Global Flip Chip Technology Market - Segmented by Wafer Bumping Process, Packaging Technology, Product, Application, and Region - Growth, Trends, and Forecast
|発行||Mordor Intelligence LLP||商品コード||547020|
|出版日||ページ情報||英文 109 Pages
|世界のフリップチップ技術市場の動向と予測：ウェハーバンピングプロセス、パッケージングプロセス、製品、用途、地域別 Global Flip Chip Technology Market - Segmented by Wafer Bumping Process, Packaging Technology, Product, Application, and Region - Growth, Trends, and Forecast|
|出版日: 2018年05月14日||ページ情報: 英文 109 Pages||
The flip chip technology market was valued at USD 22.683 billion in 2017, and is expected to reach a value of USD 32.178 billion by 2023 at a CAGR of 5.64%, over the forecast period (2018 - 2023). The regions considered in the scope of the report include North America, Europe, Asia-Pacific, Latin America, and Middle East & Africa.
Introduced by IBM 30 years ago, flip chip is keeping up with the times and developing new bumping solutions to serve advanced technologies, such as 2.5D and 3D. Flip chip is used for traditional applications, such as laptops, desktops, CPU, GPU, chipsets, etc. The demand for flip chips is expected to rise in mobile and wireless consumer applications, and other high performance applications, such as networks, servers, and data centers. Flip chip market is mainly driven by the emerging internet of things: a network of physical devices, vehicles, buildings, and other items that include embedded electronics, software, sensors, actuators, and network connectivity along with its technological superiority over the traditional wire bond electrical connection makes it the exceptional alternative. The flip-chip market is highly technology-driven and manufacturers are mainly focusing on discovering new technologies for the bumping process, which, in turn, is increasing the demand for raw materials required for manufacturing. However, some of the major restraints associated with the flip chip industry include the huge initial investment required for setting up new manufacturing facility and less available options for customization.
Nevertheless, growth in demand for sensors in smartphone industry and increase in application in personal electronic devices, such as personal computers and mobiles, opens new opportunities in the flip chip market. The demand of flip chip is also expected to increase in the coming years due to heavy investments in the research and development by key players, such as TSMC, Ltd, Amkor Technology, Inc., and IBM, which has led to constant improvements in chip quality.
A swift increase in the number of electronic devices that use flip chip technology has been observed in the recent times. The flip chip technology is revolutionizing the market, where the expansion of the Internet, digital camcorders, PDAs, desktop computers and laptops, digital cameras, mobile phones, and other electronic-based consumer products is being witnessed. With smartphones consumption increasing worldwide and rising focus on their compaction is expected to offer flip chip market a significant growth potential. Smartphones and tablets make use of flip chips, that are also known as controlled collapse chip connection.
Product functionality is in very high demand, and volume production and time-to-market have become a matter of critical importance. This amplified use of flip chip technology is driving the need for the next generation of production equipment, which includes integration and innovation. The number of applications that use flip chip technology is expected to expand rapidly over the coming few years. This factor will drive the demand for next-generation flip chip specific underfill dispensers and die bonders. The combination of both flip-chip-technology and these new platforms will provide cost-effective semiconductor packaging solutions for prominent integrated device manufacturers and original, subcontract manufacturers. Thus, the ease of integration of flip chips is expected to drive the growth of the flip chip technology market lucratively during the forecast period.
3D IC is expected to record the highest growth rate as it is equipped with all the additional advantages to that of 2.5D IC, such as enhanced capacity, improved performance, and reduced system space requirements and low power consumption. The growing demand for reduced latency, increasing density, greater bandwidth, and lower power consumption are driving the adoptions of 3D-IC designs. Three-dimensional integrated circuits contain multiple layers of active devices, have the potential to dramatically enhance chip performance, functionality, and device packing density. They also provide for microchip architecture and may facilitate the integration of heterogeneous materials, devices, and signals and offer a promising solution for reducing both silicon footprint and interconnect length without shrinking the transistors. A complete 3D-IC implementation is usually envisioned as a stack of active chips using TSVs to connect through each chip down to a package substrate.
Growing economies in this region, such as India and China impact every industry, including semiconductors. The Asia-Pacific flip chip market is expected to grow at a rapid pace, due to rising proliferation of consumer electronics in this region. With the improving economic conditions, increasing disposable income, increasing number of youth population, and rising employment rate, the consumer electronic market is flourishing in this region. China's plans to focus on semiconductor sector as a part of 12th five-year plan and strong growth of Taiwan's semiconductor and electronics industry will augment the market for Flip chip in this region. With rising internet penetration and various government initiatives, such as smart cities, smart grids and smart transportation, the IoT market is set to explode in this region over the next decade. This will create sufficient demand for the flip chip market.
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