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市場調査レポート

世界の3次元TSVおよび2.5次元IC市場:技術(DDR2、DDR3、DDR4)、用途(モバイルデバイス、コンピューターデバイス、通信デバイス)、地域別 - 成長、動向、予測(2018年〜2023年)

Global 3D TSV and 2.5D Market - Segmented by Technology (DDR2, DDR3, and DDR4), Application (Mobile Devices, Computing Devices, and Networking Devices), and Geography - Growth, Trends, and Forecast (2018 - 2023)

発行 Mordor Intelligence LLP 商品コード 635787
出版日 ページ情報 英文 85 Pages
納期: 即日から翌営業日
価格
本日の銀行送金レート: 1USD=110.69円で換算しております。
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世界の3次元TSVおよび2.5次元IC市場:技術(DDR2、DDR3、DDR4)、用途(モバイルデバイス、コンピューターデバイス、通信デバイス)、地域別 - 成長、動向、予測(2018年〜2023年) Global 3D TSV and 2.5D Market - Segmented by Technology (DDR2, DDR3, and DDR4), Application (Mobile Devices, Computing Devices, and Networking Devices), and Geography - Growth, Trends, and Forecast (2018 - 2023)
出版日: 2018年04月26日 ページ情報: 英文 85 Pages
概要

世界の3次元TSVおよび2.5次元IC市場は、2018年から2023年の調査期間に、35.2%のCAGRで成長することが予測されています。

当レポートでは、世界の3次元TSVおよび2.5次元IC市場について調査し、市場の概要、技術・製品タイプ・地域別の市場動向、市場規模の推移と予測、成長要因・阻害要因および市場機会の分析、競合情勢、主要企業のプロファイルなど、体系的な情報を提供しています。

目次

第1章 イントロダクション

  • 主な調査成果
  • 調査の前提条件
  • 市場の定義
  • 調査結果

第2章 調査手法

第3章 エグゼクティブサマリー

第4章 市場のダイナミクス

  • 市場概況
  • 成長要因
    • スマートフォン、タブレット、ゲーム機の市場拡大
    • 電子機器の小型化のトレンド
  • 阻害要因
    • 3次元および2.5次元ICパッケージの単価の高さ
  • 産業バリューチェーン分析
  • ファイブフォース分析
    • 買い手の交渉力
    • 供給企業の交渉力
    • 新規参入業者の脅威
    • 代替品の脅威
    • 競争企業間の敵対関係

第5章 世界の3次元TSVおよび2.5次元IC市場:セグメント別

  • 技術別
    • 3次元WLCSP
    • 3次元TSV
    • 2.5次元IC
  • 製品タイプ別
    • ロジック
    • イメージング・光エレクトロニクス
    • メモリー
    • MEMS/センサー
    • LED
    • 発電、アナログ/ミックスシグナル、RF、フォトニクス
  • 地域別
    • 北米
    • 欧州
    • アジア太平洋
    • ラテンアメリカ
    • 中東・アフリカ

第6章 競合他社の情報- 企業プロファイル

  • Taiwan Semiconductor Manufacturing Company Limited
  • Samsung Electronics Co. Ltd
  • 東芝
  • Pure Storage Inc.
  • ASE Group
  • Amkor Technology
  • United Microelectronics Corp.
  • STMicroelectronics NV
  • Broadcom Ltd
  • Intel Corporation.
  • Jiangsu Changing Electronics Technology Co. Ltd

第7章 投資分析

第8章 市場の将来展望

目次
Product Code: 59145

Description

The global 3D TSV and 2.5D market is expected to project a growth rate of 35.2% during the forecast period (2018 - 2023).

Connected devices and other wireless technologies like Wi-Fi and Bluetooth, are some of the features integrated in smart gadgets and devices for communicating with other devices. Several integrated circuits need to be incorporated in a single chip module for reducing the board space and cost. Miniaturization of electronic devices and the rapid growth of smartphones and tablets are also expected to influence the demand of the market.

Expanding Market for Smartphones, Tablets, and Gaming Devices

Advanced transformations of the consumer electronics require manufacturers to improve the offerings in terms of design, processing power, power consumption, and user interface, frequently. Such upgrades in consumer electronics will require the use of robust technology. 3D TSV is the core of integrated chip packaging on a nanometer scale ensuring robust hardware for technology. Shipments of smartphones is expected to reach 2 billion units by 2020, majorly due to the availability of low-cost smartphones in developing nations, such as China and India.

Asia-Pacific to Occupy a Significant Market Share

Countries, like China, Japan, South Korea, Indonesia, Singapore, and Australia have recorded high levels of manufacturing in the consumer electronics, automotive, and transportation sectors, which a key source of demand for 3D TSV and 2.5D market in the region. The rising popularity of smartphones and demand for new memory technologies has increased the growth of computationally intensive consumer electronics, thereby creating a wide range of opportunities in this region. Asia-Pacific is one of the most active manufacturing hubs in the world.

Key Developments in the Market

March 2017 - Advanced Semiconductor Engineering, Inc., and Cadence Design Systems, Inc., announced they have collaborated to release a System-in-Package (SiP) EDA solution, that addresses the challenges of designing and verifying Fan-Out Chip-on-Substrate (FOCoS) multi-die packages.

Major Players - TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED, SAMSUNG ELECTRONICS CO. LTD, TOSHIBA CORP., PURE STORAGE INC., ADVANCED SEMICONDUCTOR ENGINEERING INC., AMKOR TECHNOLOGY, UNITED MICROELECTRONICS CORP., STMICROELECTRONICS NV, BROADCOM LTD, INTEL CORPORATION, JIANGSU CHANGING ELECTRONICS TECHNOLOGY CO. LTD, amongst others.

Reasons to Purchase this Report

Impact of growing demand for smartphones and tablets.

Analyzing various perspectives of the market with the help of Porter's five forces analysis.

Growth of various products such as - MEMS, Sensors, and Optpelectronics.

Regional analysis of the market.

Identify the latest developments, market shares, and strategies employed by the major market players.

3 months analyst support, along with the Market Estimate sheet (in excel).

Customization of the Report

This report can be customized to meet your requirements. Please connect with our representative, who will ensure you get a report that suits your needs.

Table of Contents

1. Introduction

  • 1.1 Key Deliverables of the Study
  • 1.2 Study Assumptions
  • 1.3 Market Definition
  • 1.4 Key Findings of the Study

2. Research Approach and Methodology

3. Executive Summary

4. Market Dynamics

  • 4.1 Market Overview
  • 4.2 Drivers
    • 4.2.1 Expanding Market for Smartphones, Tablets, and Gaming Devices
    • 4.2.2 Rising Trend of Miniaturization of Electronics Devices
  • 4.3 Restraints
    • 4.3.1 High Unit Cost of 3D IC and 2.5D IC Packages
  • 4.4 Industry Value Chain Analysis
  • 4.5 Industry Attractiveness - Porter's Five Industry Forces Analysis
    • 4.5.1 Bargaining Power of Suppliers
    • 4.5.2 Bargaining Power of Consumers
    • 4.5.3 Threat of New Entrants
    • 4.5.4 Threat of Substitute Products or Services
    • 4.5.5 Competitive Rivalry among Existing Competitors

5. Global 3D TSV and 2.5D IC Market - Segmentation

  • 5.1 By Technology
    • 5.1.1 3D Wafer-Level Chip-Scale Packaging (WLCSP)
    • 5.1.2 3D TSV
    • 5.1.3 2.5D
  • 5.2 By Product Type
    • 5.2.1 Logic
    • 5.2.2 Imaging & Optoelectronics
    • 5.2.3 Memory
    • 5.2.4 MEMS/Sensors
    • 5.2.5 LED
    • 5.2.6 Power, Analog and Mixed Signal, RF, and Photonics
  • 5.3 By Geography
    • 5.3.1 North America
    • 5.3.2 Europe
    • 5.3.3 Asia-Pacific
    • 5.3.4 Latin America
    • 5.3.5 Middle East & Africa

6. Competitive Intelligence - Company Profiles

  • 6.1 Taiwan Semiconductor Manufacturing Company Limited
  • 6.2 Samsung Electronics Co. Ltd
  • 6.3 Toshiba Corp.
  • 6.4 Pure Storage Inc.
  • 6.5 ASE Group
  • 6.6 Amkor Technology
  • 6.7 United Microelectronics Corp.
  • 6.8 STMicroelectronics NV
  • 6.9 Broadcom Ltd
  • 6.10 Intel Corporation.
  • 6.11 Jiangsu Changing Electronics Technology Co. Ltd

List not exhaustive

7. Investment Analysis

8. Outlook of 3D TSV and 2.5D IC Market

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