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世界のLEDカプセル化市場:封入剤、エンドユーザー産業(家電、自動車、商業用照明)、地域別(2018年〜2023年)

Global LED Encapsulation Market - Segmented by Encapsulant Type, End-user Industries (Consumer Electronics, Automotive, and Commercial Lighting), and Region - Growth, Trends, and Forecast (2018 - 2023)

発行 Mordor Intelligence LLP 商品コード 704858
出版日 ページ情報 英文 98 Pages
納期: 即日から翌営業日
価格
本日の銀行送金レート: 1USD=112.89円で換算しております。
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世界のLEDカプセル化市場:封入剤、エンドユーザー産業(家電、自動車、商業用照明)、地域別(2018年〜2023年) Global LED Encapsulation Market - Segmented by Encapsulant Type, End-user Industries (Consumer Electronics, Automotive, and Commercial Lighting), and Region - Growth, Trends, and Forecast (2018 - 2023)
出版日: 2018年08月18日 ページ情報: 英文 98 Pages
概要

世界のLEDカプセル化市場は、予測期間の2018年から2023年にかけて13.52%のCAGR(複合年間成長率)で推移することが予測されています。

当レポートでは、世界のLEDカプセル化市場を調査し、市場の概要、封入剤・エンドユーザー産業・地域別の市場規模の推移と予測、市場動向、市場の成長要因および阻害要因の分析、競合情勢、主要企業のプロファイルなど、包括的な情報を提供しています。

目次

第1章 イントロダクション

  • 調査成果
  • 市場の定義
  • 調査の前提条件

第2章 調査方法

第3章 エグゼクティブサマリー

第4章 市場の分析

  • 市場概況
  • ファイブフォース分析
    • 買い手の交渉力
    • 供給企業の交渉力
    • 新規参入業者の脅威
    • 代替品の脅威
    • 競争企業間の敵対関係

第5章 市場力学

  • 市場の成長要因
    • 高出力LEDアプリケーションの需要の高まり
    • 自動車用照明の需要の増加
  • 市場の阻害要因
    • 封入剤の価格の変動性
    • 民生用電子製品における有機EL(OELD)の採用拡大
  • 市場機会
    • カプセル化技術と材料の研究開発

第6章 世界のLEDカプセル化市場:セグメント別

  • 封入剤別
    • エポキシ
    • シリコーン(メチル/フェニルシリコーン)
  • エンドユーザー産業別
    • 商業用照明
    • 自動車
    • 家電
  • 地域別
    • 北米
    • 欧州
    • アジア太平洋地域
    • 南米
    • 中東・アフリカ

第7章 企業プロファイル

  • Dow Corning Corporation
  • Nusil
  • H.B. Fuller Company
  • 信越化学
  • Henkel AG & Co. KGaA
  • 日立化成
  • パナソニック
  • Epic Resins
  • INTERTRONICS
  • Cree, Inc.
  • OSRAM Licht AG
  • NationStar Optoelectornics Co Ltd.
  • Hangzhou Silan Microelectronics CO., Ltd.

第8章 市場の投資分析

第9章 市場の将来展望

目次
Product Code: 63633

The LED encapsulation market is expected to register a CAGR of over 13.52%, during the forecast period 2018 - 2023. The report profiles the companies executing encapsulation, which includes LED manufacturers and encapsulant providers.

LED Encapsulation is a technique to increase protection for LEDs from different environmental conditions. It is popular for the operational benefits it offers. The LED encapsulation market is expected to expand with the increase in LED applications across many sectors. LED Encapsulation is a part of the packaging process in order to produce the end product, LEDs. The growth of the LED encapsulation market, therefore, is dependent on the technological advancement of the LED packaging market.

Medium-power and high-power LEDs, which generate more heat compared to the low power LEDs used in the consumer electronics. This can be addressed by opting for encapsulant during the LED packaging. Therefore, the increasing demand for the medium-power and high-power LEDs, the LED Encapsulation market is expected to expand, during the forecast period. The need for a longer life of the LEDs across applications, especially in the automotive sector (automobile forward lighting), provides scope for the encapsulant material manufacturers. The positive prospect of the automotive sector, during the forecast period, therefore, supports the growth of the LED encapsulation market. With respect to TV display application, the industry is moving from the usage of LED to OLED (Organic Light-emitting diode), which is the latest innovation and is expected to penetrate more into the market. This trend might hinder the volume growth of the LED packaging market and, thus, the encapsulation market.

The market consists of LED display manufacturers that execute their own encapsulation. Majority of the LED giants, like Dow Corning Corporation, Nusil, Panasonic, NationStar Optoelectronics., Epistar, Samsung Electronics etc., execute their own encapsulation, as it provides better control over the quality of the end product.

Silicone Encapsulant Estimated To Have the Highest Market Share

The demand for the silicon type is majorly due to the strong demand from commercial LED lighting. Silicon Encapsulant is also majorly used in other electronics applications. As the advantages silicone encapsulants provide, such as thermal transfer and light emission, are in line with the addressable need of mid- and high-power LEDs, the silicon segment is expected to grow at a substantial rate, during the forecast period. These performance benefits of silicone type explain the demand in the electrical and electronics sector. With respect to the LED encapsulation - apart from the performance benefits, the abundant availability of the material and the cost compared to Epoxy Encapsulant makes silicone encapsulant more preferred by LED manufacturers and others involved in LED encapsulation. Huge demand for silicone Encapsulant is expected from the United States and Asian regions, like South Korea and Taiwan, particularly for silicon encapsulants, due to the large production of consumer electronics like TV, tablets and monitors and the availability of the Encapsulant in that region.

Asia-Pacific is Expected to Have Highest Share in LED Encapsulation Market

Geographically, the LED encapsulation market is prevalent in Asia-Pacific (APAC) also due to the availability of encapsulation of raw material in abundance. Positive demand growth for consumer electronics and automobiles in this region, where the rapid changes in technology, is resulting in higher demand for high and medium power LEDs. This need, therefore, inculcates the LED encapsulation growth in the design of the end product.

Asia-Pacific, comprising of the major LED giants (in China), is expected to have a major market share during the forecast period. China is expected to be the major revenue generator, as it occupies more than 45% in the LED market, followed by Taiwan. Increasing demand from South Korea and Taiwan particularly for silicon Encapsulants, due to the large productions of consumer electronics like TV, tablets, and monitors, also explain the high market share. Australia, which is among the top 10 LED importers, in the world also contributes to the growth of the LED encapsulation market.

Key Developments in the LED Encapsulation Market

Jun 2018: In response to the increased production of leading-edge semiconductor packages in the region, Panasonic announced the launch of the mass production of molded underfill semiconductor encapsulation materials in Shanghai, China. Through this expansion, the company will be able to provide faster and more efficient service for semiconductor packaging customers in China, where the majority of the smartphones are being manufactured.

LED Encapsulation Market Players: DOW CORNING CORPORATION, NUSIL, H.B. FULLER COMPANY, SHIN-ETSU CHEMICAL CO. LTD, HENKEL AG & CO., KGAA, HITACHI CHEMICAL CO. LTD, PANASONIC CORPORATION, EPIC RESINS, INTERTRONICS, CREE INC., OSRAM LICHT AG, NATIONSTAR OPTOELECTRONICS CO. LTD. and HANGZHOU SILAN MICROELECTRONICS CO. LTD., among others.

Reasons to Purchase LED Encapsulation Market Report

Analysis of various perspectives of the market with the help of Porter's five forces analysis

The segments that are expected to dominate the market

Regional analysis of the market during the forecast period

Latest developments, market shares, and strategies employed by major market players and key innovators

3 months analyst support along with the Market Estimate sheet (in Excel)

Customization of the Report

This report can be customized to meet your requirements. Please connect with our representative, who will ensure you get a report that suits your needs.

Table of Contents

1. Introduction

  • 1.1 Key Study Deliverables
  • 1.2 Market Definition
  • 1.3 Study Assumptions

2. Research Methodology

3. Executive Summary

4. Market Insights

  • 4.1 Market Overview
  • 4.2 Indusrty Attractiveness-Porter's Five Forces Model
    • 4.2.1 Bargaining Power Of Suppliers
    • 4.2.2 Bargaining Power Of The Consumers
    • 4.2.3Threat Of New Entrants
    • 4.2.4 Threat Of Substitutes
    • 4.2.5 Intensity of Competitive Rivalry

5. Market Dynamics

  • 5.1 LED Encapsulation Market Drivers
    • 5.1.1 Growing demand of high power LED applications
    • 5.1.2 Growing Automotive lightning needs
  • 5.2 LED Encapsulation Market Restraints
    • 5.2.1 Volatile prices of encapsulant materials
    • 5.2.2 Growing adoption of OLEDs in consumer electronics
  • 5.3 LED Encapsulation Market Opportunities
    • 5.3.1 R&D in Encapsulation technology and materials

6. LED Encapsulation Market Segmentation

  • 6.1 LED Encapsulation Market By Encapsulant
    • 6.1.1 Epoxy
    • 6.1.2 Silicone (Methyl, Phenyl)
  • 6.2 LED Encapsulation Market By End-User Applications
    • 6.2.1 Commercial Lightning
    • 6.2.2 Automotive
    • 6.2.3 Consumer Electronics
  • 6.3 LED Encapsulation Market By Region
    • 6.3.1 North America
    • 6.3.2 Europe
    • 6.3.3 Asia-Pacific
    • 6.3.4 South America
    • 6.3.5 Middle-East and Africa

7. LED Encapsulation Market Companies

  • 7.1 Dow Corning Corporation
  • 7.2 Nusil
  • 7.3 H.B. Fuller Company
  • 7.4 Shin-Etsu Chemical Co., Ltd.
  • 7.5 Henkel AG & Co. KGaA
  • 7.6 Hitachi Chemical Co. Ltd.
  • 7.7 Panasonic Corporation
  • 7.8 Epic Resins
  • 7.9 INTERTRONICS
  • 7.10 Cree, Inc.
  • 7.11 OSRAM Licht AG
  • 7.12 NationStar Optoelectornics Co Ltd.
  • 7.13 Hangzhou Silan Microelectronics CO., Ltd.

List not exhaustive

8. LED Encapsulation Market Investment Analysis

9. Future of LED Encapsulation Market

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