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市場調査レポート

ダイボンダーの世界市場 (~2024年):半自動・全自動

Die Bonder Equipment Market by Type (Semiautomatic Die Bonder, Fully Automatic Die Bonder), Bonding Technique, Supply Chain Participant (IDM Firms, OSAT Companies), Device, Application (Consumer Electronics), and Region - Global Forecast to 2024

発行 MarketsandMarkets 商品コード 917250
出版日 ページ情報 英文 168 Pages
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価格
本日の銀行送金レート: 1USD=109.90円で換算しております。
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ダイボンダーの世界市場 (~2024年):半自動・全自動 Die Bonder Equipment Market by Type (Semiautomatic Die Bonder, Fully Automatic Die Bonder), Bonding Technique, Supply Chain Participant (IDM Firms, OSAT Companies), Device, Application (Consumer Electronics), and Region - Global Forecast to 2024
出版日: 2019年11月21日 ページ情報: 英文 168 Pages
概要

世界のダイボンダーの市場は予測期間中3.5%のCAGR (年間複合成長率) で推移し、2019年の8億2000万米ドルから、2024年には9億7200万米ドルの規模に成長すると予測されています。小型電子部品需要の拡大、IoTデバイスへのスタックダイ技術の導入拡大などの要因が同市場の成長を推進しています。

当レポートでは、世界のダイボンダーの市場を調査し、市場の定義と概要、市場成長への各種影響因子および市場機会の分析、タイプ・ボンディング技術・事業者区分・デバイス・用途・地域/主要国別の動向と市場規模の推移と予測、競合環境、主要企業のプロファイルなどをまとめています。

第1章 イントロダクション

第2章 調査手法

第3章 エグゼクティブサマリー

第4章 重要考察

第5章 市場概要

  • イントロダクション
  • 市場力学
    • 成長推進因子
    • 成長抑制因子
    • 市場機会
    • 課題
  • バリューチェーン分析

第6章 ダイボンダー市場の分析・予測:タイプ別

  • イントロダクション
  • 手動
  • 半自動
  • 全自動

第7章 ダイボンダー市場の分析・予測:ボンディング技術別

  • イントロダクション
  • エポキシ
  • 共晶ダイ接合
  • ソフトソルダー
  • その他

第8章 ダイボンダー市場の分析・予測:事業者区分別

  • イントロダクション
  • OSAT (半導体後工程受託生産) 企業
  • IDM (垂直統合型デバイスメーカー)

第9章 ダイボンダー市場の分析・予測:デバイス別

  • イントロダクション
  • オプトエレクトロニクス
  • MEMS・MOEMS
  • パワーデバイス

第10章 ダイボンダー市場の分析・予測:用途別

  • イントロダクション
  • CE製品
  • 自動車
  • 工業用
  • 通信
  • ヘルスケア
  • 航空宇宙・防衛

第11章 ダイボンダー市場の分析・予測:地域・主要国別

  • イントロダクション
  • アジア太平洋
  • 南北アメリカ
  • 欧州・中東・アフリカ

第12章 競合環境

  • イントロダクション
  • 企業ランキング
  • 競合シナリオ
  • 競合リーダーシップマッピング
  • 製品ポートフォリオ
  • 事業戦略

第13章 企業プロファイル

  • 主要企業
    • BE SEMICONDUCTOR INDUSTRIES N.V.
    • ASM PACIFIC TECHNOLOGY LTD.
    • KULICKE & SOFFA
    • MYCRONIC AB
    • PALOMAR TECHNOLOGIES, INC.
    • WEST*BOND, INC.
    • MICROASSEMBLY TECHNOLOGIES, LTD.
    • FINETECH GMBH & CO. KG
    • DR. TRESKY AG
    • SMART EQUIPMENT TECHNOLOGY 153
  • 他の有力企業
    • HYBOND, INC.
    • 澁谷工業
    • ANZA TECHNOLOGY, INC.
    • PAROTEQ GMBH
    • TRESKY GMBH
    • DIAS AUTOMATION (HK) LTD
    • 新川
    • FOUR TECHNOS CO., LTD. 158
    • FASFORD TECHNOLOGY CO., LTD. 159
    • UNITEMP GMBH 159
    • TPT WIRE BONDER GMBH & CO. KG 160

第14章 付録

図表

LIST OF TABLES

  • TABLE 1: DIE BONDER EQUIPMENT MARKET, BY TYPE, 2016-2024 (USD MILLION)
  • TABLE 2: MANUAL DIE BONDER EQUIPMENT MARKET, BY BONDING TECHNIQUE, 2016-2024 (USD MILLION)
  • TABLE 3: MANUAL DIE BONDER EQUIPMENT MARKET, BY DEVICE, 2016-2024 (USD MILLION)
  • TABLE 4: MANUAL DIE BONDER EQUIPMENT MARKET FOR OPTOELECTRONICS, BY APPLICATION, 2016-2024 (USD MILLION)
  • TABLE 5: MANUAL DIE BONDER EQUIPMENT MARKET FOR MEMS AND MOEMS, BY APPLICATION, 2016-2024 (USD MILLION)
  • TABLE 6: MANUAL DIE BONDER EQUIPMENT MARKET FOR POWER DEVICES, BY APPLICATION, 2016-2024 (USD MILLION)
  • TABLE 7: MANUAL DIE BONDER EQUIPMENT MARKET, BY APPLICATION, 2016-2024 (USD MILLION)
  • TABLE 8: MANUAL DIE BONDER EQUIPMENT MARKET, BY SUPPLY CHAIN PARTICIPANT, 2016-2024 (USD MILLION)
  • TABLE 9: SEMIAUTOMATIC DIE BONDER EQUIPMENT MARKET, BY BONDING TECHNIQUE, 2016-2024 (USD MILLION)
  • TABLE 10: SEMIAUTOMATIC DIE BONDER EQUIPMENT MARKET, BY DEVICE, 2016-2024 (USD MILLION)
  • TABLE 11: SEMIAUTOMATIC DIE BONDER EQUIPMENT MARKET FOR OPTOELECTRONICS, BY APPLICATION, 2016-2024 (USD MILLION)
  • TABLE 12: SEMIAUTOMATIC DIE BONDER EQUIPMENT MARKET FOR MEMS AND MOEMS, BY APPLICATION, 2016-2024 (USD MILLION)
  • TABLE 13: SEMIAUTOMATIC DIE BONDER EQUIPMENT MARKET FOR POWER DEVICES, BY APPLICATION, 2016-2024 (USD MILLION)
  • TABLE 14: SEMIAUTOMATIC DIE BONDER EQUIPMENT MARKET, BY APPLICATION, 2016-2024 (USD MILLION)
  • TABLE 15: SEMIAUTOMATIC DIE BONDER EQUIPMENT MARKET, BY SUPPLY CHAIN PARTICIPANT, 2016-2024 (USD MILLION)
  • TABLE 16: FULLY AUTOMATIC DIE BONDER EQUIPMENT MARKET, BY BONDING TECHNIQUE, 2016-2024 (USD MILLION)
  • TABLE 17: FULLY AUTOMATIC DIE BONDER EQUIPMENT MARKET, BY DEVICE, 2016-2024 (USD MILLION)
  • TABLE 18: FULLY AUTOMATIC DIE BONDER EQUIPMENT MARKET FOR OPTOELECTRONICS, BY APPLICATION, 2016-2024 (USD MILLION)
  • TABLE 19: FULLY AUTOMATIC DIE BONDER EQUIPMENT MARKET FOR MEMS AND MOEMS, BY APPLICATION, 2016-2024 (USD MILLION)
  • TABLE 20: FULLY AUTOMATIC DIE BONDER EQUIPMENT MARKET FOR POWER DEVICES, BY APPLICATION, 2016-2024 (USD MILLION)
  • TABLE 21: FULLY AUTOMATIC DIE BONDER EQUIPMENT MARKET, BY APPLICATION, 2016-2024 (USD MILLION)
  • TABLE 22: FULLY AUTOMATIC DIE BONDER EQUIPMENT MARKET, BY SUPPLY CHAIN PARTICIPANT, 2016-2024 (USD MILLION)
  • TABLE 23: DIE BONDER EQUIPMENT MARKET, BY BONDING TECHNIQUE, 2016-2024 (USD MILLION)
  • TABLE 24: DIE BONDER EQUIPMENT MARKET FOR EPOXY BONDING TECHNIQUE, BY TYPE, 2016-2024 (USD MILLION)
  • TABLE 25: DIE BONDER EQUIPMENT MARKET FOR EUTECTIC BONDING TECHNIQUE, BY TYPE, 2016-2024 (USD MILLION)
  • TABLE 26: DIE BONDER EQUIPMENT MARKET FOR SOFT SOLDER BONDING TECHNIQUE, BY TYPE, 2016-2024 (USD MILLION)
  • TABLE 27: DIE BONDER EQUIPMENT MARKET FOR OTHER BONDING TECHNIQUES, BY TYPE, 2016-2024 (USD MILLION)
  • TABLE 28: DIE BONDER EQUIPMENT MARKET, BY SUPPLY CHAIN PARTICIPANT, 2016-2024 (USD MILLION)
  • TABLE 29: DIE BONDER EQUIPMENT MARKET FOR OSAT COMPANIES, BY TYPE, 2016-2024 (USD MILLION)
  • TABLE 30: DIE BONDER EQUIPMENT MARKET FOR OSAT COMPANIES, BY DEVICE, 2016-2024 (USD MILLION)
  • TABLE 31: DIE BONDER EQUIPMENT MARKET FOR OPTOELECTRONICS IN OSAT COMPANIES, BY REGION, 2016-2024 (USD MILLION)
  • TABLE 32: DIE BONDER EQUIPMENT MARKET FOR MEMS AND MOEMS IN OSAT COMPANIES, BY REGION, 2016-2024 (USD MILLION)
  • TABLE 33: DIE BONDER EQUIPMENT MARKET FOR POWER DEVICES IN OSAT COMPANIES, BY REGION, 2016-2024 (USD THOUSAND)
  • TABLE 34: DIE BONDER EQUIPMENT MARKET FOR OSAT COMPANIES, BY REGION, 2016-2024 (USD MILLION)
  • TABLE 35: DIE BONDER EQUIPMENT MARKET FOR OSAT COMPANIES, BY APPLICATION, 2016-2024 (USD MILLION)
  • TABLE 36: DIE BONDER EQUIPMENT MARKET FOR IDM FIRMS, BY TYPE, 2016-2024 (USD MILLION)
  • TABLE 37: DIE BONDER EQUIPMENT MARKET FOR IDM FIRMS, BY DEVICE, 2016-2024 (USD MILLION)
  • TABLE 38: DIE BONDER EQUIPMENT MARKET FOR OPTOELECTRONICS IN IDM FIRMS, BY REGION, 2016-2024 (USD THOUSAND)
  • TABLE 39: DIE BONDER EQUIPMENT MARKET FOR MEMS AND MOEMS IN IDM FIRMS, BY REGION, 2016-2024 (USD MILLION)
  • TABLE 40: DIE BONDER EQUIPMENT MARKET FOR POWER DEVICES IN IDM FIRMS, BY REGION, 2016-2024 (USD MILLION)
  • TABLE 41: DIE BONDER EQUIPMENT MARKET FOR IDM FIRMS, BY REGION, 2016-2024 (USD MILLION)
  • TABLE 42: DIE BONDER EQUIPMENT MARKET FOR IDM FIRMS, BY APPLICATION, 2016-2024 (USD THOUSAND)
  • TABLE 43: DIE BONDER EQUIPMENT MARKET, BY DEVICE, 2016-2024 (USD MILLION)
  • TABLE 44: DIE BONDER EQUIPMENT MARKET FOR OPTOELECTRONICS, BY TYPE, 2016-2024 (USD MILLION)
  • TABLE 45: DIE BONDER EQUIPMENT MARKET FOR OPTOELECTRONICS, BY SUPPLY CHAIN PARTICIPANT, 2016-2024 (USD MILLION)
  • TABLE 46: DIE BONDER EQUIPMENT MARKET FOR OPTOELECTRONICS, BY APPLICATION, 2016-2024 (USD MILLION)
  • TABLE 47: DIE BONDER EQUIPMENT MARKET FOR OPTOELECTRONICS, BY REGION, 2016-2024 (USD MILLION)
  • TABLE 48: DIE BONDER EQUIPMENT MARKET IN APAC FOR OPTOELECTRONICS, BY COUNTRY, 2016-2024 (USD MILLION)
  • TABLE 49: DIE BONDER EQUIPMENT MARKET IN AMERICAS FOR OPTOELECTRONICS, BY COUNTRY, 2016-2024 (USD MILLION)
  • TABLE 50: DIE BONDER EQUIPMENT MARKET IN EMEA FOR OPTOELECTRONICS, BY COUNTRY, 2016-2024 (USD THOUSAND)
  • TABLE 51: DIE BONDER EQUIPMENT MARKET FOR MEMS AND MOEMS, BY TYPE, 2016-2024 (USD MILLION)
  • TABLE 52: DIE BONDER EQUIPMENT MARKET FOR MEMS AND MOEMS, BY SUPPLY CHAIN PARTICIPANT, 2016-2024 (USD MILLION)
  • TABLE 53: DIE BONDER EQUIPMENT MARKET FOR MEMS AND MOEMS, BY APPLICATION, 2016-2024 (USD MILLION)
  • TABLE 54: DIE BONDER EQUIPMENT MARKET FOR MEMS AND MOEMS, BY REGION, 2016-2024 (USD MILLION)
  • TABLE 55: DIE BONDER EQUIPMENT MARKET IN APAC FOR MEMS AND MOEMS, BY COUNTRY, 2016-2024 (USD MILLION)
  • TABLE 56: DIE BONDER EQUIPMENT MARKET IN AMERICAS FOR MEMS AND MOEMS, BY COUNTRY, 2016-2024 (USD MILLION)
  • TABLE 57: DIE BONDER EQUIPMENT MARKET FOR MEMS AND MOEMS IN EMEA, BY COUNTRY, 2016-2024 (USD THOUSAND)
  • TABLE 58: DIE BONDER EQUIPMENT MARKET FOR POWER DEVICES, BY TYPE, 2016-2024 (USD MILLION)
  • TABLE 59: DIE BONDER EQUIPMENT MARKET FOR POWER DEVICES, BY SUPPLY CHAIN PARTICIPANT, 2016-2024 (USD MILLION)
  • TABLE 60: DIE BONDER EQUIPMENT MARKET FOR POWER DEVICES, BY APPLICATION, 2016-2024 (USD MILLION)
  • TABLE 61: DIE BONDER EQUIPMENT MARKET FOR POWER DEVICES, BY REGION, 2016-2024 (USD MILLION)
  • TABLE 62: DIE BONDER EQUIPMENT MARKET IN APAC FOR POWER DEVICES, BY COUNTRY, 2016-2024 (USD MILLION)
  • TABLE 63: DIE BONDER EQUIPMENT MARKET IN AMERICAS FOR POWER DEVICES, BY COUNTRY, 2016-2024 (USD MILLION)
  • TABLE 64: DIE BONDER EQUIPMENT MARKET IN EMEA FOR POWER DEVICES, BY COUNTRY, 2016-2024 (USD THOUSAND)
  • TABLE 65: DIE BONDER EQUIPMENT MARKET, BY APPLICATION, 2016-2024 (USD MILLION)
  • TABLE 66: DIE BONDER EQUIPMENT MARKET FOR CONSUMER ELECTRONICS APPLICATIONS, BY TYPE, 2016-2024 (USD MILLION)
  • TABLE 67: DIE BONDER EQUIPMENT MARKET FOR CONSUMER ELECTRONICS APPLICATIONS, BY SUPPLY CHAIN PARTICIPANT, 2016-2024 (USD MILLION)
  • TABLE 68: DIE BONDER EQUIPMENT MARKET FOR CONSUMER ELECTRONICS APPLICATIONS, BY DEVICE, 2016-2024 (USD MILLION)
  • TABLE 69: DIE BONDER EQUIPMENT MARKET FOR AUTOMOTIVE APPLICATIONS, BY TYPE, 2016-2024 (USD MILLION)
  • TABLE 70: DIE BONDER EQUIPMENT MARKET FOR AUTOMOTIVE APPLICATIONS, BY SUPPLY CHAIN PARTICIPANT, 2016-2024 (USD MILLION)
  • TABLE 71: DIE BONDER EQUIPMENT MARKET FOR AUTOMOTIVE APPLICATIONS, BY DEVICE, 2016-2024 (USD MILLION)
  • TABLE 72: DIE BONDER EQUIPMENT MARKET FOR INDUSTRIAL APPLICATIONS, BY TYPE, 2016-2024 (USD MILLION)
  • TABLE 73: DIE BONDER EQUIPMENT MARKET FOR INDUSTRIAL APPLICATIONS, BY SUPPLY CHAIN PARTICIPANT, 2016-2024 (USD MILLION)
  • TABLE 74: DIE BONDER EQUIPMENT MARKET FOR INDUSTRIAL APPLICATIONS, BY DEVICE, 2016-2024 (USD MILLION)
  • TABLE 75: DIE BONDER EQUIPMENT MARKET FOR TELECOMMUNICATIONS APPLICATIONS, BY TYPE, 2016-2024 (USD MILLION)
  • TABLE 76: DIE BONDER EQUIPMENT MARKET FOR TELECOMMUNICATIONS APPLICATIONS, BY SUPPLY CHAIN PARTICIPANT, 2016-2024 (USD MILLION)
  • TABLE 77: DIE BONDER EQUIPMENT MARKET FOR TELECOMMUNICATIONS APPLICATIONS, BY DEVICE, 2016-2024 (USD MILLION)
  • TABLE 78: DIE BONDER EQUIPMENT MARKET FOR HEALTHCARE APPLICATIONS, BY TYPE, 2016-2024 (USD MILLION)
  • TABLE 79: DIE BONDER EQUIPMENT MARKET FOR HEALTHCARE APPLICATIONS, BY SUPPLY CHAIN PARTICIPANT, 2016-2024 (USD MILLION)
  • TABLE 80: DIE BONDER EQUIPMENT MARKET FOR HEALTHCARE APPLICATIONS, BY DEVICE, 2016-2024 (USD MILLION)
  • TABLE 81: DIE BONDER EQUIPMENT MARKET FOR AEROSPACE & DEFENSE APPLICATIONS, BY TYPE, 2016-2024 (USD MILLION)
  • TABLE 82: DIE BONDER EQUIPMENT MARKET FOR AEROSPACE & DEFENSE APPLICATIONS, BY SUPPLY CHAIN PARTICIPANT, 2016-2024 (USD THOUSAND)
  • TABLE 83: DIE BONDER EQUIPMENT MARKET FOR AEROSPACE & DEFENSE APPLICATIONS, BY DEVICE, 2016-2024 (USD MILLION)
  • TABLE 84: DIE BONDER EQUIPMENT MARKET, BY REGION, 2016-2024 (USD MILLION)
  • TABLE 85: DIE BONDER EQUIPMENT MARKET IN APAC, BY SUPPLY CHAIN PARTICIPANT, 2016-2024 (USD MILLION)
  • TABLE 86: DIE BONDER EQUIPMENT MARKET IN APAC, BY DEVICE, 2016-2024 (USD MILLION)
  • TABLE 87: DIE BONDER EQUIPMENT MARKET IN APAC, BY COUNTRY, 2016-2024 (USD MILLION)
  • TABLE 88: DIE BONDER EQUIPMENT MARKET IN TAIWAN, BY DEVICE, 2016-2024 (USD MILLION)
  • TABLE 89: DIE BONDER EQUIPMENT MARKET IN CHINA, BY DEVICE, 2016-2024 (USD MILLION)
  • TABLE 90: DIE BONDER EQUIPMENT MARKET IN JAPAN, BY DEVICE, 2016-2024 (USD MILLION)
  • TABLE 91: DIE BONDER EQUIPMENT MARKET IN SOUTH KOREA, BY DEVICE, 2016-2024 (USD MILLION)
  • TABLE 92: DIE BONDER EQUIPMENT MARKET IN REST OF APAC, BY DEVICE, 2016-2024 (USD MILLION)
  • TABLE 93: DIE BONDER EQUIPMENT MARKET IN AMERICAS, BY SUPPLY CHAIN PARTICIPANT, 2016-2024 (USD MILLION)
  • TABLE 94: DIE BONDER EQUIPMENT MARKET IN AMERICAS, BY DEVICE, 2016-2024 (USD MILLION)
  • TABLE 95: DIE BONDER EQUIPMENT MARKET IN AMERICAS, BY COUNTRY, 2016-2024 (USD MILLION)
  • TABLE 96: DIE BONDER EQUIPMENT MARKET IN US, BY DEVICE, 2016-2024 (USD MILLION)
  • TABLE 97: DIE BONDER EQUIPMENT MARKET IN CANADA, BY DEVICE, 2016-2024 (USD THOUSAND)
  • TABLE 98: DIE BONDER EQUIPMENT MARKET IN REST OF AMERICAS, BY DEVICE, 2016-2024 (USD MILLION)
  • TABLE 99: DIE BONDER EQUIPMENT MARKET IN EMEA, BY SUPPLY CHAIN PARTICIPANT, 2016-2024 (USD MILLION)
  • TABLE 100: DIE BONDER EQUIPMENT MARKET IN EMEA, BY DEVICE, 2016-2024 (USD MILLION)
  • TABLE 101: DIE BONDER EQUIPMENT MARKET IN EMEA, BY COUNTRY, 2016-2024 (USD MILLION)
  • TABLE 102: DIE BONDER EQUIPMENT MARKET IN GERMANY, BY DEVICE, 2016-2024 (USD MILLION)
  • TABLE 103: DIE BONDER EQUIPMENT MARKET IN UK, BY DEVICE, 2016-2024 (USD THOUSAND)
  • TABLE 104: DIE BONDER EQUIPMENT MARKET IN ISRAEL, BY DEVICE, 2016-2024 (USD THOUSAND)
  • TABLE 105: DIE BONDER EQUIPMENT MARKET IN FRANCE, BY DEVICE, 2016-2024 (USD THOUSAND)
  • TABLE 106: DIE BONDER EQUIPMENT MARKET IN REST OF EMEA, BY DEVICE, 2016-2024 (USD THOUSAND)
  • TABLE 107: PRODUCT LAUNCHES, 2017-2019
  • TABLE 108: PARTNERSHIPS, COLLABORATIONS, CONTRACTS AND AGREEMENTS, 2017-2019
  • TABLE 109: ACQUISITIONS, 2018
  • TABLE 110: EXPANSIONS, 2017-2019

LIST OF FIGURES

  • FIGURE 1: DIE BONDER EQUIPMENT MARKET: RESEARCH DESIGN
  • FIGURE 2: MARKET SIZE ESTIMATION METHODOLOGY: APPROACH 1 (SUPPLY SIDE): REVENUE GENERATED FROM PRODUCTS IN DIE BONDER EQUIPMENT MARKET
  • FIGURE 3: MARKET SIZE ESTIMATION METHODOLOGY: APPROACH 2 BOTTOM-UP (SUPPLY SIDE): ILLUSTRATIVE EXAMPLE OF COMPANY IN DIE BONDER EQUIPMENT MARKET
  • FIGURE 4: MARKET SIZE ESTIMATION METHODOLOGY: APPROACH 2 - BOTTOM-UP (DEMAND SIDE): SUPPLY CHAIN PARTICIPANTS COVERED UNDER DIE BONDER EQUIPMENT MARKET
  • FIGURE 5: MARKET SIZE ESTIMATION METHODOLOGY: APPROACH 3 - BOTTOM-UP MARKET ESTIMATION FOR DIE BONDER EQUIPMENT, BY TYPE
  • FIGURE 6: MARKET SIZE ESTIMATION METHODOLOGY: BOTTOM-UP APPROACH
  • FIGURE 7: MARKET SIZE ESTIMATION METHODOLOGY: TOP-DOWN APPROACH
  • FIGURE 8: DATA TRIANGULATION
  • FIGURE 9: RESEARCH STUDY ASSUMPTIONS
  • FIGURE 10: MARKET FOR FULLY AUTOMATIC DIE BONDER EQUIPMENT TO GROW AT HIGHEST CAGR DURING 2019-2024
  • FIGURE 11: DIE BONDER EQUIPMENT MARKET FOR IDM FIRMS TO GROW AT HIGHER CAGR DURING 2019-2024
  • FIGURE 12: AUTOMOTIVE APPLICATION TO WITNESS HIGHEST CAGR IN DIE BONDER EQUIPMENT MARKET DURING 2019-2024
  • FIGURE 13: APAC TO BE FASTEST-GROWING REGION IN DIE BONDER EQUIPMENT MARKET DURING FORECAST PERIOD
  • FIGURE 14: INCREASING DEMAND FOR MINIATURIZED ELECTRONIC DEVICES TO SPUR DIE BONDER EQUIPMENT MARKET GROWTH DURING FORECAST PERIOD
  • FIGURE 15: CHINA TO RECORD HIGHEST CAGR IN OVERALL DIE BONDER EQUIPMENT MARKET DURING FORECAST PERIOD
  • FIGURE 16: EPOXY BONDING TECHNIQUE TO CONTINUE TO ACCOUNT FOR LARGEST SHARE OF DIE BONDER EQUIPMENT MARKET TILL 2024
  • FIGURE 17: CONSUMER ELECTRONICS AND APAC LIKELY TO BE LARGEST SHAREHOLDERS IN OVERALL DIE BONDER EQUIPMENT MARKET, BY APPLICATION AND REGION, RESPECTIVELY, IN 2024
  • FIGURE 18: GROWING DEMAND OF MINIATURIZATION OF ELECTRONIC DEVICES TO DRIVE DIE BONDER EQUIPMENT MARKET
  • FIGURE 19: DIE BONDER EQUIPMENT MARKET DRIVERS AND THEIR IMPACT
  • FIGURE 20: DIE BONDER EQUIPMENT MARKET RESTRAINTS AND THEIR IMPACT
  • FIGURE 21: DIE BONDER EQUIPMENT MARKET OPPORTUNITIES AND THEIR IMPACT
  • FIGURE 22: DIE BONDER EQUIPMENT MARKET CHALLENGES AND THEIR IMPACT
  • FIGURE 23: DIE BONDER EQUIPMENT ECOSYSTEM: MAJOR VALUE IS ADDED BY PRODUCT MANUFACTURERS
  • FIGURE 24: DIE BONDER EQUIPMENT MARKET, BY TYPE
  • FIGURE 25: MARKET FOR FULLY AUTOMATIC DIE BONDERS TO GROW AT HIGHEST CAGR DURING FORECAST PERIOD
  • FIGURE 26: MANUAL DIE BONDER EQUIPMENT MARKET FOR AUTOMOTIVE APPLICATION TO GROW AT HIGHEST CAGR DURING FORECAST PERIOD
  • FIGURE 27: IDM FIRMS TO EXHIBIT HIGHER CAGR IN SEMIAUTOMATIC DIE BONDING EQUIPMENT MARKET DURING FORECAST PERIOD
  • FIGURE 28: FULLY DIE BONDER EQUIPMENT MARKET FOR AUTOMOTIVE APPLICATION TO GROW AT HIGHEST CAGR DURING FORECAST PERIOD
  • FIGURE 29: DIE BONDER EQUIPMENT MARKET, BY BONDING TECHNIQUE
  • FIGURE 30: MARKET FOR EUTECTIC BONDING TECHNIQUE TO GROW AT HIGHEST CAGR DURING FORECAST PERIOD
  • FIGURE 31: FULLY AUTOMATIC SOFT SOLDER DIE BONDERS TO DOMINATE MARKET DURING FORECAST PERIOD
  • FIGURE 32: DIE BONDER EQUIPMENT MARKET, BY SUPPLY CHAIN PARTICIPANT
  • FIGURE 33: IDM FIRMS TO COMMAND DIE BONDER EQUIPMENT MARKET DURING 2019-2024
  • FIGURE 34: APAC TO REGISTER HIGHEST CAGR IN DIE BONDER EQUIPMENT MARKET FOR OSAT COMPANIES DURING FORECAST PERIOD
  • FIGURE 35: AUTOMOTIVE APPLICATION TO RECORD HIGHEST CAGR IN DIE BONDER MARKET FOR IDM FIRMS DURING FORECAST PERIOD
  • FIGURE 36: DIE BONDER EQUIPMENT MAREKT, BY DEVICE
  • FIGURE 37: DIE BONDER EQUIPMENT MARKET FOR MEMS AND MOEMS DEVICES TO GROW AT HIGHEST CAGR DURING FORECAST PERIOD
  • FIGURE 38: APAC TO REGISTER HIGHEST CAGR IN DIE BONDER EQUIPMENT MARKET FOR OPTOELECTRONICS DURING FORECAST PERIOD
  • FIGURE 39: FULLY AUTOMATIC DIE BONDER EQUIPMENT MARKET FOR MEMS AND MOEMS DEVICES TO GROW AT HIGHEST CAGR DURING FORECAST PERIOD
  • FIGURE 40: GERMANY TO DOMINATE DIE BONDER EQUIPMENT MARKET FOR MEMS AND MOEMS DURING FORECAST PERIOD
  • FIGURE 41: AUTOMOTIVE APPLICATION TO WITNESS HIGHEST CAGR IN DIE BONDER EQUIPMENT MARKET FOR POWER DEVICES DURING FORECAST PERIOD
  • FIGURE 42: DIE BONDER EQUIPMENT MAREKT, BY APPLICATION
  • FIGURE 43: DIE BONDER EQUIPMENT MARKET FOR AUTOMOTIVE APPLICATION TO GROW AT HIGHEST CAGR DURING FORECAST PERIOD
  • FIGURE 44: FULLY AUTOMATIC DIE BONDERS TO DOMINATE MARKET FOR AUTOMOTIVE APPLICATIONS DURING FORECAST PERIOD
  • FIGURE 45: MEMS AND MOEMS DEVICES TO EXHIBIT HIGHEST CAGR IN DIE BONDER EQUIPMENT MARKET FOR INDUSTRIAL APPLICATIONS DURING FORECAST PERIOD
  • FIGURE 46: IDM FIRMS TO LEAD DIE BONDER EQUIPMENT MARKET FOR HEALTHCARE APPLICATIONS DURING FORECAST PERIOD
  • FIGURE 47: DIE BONDER EQUIPMENT IN APAC TO GROW AT HIGHEST CARG DURING FORECAST PERIOD
  • FIGURE 48: APAC: DIE BONDER EQUIPMENT MARKET SNAPSHOT
  • FIGURE 49: MEMS AND MOEMS DEVICES TO RECORD HIGHEST CARG IN DIE BONDER EQUIPMENT MARKET IN JAPAN DURING FORECAST PERIOD
  • FIGURE 50: AMERICAS: DIE BONDER EQUIPMENT MARKET SNAPSHOT
  • FIGURE 51: DIE BONDER EQUIPMENT MARKET IN CANADA FOR MEMS AND MOEMS DEVICES TO GROW AT HIGHEST CARG DURING FORECAST PERIOD
  • FIGURE 52: EMEA: DIE BONDER EQUIPMENT MARKET SNAPSHOT
  • FIGURE 53: GERMANY TO REGISTER HIGHEST CARG IN DIE BONDER EQUIPMENT MARKET IN EMEA DURING FORECAST PERIOD
  • FIGURE 54: MEMES AND MOEMS DEVICES TO EXHIBIT HIGHEST CARG IN FRENCH DIE BONDER EQUIPMENT MARKET DURING FORECAST PERIOD
  • FIGURE 55: COMPANIES ADOPTED PRODUCT LAUNCHES AS KEY GROWTH STRATEGIES FROM 2017 TO 2019
  • FIGURE 56: RANKING OF TOP 5 PLAYERS IN DIE BONDER EQUIPMENT MARKET
  • FIGURE 57: DIE BONDER EQUIPMENT MARKET (GLOBAL) COMPETITIVE LEADERSHIP MAPPING, 2018
  • FIGURE 58: BE SEMICONDUCTOR INDUSTRIES N.V.: COMPANY SNAPSHOT
  • FIGURE 59: ASM PACIFIC TECHNOLOGY LTD: COMPANY SNAPSHOT
  • FIGURE 60: KULICKE & SOFFA: COMPANY SNAPSHOT
  • FIGURE 61: MYCRONIC AB: COMPANY SNAPSHOT
目次
Product Code: SE 7446

"Die bonder equipment market is projected to grow at CAGR of 3.5% from 2019 to 2024"

The global die bonder equipment market size is projected to grow from USD 820 million in 2019 to USD 972 million by 2024, at a CAGR of 3.5% from 2019 to 2024. Key factors fueling the growth of this market include the growing demand for miniature electronic components and the increasing adoption of stacked die technology in IoT devices.

"Market for fully automatic die bonders is projected to grow at highest CAGR during forecast period"

Among different types, fully automatic die bonders are projected to lead the market from 2019 to 2024. Fully automatic die bonders can work on different modules, such as wire bonding, wedge bonding, flip chip bonding, and die bonding. Fully automatic die bonders are required for the assembly and packaging of the high volume of consumer products. In addition, fully automatic die bonder equipment provide micron-level placement accuracy, ranging from ± 1.5μm to ± 0.5μm, necessary for the fabrication of electronic components used in medical devices, automobile systems, and consumer electronics, which is expected to propel the market growth in the near future.

" Market for eutectic bonding technique is projected to grow at highest CAGR during 2019-2024"

Among bonding techniques, the eutectic bonding technique is projected to witness the highest CAGR in the die bonder equipment market from 2019 to 2024. This technique requires higher operating temperature during the bonding process, and the bond created is not only robust but can also remain intact even in harsh environments. Semiconductor components fabricated using the eutectic bonding technique are suitable for products that are used in automotive, telecommunications, and industrial applications due to their robustness, which is expected to contribute significantly to the growth of the market for the eutectic bonding technique in the near future.

"Consumer electronics application accounted for largest market share in 2018"

Among applications, the consumer electronics segment is projected to lead the die bonder equipment market from 2019 to 2024. The largest market size is due to the high demand for miniaturized consumer electronic products such as smartphones, wearables, and white goods that provide advantages such as compactness and durability. These miniaturized products make use of several devices, such as optoelectronics, MEMS, and MOEMS. All these devices require die bonding equipment in the assembly process of these components.

"Asia Pacific (APAC) is expected to hold largest share of die bonder equipment market in 2024"

APAC is expected to hold the largest share of the die bonder equipment industry in 2024. More than 60% of OSAT players present across the world have their headquarters in the APAC region. These OSAT companies use die bonding equipment in the semiconductor fabrication process. Additionally, an increasing number of IDMs in the region is expected to boost the die bonder equipment market growth in the near future. Similarly, the mass production of electronic products, such as smartphones, wearables, and white goods, in China and Taiwan is also expected to accelerate market growth in APAC.

Breakdown of Profiles of Primary Participants:

  • By Company: Tier 1 = 45%, Tier 2 = 35%, and Tier 3 = 20%
  • By Designation: C-level Executives = 35%, Managers = 43%, and Others (Managers, Scientists, and University Researchers) = 22%
  • By Region: APAC = 38%, Americas = 37%, and EMEA = 25%

Major players profiled in this report:

  • BE Semiconductor Industries N.V.
  • ASM Pacific Technology Ltd.
  • Kulicke & Soffa
  • Mycronic AB
  • Palomar Technologies, Inc.
  • West*Bond, Inc.
  • MicroAssembly Technologies, Ltd.
  • Finetech GmbH & Co. KG
  • Dr. Tresky AG
  • Smart Equipment Technology

Research Coverage:

This report offers detailed insights into the die bonder equipment market based on type, bonding technique, supply chain participant, device, application, and region. Based on type, the die bonder equipment industry has been segmented into manual, semiautomatic, and fully automatic die bonders. Based on bonding technique, the market has been divided into epoxy, eutectic, soft solder, and other bonding techniques. Based on supply chain participant, the die bonder equipment market has been classified into IDM firms and OSAT companies. Based on device, the market has been divided into optoelectronics, MEMS and MOEMS, and power devices. Based on application, the die bonder equipment market has been classified into consumer electronics, automotive, industrial, telecommunications, healthcare, and aerospace & defense. The market has been studied for Asia Pacific (APAC), the Americas; and Europe, the Middle East, and Africa (EMEA).

Reasons to Buy the Report:

The report is expected to help market leaders/new entrants in this market in the following ways:

  • 1. This report segments the die bonder equipment market comprehensively and provides the closest approximations of the overall size of the market, as well as its segments and subsegments.
  • 2. The report is expected to help stakeholders understand the pulse of the market and provide them with information about key drivers, restraints, challenges, and opportunities.
  • 3. This report aims at helping stakeholders in obtaining an improved understanding of their competitors and gaining insights to enhance their position in the market. The competitive landscape section includes the competitor ecosystem of the market, as well as growth strategies such as product launches, expansions, agreements, partnerships, collaborations, and acquisitions adopted by major market players.

TABLE OF CONTENTS

1 INTRODUCTION

  • 1.1 STUDY OBJECTIVES
  • 1.2 MARKET DEFINITION AND SCOPE
    • 1.2.1 INCLUSIONS AND EXCLUSIONS
  • 1.3 SCOPE
    • 1.3.1 MARKETS COVERED
    • 1.3.2 YEARS CONSIDERED
  • 1.4 CURRENCY
  • 1.5 LIMITATIONS
  • 1.6 MARKET STAKEHOLDERS

2 RESEARCH METHODOLOGY

  • 2.1 RESEARCH DATA
    • 2.1.1 SECONDARY DATA
      • 2.1.1.1 Secondary sources
    • 2.1.2 PRIMARY DATA
      • 2.1.2.1 Breakdown of primary interviews
      • 2.1.2.2 Key data from primary sources
  • 2.2 MARKET SIZE ESTIMATION
    • 2.2.1 BOTTOM-UP APPROACH
      • 2.2.1.1 Approach for capturing market size by bottom-up analysis (demand side)
    • 2.2.2 TOP-DOWN APPROACH
      • 2.2.2.1 Approach for capturing market share by top-down analysis (supply side)
  • 2.3 MARKET BREAKDOWN AND DATA TRIANGULATION
  • 2.4 RESEARCH ASSUMPTIONS

3 EXECUTIVE SUMMARY

4 PREMIUM INSIGHTS

  • 4.1 ATTRACTIVE GROWTH OPPORTUNITIES IN DIE BONDER EQUIPMENT MARKET
  • 4.2 DIE BONDER EQUIPMENT MARKET, BY COUNTRY
  • 4.3 DIE BONDER EQUIPMENT MARKET, BY BONDING TECHNIQUE
  • 4.4 DIE BONDER EQUIPMENT MARKET, BY APPLICATION AND REGION

5 MARKET OVERVIEW

  • 5.1 INTRODUCTION
  • 5.2 MARKET DYNAMICS
    • 5.2.1 DRIVERS
      • 5.2.1.1 Growing demand for miniature electronic components
      • 5.2.1.2 Increasing adoption of stacked die technology in IoT devices
    • 5.2.2 RESTRAINTS
      • 5.2.2.1 High cost of ownership
    • 5.2.3 OPPORTUNITIES
      • 5.2.3.1 Increasing demand for 3D semiconductor assembly and packaging
    • 5.2.4 CHALLENGES
      • 5.2.4.1 Mechanical unbalance of moving parts
  • 5.3 VALUE CHAIN ANALYSIS
    • 5.3.1 DIE BONDER EQUIPMENT VALUE CHAIN

6 DIE BONDER EQUIPMENT MARKET, BY TYPE

  • 6.1 INTRODUCTION
  • 6.2 MANUAL DIE BONDERS
    • 6.2.1 MANUAL DIE BONDERS PLAY SIGNIFICANT ROLE IN R&D, TESTING, AND PROTOTYPING APPLICATIONS
  • 6.3 SEMIAUTOMATIC DIE BONDERS
    • 6.3.1 SEMIAUTOMATIC DIE BONDERS ARE EASY TO USE AND FLEXIBLE
  • 6.4 FULLY AUTOMATIC DIE BONDERS
    • 6.4.1 FULLY AUTOMATIC DIE BONDERS TO CONTINUE TO REGISTER HIGHEST CAGR AND LARGEST MARKET SIZE DURING 2019-2024

7 DIE BONDER EQUIPMENT MARKET, BY BONDING TECHNIQUE

  • 7.1 INTRODUCTION
  • 7.2 EPOXY
    • 7.2.1 EPOXY BONDING TO ACCOUNT FOR LARGEST SHARE OF DIE BONDER EQUIPMENT MARKET DUE TO LOW COST AND LOW CURING TEMPERATURE
  • 7.3 EUTECTIC
    • 7.3.1 DIE BONDER EQUIPMENT MARKET FOR EUTECTIC BONDING TECHNIQUE TO GROW AT HIGHEST CAGR DURING FORECAST PERIOD
  • 7.4 SOFT SOLDER
    • 7.4.1 SOFT SOLDER BOIDNG PLAYS SIGNIFICANT ROLE IN FABRICATION OF POWER DEVICES
  • 7.5 OTHERS
    • 7.5.1 ASSEMBLY OF TEMPERATURE-RESTRICTED PRODUCTS FUEL GROWTH OF MARKET FOR OTHER BONDING TECHNIQUES

8 DIE BONDER EQUIPMENT MARKET, BY SUPPLY CHAIN PARTICIPANT

  • 8.1 INTRODUCTION
  • 8.2 OSAT COMPANIES
    • 8.2.1 OSAT COMPANIES TO PLAY SIGNIFICANT ROLE OWING TO CHALLENGES FACED BY FOUNDRIES RELATED TO ASSEMBLY AND PACKAGING
  • 8.3 IDM FIRMS
    • 8.3.1 IDM FIRMS TO CONTINUE TO LEAD DIE BONDER EQUIPMENT MARKET OWING TO THEIR ABILITY TO PROGRESS RAPIDLY WITH INNOVATIVE TECHNOLOGIES DURING FORECAST PERIOD

9 DIE BONDER EQUIPMENT MARKET, BY DEVICE

  • 9.1 INTRODUCTION
  • 9.2 OPTOELECTRONICS
    • 9.2.1 OPTOELECTRONICS TO CONTINUE TO ACCOUNT FOR LARGEST SHARE OF DIE BONDER EQUIPMENT MARKET DURING FORECAST PERIOD
  • 9.3 MEMS AND MOEMS
    • 9.3.1 AUTOMOTIVE, CONSUMER ELECTRONICS, HEALTHCARE, AND TELECOMMUNICATIONS SECTORS CONTRIBUTE MOST TO HIGHEST CAGR OF MEMS AND MOEMS DEVICES IN COMING YEARS
  • 9.4 POWER DEVICES
    • 9.4.1 DIE ATTACH PACKAGING METHODOLOGY ENABLES POWER DEVICES TO WITHSTAND EXTREME OPERATING CONDITIONS

10 DIE BONDER EQUIPMENT MARKET, BY APPLICATION

  • 10.1 INTRODUCTION
  • 10.2 CONSUMER ELECTRONICS
    • 10.2.1 INCREASING ADOPTION OF MINIATURIZED AND LIGHTWEIGHT ELECTRONIC PRODUCTS ACCELERATES DEMAND FOR DIE BONDERS
  • 10.3 AUTOMOTIVE
    • 10.3.1 RISING USE OF MEMS TO ENSURE IMPROVED PASSENGER SAFETY WOULD SPUR DEMAND FOR DIE BONDERS IN AUTOMOTIVE APPLICATIONS
  • 10.4 INDUSTRIAL
    • 10.4.1 GROWING IMPLEMENTATION OF INDUSTRIAL IOT TO DRIVE GROWTH OF DIE BONDER EQUIPMENT MARKET FOR INDUSTRIAL APPLICATIONS
  • 10.5 TELECOMMUNICATIONS
    • 10.5.1 RISING DEPLOYMENT OF 5G NETWORK INFRASTRUCTURE CONTRIBUTING TO GROWTH OF DIE BONDER EQUIPMENT MARKET FOR TELECOMMUNICATIONS APPLICATIONS
  • 10.6 HEALTHCARE
    • 10.6.1 SURGING DEMAND FOR NANO-SIZED AND LIGHTWEIGHT HEALTHCARE GADGETS AUGMENTS ADOPTION OF DIE BONDERS IN HEALTHCARE APPLICATIONS
  • 10.7 AEROSPACE & DEFENSE
    • 10.7.1 INCREASING DEMAND FOR ROBUST COMPONENTS BOOSTING DIE BONDER MARKET GROWTH FOR AEROSPACE & DEFENSE APPLICATIONS

11 GEOGRAPHIC ANALYSIS

  • 11.1 INTRODUCTION
  • 11.2 APAC
    • 11.2.1 TAIWAN
      • 11.2.1.1 Presence of many key OSAT companies drives market growth in Taiwan
    • 11.2.2 CHINA
      • 11.2.2.1 Growing trend of miniaturization in consumer electronic products spurs growth of market in China
    • 11.2.3 JAPAN
      • 11.2.3.1 Increasing demand for passenger cars and commercial vehicles and expanding presence of market players in country fuels growth of die bonder equipment market in Japan
    • 11.2.4 SOUTH KOREA
      • 11.2.4.1 South Korea to continue to account for largest size of market in APAC during 2019-2024
    • 11.2.5 REST OF APAC
      • 11.2.5.1 Strong presence of die bonder equipment manufactures accelerates market growth in Rest of APAC
  • 11.3 AMERICAS
    • 11.3.1 US
      • 11.3.1.1 US to continue to lead die bonder equipment market in Americas during 2019-2024
    • 11.3.2 CANADA
      • 11.3.2.1 Government initiatives toward developing electric vehicle infrastructure to create growth opportunities for die bonder equipment market in near future
    • 11.3.3 REST OF AMERICAS
      • 11.3.3.1 Increasing demand for IoT and 5G surging demand for die bonding equipment in Rest of Americas
  • 11.4 EMEA
    • 11.4.1 GERMANY
      • 11.4.1.1 Adoption of smart homes and connected cars to spur demand in Germany
    • 11.4.2 UK
      • 11.4.2.1 Deployment of 5G infrastructure fueling market growth in UK
    • 11.4.3 ISRAEL
      • 11.4.3.1 Presence of fabrication plants of IDM companies including Intel and Tower Jazz to boost market growth in Israel
    • 11.4.4 FRANCE
      • 11.4.4.1 Developed communication network has prompted market growth in France
    • 11.4.5 REST OF EMEA
      • 11.4.5.1 Initiatives of die bonder equipment manufacturers to propel market growth in Rest of EMEA

12 COMPETITIVE LANDSCAPE

  • 12.1 INTRODUCTION
  • 12.2 MARKET RANKING ANALYSIS, 2018
  • 12.3 COMPETITIVE SCENARIO
    • 12.3.1 PRODUCT LAUNCHES
    • 12.3.2 PARTNERSHIPS, COLLABORATIONS, CONTRACTS AND AGREEMENTS
    • 12.3.3 ACQUISITIONS
    • 12.3.4 EXPANSIONS
  • 12.4 COMPETITIVE LEADERSHIP MAPPING
    • 12.4.1 VISIONARY LEADERS
    • 12.4.2 DYNAMIC DIFFERENTIATORS
    • 12.4.3 INNOVATORS
    • 12.4.4 EMERGING COMPANIES
  • 12.5 STRENGTH OF PRODUCT PORTFOLIO
  • 12.6 BUSINESS STRATEGY EXCELLENCE

13 COMPANY PROFILES

  • 13.1 KEY PLAYERS

(Business overview, Products offered, Recent Developments, SWOT Analysis, MNM view)*

    • 13.1.1 BE SEMICONDUCTOR INDUSTRIES N.V.
    • 13.1.2 ASM PACIFIC TECHNOLOGY LTD.
    • 13.1.3 KULICKE & SOFFA
    • 13.1.4 MYCRONIC AB
    • 13.1.5 PALOMAR TECHNOLOGIES, INC.
    • 13.1.6 WEST*BOND, INC.
    • 13.1.7 MICROASSEMBLY TECHNOLOGIES, LTD.
    • 13.1.8 FINETECH GMBH & CO. KG
    • 13.1.9 DR. TRESKY AG
    • 13.1.10 SMART EQUIPMENT TECHNOLOGY
  • 13.2 RIGHT TO WIN
  • 13.3 OTHER KEY PLAYERS
    • 13.3.1 HYBOND, INC.
    • 13.3.2 SHIBUYA CORPORATION
    • 13.3.3 ANZA TECHNOLOGY, INC.
    • 13.3.4 PAROTEQ GMBH
    • 13.3.5 TRESKY GMBH
    • 13.3.6 DIAS AUTOMATION (HK) LTD
    • 13.3.7 SHINKAWA LTD.
    • 13.3.8 FOUR TECHNOS CO., LTD.
    • 13.3.9 FASFORD TECHNOLOGY CO., LTD.
    • 13.3.10 UNITEMP GMBH
    • 13.3.11 TPT WIRE BONDER GMBH & CO. KG

Details on Business overview, Products offered, Recent Developments, SWOT Analysis, MNM view might not be captured in case of unlisted companies.

14 APPENDIX

  • 14.1 DISCUSSION GUIDE
  • 14.2 KNOWLEDGE STORE: MARKETSANDMARKETS' SUBSCRIPTION PORTAL
  • 14.3 AVAILABLE CUSTOMIZATIONS
  • 14.4 RELATED REPORTS
  • 14.5 AUTHOR DETAILS
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