, almost 145 million people in the United States owned a smartphone, and this figure is set to rise to 220 million by 2018. Additionally, the share of smartphones consumers in China was over 53.3% of the total mobile phone users in the country in 2016, which increased to over 56 % in 2017. With the increase in adoption of smartphones, the use of packaged memory chips is also increasing. Also, with the development of memory packaging techniques, the size of smartphones is reduced, which may further augment the demand for the memory packing market.

Asia-Pacific is expected to be the Fastest Growing Region in the Memory Packaging Market

The memory packaging market in the Asia-Pacific region is predicted to witness a rapid growth over the forecast period. China stands as a largest Asia-Pacific memory packaging market, due to a wide range of applications of memory packaging in numerous consumer electronics, mainly tablets and smartphones. The high adoption rate of smartphones in many Asia-Pacific countries is due to the advanced features and sleek aesthetic looks of these smartphones. Memory packaging technologies offer effective space utilization to the smartphones, which is a crucial factor leading to the growth of this market. Also, the existence of significant memory packaging vendors in the region, such as SK Hynix Inc., Samsung Electronics Co. Ltd, Intel Corporation, etc., is boosting the memory packaging market in the region.

Key Developments in the Market

June 2018: Micron Technology Inc. announced a volume production for its 8GB GDDR6 memory. Targeting up to 64GB/s in one package, GDDR6 is set to bring a significant improvement over the fastest available GDDR5. This high level of single-chip performance, using proven and industry-standard BGA packaging is expected to give designers a powerful, cost-efficient, and low-risk solution using the most scalable and high-speed discrete memory available in the market.

Oct 2017: Winbond Electronics Corporation stacked NOR and NAND dies in 8-pin memory package. The company's new W25M Series allows stacking of homogeneous or heterogeneous flash so that memories of varying densities can be used for the code and data storage.

Major Players: SK HYNIX INC., CISCO SYSTEMS INC., NANYA TECHNOLOGY CORPORATION., WINBOND ELECTRONICS CORPORATION., MICRON TECHNOLOGY INC., FUJITSU SEMICONDUCTOR LIMITED., WESTERN DIGITAL CORPORATION., SAMSUNG ELECTRONICS CO. LTD., QUALCOMM TECHNOLOGIES INC., STMICROELECTRONICS., IBM CORPORATION., DELL EMC., TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION., HANA MICRON INC., APPLE INC. and ASE GROUP., among others.

Reasons to Purchase The Report

Current and future memory packaging market outlook in the developed and emerging markets

Analyzing various perspectives of the market with the help of Porter's five forces analysis

The segment that is expected to dominate the market

Regions that are expected to witness the fastest growth during the forecast period

Identify the latest developments, market shares, and strategies employed by major market players.

3 months analyst support, along with the Market Estimate sheet (in Excel).

Customization of The Report

This report can be customized to meet your requirements. Please connect with our representative, who will ensure you get a report that suits your needs.

Table of Contents

1. Introduction

  • 1.1. Key Study Deliverables
  • 1.2. Market Definition
  • 1.3. Study Assumptions

2. Research Methodology

3. Executive Summary

4. Market Insights

  • 4.1. Memory Packaging Market Overview
  • 4.2. Industry Attractiveness - Porter's Five Forces Model
    • 4.2.1. Bargaining Power of Suppliers
    • 4.2.2. Bargaining Power of Consumers
    • 4.2.3. Threat of New Entrants
    • 4.2.4. Threat of Substitute Products and Services
    • 4.2.5. Competitive Rivalry in the Industry
  • 4.3. Industry Value Chain Analysis
  • 4.4. Technology Roadmap

5. Market Dynamics

  • 5.1. Memory Packaging Market Drivers
    • 5.1.1. Emerging Trend of Autonomous Driving and In-Vehicle Infotainment
    • 5.1.2. Increase in Demand for Smartphones
    • 5.1.3. Memory Semiconductor Business Explosion
    • 5.1.4. Continuous Developments in High-bandwidth Memory (HBM) and Redistribution Layer
    • 5.1.5. Effective Space Utilization
  • 5.2. Memory Packaging Market Challenges
    • 5.2.1. Harsh Reliability Requirements in the Automotive Environment
    • 5.2.2. Changing landscape of The OSATs Industry

6. Global Memory Packaging Market - Segmentation

  • 6.1. Memory Packaging Market By Platform
    • 6.1.1. Flip-chip
    • 6.1.2. Lead-frame
    • 6.1.3. Wafer-level Chip-scale Packaging (WLCSP)
    • 6.1.4. Through-Silicon Via (TSV)
    • 6.1.5. Wire-bond
  • 6.2. Memory Packaging Market By Application
    • 6.2.1. NAND Flash Packaging
    • 6.2.2. NOR Flash Packaging
    • 6.2.3. 3D TSV Packaging
    • 6.2.4. DRAM Packaging
  • 6.3. Memory Packaging Market By End User
    • 6.3.1. IT and Telecommunication
    • 6.3.2. Consumer Electronics
    • 6.3.3. Embedded Systems
    • 6.3.4. Automotive
    • 6.3.5. Military and Aerospace
    • 6.3.6. Medical Industry
  • 6.4. Memory Packaging Market By Region
    • 6.4.1. North America Memory Packaging Market (2018-2023)
      • 6.4.1.1. United States Memory Packaging Market (2018-2023)
      • 6.4.1.2. Canada Memory Packaging Market (2018-2023)
    • 6.4.2. Europe Memory Packaging Market (2018-2023)
      • 6.4.2.1. United Kingdom Memory Packaging Market (2018-2023)
      • 6.4.2.2. Germany Memory Packaging Market (2018-2023)
      • 6.4.2.3. France Memory Packaging Market (2018-2023)
      • 6.4.2.4. Rest of Europe
    • 6.4.3. Asia-Pacific Memory Packaging Market (2018-2023)
      • 6.4.3.1. China Memory Packaging Market (2018-2023)
      • 6.4.3.2. Japan Memory Packaging Market (2018-2023)
      • 6.4.3.3. India Memory Packaging Market (2018-2023)
      • 6.4.3.4. South Korea Memory Packaging Market (2018-2023)
      • 6.4.3.5. Rest of Asia-Pacific
    • 6.4.4. Latin America Memory Packaging Market (2018-2023)
      • 6.4.4.1. Brazil Memory Packaging Market (2018-2023)
      • 6.4.4.2. Mexico Memory Packaging Market (2018-2023)
      • 6.4.4.3. Argentina Memory Packaging Market (2018-2023)
      • 6.4.4.4. Rest of Latin America
    • 6.4.5. Middle East & Africa Memory Packaging Market (2018-2023)
      • 6.4.5.1. Saudi Arabia Memory Packaging Market (2018-2023)
      • 6.4.5.2. South Africa Memory Packaging Market (2018-2023)
      • 6.4.5.3. United Arab Emirates Memory Packaging Market (2018-2023)
      • 6.4.5.4. Rest of Middle East & Africa

7. Memory Packaging Market Companies

  • 7.1. SK Hynix Inc.
  • 7.2. Intel Corporation
  • 7.3. Cisco Systems Inc.
  • 7.4. Nanya Technology Corporation
  • 7.5. Winbond Electronics Corporation
  • 7.6. Micron Technology Inc.
  • 7.7. Fujitsu Semiconductor Limited
  • 7.8. Western Digital Corporation
  • 7.9. Samsung Electronics Co. Ltd
  • 7.10. Qualcomm Technologies Inc.
  • 7.11. STMicroelectronics
  • 7.12. IBM Corporation
  • 7.13. Dell EMC
  • 7.14. Toshiba Electronic Devices & Storage Corporation
  • 7.15. Hana Micron Inc.
  • 7.16. Apple Inc.
  • 7.17. ASE Group

(List Not Exhaustive)

8. Memory Packaging Market Investment Analysis

9. Future of the Memory Packaging Market

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