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市場調査レポート

極端紫外線リソグラフィ (EUVL) の世界市場 - 2023年までの予測:IDM、ファウンドリ

Extreme Ultraviolet Lithography (EUVL) Market by End User (Integrated Device Manufacturer (IDM) and Foundry Companies), Equipment (Qualitative), and Geography (The Americas and Asia Pacific) - Global Trend and Forecast to 2023

発行 MarketsandMarkets 商品コード 657580
出版日 ページ情報 英文 97 Pages
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本日の銀行送金レート: 1USD=113.44円で換算しております。
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極端紫外線リソグラフィ (EUVL) の世界市場 - 2023年までの予測:IDM、ファウンドリ Extreme Ultraviolet Lithography (EUVL) Market by End User (Integrated Device Manufacturer (IDM) and Foundry Companies), Equipment (Qualitative), and Geography (The Americas and Asia Pacific) - Global Trend and Forecast to 2023
出版日: 2018年06月25日 ページ情報: 英文 97 Pages
概要

極端紫外線リソグラフィ (EUVL) 市場は、2018年の29億8000万米ドルから、2023年までに103億1000万米ドルまで拡大すると見られています。市場は、2018年〜2023年のCAGR (複合年間成長率) で、28.16%の成長が予測されています。

当レポートでは、世界の極端紫外線リソグラフィ (EUVL) 市場について調査分析し、市場概要、産業動向、セグメント別の市場分析、競合情勢、主要企業などについて、体系的な情報を提供しています。

第1章 イントロダクション

第2章 調査手法

第3章 エグゼクティブサマリー

第4章 市場概要

  • イントロダクション
  • 市場力学
    • 促進要因
    • 抑制要因
    • 機会
    • 課題

第5章 産業分析

  • イントロダクション
  • 市場の進化
  • サプライチェーン分析
  • プロセスフロー分析
  • 影響分析
  • ROI分析

第6章 極端紫外線リソグラフィ (EUVL) の世界市場:エンドユーザー別

  • イントロダクション
  • IDM (垂直統合型デバイスメーカー)
  • ファウンドリ

第7章 極端紫外線リソグラフィ (EUVL) の世界市場:地域別

  • イントロダクション
  • 南北アメリカ
  • アジア太平洋地域

第8章 極端紫外線リソグラフィ (EUVL) の世界市場:装置 (定性的) 別

  • イントロダクション
  • 光源
  • 光学
  • マスク
  • その他

第9章 競合情勢

  • 概要
  • ランキング分析
  • 競合シナリオ

第10章 企業プロファイル

  • 主要企業
    • ASML
    • ニコン
    • キヤノン
  • 主要サプライヤー
    • CARL ZEISS
    • 凸版印刷
    • NTTアドバンステクノロジ
  • 主要カスタマー
    • INTEL
    • SAMSUNG
    • SK HYNIX
    • 東芝
    • TSMC
    • GLOBALFOUNDRIES

第11章 付録

目次
Product Code: SE 6398

"The EUV lithography market is estimated to grow at a CAGR of 28.16% between 2018 and 2023."

The EUV lithography market is emerging and is expected to grow further in the coming years. The market for EUV lithography is likely to be valued at USD 2.98 billion in 2018 and is expected to reach USD 10.31 billion by 2023, at a CAGR of 28.16% between 2018 and 2023. The factors that drive the market growth include the growing need for the trend of miniaturization and reduction in process complexity and cost. However, high price of EUV lithography systems may restrict the growth of the EUV lithography market.

"Market for foundry expected to grow at a higher CAGR during the forecast period."

Usually, the volume of wafer processing at foundries is higher than that at IDMs. The foundry has a wide variety of requirements to address different customers. For instance, TSMC (Taiwan), a leading pure-play foundry, holds the largest revenue for wafer fabrication. On top of that, the increasing demand for advanced packaging for miniaturized devices is expected to be the key driver for the adoption of EUV lithography in foundries.

"Market in APAC is likely to account for the largest share in 2018"

Major drivers for the growth of the EUV lithography market in APAC are the growing number of wafer-processing capability and increasing demand from fab-less players at leading foundries in the region. TSMC (Taiwan), the world's leading foundry acquiring more than 50% of the revenue, started investing in the expansion of its wafer-processing capability and planned to invest in EUV lithography. The foundry holds the highest number of wafer-processing capability than any other leading players in the semiconductor manufacturing industry.

Breakdown of the profiles of primary participants:

  • By Company: Tier 1 = 55%, Tier 2 = 25%, and Tier 3 = 20%
  • By Designation: C-level Executives = 37%, Directors = 36%, and Others = 27%
  • By Region: North America = 34%, EMEA = 35%, and APAC = 31 %

Major players profiled in this report include:

  • ASML (Netherlands)
  • Nikon (Japan)
  • Canon (Japan)
  • Carl Zeiss (Germany)
  • Toppan Printing (Japan)
  • NTT Advanced Technology (Japan)
  • Samsung (South Korea)
  • SK Hynix (South Korea)
  • Intel (US)
  • Toshiba (Japan)
  • GLOBALFOUNDRIES (US)
  • TSMC (Taiwan)

Research Coverage:

The study segments in the EUV lithography market report include equipment-light source, mirrors, mask, and others; end user-integrated device manufacturers (IDMs) and foundries. The study also covers applications and geographic forecast of the market size for various segments with regard to 2 main regions-the Americas and APAC.

Reasons to Buy the Report:

The report would help the market leaders/new entrants in this market in the following ways:

  • 1. This report segments the EUV lithography market comprehensively and provides the closest approximations of the overall market size and those of the subsegments across different applications and regions.
  • 2. The report gives the detailed analysis of the EUV lithography market with the help of competitive landscape, value chain analysis, and impact analysis, including the key companies in the market and their relations in the ecosystem.
  • 3. The report helps stakeholders understand the pulse of the market and provides them the information on key drivers, restraints, challenges, and opportunities pertaining to the EUV lithography market.

TABLE OF CONTENTS

1. INTRODUCTION

  • 1.1. STUDY OBJECTIVES
  • 1.2. DEFINITION
  • 1.3. STUDY SCOPE
    • 1.3.1. MARKETS COVERED
    • 1.3.2. GEOGRAPHIC SCOPE
    • 1.3.3. YEARS CONSIDERED FOR THE STUDY
  • 1.4. CURRENCY
  • 1.5. LIMITATIONS
  • 1.6. STAKEHOLDERS

2. RESEARCH METHODOLOGY

  • 2.1. RESEARCH DATA
    • 2.1.1. SECONDARY DATA
      • 2.1.1.1. Secondary sources
    • 2.1.2. PRIMARY DATA
      • 2.1.2.1. Primary sources
      • 2.1.2.2. Key industry insights
      • 2.1.2.3. Breakdown of primary interviews
    • 2.1.3. SECONDARY AND PRIMARY RESEARCH
  • 2.2. MARKET SIZE ESTIMATION
    • 2.2.1. BOTTOM-UP APPROACH
      • 2.2.1.1. Approach for capturing the market size by bottom-up analysis (demand side)
    • 2.2.2. TOP-DOWN APPROACH
      • 2.2.2.1. Approach for capturing the market share by top-down analysis (supply side)
  • 2.3. DATA TRIANGULATION
  • 2.4. ASSUMPTIONS

3. EXECUTIVE SUMMARY

4. MARKET OVERVIEW

  • 4.1. INTRODUCTION
  • 4.2. MARKET DYNAMICS
    • 4.2.1. DRIVERS
      • 4.2.1.1. Trend of miniaturization
      • 4.2.1.2. Reduced complexity and cost
    • 4.2.2. RESTRAINTS
      • 4.2.2.1. High price of EUVL systems
    • 4.2.3. OPPORTUNITIES
      • 4.2.3.1. Advanced packaging market
    • 4.2.4. CHALLENGES
      • 4.2.4.1. Design complexity and infrastructure readiness

5. INDUSTRY ANALYSIS

  • 5.1. INTRODUCTION
  • 5.2. MARKET EVOLUTION
    • 5.2.1. LITHOGRAPHY TECHNOLOGY COMPARISON
  • 5.3. SUPPLY CHAIN ANALYSIS
  • 5.4. PROCESS FLOW ANALYSIS
  • 5.5. IMPACT ANALYSIS
    • 5.5.1. SUPPLIERS LANDSCAPE
    • 5.5.2. LITHOGRAPHY MANUFACTURERS
    • 5.5.3. SEMICONDUCTOR MANUFACTURING
    • 5.5.4. PRODUCT MANUFACTURERS
    • 5.5.5. END CUSTOMERS
  • 5.6. ROI ANALYSIS

6. EUV LITHOGRAPHY MARKET, BY END USER

  • 6.1. INTRODUCTION
  • 6.2. INTEGRATED DEVICE MANUFACTURER (IDM)
  • 6.3. FOUNDRY

7. GEOGRAPHIC ANALYSIS

  • 7.1. INTRODUCTION
  • 7.2. THE AMERICAS
  • 7.3. ASIA PACIFIC (APAC)

8. EUV LITHOGRAPHY, BY EQUIPMENT (QUALITATIVE)

  • 8.1. INTRODUCTION
  • 8.2. LIGHT SOURCE
  • 8.3. OPTICS
  • 8.4. MASK
  • 8.5. OTHERS

9. COMPETITIVE LANDSCAPE

  • 9.1. OVERVIEW
  • 9.2. RANKING ANALYSIS
  • 9.3. COMPETITIVE SCENARIO
    • 9.3.1. PRODUCT DEVELOPMENTS AND LAUNCHES
    • 9.3.2. PARTNERSHIPS, AGREEMENTS, AND COLLABORATIONS
    • 9.3.3. ACQUISITIONS
    • 9.3.4. INVESTMENTS AND EXPANSIONS

10. COMPANY PROFILES (Business Overview, Products & Services, Key Insights, Recent Developments, SWOT Analysis, MnM View)*

  • 10.1. KEY PLAYERS
    • 10.1.1. ASML
    • 10.1.2. NIKON
    • 10.1.3. CANON
  • 10.2. KEY SUPPLIERS
    • 10.2.1. CARL ZEISS
    • 10.2.2. TOPPAN PRINTING
    • 10.2.3. NTT ADVANCED TECHNOLOGY
  • 10.3. KEY CUSTOMERS
    • 10.3.1. INTEL
    • 10.3.2. SAMSUNG
    • 10.3.3. SK HYNIX
    • 10.3.4. TOSHIBA
    • 10.3.5. TSMC
    • 10.3.6. GLOBALFOUNDRIES

*Details on Business Overview, Products & Services, Key Insights, Recent Developments, SWOT Analysis, MnM View might not be captured in case of unlisted companies.

11. APPENDIX

  • 11.1. INSIGHTS OF INDUSTRY EXPERTS
  • 11.2. QUESTIONNAIRE
  • 11.3. KNOWLEDGE STORE: MARKETSANDMARKETS' SUBSCRIPTION PORTAL
  • 11.4. INTRODUCING RT: REAL-TIME MARKET INTELLIGENCE
  • 11.5. AVAILABLE CUSTOMIZATIONS
  • 11.6. RELATED REPORT
  • 11.7. AUTHOR DETAILS

LIST OF TABLES

  • TABLE 1: EUV LITHOGRAPHY MARKET, 2016-2023 (USD MILLION)
  • TABLE 2: LITHOGRAPHY TECHNOLOGY COMPARISON
  • TABLE 3: EUVL RETURN ON INVESTMENT
  • TABLE 4: EUV LITHOGRAPHY MARKET, BY END USER, 2016-2023 (USD BILLION)
  • TABLE 5: EUV LITHOGRAPHY MARKET, BY END USER, 2016-2023 (UNITS))
  • TABLE 6: IDM EUV LITHOGRAPHY MARKET, BY REGION, 2016-2023 (USD BILLION)
  • TABLE 7: IDM EUV LITHOGRAPHY MARKET, BY REGION, 2016-2023 (UNITS)
  • TABLE 8: FOUNDRY EUV LITHOGRAPHY MARKET, BY REGION, 2016-2023 (USD BILLION)
  • TABLE 9: IDM EUV LITHOGRAPHY MARKET, BY REGION, 2016-2023 (UNITS)
  • TABLE 10: EUV LITHOGRAPHY MARKET, BY REGION, 2016-2023 (USD BILLION)
  • TABLE 11: EUV LITHOGRAPHY MARKET, BY REGION, 2016-2023 (UNITS)
  • TABLE 12: EUV LITHOGRAPHY MARKET IN THE AMERICAS, BY END USER, 2016-2023 (USD BILLION)
  • TABLE 13: EUV LITHOGRAPHY MARKET IN THE AMERICAS, BY END USER, 2016-2023 (UNIT)
  • TABLE 14: EUV LITHOGRAPHY MARKET IN APAC, BY END-USER, 2016-2023 (USD BILLION)
  • TABLE 15: EUV LITHOGRAPHY MARKET IN APAC, BY END-USER, 2016-2023 (UNIT)
  • TABLE 16: RANKING ANALYSIS OF THE TOP 3 PLAYERS IN THE NEXT-GENERATION LITHOGRAPHY MARKET
  • TABLE 17: PRODUCT DEVELOPMENTS AND LAUNCHES, 2015-2017
  • TABLE 18: PARTNERSHIP, AGREEMENT, AND COLLABORATIONS, 2016-2018
  • TABLE 19: ACQUISITIONS, 2014
  • TABLE 20: INVESTMENTS AND EXPANSIONS, 2017-2018

LIST OF FIGURES

  • FIGURE 1: EUV LITHOGRAPHY MARKET SEGMENTATION
  • FIGURE 2: RESEARCH FLOW
  • FIGURE 3: EUV LITHOGRAPHY MARKET: RESEARCH DESIGN
  • FIGURE 4: BOTTOM-UP APPROACH
  • FIGURE 5: TOP-DOWN APPROACH
  • FIGURE 6: DATA TRIANGULATION
  • FIGURE 7: INCREASING DEMAND FOR EUV LITHOGRAPHY YEAR-ON-YEAR ACROSS THE GLOBE
  • FIGURE 8: FOUNDRY TO REGISTER A HIGHER CAGR IN THE EUV LITHOGRAPHY MARKET DURING THE FORECAST PERIOD
  • FIGURE 9: MARKET IN APAC TO GROW AT A HIGHER CAGR DURING THE FORECAST PERIOD
  • FIGURE 10: TREND OF MINIATURIZATION IS DRIVING THE GROWTH OF THE EUV LITHOGRAPHY MARKET
  • FIGURE 11: MANUFACTURING COST PER WAFER FOR DIFFERENT TYPES OF LITHOGRAPHY
  • FIGURE 12: COMPARISON OF DRAM PROCESSING STEPS PER LAYER BY LITHOGRAPHY TECHNOLOGY
  • FIGURE 13: EVOLUTION OF LITHOGRAPHY
  • FIGURE 14: EVOLUTION OF EUV LITHOGRAPHY
  • FIGURE 15: LITHOGRAPHY TECHNOLOGY DEVELOPMENT
  • FIGURE 16: SUPPLY CHAIN: EUV LITHOGRAPHY MARKET, 2017
  • FIGURE 17: EUVL PROCESS FLOW ANALYSIS
  • FIGURE 18: EUVL MASK PROCESS FLOW
  • FIGURE 19: TOTAL WAFER PROCESSING COST COMPARISON
  • FIGURE 20: EUVL IMPACT OF SEMICONDUCTOR MANUFACTURERS
  • FIGURE 21: EUVL BREAK-EVEN ANALYSIS
  • FIGURE 22: FOUNDRY TO REGISTER THE HIGHER CAGR IN THE EUV LITHOGRAPHY MARKET DURING THE FORECAST PERIOD
  • FIGURE 23: MARKET IN APAC TO GROW AT A HIGHER CAGR DURING THE FORECAST PERIOD
  • FIGURE 24: MARKET SNAPSHOT: THE AMERICAS
  • FIGURE 25: MARKET SNAPSHOT: APAC
  • FIGURE 26: EUV LITHOGRAPHY EQUIPMENT DEVELOPMENT
  • FIGURE 27: COMPANIES ADOPTED PARTNERSHIPS, AGREEMENTS, AND COLLABORATIONS AS THE KEY GROWTH STRATEGY OVER THE LAST 5 YEARS (2014-2018)
  • FIGURE 28: ASML: COMPANY SNAPSHOT
  • FIGURE 29: NIKON: COMPANY SNAPSHOT
  • FIGURE 30: CANON: COMPANY SNAPSHOT
  • FIGURE 31: CARL ZEISS: COMPANY SNAPSHOT
  • FIGURE 32: TOPPAN PRINTING: COMPANY SNAPSHOT
  • FIGURE 33: INTEL: COMPANY SNAPSHOT
  • FIGURE 34: SAMSUNG: COMPANY SNAPSHOT
  • FIGURE 35: SK HYNIX: COMPANY SNAPSHOT
  • FIGURE 36: TOSHIBA: COMPANY SNAPSHOT
  • FIGURE 37: TSMC: COMPANY SNAPSHOT
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