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3D TSVデバイスの世界市場 - タイプ、用途、地域別 - 成長、トレンド、および予測(2018年〜2023年)

Global 3D TSV Devices Market - Growth, Trends and Forecast (2018 - 2023)

発行 Mordor Intelligence LLP 商品コード 546864
出版日 ページ情報 英文 101 Pages
納期: 即日から翌営業日
価格
本日の銀行送金レート: 1USD=113.61円で換算しております。
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3D TSVデバイスの世界市場 - タイプ、用途、地域別 - 成長、トレンド、および予測(2018年〜2023年) Global 3D TSV Devices Market - Growth, Trends and Forecast (2018 - 2023)
出版日: 2018年07月10日 ページ情報: 英文 101 Pages
概要

3D TSVデバイス市場は、2018年から2023年にかけて、6.88%のCAGRで拡大すると予測されています。

当レポートでは、3D TSVデバイスの世界市場を調査し、市場の概要、用途、地域別の市場動向、市場規模の推移と予測、市場促進・阻害要因ならびに市場機会の分析、競合情勢、主要企業のプロファイルなど包括的な情報を提供しています。

目次

第1章 イントロダクション

  • 調査成果
  • 調査結果
  • 調査方法

第2章 エグゼクティブサマリー

第3章 市場の概要

  • 概要
  • ファイブフォース分析
    • 新規参入の脅威
    • 消費者の交渉力
    • サプライヤーの交渉力
    • 代替製品およびサービスの脅威
    • 業界内での競争

第4章 市場のダイナミクス

  • 成長要因
  • 阻害要因

第5章 市場セグメンテーション

  • 用途別
    • 家電
    • 情報通信
    • 自動車
    • 航空宇宙・防衛
    • その他
  • 地域別
    • 北米
    • 欧州
    • アジア太平洋地域
    • 中南米
    • 中東・アフリカ

第6章 ベンダーの市場シェア

第7章 企業プロファイル

  • Amkor Technology, Inc. (US)
  • GLOBALFOUNDRIES (US)
  • Invensas Corporation (US)
  • Iwate Toshiba Electronics Co., Ltd. (Japan)
  • Micron Technology, Inc. (US)
  • Samsung Electronics Co., Ltd. (South Korea)
  • SK Hynix Inc. (South Korea)
  • Sony Corporation (Japan)
  • STATS ChipPAC Ltd. (Singapore)
  • Taiwan Semiconductor Manufacturing Company Limited (TSMC) (Taiwan)
  • Teledyne DALSA Inc. (Canada)
  • Tezzaron Semiconductor Corp. (US)
  • United Microelectronics Corporation (UMC) (Taiwan)
  • Xilinx Inc. (US)

第8章 投資分析

第9章 市場の将来展望

目次
Product Code: 30948

The 3D TSV devices market is expected to register a CAGR of 6.88%, over the forecast period 2018 - 2023. The scope of the market is limited to the x-ray scanners for security purposes.

Driven by the rising demand for novel, high-performance chip architectures featuring advantages, such as greater performance, power utilization, and form factor features, 3D TSV technology is making healthy progress in the semiconductor industry. The development in the 3D TSV advanced wafer packaging technology market is presently fuelled by factors, such as strong outlook for the Information & Communication Technologies (ICT) sector, extension in communication services provider (CSP) operations, demand for advanced packaging, intensified activity in corporate data centers, and increasing propagation of cloud computing services.

Consumer Electronics to Witness Significant Growth Over the Forecast Period

Leveraging its capability to deliver advanced integrated chip models with lesser footprint and decreased capacitance, 3D TSV technology is progressively being used in improving the memory, logic functions of electronics, CMOS, and non-memory, such as tablet PCs, smart phones, and televisions, among others. The propagation of 3D TSV in the DRAM memory vertical with pioneering technology platforms, such as Wide I/O, High Bandwidth Memory (HBM), and Hybrid Memory Cube (HMC) is also contributing to the market growth.

China to Hold the Largest Market Share in Asia-Pacific

China, a major manufacturer and the largest exporter of consumer electronics across the world, is supported by the huge research and development (R&D) investments in cutting-edge technology and shorter product development cycles, which have further driven the exports of electronic goods all over the world. To cater to the various advancements in consumer applications, such as, smartphones, tablets and wearable products, the MEMS and CIS markets are expected to exhibit a robust growth over the forecast period, in turn, fueling the growth of the 3D TSV devices market. All these factors are expected to drive the market for 3D TSV devices.

Adoption of Cloud-based Storage and Cloud Computing By Enterprises to Drive the Market Over the Forecast Period

The adoption of cloud for data storage has been witnessed across various enterprises around the world, since the commercial data requires a large storage space, varying from large firms to SME's. With the advent of IoT and big data analytics there is a rising amount of data being generated. Since, on-premise storage of these huge amounts of data becomes expensive, many enterprises have started moving their data to the cloud storage by selecting service providers, such as Microsoft Azure, AWS, and Google Cloud Platform. 3D TSV has a major role to play as it provides high speed data transmitting while maintaining power budget, a major requirement for cloud storage and cloud computing. Thus, the increase in the adoption of cloud-based storage is expected to fuel the demand for 3D TSV devices market during the forecast period.

Key Developments:

  • May 2017 - Amkor Technology acquired Nanium SA, a manufacturer of WLFO technology. The acquisition is aimed at strengthening Amkor in the fast-growing market of wafer-level packaging for smartphones, tablets, and other applications
  • Major Players: SONY CORPORATION, TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED, TELEDYNE DALSA INC., AMKOR TECHNOLOGY INC., XILINX INC., INVENSAS CORPORATION, TELEDYNE DALSA INC. , SAMSUNG ELECTRONICS CO. LTD, MICRON TECHNOLOGY INC. AND UNITED MICROELECTRONICS CORPORATION, amongst others.

Reasons to Purchase this Report:

  • Current and future 3D TSV devices market outlook in the developed and emerging economies
  • Analyzing various perspectives of the market with the help of Porter's five forces analysis
  • The segments that are expected to dominate the market
  • Regions that are expected to witness fastest growth during the forecast period
  • Identifying the latest developments, market shares, and strategies employed by the major market players.
  • 3-month analyst support, along with the Market Estimate sheet in excel

Customization of the Report:

This report can be customized to meet your requirements. Please connect with our representative, who will ensure you get a report that suits your needs

Table of Contents

1. Introduction

  • 1.1 Study Deliverables
  • 1.2 Key Findings of The Study
  • 1.3 Research Methodology

2. Executive Summary

3. Market Overview

  • 3.1 Overview
  • 3.2 Porters Five Force Analysis
    • 3.2.1 Threat of New Entrants
    • 3.2.2 Bargaining Power of Consumers
    • 3.2.3 Bargaining Power of Suppliers
    • 3.2.4 Threat of Substitute Products and Services
    • 3.2.5 Intensity of Competitive Rivalry

4. Market Dynamics

  • 4.1 Drivers
    • 4.1.1 Proliferation of Cloud Computing Across Enterpsies
  • 4.2 Restraints
    • 4.2.1 High R&D Investment and Need for Skilled Labour

5. Global 3D TSV Devices Market Segmentation

  • 5.1 By Industry
    • 5.1.1 Consumer Electronics
    • 5.1.2 IT and Telecom
    • 5.1.3 Automotive
    • 5.1.4 Aerospace and Defence
    • 5.1.5 others
  • 5.2 By Region
    • 5.2.1 North America
    • 5.2.2 Europe
    • 5.2.3 Asia Pacific
    • 5.2.4 Latin America
    • 5.2.5 Middle East and Africa

6. Vendor Market Share Analysis

7. Competitive Intelligence - Company Profiles

  • 7.1. Amkor Technology, Inc. (US)
  • 7.2 GLOBALFOUNDRIES (US)
  • 7.3 Invensas Corporation (US)
  • 7.4 Iwate Toshiba Electronics Co., Ltd. (Japan)
  • 7.5 Micron Technology, Inc. (US)
  • 7.6 Samsung Electronics Co., Ltd. (South Korea)
  • 7.7 SK Hynix Inc. (South Korea)
  • 7.8 Sony Corporation (Japan)
  • 7.9 STATS ChipPAC Ltd. (Singapore)
  • 7.10 Taiwan Semiconductor Manufacturing Company Limited (TSMC) (Taiwan)
  • 7.11 Teledyne DALSA Inc. (Canada)
  • 7.12 Tezzaron Semiconductor Corp. (US)
  • 7.13 United Microelectronics Corporation (UMC) (Taiwan)
  • 7.14 Xilinx Inc. (US)

8. Investment Analysis

  • 8.1 Recent Mergers & Acquisitions
  • 8.2 Investment Scenario & Opportunities

9. Future of the Market

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