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世界の自動ウェハー実装機市場:ウエハーサイズ(300mm、200mm、150mm)、エンドユーザー(半導体メーカー、IDM、記憶装置メーカー)、用途、地域別 - 成長、動向、予測(2018年〜2023年)

Global Automatic Mounter Wafer Equipment Market - Segmented by Wafer Size (300 mm, 200 mm, 150 mm), End User (Foundries, Inter-level Dielectric Material (IDM), Memory), Application, and Geography - Growth, Trends, and Forecast (2018 - 2023)

発行 Mordor Intelligence LLP 商品コード 635795
出版日 ページ情報 英文 85 Pages
納期: 即日から翌営業日
価格
本日の銀行送金レート: 1USD=111.89円で換算しております。
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世界の自動ウェハー実装機市場:ウエハーサイズ(300mm、200mm、150mm)、エンドユーザー(半導体メーカー、IDM、記憶装置メーカー)、用途、地域別 - 成長、動向、予測(2018年〜2023年) Global Automatic Mounter Wafer Equipment Market - Segmented by Wafer Size (300 mm, 200 mm, 150 mm), End User (Foundries, Inter-level Dielectric Material (IDM), Memory), Application, and Geography - Growth, Trends, and Forecast (2018 - 2023)
出版日: 2018年04月26日 ページ情報: 英文 85 Pages
概要

世界の自動ウェハー実装機市場は、2018年から2023年の調査期間に13.2%のCAGRで推移することが予測されています。

当レポートでは、世界の自動ウェハー実装機市場を調査し、市場の概要、ウェハーサイズ・用途・エンドユーザー(半導体製造メーカー、IDM、記憶装置メーカー)・地域別の市場動向、市場規模の推移と予測、成長要因・阻害要因の分析、競合情勢、主要企業のプロファイルなど、体系的な情報を提供しています。

目次

第1章 イントロダクション

  • 主な調査成果
  • 調査の前提条件
  • 市場の定義
  • 調査結果

第2章 調査手法

第3章 エグゼクティブサマリー

第4章 市場のダイナミクス

  • 市場概況
  • 市場促進要因
  • 市場阻害要因
  • ファイブフォース分析
    • 買い手の交渉力
    • 供給企業の交渉力
    • 新規参入業者の脅威
    • 代替品の脅威
    • 競争企業間の敵対関係

第5章 世界の自動ウェハー実装機市場:セグメント別

  • ウェハーサイズ別
    • 300mm
    • 200mm
    • 150mm
    • 100mm
    • その他
  • 用途別
    • ダイシング
    • ダイアタッチフィルム(DAF)
    • 保護(バックグラインド)
    • その他
  • エンドユーザー
    • 記憶装置メーカー
    • 半導体メーカー
    • IDM
    • その他
  • 地域別
    • 北米
    • 欧州
    • アジア太平洋
    • ラテンアメリカ
    • 中東・アフリカ

第6章 企業プロファイル

  • DISCO Corp.
  • Advanced Dicing Technologies
  • Longhill Industries
  • Syagrus Systems
  • 東京エレクトロン
  • Technovision
  • Lintec Corporation
  • 日東電工
  • タカトリ
  • Ultron Systems

第7章 投資分析

第8章 市場の将来展望

目次
Product Code: 58804

The global automatic mounter wafer equipment market is projected to grow at a CAGR of 13.2% during the forecast period (2018 - 2023).

The wafer mounter equipment market is expected to witness stable growth during the forecast period. Adoption of advanced electronic controls in the consumer electronics and automotive industry and rapid growth of applications are expected to influence the market. Furthermore, the demand for consumer electronics and rising capital investment by several automatic wafer manufacturing companies are also expected to provide growth opportunities during the forecast period. Due to several competitive benefits, such as increase in handling throughput, reliability, frequency, and increasing need to eliminate defects due to human errors, and the demand for automatic wafer equipment are being adopted widely.

Increasing Demand for IoT

The global Internet of Things (IoT) market is growing at a significant rate. A rise in number of interconnected smart devices over the Internet coupled with advances in sensor technologies is fueling the adoption of IoT for faster data communication. Favorable support from governments for the adoption of IoT in several industries coupled with the mass adoption of Internet is driving the adoption of IoT, thereby increasing the growth of Semiconductor Foundry market.

IDM Segment to Occupy Significant Market Share

Rising demand for integrated circuit across several end users, such as consumer electronics, automotive, and aerospace & defense, is impacting growth of the IDMs segment. Changing consumer preferences, along with the presence of advanced consumer electronic devices is supporting the market. Moreover, with the advent of 3D and UHD TVs, the demand for Ics has increased significantly. The miniaturization and integration of semiconductors has given rise to smaller, lighter, and more portable devices, like tablets, smartphones, and the emerging IoT devices.

Asia-Pacific to Occupy Significant Market Share

Low-cost production and increasing demand for semiconductor electronics are some of the major factors influencing the automatic wafer mounter equipment market in Asia-Pacific. Moreover, several initiatives, like construction of new wafer fabrication plant, are also expected to impact the demand for automatic wafer mounter equipment. The presence of a large number of semiconductor production equipment manufacturing companies in Asia-Pacific is another major factor positively driving the market in Asia-Pacific.

Major Players : ADVANCED DICING TECHNOLOGIES, LONGHILL INDUSTRIES, SYAGRUS SYSTEMS, TOKYO ELECTRON LTD, TECHNOVISION, LINTEC CORPORATION, NITTO DENKO, TAKATORI, ULTRON SYSTEMS, amongst others.

Reasons to Purchase the Report

Impact of growing IoT and consumer electronics

Analyzing various perspectives of the market with the help of Porter's five forces analysis

Growth across several end users, such as consumer electronics, industrial, and automotive

Regional analysis of the market

Identify the latest developments, market shares, and strategies employed by the major market players

3-month analyst support, along with the Market Estimate sheet (in excel)

Customization of the Report

This report can be customized to meet your requirements. Please connect with our representative, who will ensure you get a report that suits your needs.

Table of Contents

1. Introduction

  • 1.1 Key Deliverables of the Study
  • 1.2 Study Assumptions
  • 1.3 Market Definition
  • 1.4 Key Findings of the Study

2. Research Approach and Methodology

3. Executive Summary

4. Market Dynamics

  • 4.1 Market Overview
  • 4.2 Factors Driving the Market
  • 4.3 Factors Restraining the Market
  • 4.4 Industry Attractiveness - Porter's Five Forces Analysis
    • 4.4.1 Bargaining Power of Suppliers
    • 4.4.2 Bargaining Power of Consumers
    • 4.4.3 Threat of New Entrants
    • 4.4.4 Threat of Substitute Products or Services
    • 4.4.5 Competitive Rivalry among Existing Competitors

5. Global Automatic Mounter Wafer Equipment Market Segmentation

  • 5.1 By Wafer Size
    • 5.1.1 300 mm Wafer Size
    • 5.1.2 200 mm Wafer Size
    • 5.1.3 150 mm Wafer Size
    • 5.1.4 100 mm Wafer Size
    • 5.1.5 Other
  • 5.2 By Application
    • 5.2.1 Dicing
    • 5.2.2 DAF (Die Attached Film)
    • 5.2.3 Protection (Back Grinding)
    • 5.2.4 Others
  • 5.3 By End User
    • 5.3.1 Memory Manufacturers
    • 5.3.2 Foundries
    • 5.3.3 IDMs
    • 5.3.4 Others
  • 5.4 By Geography
    • 5.4.1 North America
    • 5.4.2 Europe
    • 5.4.3 Asia-Pacific
    • 5.4.4 Latin America
    • 5.4.5 Middle East & Africa

6. Competitive Intelligence - Company Profiles

  • 6.1 DISCO Corp.
  • 6.2 Advanced Dicing Technologies
  • 6.3 Longhill Industries
  • 6.4 Syagrus Systems
  • 6.5 Tokyo Electron Ltd
  • 6.6 Technovision
  • 6.7 Lintec Corporation
  • 6.8 Nitto Denko
  • 6.9 Takatori
  • 6.10 Ultron Systems

7. Investment Analysis

8. Outlook of the Automatic Mounter Wafer Equipment Market

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