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市場調査レポート

回路材料の世界市場の予測 〜2023年:基板材料・導電性材料・外層材料

Circuit Materials Market by Material Class (Substrate, Conducting Material, Outer Layer), Substrate (Fiberglass Epoxy, Paper-Phenolic), Conducting Material, Outer Layer (LIPSM, Dry Film Photoimageable), Application, Region - Global Forecast 2023

発行 MarketsandMarkets 商品コード 662058
出版日 ページ情報 英文 124 Pages
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回路材料の世界市場の予測 〜2023年:基板材料・導電性材料・外層材料 Circuit Materials Market by Material Class (Substrate, Conducting Material, Outer Layer), Substrate (Fiberglass Epoxy, Paper-Phenolic), Conducting Material, Outer Layer (LIPSM, Dry Film Photoimageable), Application, Region - Global Forecast 2023
出版日: 2018年07月10日 ページ情報: 英文 124 Pages
概要

世界の回路材料の市場は予測期間中3.8%のCAGR (年間複合成長率) で推移し、2018年の305億8000万米ドルから、2023年には368億5000万米ドルの規模に成長すると予測されています。エレクトロニクス産業における技術的発展に伴う回路材料需要の拡大が同市場の成長を推進する見通しです。

当レポートでは、世界の回路材料の市場を調査し、市場の定義と概要、市場成長への影響因子および市場機会の分析、材料クラス・基板材料・導電性材料・外層材料・用途・地域/主要国別の動向と市場規模の推移と予測、競合環境、主要企業のプロファイルなどをまとめています。

FIGURE 13 THE CIRCUIT MATERIALS MARKET

第1章 イントロダクション

第2章 調査手法

第3章 エグゼクティブサマリー

第4章 重要考察

第5章 市場概要

  • イントロダクション
  • 市場力学
    • 成長推進因子
    • 成長抑制因子
    • 市場機会
    • 課題
  • ポーターのファイブフォース分析

第6章 回路材料市場の分析・予測:材料クラス別

  • イントロダクション
  • 基板
  • 導電性材料
  • 外層

第7章 回路材料市場の分析・予測:基板材料別

  • イントロダクション
  • ガラス繊維・エポキシ
  • 紙・フェノール
  • CEM
  • ポリイミド
  • その他

第8章 回路材料市場の分析・予測:導電性材料別

  • イントロダクション
  • その他

第9章 回路材料市場の分析・予測:外層材料別

  • イントロダクション
  • 液状インク感光性ソルダーマスク
  • 感光性ドライフィルム
  • その他
    • 液状エポキシ
    • 上部・下部サイドマスク

第10章 回路材料市場の分析・予測:用途別

  • イントロダクション
  • 通信
  • 工業エレクトロニクス
  • 自動車
  • 航空宇宙・防衛
  • その他

第11章 回路材料市場の分析・予測:地域別

  • イントロダクション
  • アジア太平洋
    • 中国
    • 台湾
    • 韓国
    • 日本
    • インド
  • 北米
    • 米国
    • カナダ
  • 欧州
    • ドイツ
    • イタリア
    • フランス
    • 英国
  • ラテンアメリカ
    • ブラジル
    • メキシコ
    • アルゼンチン
  • 中東・アフリカ
    • イスラエル
    • 南アフリカ

第12章 競合環境

  • 概要
  • 競合シナリオ
    • 新製品の開発
    • 提携

第13章 企業プロファイル

  • SHENGYI TECHNOLOGY CO., LTD.
  • KINGBOARD LAMINATES HOLDINGS LTD.
  • ITEQ CORPORATION
  • DOWDUPONT
  • JINAN GUOJI TECHNOLOGY CO., LTD.
  • ETERNAL MATERIALS CO., LTD.
  • ROGERS CORPORATION
  • TAIFLEX SCIENTIFIC CO., LTD.
  • ISOLA GROUP
  • ニッカン工業
  • その他

第14章 付録

図表

LIST OF TABLES

  • TABLE 1: CIRCUIT MATERIALS MARKET SIZE, BY MATERIAL CLASS, 2016-2023 (USD MILLION)
  • TABLE 2: SUBSTRATE: CIRCUIT MATERIALS MARKET SIZE, BY REGION, 2016-2023 (USD MILLION)
  • TABLE 3: CONDUCTING MATERIAL: CIRCUIT MATERIALS MARKET SIZE, BY REGION, 2016-2023 (USD MILLION)
  • TABLE 4: OUTER LAYER: CIRCUIT MATERIALS MARKET SIZE, BY REGION, 2016-2023 (USD MILLION)
  • TABLE 5: CIRCUIT MATERIALS MARKET SIZE, BY SUBSTRATE, 2016-2023 (USD MILLION)
  • TABLE 6: FIBERGLASS-EPOXY: CIRCUIT MATERIALS MARKET SIZE, BY REGION, 2016-2023 (USD MILLION)
  • TABLE 7: PAPER-PHENOLIC: CIRCUIT MATERIALS MARKET SIZE, BY REGION, 2016-2023 (USD MILLION)
  • TABLE 8: CEM: CIRCUIT MATERIALS MARKET SIZE, BY REGION, 2016-2023 (USD MILLION)
  • TABLE 9: POLYIMIDE: CIRCUIT MATERIALS MARKET SIZE, BY REGION, 2016-2023 (USD MILLION)
  • TABLE 10: OTHERS: CIRCUIT MATERIALS MARKET SIZE, BY REGION, 2016-2023 (USD MILLION)
  • TABLE 11: CIRCUIT MATERIALS MARKET SIZE, BY CONDUCTING MATERIAL, 2016-2023 (USD MILLION)
  • TABLE 12: COPPER: CIRCUIT MATERIALS MARKET SIZE, BY REGION, 2016-2023 (USD MILLION)
  • TABLE 13: OTHERS: CIRCUIT MATERIALS MARKET SIZE, BY REGION, 2016-2023 (USD MILLION)
  • TABLE 14: CIRCUIT MATERIALS MARKET SIZE, BY OUTER LAYER, 2016-2023 (USD MILLION)
  • TABLE 15: LIQUID INK PHOTOIMAGEABLE SOLDER MASK: CIRCUIT MATERIALS MARKET SIZE, BY REGION, 2016-2023 (USD MILLION)
  • TABLE 16: DRY FILM PHOTOIMAGEABLE: CIRCUIT MATERIALS MARKET SIZE, BY REGION, 2016-2023 (USD MILLION)
  • TABLE 17: OTHERS: CIRCUIT MATERIALS MARKET SIZE, BY REGION, 2016-2023 (USD MILLION)
  • TABLE 18: CIRCUIT MATERIALS MARKET SIZE, BY APPLICATION, 2016-2023 (USD MILLION)
  • TABLE 19: CIRCUIT MATERIALS MARKET SIZE IN COMMUNICATIONS, BY REGION, 2016-2023 (USD MILLION)
  • TABLE 20: CIRCUIT MATERIALS MARKET SIZE IN INDUSTRIAL ELECTRONICS, BY REGION, 2016-2023 (USD MILLION)
  • TABLE 21: CIRCUIT MATERIALS MARKET SIZE IN AUTOMOTIVE, BY REGION, 2016-2023 (USD MILLION)
  • TABLE 22: CIRCUIT MATERIALS MARKET SIZE IN AEROSPACE & DEFENSE, BY REGION, 2016-2023 (USD MILLION)
  • TABLE 23: CIRCUIT MATERIALS MARKET SIZE IN OTHER APPLICATIONS, BY REGION, 2016-2023 (USD MILLION)
  • TABLE 24: CIRCUIT MATERIALS MARKET SIZE, BY REGION, 2016-2023 (USD MILLION)
  • TABLE 25: APAC: CIRCUIT MATERIALS MARKET SIZE, BY MATERIAL CLASS, 2016-2023 (USD MILLION)
  • TABLE 26: APAC: CIRCUIT MATERIALS MARKET SIZE, BY SUBSTRATE, 2016-2023 (USD MILLION)
  • TABLE 27: APAC: CIRCUIT MATERIALS MARKET SIZE, BY CONDUCTING MATERIAL, 2016-2023 (USD MILLION)
  • TABLE 28: APAC: CIRCUIT MATERIALS MARKET SIZE, BY OUTER LAYER, 2016-2023 (USD MILLION)
  • TABLE 29: APAC: CIRCUIT MATERIALS MARKET SIZE, BY APPLICATION, 2016-2023 (USD MILLION)
  • TABLE 30: CHINA: CIRCUIT MATERIALS MARKET SIZE, BY APPLICATION, 2016-2023 (USD MILLION)
  • TABLE 31: TAIWAN: CIRCUIT MATERIALS MARKET SIZE, BY APPLICATION, 2016-2023 (USD MILLION)
  • TABLE 32: SOUTH KOREA: CIRCUIT MATERIALS MARKET SIZE, BY APPLICATION, 2016-2023 (USD MILLION)
  • TABLE 33: JAPAN: CIRCUIT MATERIALS MARKET SIZE, BY APPLICATION, 2016-2023 (USD MILLION)
  • TABLE 34: INDIA: CIRCUIT MATERIALS MARKET SIZE, BY APPLICATION, 2016-2023 (USD MILLION)
  • TABLE 35: APAC: CIRCUIT MATERIALS MARKET SIZE, BY COUNTRY, 2016-2023 (USD MILLION)
  • TABLE 36: NORTH AMERICA: CIRCUIT MATERIALS MARKET SIZE, BY MATERIAL CLASS, 2016-2023 (USD MILLION)
  • TABLE 37: NORTH AMERICA: CIRCUIT MATERIALS MARKET SIZE, BY SUBSTRATE, 2016-2023 (USD MILLION)
  • TABLE 38: NORTH AMERICA: CIRCUIT MATERIALS MARKET SIZE, BY CONDUCTING MATERIAL, 2016-2023 (USD MILLION)
  • TABLE 39: NORTH AMERICA: CIRCUIT MATERIALS MARKET SIZE, BY OUTER LAYER, 2016-2023 (USD MILLION)
  • TABLE 40: NORTH AMERICA: CIRCUIT MATERIALS MARKET SIZE, BY APPLICATION, 2016-2023 (USD MILLION)
  • TABLE 41: US: CIRCUIT MATERIALS MARKET SIZE, BY APPLICATION, 2016-2023 (USD MILLION)
  • TABLE 42: NORTH AMERICA: CIRCUIT MATERIALS MARKET SIZE, BY COUNTRY, 2016-2023 (USD MILLION)
  • TABLE 43: EUROPE: CIRCUIT MATERIALS MARKET SIZE, BY MATERIAL CLASS, 2016-2023 (USD MILLION)
  • TABLE 44: EUROPE: CIRCUIT MATERIALS MARKET SIZE, BY SUBSTRATE, 2016-2023 (USD MILLION)
  • TABLE 45: EUROPE: CIRCUIT MATERIALS MARKET SIZE, BY CONDUCTING MATERIAL, 2016-2023 (USD MILLION)
  • TABLE 46: EUROPE: CIRCUIT MATERIALS MARKET SIZE, BY OUTER LAYER, 2016-2023 (USD MILLION)
  • TABLE 47: EUROPE: CIRCUIT MATERIALS MARKET SIZE, BY APPLICATION, 2016-2023 (USD MILLION)
  • TABLE 48: EUROPE: CIRCUIT MATERIALS MARKET SIZE, BY COUNTRY, 2016-2023 (USD MILLION)
  • TABLE 49: LATIN AMERICA: CIRCUIT MATERIALS MARKET SIZE, BY MATERIAL CLASS, 2016-2023 (USD MILLION)
  • TABLE 50: LATIN AMERICA: CIRCUIT MATERIALS MARKET SIZE, BY SUBSTRATE, 2016-2023 (USD MILLION)
  • TABLE 51: LATIN AMERICA: CIRCUIT MATERIALS MARKET SIZE, BY CONDUCTING MATERIAL, 2016-2023 (USD MILLION)
  • TABLE 52: LATIN AMERICA: CIRCUIT MATERIALS MARKET SIZE, BY OUTER LAYER, 2016-2023 (USD MILLION)
  • TABLE 53: LATIN AMERICA: CIRCUIT MATERIALS MARKET SIZE, BY APPLICATION, 2016-2023 (USD MILLION)
  • TABLE 54: LATIN AMERICA: CIRCUIT MATERIALS MARKET SIZE, BY COUNTRY, 2016-2023 (USD MILLION)
  • TABLE 55: MEA: CIRCUIT MATERIALS MARKET SIZE, BY MATERIAL CLASS, 2016-2023 (USD MILLION)
  • TABLE 56: MEA: CIRCUIT MATERIALS MARKET SIZE, BY SUBSTRATE, 2016-2023 (USD MILLION)
  • TABLE 57: MEA: CIRCUIT MATERIALS MARKET SIZE, BY CONDUCTING MATERIAL, 2016-2023 (USD MILLION)
  • TABLE 58: MEA: CIRCUIT MATERIALS MARKET SIZE, BY OUTER LAYER, 2016-2023 (USD MILLION)
  • TABLE 59: MEA: CIRCUIT MATERIALS MARKET SIZE, BY APPLICATION, 2016-2023 (USD MILLION)
  • TABLE 60: MEA: CIRCUIT MATERIALS MARKET SIZE, BY COUNTRY, 2016-2023 (USD MILLION)
  • TABLE 61: NEW PRODUCT DEVELOPMENTS, 2015-2018
  • TABLE 62: PARTNERSHIPS, 2016

LIST OF FIGURES

  • FIGURE 1: CIRCUIT MATERIALS: MARKET SEGMENTATION
  • FIGURE 2: CIRCUIT MATERIALS MARKET: RESEARCH DESIGN
  • FIGURE 3: MARKET SIZE ESTIMATION: BOTTOM-UP APPROACH
  • FIGURE 4: MARKET SIZE ESTIMATION: TOP-DOWN APPROACH
  • FIGURE 5: CIRCUIT MATERIALS MARKET: DATA TRIANGULATION
  • FIGURE 6: SUBSTRATE SEGMENT TO ACCOUNT FOR THE LARGEST MARKET SHARE
  • FIGURE 7: FIBERGLASS-EPOXY SEGMENT TO RECORD THE HIGHEST MARKET GROWTH
  • FIGURE 8: COPPER CONTINUES TO BE THE WIDELY USED CONDUCTING MATERIAL
  • FIGURE 9: LIQUID INK PHOTOIMAGEABLE SOLDER MASK SEGMENT TO REGISTER THE HIGHEST CAGR
  • FIGURE 10: COMMUNICATIONS APPLICATION TO LEAD THE CIRCUIT MATERIALS MARKET
  • FIGURE 11: CHINA TO BE THE DOMINANT CIRCUIT MATERIALS MARKET
  • FIGURE 12: APAC TO LEAD THE CIRCUIT MATERIALS MARKET
  • FIGURE 13: TECHNOLOGICAL ADVANCEMENTS IN VARIOUS SECTORS TO DRIVE THE DEMAND FOR CIRCUIT MATERIALS
  • FIGURE 14: FIBERGLASS-EPOXY SEGMENT TO WITNESS THE HIGHEST GROWTH
  • FIGURE 15: COPPER WAS THE LARGEST CONDUCTING MATERIAL SEGMENT IN 2017
  • FIGURE 16: LIQUID INK PHOTOIMAGEABLE SOLDER MASK CONTINUES TO BE THE MOST USED OUTER LAYER
  • FIGURE 17: COMMUNICATIONS APPLICATION TO LEAD THE CIRCUIT MATERIALS MARKET
  • FIGURE 18: INDIA TO BE THE FASTEST-GROWING CIRCUIT MATERIALS MARKET
  • FIGURE 19: OVERVIEW OF FACTORS GOVERNING THE CIRCUIT MATERIALS MARKET
  • FIGURE 20: CIRCUIT MATERIALS MARKET: PORTER'S FIVE FORCES ANALYSIS
  • FIGURE 21: SUBSTRATE SEGMENT TO DOMINATE THE CIRCUIT MATERIALS MARKET
  • FIGURE 22: FIBERGLASS-EPOXY SUBSTRATE TO BE THE HIGHLY USED CIRCUIT MATERIAL
  • FIGURE 23: APAC TO LEAD THE FIBERGLASS-EPOXY SUBSTRATE SEGMENT
  • FIGURE 24: COPPER TO DOMINATE THE CIRCUIT MATERIALS MARKET
  • FIGURE 25: APAC TO BE THE LARGEST CIRCUIT MATERIALS MARKET IN THE COPPER SEGMENT
  • FIGURE 26: LIQUID INK PHOTOIMAGEABLE SOLDER MASK TO DOMINATE THE CIRCUIT MATERIALS MARKET
  • FIGURE 27: APAC TO LEAD THE MARKET IN THE LIQUID INK PHOTOIMAGEABLE SOLDER MASK SEGMENT
  • FIGURE 28: COMMUNICATIONS APPLICATION TO ACCOUNT FOR THE LARGEST SHARE IN THE CIRCUIT MATERIALS MARKET
  • FIGURE 29: APAC TO DOMINATE THE COMMUNICATIONS APPLICATION SEGMENT
  • FIGURE 30: INDIA TO REGISTER THE HIGHEST CAGR OF THE CIRCUIT MATERIALS MARKET
  • FIGURE 31: APAC: CIRCUIT MATERIALS MARKET SNAPSHOT
  • FIGURE 32: NORTH AMERICA: CIRCUIT MATERIALS MARKET SNAPSHOT
  • FIGURE 33: EUROPE: CIRCUIT MATERIALS MARKET SNAPSHOT
  • FIGURE 34: COMPANIES ADOPTED NEW PRODUCT DEVELOPMENTS AS THE KEY GROWTH STRATEGY BETWEEN 2015 AND 2018
  • FIGURE 35: SHENGYI TECHNOLOGY: SWOT ANALYSIS
  • FIGURE 36: KINGBOARD LAMINATES: COMPANY SNAPSHOT
  • FIGURE 37: KINGBOARD LAMINATES: SWOT ANALYSIS
  • FIGURE 38: ITEQ CORPORATION: COMPANY SNAPSHOT
  • FIGURE 39: ITEQ CORPORATION: SWOT ANALYSIS
  • FIGURE 40: DOWDUPONT: COMPANY SNAPSHOT
  • FIGURE 41: DOWDUPONT: SWOT ANALYSIS
  • FIGURE 42: JINAN GUOJI TECHNOLOGY: COMPANY SNAPSHOT
  • FIGURE 43: JINAN GUOJI TECHNOLOGY: SWOT ANALYSIS
  • FIGURE 44: ROGERS CORPORATION: COMPANY SNAPSHOT
  • FIGURE 45: TAIFLEX SCIENTIFIC: COMPANY SNAPSHOT
目次
Product Code: CH 6440

"The circuit materials market is projected to register a CAGR of 3.8%, in terms of value, between 2018 and 2023"

The circuit materials market size is estimated to be USD 30.58 billion in 2018 and is projected to reach USD 36.85 billion by 2023, at a CAGR of 3.8% between 2018 and 2023. The increasing demand for circuit materials due to technological advancements in the electronics sector is the most significant factor projected to drive the market. The technological developments in the developing economies are also contributing to the circuit materials market growth. However, the low supply of copper foil to the electronic industry is acting as a restraint to the market growth.

The copper conducting material segment of the circuit materials market is projected to register the highest CAGR, in terms of value, during the forecast period

Copper is used as a conducting layer on the various types of substrates such as fiberglass-epoxy, paper-phenolic, and CEM. The use of copper as a conducting material offers excellent current conductivity and electromagnetic shielding which enhances the performance of various electronic devices. Also, when copper is applied on various substrates, it can be chemically etched to divide the copper layer into separate conducting lines called tracks or circuit traces. This chemical etching process is easy to achieve with copper compared to other conducting materials. The ease of chemical processing and better conductivity have increased the demand for copper as a conducting material and has helped it to register the highest CAGR during the forecast period.

The circuit materials market in the APAC region is projected to register the highest CAGR, in terms of value, between 2018 and 2023

The circuit materials market in the APAC region is projected to register the highest CAGR, in terms of value, during the forecast period as APAC is one of the promising circuit materials markets. The continuous rise in the production of technologically advanced electronic products has resulted in high demand for circuit materials. This increasing demand for technologically advanced electronic products in various applications such as communications, industrial electronics, and automotive has led to innovations and developments in the electronics industry of APAC making it a promising circuit materials market, globally.

In the process of determining and verifying the market size for several segments and subsegments gathered through secondary research, extensive primary interviews have been conducted as follows:

  • By Company Type- Tier 1 - 37%, Tier 2 - 42%, and Tier 3 - 21%
  • By Designation- C level - 30%, Director level - 25%, and Others - 45%
  • By Region- APAC - 40%, Europe - 27%, North America - 20%, Middle East & Africa - 7%, and Latin America - 6%

This report provides a comprehensive analysis of the key companies listed below:

  • Shengyi Technology (China)
  • Kingboard Laminates (Hong Kong)
  • ITEQ Corporation (Taiwan)
  • DowDuPont (US)
  • Jinan Guoji Technology (China)
  • Eternal Materials (Taiwan)
  • Rogers Corporation (US)
  • Taiflex Scientific (Taiwan)
  • Isola Group (US)
  • Nikkan Industries (Japan)

Research Coverage:

This report covers the circuit materials market and forecasts the size of the market until 2023. The report includes the segmentation of the circuit materials market based on material class, substrate, conducting material, outer layer, application, and region. Porter's Five Forces analysis and key market dynamics such as drivers, restraints, challenges, and opportunities influencing the growth of the circuit materials market have been discussed in the report. The report also provides company profiles and competitive benchmarking of major players operating in the market.

Benefits of Buying the Report:

The report is expected to help market leaders/new entrants in the circuit materials market in the following ways:

  • This report segments the circuit materials market and provides the closest approximation of revenues for the overall market and its subsegments across different verticals and regions.
  • The report helps stakeholders understand the pulse of the market and provides information on key drivers, restraints, challenges, and opportunities of the circuit materials market.
  • This report is also expected to help stakeholders understand their competitors and gain insights to better their positions in the circuit materials market. The competitive landscape section includes the ecosystem of competitors and detailed information on new product developments and partnerships.

TABLE OF CONTENTS

1. INTRODUCTION

  • 1.1. OBJECTIVES OF THE STUDY
  • 1.2. MARKET DEFINITION
  • 1.3. MARKET SCOPE
    • 1.3.1. YEARS CONSIDERED FOR THE STUDY
  • 1.4. CURRENCY
  • 1.5. LIMITATIONS
  • 1.6. STAKEHOLDERS

2. RESEARCH METHODOLOGY

  • 2.1. RESEARCH DATA
    • 2.1.1. SECONDARY DATA
      • 2.1.1.1. Key data from secondary sources
    • 2.1.2. PRIMARY DATA
      • 2.1.2.1. Key data from primary sources
      • 2.1.2.2. Key industry insights
      • 2.1.2.3. Breakdown of primary interviews
  • 2.2. MARKET SIZE ESTIMATION
    • 2.2.1. BOTTOM-UP APPROACH
    • 2.2.2. TOP-DOWN APPROACH
  • 2.3. DATA TRIANGULATION
  • 2.4. RESEARCH ASSUMPTIONS

3. EXECUTIVE SUMMARY

4. PREMIUM INSIGHTS

  • 4.1. ATTRACTIVE OPPORTUNITIES IN THE CIRCUIT MATERIALS MARKET
  • 4.2. CIRCUIT MATERIALS MARKET, BY SUBSTRATE
  • 4.3. CIRCUIT MATERIALS MARKET, BY CONDUCTING MATERIAL AND REGION
  • 4.4. CIRCUIT MATERIALS MARKET, BY OUTER LAYER
  • 4.5. CIRCUIT MATERIALS MARKET, BY APPLICATION
  • 4.6. CIRCUIT MATERIALS MARKET, BY COUNTRY

5. MARKET OVERVIEW

  • 5.1. MARKET DYNAMICS
    • 5.1.1. DRIVERS
      • 5.1.1.1. Technological advancements in the electronics sector
    • 5.1.2. RESTRAINTS
      • 5.1.2.1. Low supply of copper foil
    • 5.1.3. OPPORTUNITIES
      • 5.1.3.1. Technological developments in developing economies
    • 5.1.4. CHALLENGES
      • 5.1.4.1. Production of green and energy-efficient products
  • 5.2. PORTER'S FIVE FORCES ANALYSIS
    • 5.2.1. THREAT OF NEW ENTRANTS
    • 5.2.2. THREAT OF SUBSTITUTES
    • 5.2.3. BARGAINING POWER OF SUPPLIERS
    • 5.2.4. BARGAINING POWER OF BUYERS
    • 5.2.5. INTENSITY OF COMPETITIVE RIVALRY

6. CIRCUIT MATERIALS MARKET, BY MATERIAL CLASS

  • 6.1. INTRODUCTION
  • 6.2. SUBSTRATE
  • 6.3. CONDUCTING MATERIAL
  • 6.4. OUTER LAYER

7. CIRCUIT MATERIALS MARKET, BY SUBSTRATE

  • 7.1. INTRODUCTION
  • 7.2. FIBERGLASS-EPOXY
  • 7.3. PAPER-PHENOLIC
  • 7.4. CEM
  • 7.5. POLYIMIDE
  • 7.6. OTHERS

8. CIRCUIT MATERIALS MARKET, BY CONDUCTING MATERIAL

  • 8.1. INTRODUCTION
  • 8.2. COPPER
  • 8.3. OTHERS

9. CIRCUIT MATERIALS MARKET, BY OUTER LAYER

  • 9.1. INTRODUCTION
  • 9.2. LIQUID INK PHOTOIMAGEABLE SOLDER MASK
  • 9.3. DRY FILM PHOTOIMAGEABLE
  • 9.4. OTHERS
    • 9.4.1. EPOXY LIQUID
    • 9.4.2. TOP AND BOTTOM SIDE MASKS

10. CIRCUIT MATERIALS MARKET, BY APPLICATION

  • 10.1. INTRODUCTION
  • 10.2. COMMUNICATIONS
  • 10.3. INDUSTRIAL ELECTRONICS
  • 10.4. AUTOMOTIVE
  • 10.5. AEROSPACE & DEFENSE
  • 10.6. OTHERS

11. CIRCUIT MATERIALS MARKET, BY REGION

  • 11.1. INTRODUCTION
  • 11.2. APAC
    • 11.2.1. CHINA
    • 11.2.2. TAIWAN
    • 11.2.3. SOUTH KOREA
    • 11.2.4. JAPAN
    • 11.2.5. INDIA
  • 11.3. NORTH AMERICA
    • 11.3.1. US
    • 11.3.2. CANADA
  • 11.4. EUROPE
    • 11.4.1. GERMANY
    • 11.4.2. ITALY
    • 11.4.3. FRANCE
    • 11.4.4. UK
  • 11.5. LATIN AMERICA
    • 11.5.1. BRAZIL
    • 11.5.2. MEXICO
    • 11.5.3. ARGENTINA
  • 11.6. MIDDLE EAST & AFRICA (MEA)
    • 11.6.1. ISRAEL
    • 11.6.2. SOUTH AFRICA

12. COMPETITIVE LANDSCAPE

  • 12.1. OVERVIEW
  • 12.2. COMPETITIVE SCENARIO
    • 12.2.1. NEW PRODUCT DEVELOPMENTS
    • 12.2.2. PARTNERSHIPS

13. COMPANY PROFILES (Overview, Financial*, Products & Services, Strategy, and Developments)

  • 13.1. SHENGYI TECHNOLOGY CO., LTD.
  • 13.2. KINGBOARD LAMINATES HOLDINGS LTD.
  • 13.3. ITEQ CORPORATION
  • 13.4. DOWDUPONT
  • 13.5. JINAN GUOJI TECHNOLOGY CO., LTD.
  • 13.6. ETERNAL MATERIALS CO., LTD.
  • 13.7. ROGERS CORPORATION
  • 13.8. TAIFLEX SCIENTIFIC CO., LTD.
  • 13.9. ISOLA GROUP
  • 13.10. NIKKAN INDUSTRIES CO., LTD.
  • 13.11. OTHER COMPANIES
    • 13.11.1. PANASONIC CORPORATION
    • 13.11.2. MITSUBISHI MATERIALS CORPORATION
    • 13.11.3. PARK ELECTROCHEMICAL CORPORATION
    • 13.11.4. NIKKO-MATERIALS CO., LTD.
    • 13.11.5. D. D. ENTERPRISES
    • 13.11.6. TACONIC
    • 13.11.7. ARLON ELECTRONIC MATERIALS
    • 13.11.8. SHANGHAI NANYA COPPER CLAD LAMINATE CO., LTD.
    • 13.11.9. VENTEC INTERNATIONAL GROUP
    • 13.11.10. TAMURA CORPORATION
    • 13.11.11. INTERNATIONAL LAMINATE MATERIAL LTD
    • 13.11.12. TONGLING HUAKE ELECTRONIC MATERIAL CO., LTD.
    • 13.11.13. NAM HING INDUSTRIAL LAMINATE LTD
    • 13.11.14. CHANG CHUN GROUP
    • 13.11.15. DOOSAN CORPORATION ELECTRO-MATERIALS

*Details might not be captured in case of unlisted companies

14. APPENDIX

  • 14.1. DISCUSSION GUIDE
  • 14.2. KNOWLEDGE STORE: MARKETSANDMARKETS SUBSCRIPTION PORTAL
  • 14.3. INTRODUCING RT: REAL-TIME MARKET INTELLIGENCE
  • 14.4. AVAILABLE CUSTOMIZATIONS
  • 14.5. RELATED REPORTS
  • 14.6. AUTHOR DETAILS
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