Global 3D Semiconductor Packaging Market: By Type (3D SIP, 3D WLP, 3D SIC, 3D IC), Packaging Method (Package on Package, Through Silicon via (TSV), Through Class Via (TGV) and Others) End-User (Consumer Electronics, Telecommunication, Industrial, Automotive, Military and Aerospace), Region-Forecast Till 2023
Market analysis
Interest for 3D semiconductor packaging is on the ascent. This is basically inferable from a few utilitarian preferences of 3D semiconductor packaging when contrasted with ordinary choices. Additionally, the rising inclination for power-effective arrangements is having a beneficial outcome on 3D semiconductor packaging. It is exceedingly best in class and aides in improving the exhibition of the circuit execution. Expanded use in shopper hardware is mostly boosting the selection of 3D semiconductor packaging. Simultaneously, the developing scaling down pattern in hardware planning and assembling is making new roads for market players. The Global 3D Semiconductor Packaging Market is required to observe a CAGR of 16.25% during the conjecture time frame (2018-2023) and outperform a valuation of USD 37,400 million.
Market segmentation
The Global 3D Semiconductor Packaging Market is segmented on the basis of its packaging type, end-user, type, and regional demand. On the basis of its Packaging Method, the Global 3D Semiconductor Packaging Market is sectioned into Through Silicon via (TSV), Package on Package, Through Class Via (TGV) and Others. Based on its type, the Global 3D Semiconductor Packaging Market is bifurcated into 3D SIP, 3D WLP, 3D SIC, and 3D IC. Based on its End User, the Global 3D Semiconductor Packaging Market is divided into Telecommunication, Consumer Electronics, Industrial, Military and Aerospace, Automotive, and Others.
Regional analysis
Geographically, the Global 3D Semiconductor Packaging Market is divided into global regions like Europe, North America, Asia- Pacific, Middle East, LATAM, and Africa.
Major players
Advanced Semiconductor Engineering Inc., Siliconware Precision Induatries Co., Ltd., Xilinx Inc., Taiwan Semiconductor Manufacturing Co. Ltd., and ams AG, Amkor Tecnhology Inc., Intel Corporation, Jiangsu Changjiang Electronics Technology Co., Ltd., STMicroelectronics NV, Samsung Electronics Corporation Ltd., among others are some of the major players in the Global 3D Semiconductor Packaging Market.
Table of Contents
1 Executive Summary
2 Market Introduction
- 2.1 Definition
- 2.2 Scope of the Study
- 2.3 List of Assumptions
- 2.4 Market Structure
3 Research Methodology
- 3.1 Research Process
- 3.2 Secondary Research
- 3.3 Primary Research
- 3.4 Forecast Model
4 Market Dynamics
- 4.1 Introduction
- 4.2 Drivers
- 4.2.1 Rising Demand for Miniaturization of Portable Electronics Devices
- 4.2.2 Increasing Use in the Automotive Industry
- 4.2.3 Driver Impact Analysis
- 4.3 Restraints
- 4.3.1 Concerns Regarding Heat Dissipation
- 4.3.2 Restraint Impact Analysis
- 4.4 Opportunities
- 4.4.1 Proliferation of IoT and Wireless Devices
- 4.5 Supply Chain Analysis
- 4.6 Porter's Five Forces Model
- 4.6.1 Threat of New Entrants
- 4.6.2 Bargaining Power of Suppliers
- 4.6.3 Threat of Substitutes
- 4.6.4 Bargaining Power of Buyers
- 4.6.5 Intensity of Rivalry
5 Market Alerts
- 5.1 Market Trends
- 5.1.1 Current Development in 3D Substrate Technology
- 5.2 Use Cases
- 5.2.1 3D Packaging Technology for Microelectronics
- 5.2.2 3D heterogenous integration technologies to support Artificial Intelligence (AI)
6 Global 3D Semiconductor Packaging Market, By Type
- 6.1 Overview
- 6.1.1 3D SIP (System in Package)
- 6.1.2 3D WLP
- 6.1.3 3D SIC
- 6.1.4 3D IC
7 Global 3D Semiconductor Packaging Market, By Packaging Method
- 7.1 Overview
- 7.1.1 Package on Package
- 7.1.2 Through Silicon Via (TSV)
- 7.1.3 Through Glass Via (TGV)
- 7.1.4 Others
8 Global 3D Semiconductor Packaging Market, By End-User
- 8.1 Overview
- 8.1.1 Consumer Electronics
- 8.1.2 Telecommunication`
- 8.1.3 Industrial
- 8.1.4 Automotive
- 8.1.5 Military & Aerospace
9 3D Semiconductor Packaging Market, By Region
- 9.1 Introduction
- 9.2 North America
- 9.2.1 US
- 9.2.2 Canada
- 9.2.3 Mexico
- 9.3 Europe
- 9.3.1 UK
- 9.3.2 Germany
- 9.3.3 France
- 9.3.4 Rest of Europe
- 9.4 Asia-Pacific
- 9.4.1 China
- 9.4.2 Japan
- 9.4.3 India
- 9.4.4 South Korea
- 9.4.5 Rest of Asia-Pacific
- 9.5 Rest of the World
- 9.5.1 Middle East & Africa
- 9.5.2 Latin America
10 Competitive Landscape
11 Company Profiles
- 11.1 Jiangsu Changjiang Electronics Technology Co., Ltd
- 11.1.1 Company Overviews
- 11.1.2 Financial Overview
- 11.1.3 Products/Solution/Services Offered
- 11.1.4 Key Developments
- 11.2 Intel Corporation
- 11.2.1 Company Overviews
- 11.2.2 Financial Overview
- 11.2.3 Products/Solution/Services Offered
- 11.2.4 Key Developments
- 11.2.5 SWOT Analysis
- 11.2.6 Key Strategy
- 11.3 Siliconware Precision Industries Co., Ltd
- 11.3.1 Company Overviews
- 11.3.2 Financial Overview
- 11.3.3 Products/Solution/Services Offered
- 11.3.4 Key Developments
- 11.4 STMicroelectronics NV
- 11.4.1 Company Overviews
- 11.4.2 Financial Overview
- 11.4.3 Products/Solution/Services Offered
- 11.4.4 Key Developments
- 11.4.5 SWOT Analysis
- 11.4.6 Key Strategy
- 11.5 Xilinx Inc.
- 11.5.1 Company Overviews
- 11.5.2 Financial Overview
- 11.5.3 Products/Solution/Services Offered
- 11.5.4 Key Developments
- 11.5.5 SWOT Analysis
- 11.5.6 Key Strategy
- 11.6 Samsung Electronics Corporation Ltd
- 11.6.1 Company Overview
- 11.6.2 Financial Overview
- 11.6.3 Products/Services Offered
- 11.6.4 Key Developments
- 11.6.5 SWOT Analysis
- 11.6.6 Key Strategy
- 11.7 Taiwan Semiconductor Manufacturing Co. Ltd.
- 11.7.1 Company Overview
- 11.7.2 Financial Overview
- 11.7.3 Products/Services Offered
- 11.7.4 Key Developments
- 11.7.5 SWOT Analysis
- 11.7.6 Key Strategy
- 11.8 Advanced Semiconductor Engineering Inc.
- 11.8.1 Company Overview
- 11.8.2 Financial Overview
- 11.8.3 Products/Services Offered
- 11.8.4 Key Developments
- 11.8.5 SWOT Analysis
- 11.8.6 Key Strategy
- 11.9 ams AG
- 11.9.1 Company Overview
- 11.9.2 Financial Overview
- 11.9.3 Products/Services Offered
- 11.9.4 Key Developments
- 11.9.5 SWOT Analysis
- 11.9.6 Key Strategy
- 11.1 Amkor Technology Inc.
- 11.10.1 Company Overview
- 11.10.2 Financial Overview
- 11.10.3 Products/Services Offered
- 11.10.4 Key Developments
- 11.10.5 SWOT Analysis
- 11.10.6 Key Strategy
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