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市場調査レポート

世界のフリップチップ技術市場の動向と予測

Flip Chip Technology Market - Growth, Trends, and Forecast (2019 - 2024)

発行 Mordor Intelligence LLP 商品コード 547020
出版日 ページ情報 英文 120 Pages
納期: 2-3営業日
価格
本日の銀行送金レート: 1USD=109.58円で換算しております。
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世界のフリップチップ技術市場の動向と予測 Flip Chip Technology Market - Growth, Trends, and Forecast (2019 - 2024)
出版日: 2019年05月01日 ページ情報: 英文 120 Pages
概要

当レポートでは、世界のフリップチップ技術市場について調査し、市場の概要、ウェハーダンピングプロセス・パッケージングプロセス・製品・用途・地域別の市場動向、市場規模の推移と予測、市場成長・阻害要因の分析、市場シェア、競合情勢、主要企業のプロファイルなど、包括的な情報を提供しています。

目次

第1章 イントロダクション

  • 調査成果
  • 市場の定義
  • 市場規模

第2章 調査方法

  • イントロダクション
  • 調査手法

第3章 エグゼクティブサマリー

第4章 市場の概要

  • 現在の市場シナリオ
  • 市場成長要因
    • 高いパッケージ密度
    • 統合の容易さ
  • 市場阻害要因
  • 産業魅力 - ファイブフォース分析
    • サプライヤーの交渉力
    • 消費者の交渉力
    • 新規参入の脅威
    • 代替製品およびサービスの脅威
    • 業界内での競争
  • 産業バリューチェーン分析

第5章 市場セグメンテーション

第6章 世界のフリップチップ技術市場:ウェハーバンピングプロセス別

  • 銅ピラー
  • スズ鉛共晶はんだ(Sn-Pb共晶はんだ)
  • 鉛フリーはんだ
  • 金スタッドバンプ

第7章 世界のフリップチップ技術市場:パッケージングプロセス別

  • 2D IC
  • 2.5D IC
  • 3D IC

第8章 世界のフリップチップ技術市場:製品別

  • メモリー
  • 高輝度発光ダイオード(LED)
  • RFIC、電源IC、アナログIC
  • イメージング
  • 2DロジックSoC(System on a Chip)

第9章 世界のフリップチップ技術市場:用途別

  • 医療機器
  • 産業
  • 自動車
  • グラフィックス プロセッシング ユニット & チップセット
  • スマートテクノロジー
  • ロボット工学
  • 電子デバイス

第10章 世界のフリップチップ技術市場:地域別

  • 北米
    • 米国
    • カナダ
  • 欧州
    • ドイツ
    • 英国
    • フランス
    • スペイン
    • イタリア
    • その他
  • アジア太平洋地域
    • 中国
    • 日本
    • インド
    • オーストラリア
    • インドネシア
    • マレーシア
    • シンガポール
    • 韓国
    • その他
  • 中東・アフリカ
  • ラテンアメリカ

第11章 競合分析 - 企業プロファイル

  • Amkor Technology
  • IBM Corp.
  • Intel Corp.
  • Taiwan Semiconductor Manufacturing Co.
  • Samsung Electronics Co. Ltd.
  • Texas Instruments Inc.
  • Global Foundries U.S Inc.
  • Stats Chippac Ltd.
  • NEPES PTE. LTD
  • Powertech Technology

第12章 競合情勢

  • 市場シェア分析
  • 開発動向の分析
  • 投資機会

第13章 フリップチップ技術の将来展望

目次
Product Code: 55573

Market Overview

The flip chip technology market was valued at USD 24.45 billion in 2018, and is expected to reach a value of USD 33.91 billion by 2024 at a CAGR of 5.75%, over the forecast period (2019 - 2024). Medical Industry is also embracing flip chips while suggesting health and fitness tracking bands to patients for measuring heart rates, blood pressure, glucose levels and pulse.

  • Packaging has become a key determinant for using or abandoning a device in a new design. Miniaturization plays an important role in product design. A small form factor in terms of size and weight, yet an increase in computing power helps to achieve the optimum design which is required by most of the consumer electronics. This is driving the flip chip market to grow in various segments especially electronics.
  • For modern IC designs, the increasing design complexity and decreasing feature size makes I/O connection a critical problem. High integration density, larger I/O counts, faster speed and better signal intensity provided by flip chip packages, is contributing to the market growth.
  • One of the factors hindering the growth of the market is packaging cost, which is more than wire bonding. The increase in cost is due to substrate and wafer bumping. These two cost drivers are related to the act of bringing I/Os out under the die.

Scope of the Report

Flip chip technology is one of the oldest and widely used techniques for semiconductor packaging. Flip chip was originally introduced by IBM 30 years ago. Nevertheless, it is keeping up with times and developing new bumping solutions to serve advanced technologies such as 2.5D and 3D. Flip chip is used for traditional applications, such as Laptops, Desktops, CPU, GPU, chipsets etc.

Key Market Trends

Consumer Electronics to Dominate the Market

  • The demand for flip chips is expected to rise in mobile & wireless, consumer applications, and other high-performance applications such as networks, servers and data centers.
  • The flip chip technology is revolutionizing the market, where the expansion of the Internet, digital camcorders, PDAs, desktop computers and laptops, digital cameras, mobile phones, and other electronic-based consumer products is seen.
  • Consumer electronics are becoming smaller, thinner and lighter, by utilizing advanced electronic packaging.
  • With rising internet penetration and various government initiatives, such as smart cities, smart grids and smart transportation, the IOT market is set to explode over the next decade. This will create sufficient demand for the flip chip market.

Asia-Pacific to Witness the Fastest Growth

  • Growing economies in the Asia-Pacific region, such as India and China, impact every industry, including semiconductors. The Asia-Pacific flip chip market is expected to grow at a rapid pace, due to the rising proliferation of consumer electronics in this region.
  • With the improving economic conditions, increasing disposable income, growing number of the youth population, and rising employment rate, the consumer electronics market is flourishing in this region.
  • China's plans to focus on the semiconductor sector as a part of 12th five-year plan and strong growth of Taiwan's semiconductor and electronics industry will augment the market for Flip chip in this region.
  • With rising internet penetration and various government initiatives, such as smart cities, smart grids and smart transportation, the IOT market is set to explode in this region over the next decade. This will create sufficient demand for the flip chip market.

Competitive Landscape

Flip chip market is slowing fragmenting due to growing number of end-users like automotive, industrial and consumer electronics. Acquisitions also play an important role in upgrading the skills and manpower of the parent company.

  • February 2019 - Intel Corporation acqui-hired Ineda Systems, a Hyderabad-based startup which manufactures microchips.
  • December 2018 - IBM announced an agreement with Samsung to manufacture 7-nanometer (nm) microprocessors for IBM Power Systems™, IBM Z™ and LinuxONE™, high-performance computing (HPC) systems, and cloud offerings.
  • July 2018 - Amkor partnered with Mentor to release Amkor's SmartPackage™ Package Assembly Design Kit (PADK), the first in the industry to support Mentor's High-Density Advanced Packaging (HDAP) design process and tools.

Reasons to Purchase this report:

  • The market estimate (ME) sheet in Excel format
  • Report customization as per the client's requirements
  • 3 months of analyst support

Table of Contents

1 INTRODUCTION

  • 1.1 Study Deliverables
  • 1.2 Study Assumptions
  • 1.3 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET DYNAMICS

  • 4.1 Market Overview
  • 4.2 Introduction to Market Drivers and Restraints
  • 4.3 Market Drivers
    • 4.3.1 High Packaging Density Leading to Miniaturization
    • 4.3.2 Advancements in Electronics Packaging is Causing the Market to Expand
  • 4.4 Market Restraints
    • 4.4.1 High Cost Associated With Flip Chip Technology
  • 4.5 Value Chain Analysis
  • 4.6 Industry Attractiveness - Porter's Five Force Analysis
    • 4.6.1 Threat of New Entrants
    • 4.6.2 Bargaining Power of Buyers/Consumers
    • 4.6.3 Bargaining Power of Suppliers
    • 4.6.4 Threat of Substitute Products
    • 4.6.5 Intensity of Competitive Rivalry

5 MARKET SEGMENTATION

  • 5.1 By Product
    • 5.1.1 Memory
    • 5.1.2 Light-Emitting Diode
    • 5.1.3 CMOS Image Sensor
    • 5.1.4 SoC
    • 5.1.5 GPU
    • 5.1.6 CPU
  • 5.2 By Wafer Bumping Process
    • 5.2.1 Copper Pillar
    • 5.2.2 Tin-Lead Eutectic Solder
    • 5.2.3 Lead Free Solder
    • 5.2.4 Gold Stud Bumping
  • 5.3 By Packaging Technology
    • 5.3.1 2D IC
    • 5.3.2 2.5D IC
    • 5.3.3 3D IC
  • 5.4 By Application
    • 5.4.1 Military & Defense
    • 5.4.2 Medical & Healthcare
    • 5.4.3 Industrial Sector
    • 5.4.4 Automotive
    • 5.4.5 Consumer Electronics
    • 5.4.6 Telecommunication
    • 5.4.7 Other Applications
  • 5.5 Geography
    • 5.5.1 North America
    • 5.5.2 Europe
    • 5.5.3 Asia-Pacific
    • 5.5.4 Latin America
    • 5.5.5 Middle East & Africa

6 COMPETITIVE LANDSCAPE

  • 6.1 Company Profiles
    • 6.1.1 Amkor Technology Inc.
    • 6.1.2 IBM Corporation
    • 6.1.3 Intel Corporation
    • 6.1.4 Taiwan Semiconductor Manufacturing Company Limited
    • 6.1.5 Samsung Electronics Co. Ltd.
    • 6.1.6 Texas Instruments Inc.
    • 6.1.7 GlobalFoundries U.S. Inc.
    • 6.1.8 STATS ChipPAC Ltd
    • 6.1.9 Powertech Technology (Singapore) Pte. Ltd.

7 INVESTMENT ANALYSIS

8 MARKET OPPORTUNITIES AND FUTURE TRENDS

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