HMC (ハイブリッドメモリキューブ)・HBM (広帯域メモリ) の世界市場の予測 ～2023年：メモリの種類別 (HMC、HBM)・製品種類別 (GPU、CPU、APU、FPGA、ASIC)・用途別 (グラフィックス、高性能コンピューティング、ネットワーキング、データセンター)・地域別
Hybrid Memory Cube (HMC) and High-bandwidth Memory (HBM) Market by Memory Type (HMC and HBM), Product type (GPU, CPU, APU, FPGA, ASIC), Application (Graphics, High-performance Computing, Networking, Data Centers), and Geography - Global Forecast to 2023
|HMC (ハイブリッドメモリキューブ)・HBM (広帯域メモリ) の世界市場の予測 ～2023年：メモリの種類別 (HMC、HBM)・製品種類別 (GPU、CPU、APU、FPGA、ASIC)・用途別 (グラフィックス、高性能コンピューティング、ネットワーキング、データセンター)・地域別|
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世界のHMC・HBMの市場は、2018年には9億2270万米ドル、2022年には38億4250万米ドルと、33.02%のCAGR (複合年間成長率) で成長する見通しです。市場成長の主な要因として、高帯域・省電力・高拡張性メモリの需要増加や、人工知能 (AI) の普及、電子機器の小型化などが挙げられます。他方、設計の難しさが市場成長のネックとなっています。
当レポートでは、世界のHMC (ハイブリッドメモリキューブ) およびHBM (広帯域メモリ) の市場を調査し、製品の定義と市場の概要、産業構造とバリューチェーン、市場規模の推移と予測、市場成長への影響因子、メモリ／製品の種類別・用途別・地域別の詳細動向、競合環境、主要企業のプロファイルなどをまとめています。
The HMC and HBM market is emerging and is expected to grow further in the coming years. The market for HMC and HBM is likely to be valued at USD 922.7 million in 2018 and USD 3,842.5 million by 2023, at a CAGR of 33.02% between 2018 and 2023. The factors that drive the market growth include the growing need for high-bandwidth, low power consuming, and highly scalable memories; increasing adoption of artificial intelligence; and rising trend of miniaturization of electronic devices. However, thermal issues caused by high level of integration restrict the growth of the HMC and HBM market.
Currently, the major application of HBM is graphics. With improved specifications, HBM has started gaining traction in high-performance computing, cloud computing, and networking; the adoption of the HBM technology in these applications is further expected to increase in the coming years. Moreover, HBM is priced at a lower cost than HMC; this has encouraged companies to integrate HBM in their high-end products.
The high market share of CPUs is due to their significant adoption in high-performance computing, especially in data centers. HMCs have been developed for this particular application to support advanced and intensive real-time operation. CPU plays a critical role in deterring how content can be handled. More the applications and content utility more processing capability is required in CPU. Therefore, advanced CPUs widely adopt the HMC and HBM technology to increase the performance of CPUs for servers rather than increasing the number of CPUs. The leading player in the CPU market, Intel (US) offers processors with inbuilt HMC, serving a large market of HPC and data centers.
A majority of the products available in the market with the HBM technology are GPU products. HBM was initially adopted in GPUs specifically for graphics applications. For instance, AMD (US) developed the HBM technology along with SK Hynix (South Korea) to be used in GPUs. Along with GPUs, APUs have also been introduced in the market that are increasingly being used for gaming applications. The increasing adoption of HMC and HBM in gaming is largely due to the increasing requirements to process more pixels for larger screens and support higher compute rates for more stabilization to support high-end gaming.
The high adoption of HMC and HBM memories in North America is largely attributed to the growth in high-performance computing (HPC) applications that require high-bandwidth memory solutions for fast data processing. The demand for HPC in North America is growing owing to the increasing market for AI, machine learning, and cloud computing. In addition, major HPC-based CPU and processor providers, such as Intel, are based in North American countries. Other key tech companies such as Google, Amazon, and Microsoft are headquartered in the US and have served to drive the demand for high-performing CPUs in servers and supercomputers.
Major players profiled in this report include:
The study segments in the HMC and HBM market report include memory type-HMC and HBM; product type- graphics processing unit, central processing unit, accelerated processing unit, field-programmable gate array, application-specific integrated circuit. The study also covers applications and geographic forecast of the market size for various segments with regard to four main regions-North America, Europe, APAC, and RoW.
The report would help the market leaders/new entrants in this market in the following ways:
*Details on Business Overview, Products Offered, Recent Developments, SWOT Analysis, and MnM View might not be captured in case of unlisted companies.