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市場調査レポート

成形回路部品 (MID) の世界市場の予測 2023年:レーザーダイレクトストラクチャリング (LDS) ・二個取り成形・フィルム技術

Molded Interconnect Device (MID) Market by Process (LDS, 2-Shot Molding, Film Techniques), Product (Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting), Industry, and Geography - Global Forecast to 2023

発行 MarketsandMarkets 商品コード 691689
出版日 ページ情報 英文 92 Pages
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成形回路部品 (MID) の世界市場の予測 2023年:レーザーダイレクトストラクチャリング (LDS) ・二個取り成形・フィルム技術 Molded Interconnect Device (MID) Market by Process (LDS, 2-Shot Molding, Film Techniques), Product (Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting), Industry, and Geography - Global Forecast to 2023
出版日: 2018年08月31日 ページ情報: 英文 92 Pages
概要

世界の成形回路部品 (MID) 市場は、2018年の8億9,410万米ドルから、2023年までに17億9,830万米ドルへ、15.0%のCAGR (年間複合成長率) で拡大すると予測されています。MID市場の成長を促進する主な要因は、医療機器におけるMIDの利用拡大、消費者エレクトロニクス産業における小型化需要の増加、およびE-waste (電気電子機器廃棄物) を削減するニーズの高まりです。しかし、LDS機器メーカーの技術独占は、同市場の成長を抑制する主要因となっています。

当レポートでは、世界の成形回路部品 (MID) 市場を調査し、市場概要、市場成長推進因子・阻害因子および市場機会の分析、各セグメント・地域/主要国別の動向と市場規模の推移と予測、競合環境と市場シェア、主要企業のプロファイルなどをまとめています。

FIGURE 12 MOLDED INTERCONNECT DEVICE MARKET

第1章 イントロダクション

第2章 調査手法

第3章 エグゼクティブサマリー

第4章 重要考察

  • 成形回路部品 (MID) 市場成長にとっての魅力的な機会
  • 消費者エレクトロニクス産業向け成形回路部品 (MID) 市場:製品タイプ別
  • アンテナ・接続モジュール向け成形回路部品 (MID) 市場:産業別
  • 欧州における成形回路部品 (MID) 市場:プロセス別
  • 成形回路部品 (MID) 市場:地域別

第5章 市場概要

  • イントロダクション
  • 市場力学
    • 成長推進因子
    • 成長阻害因子
    • 市場機会
    • 課題

第6章 産業動向

  • イントロダクション
  • インモールドエレクトロニクス (IME)
    • 用途
    • 構成要素

第7章 成形回路部品 (MID) 市場:プロセス別

  • イントロダクション
  • レーザーダイレクトストラクチャリング (LDS)
  • 二個取り成形
  • フィルム技術

第8章 成形回路部品 (MID) 市場:製品タイプ別

  • イントロダクション
  • アンテナ・接続モジュール
  • センサー
  • コネクター・スイッチ
  • 照明
  • その他

第9章 成形回路部品 (MID) 市場:産業別

  • イントロダクション
  • 通信
  • 消費者エレクトロニクス
  • 自動車
  • 医療
  • 工業

第10章 地域分析

  • イントロダクション
  • 北米
  • 欧州
  • アジア太平洋 (APAC)
  • その他 (ROW)

第11章 競合情勢

  • イントロダクション
  • 企業ランキング分析
  • 競合状況・動向

第12章 企業プロファイル

  • イントロダクション
  • 主要企業
    • MOLEX
    • LPKF LASER & ELECTRONICS
    • TE CONNECTIVITY
    • HARTING
    • ARLINGTON PLATING COMPANY
    • JOHNAN
    • MID SOLUTIONS
    • 2E MECHATRONIC
    • MULTIPLE DIMENSIONS
  • その他の重要企業
    • LASER MICRONICS
    • TEPROSA
    • AXON CABLE
    • S2P
    • SUZHOU CICOR TECHNOLOGY CO. LTD
    • IME VENDORS

第13章 付録

図表

LIST OF TABLES

  • TABLE 1: MOLDED INTERCONNECT DEVICE MARKET, BY PROCESS, 2015-2023 (USD MILLION)
  • TABLE 2: MOLDED INTERCONNECT DEVICE MARKET, BY PRODUCT TYPE, 2015-2023 (USD MILLION)
  • TABLE 3: MOLDED INTERCONNECT DEVICE MARKET FOR ANTENNAE AND CONNECTIVITY MODULES, BY INDUSTRY, 2015-2023 (USD MILLION)
  • TABLE 4: MOLDED INTERCONNECT DEVICE MARKET FOR SENSORS, BY INDUSTRY, 2015-2023 (USD MILLION)
  • TABLE 5: MOLDED INTERCONNECT DEVICE MARKET FOR CONNECTORS AND SWITCHES, BY INDUSTRY, 2015-2023 (USD MILLION)
  • TABLE 6: MOLDED INTERCONNECT DEVICE MARKET FOR LIGHTING, BY INDUSTRY, 2015-2023 (USD MILLION)
  • TABLE 7: MOLDED INTERCONNECT DEVICE MARKET FOR OTHERS, BY INDUSTRY, 2015-2023 (USD MILLION)
  • TABLE 8: MOLDED INTERCONNECT DEVICE MARKET, BY INDUSTRY, 2015-2023 (USD MILLION)
  • TABLE 9: MOLDED INTERCONNECT DEVICE MARKET FOR TELECOMMUNICATIONS, BY PRODUCT TYPE, 2015-2023 (USD MILLION)
  • TABLE 10: MOLDED INTERCONNECT DEVICE MARKET FOR CONSUMER ELECTRONICS, BY PRODUCT TYPE, 2015-2023 (USD MILLION)
  • TABLE 11: MOLDED INTERCONNECT DEVICE MARKET FOR AUTOMOTIVE, BY PRODUCT TYPE, 2015-2023 (USD MILLION)
  • TABLE 12: MOLDED INTERCONNECT DEVICE MARKET FOR MEDICAL, BY PRODUCT TYPE, 2015-2023 (USD MILLION)
  • TABLE 13: MOLDED INTERCONNECT DEVICE MARKET FOR INDUSTRIAL, BY PRODUCT TYPE, 2015-2023 (USD MILLION)
  • TABLE 14: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2015-2023 (USD MILLION)
  • TABLE 15: MOLDED INTERCONNECT DEVICE MARKET IN NORTH AMERICA, BY COUNTRY, 2015-2023 (USD MILLION)
  • TABLE 16: MOLDED INTERCONNECT DEVICE MARKET IN NORTH AMERICA, BY PROCESS, 2015-2023 (USD MILLION)
  • TABLE 17: MOLDED INTERCONNECT DEVICE MARKET IN NORTH AMERICA, BY INDUSTRY, 2015-2023 (USD MILLION)
  • TABLE 18: MOLDED INTERCONNECT DEVICE MARKET IN EUROPE, BY COUNTRY, 2015-2023 (USD MILLION)
  • TABLE 19: MOLDED INTERCONNECT DEVICE MARKET IN EUROPE, BY PROCESS, 2015-2023 (USD MILLION)
  • TABLE 20: MOLDED INTERCONNECT DEVICE MARKET IN EUROPE, BY INDUSTRY, 2015-2023 (USD MILLION)
  • TABLE 21: MOLDED INTERCONNECT DEVICE MARKET IN APAC, BY COUNTRY, 2015-2023 (USD MILLION)
  • TABLE 22: MOLDED INTERCONNECT DEVICE MARKET IN APAC, BY PROCESS, 2015-2023 (USD MILLION)
  • TABLE 23: MOLDED INTERCONNECT DEVICE MARKET IN APAC, BY INDUSTRY, 2015-2023 (USD MILLION)
  • TABLE 24: MOLDED INTERCONNECT DEVICE MARKET IN ROW, BY REGION, 2015-2023 (USD MILLION)
  • TABLE 25: MOLDED INTERCONNECT DEVICE MARKET IN ROW, BY PROCESS, 2015-2023 (USD MILLION)
  • TABLE 26: MOLDED INTERCONNECT DEVICE MARKET IN ROW, BY INDUSTRY, 2015-2023 (USD MILLION)
  • TABLE 27: RANKING OF KEY PLAYERS IN MOLDED INTERCONNECT DEVICE MARKET (2017)
  • TABLE 28: EXPANSIONS 2017-2018
  • TABLE 29: MERGER AND ACQUISITIONS, 2015-2017
  • TABLE 30: PRODUCT DEVELOPMENT, 2017
  • TABLE 31: AGREEMENT, 2017

LIST OF FIGURES

  • FIGURE 1: MOLDED INTERCONNECT DEVICE MARKET SEGMENTATION
  • FIGURE 2: MOLDED INTERCONNECT DEVICES MARKET: REPORT DESIGN
  • FIGURE 3: PROCESS FLOW
  • FIGURE 4: MARKET SIZE ESTIMATION METHODOLOGY: BOTTOM-UP APPROACH
  • FIGURE 5: MARKET SIZE ESTIMATION METHODOLOGY: TOP-DOWN APPROACH
  • FIGURE 6: DATA TRIANGULATION
  • FIGURE 7: ASSUMPTIONS FOR RESEARCH STUDY
  • FIGURE 8: LASER DIRECT STRUCTURING TO LEAD MOLDED INTERCONNECT DEVICE MARKET DURING FORECAST PERIOD
  • FIGURE 9: ANTENNAE AND CONNECTIVITY MODULES TO HOLD LARGEST SIZE OF MOLDED INTERCONNECT DEVICE MARKET BY 2023
  • FIGURE 10: MOLDED INTERCONNECT DEVICE MARKET FOR AUTOMOTIVE TO GROW AT HIGHEST CAGR DURING FORECAST PERIOD
  • FIGURE 11: MOLDED INTERCONNECT DEVICE MARKET TO GROW AT HIGHEST CAGR IN GERMANY DURING FORECAST PERIOD
  • FIGURE 12: INCREASING USE OF MOLDED INTERCONNECT DEVICES IN AUTOMOTIVE INDUSTRY TO OFFER OPPORTUNITIES FOR MARKET GROWTH
  • FIGURE 13: ANTENNAE AND CONNECTIVITY MODULES TO LEAD MOLDED INTERCONNECT DEVICE MARKET FOR CONSUMER ELECTRONICS DURING FORECAST PERIOD
  • FIGURE 14: AUTOMOTIVE TO GROW AT HIGHEST CAGR DURING FORECAST PERIOD
  • FIGURE 15: LASER DIRECT STRUCTURING HELD LARGEST SHARE OF MOLDED INTERCONNECT DEVICE MARKET IN EUROPE IN 2017
  • FIGURE 16: MOLDED INTERCONNECT DEVICE MARKET TO GROW AT HIGHEST CAGR IN EUROPE FROM 2018 TO 2023
  • FIGURE 17: RISING DEMAND FOR MINIATURIZATION IN CONSUMER ELECTRONICS INDUSTRY DRIVING THE MID MARKET
  • FIGURE 18: MOLDED INTERCONNECT DEVICE MARKET: GEOGRAPHIC SNAPSHOT
  • FIGURE 19: MOLDED INTERCONNECT DEVICE MARKET SNAPSHOT: NORTH AMERICA
  • FIGURE 20: MOLDED INTERCONNECT DEVICE MARKET SNAPSHOT: EUROPE
  • FIGURE 21: MOLDED INTERCONNECT DEVICE MARKET SNAPSHOT: APAC
  • FIGURE 22: COMPANIES ADOPTED EXPANSION AS KEY GROWTH STRATEGY DURING 2016-2018
  • FIGURE 23: LPKF: COMPANY SNAPSHOT
  • FIGURE 24: TE CONNECTIVITY: COMPANY SNAPSHOT
目次
Product Code: SE 6567

MID market to grow at significant rate during 2018-2023

The MID market is expected to reach USD 1,798.3 million by 2023 from USD 894.1 million in 2018, at a CAGR of 15.0% from 2018 to 2023. Key factors driving the growth of the MID market include the increasing use of MID in medical devices, rising demand for miniaturization in the consumer electronics industry, and growing need to reduce e-waste. However, the technological monopoly of LDS equipment manufacturer is a major factor restraining the growth of the market.

Sensors to boost MID market growth during forecast period

MIDs are used in sensors for a variety of industrial and automotive applications. Industrial applications include temperature sensors, motion sensors, pressure sensors, and flow sensors, among others. In automotive, MID-based sensors are used in adaptive cruise control system, central locking, and climate control applications. MID miniaturizes devices, which helps reduce the weight of the overall sensor system and increases functionality, resulting in low-cost end-use devices. The use of MID will increase in sensors, which will further drive the MID market growth in the coming years.

Asia Pacific to account for largest size of MID market during forecast period

APAC is expected to offer lucrative opportunities for the MID market growth owing to the growing base for communication infrastructure, communication devices, and consumer electronics. APAC is one of the key regions for players dealing with smartphones and wearable devices. The trend of miniaturization of components in smartphones and wearables will drive the MID market in this region. This region is expected to witness mass commercialization of 5G by 2020.

Following is the breakup of the profiles of primary participants for the report:

  • By Company Type: Tier 1 - 20%, Tier 2 - 55%, and Tier 3 - 25%
  • By Designation: C-Level Executives - 45%, Directors - 30%, and Others - 25%
  • By Region: North America - 45%, Europe - 30%, APAC - 20%, and RoW - 5%

Key players operating in the MID market are: Molex (US), LPKF (Germany), TE Connectivity (Switzerland), HARTING (Germany), APC (US), JOHNAN (Japan), MID Solutions (Germany), 2E mechatronic (Germany), and Multiple Dimensions (Switzerland).

Research Coverage:

This research report categorizes the MID market by process, product type, industry, and geography. By process, the market has been segmented into LDS, 2-shot molding, and film techniques. By product type, the MID market has been classified into antennae & connectivity modules, connectors & switches, sensors, lighting, and others. By industry, the market has been segmented into telecommunications, consumer electronics, automotive, medical, and industrial. Moreover, the report covers the market in 4 major regions-North America, Europe, APAC, and RoW.

Key Benefits of Buying the Report:

  • Illustrative segmentation, analysis, and forecast for the market based on process, product type, industry, and geography have been conducted to give an overall view of the MID market.
  • Major drivers, restraints, opportunities, and challenges pertaining to the MID market have been detailed in this report.
  • A detailed competitive landscape, including the revenues of key players, has been presented.

TABLE OF CONTENTS

1. INTRODUCTION

  • 1.1. STUDY OBJECTIVES
  • 1.2. DEFINITION
  • 1.3. STUDY SCOPE
    • 1.3.1. YEARS CONSIDERED FOR STUDY
  • 1.4. CURRENCY
  • 1.5. STAKEHOLDERS

2. RESEARCH METHODOLOGY

  • 2.1. RESEARCH DATA
    • 2.1.1. SECONDARY DATA
      • 2.1.1.1. Key data from secondary sources
    • 2.1.2. PRIMARY DATA
      • 2.1.2.1. Key data from primary sources
      • 2.1.2.2. Breakdown of primaries
  • 2.2. MARKET SIZE ESTIMATION
    • 2.2.1. BOTTOM-UP APPROACH
    • 2.2.2. TOP-DOWN APPROACH
  • 2.3. MARKET BREAKDOWN AND DATA TRIANGULATION
  • 2.4. RESEARCH ASSUMPTIONS

3. EXECUTIVE SUMMARY

4. PREMIUM INSIGHT

  • 4.1. ATTRACTIVE OPPORTUNITIES FOR MOLDED INTERCONNECT DEVICE MARKET GROWTH
  • 4.2. MOLDED INTERCONNECT DEVICE MARKET FOR CONSUMER ELECTRONICS INDUSTRY, BY PRODUCT TYPE
  • 4.3. MOLDED INTERCONNECT DEVICE MARKET FOR ANTENNAE AND CONNECTIVITY MODULES, BY INDUSTRY
  • 4.4. MOLDED INTERCONNECT DEVICE MARKET IN EUROPE, BY PROCESS
  • 4.5. MOLDED INTERCONNECT DEVICE MARKET, BY REGION

5. MARKET OVERVIEW

  • 5.1. INTRODUCTION
  • 5.2. MARKET DYNAMICS
    • 5.2.1. DRIVERS
      • 5.2.1.1. Increasing use of MID in medical devices
      • 5.2.1.2. Rising demand for miniaturization in consumer electronics industry
      • 5.2.1.3. Increasing need to reduce e-waste
    • 5.2.2. RESTRAINTS
      • 5.2.2.1. Technological monopoly of LDS equipment manufacturer
    • 5.2.3. OPPORTUNITIES
      • 5.2.3.1. Rising use of MID in automotive industry
      • 5.2.3.2. Growth in IoT devices
    • 5.2.4. CHALLENGES
      • 5.2.4.1. Incompatibility with electronic packages

6. INDUSTRY TRENDS

  • 6.1. INTRODUCTION
  • 6.2. IN-MOLD ELECTRONICS (IME)
    • 6.2.1. APPLICATIONS
    • 6.2.2. BUILDING BLOCKS

7. MOLDED INTERCONNECT DEVICE MARKET, BY PROCESS

  • 7.1. INTRODUCTION
  • 7.2. LASER DIRECT STRUCTURING
  • 7.3. 2-SHOT MOLDING
  • 7.4. FILM TECHNIQUES

8. MOLDED INTERCONNECT DEVICE MARKET, BY PRODUCT TYPE

  • 8.1. INTRODUCTION
  • 8.2. ANTENNAE AND CONNECTIVITY MODULES
  • 8.3. SENSORS
  • 8.4. CONNECTORS AND SWITCHES
  • 8.5. LIGHTING
  • 8.6. OTHERS

9. MOLDED INTERCONNECT DEVICE MARKET, BY INDUSTRY

  • 9.1. INTRODUCTION
  • 9.2. TELECOMMUNICATIONS
  • 9.3. CONSUMER ELECTRONICS
  • 9.4. AUTOMOTIVE
  • 9.5. MEDICAL
  • 9.6. INDUSTRIAL

10. GEOGRAPHIC ANALYSIS

  • 10.1. INTRODUCTION
  • 10.2. NORTH AMERICA
    • 10.2.1. US
    • 10.2.2. CANADA
  • 10.3. EUROPE
    • 10.3.1. GERMANY
    • 10.3.2. SWITZERLAND
    • 10.3.3. FRANCE
    • 10.3.4. REST OF EUROPE
  • 10.4. ASIA PACIFIC (APAC)
    • 10.4.1. CHINA
    • 10.4.2. JAPAN
    • 10.4.3. SOUTH KOREA
    • 10.4.4. REST OF APAC
  • 10.5. REST OF THE WORLD (ROW)
    • 10.5.1. SOUTH AMERICA
    • 10.5.2. MIDDLE EAST AND AFRICA

11. COMPETITIVE LANDSCAPE

  • 11.1. INTRODUCTION
  • 11.2. MARKET PLAYER RANKING ANALYSIS
  • 11.3. COMPETITIVE SITUATIONS AND TRENDS
    • 11.3.1. EXPANSIONS
    • 11.3.2. MERGER AND ACQUISITIONS
    • 11.3.3. PRODUCT DEVELOPMENT
    • 11.3.4. AGREEMENT

12. COMPANY PROFILES (Business overview, Products offered, Recent developments, MNM view, SWOT analysis)*

  • 12.1. INTRODUCTION
  • 12.2. KEY PLAYERS
    • 12.2.1. MOLEX
    • 12.2.2. LPKF LASER & ELECTRONICS
    • 12.2.3. TE CONNECTIVITY
    • 12.2.4. HARTING
    • 12.2.5. ARLINGTON PLATING COMPANY
    • 12.2.6. JOHNAN
    • 12.2.7. MID SOLUTIONS
    • 12.2.8. 2E MECHATRONIC
    • 12.2.9. MULTIPLE DIMENSIONS
  • 12.3. OTHER IMPORTANT PLAYERS
    • 12.3.1. LASER MICRONICS
    • 12.3.2. TEPROSA
    • 12.3.3. AXON CABLE
    • 12.3.4. S2P
    • 12.3.5. SUZHOU CICOR TECHNOLOGY CO. LTD
    • 12.3.6. IME VENDORS
      • 12.3.6.1. DowDUPont
      • 12.3.6.2. TactoTek
      • 12.3.6.3. Dura Tech Industries
      • 12.3.6.4. Tekra
      • 12.3.6.5. Yomura Technologies

*Business overview, Products offered, Recent developments, MNM view, SWOT analysis might not be captured in case of unlisted companies.

13. APPENDIX

  • 13.1. INSIGHTS OF INDUSTRY EXPERTS
  • 13.2. DISCUSSION GUIDE
  • 13.3. KNOWLEDGE STORE: MARKETSANDMARKETS' SUBSCRIPTION PORTAL
  • 13.4. AVAILABLE CUSTOMIZATIONS
  • 13.5. RELATED REPORTS
  • 13.6. AUTHOR DETAILS
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