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熱伝導パッド・材料の世界市場 2020年:種類別 (相変化材料、放熱グリス、サーマルパッド)・製品別 (MOSFET、サイリスタ、IGBT)・用途別の将来予測

Thermal Interface Pads & Material Market by Type (Phase Change Material, Thermal Grease, Thermal Pads), Products (MOSFET, Thyristor, IGBT), Application (Consumer Electronics, Telecom Equipment, Power Supply Units) - Forecast to 2020

発行 MarketsandMarkets 商品コード 330367
出版日 ページ情報 英文 136 Pages
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熱伝導パッド・材料の世界市場 2020年:種類別 (相変化材料、放熱グリス、サーマルパッド)・製品別 (MOSFET、サイリスタ、IGBT)・用途別の将来予測 Thermal Interface Pads & Material Market by Type (Phase Change Material, Thermal Grease, Thermal Pads), Products (MOSFET, Thyristor, IGBT), Application (Consumer Electronics, Telecom Equipment, Power Supply Units) - Forecast to 2020
出版日: 2015年05月11日 ページ情報: 英文 136 Pages
概要

熱伝導パッド・材料とは、電子部品からヒートシンクへと熱を伝送するために使われている製品で、民生用電子製品や通信機器、電源ユニット、航空宇宙などの様々な産業で活用されています。世界の熱伝導パッド/材料市場は、2014年の8億5006万米ドルから、2020年には13億7902万米ドルまで、年平均成長率 (CAGR) 9.67%の速度で成長する、と推計されています。

当レポートでは、全世界の熱伝導パッドおよび熱伝導材料の市場について分析し、市場の基本的構造や最新動向、主な市場促進・阻害要因、市場規模の動向見通し (今後6年間分)、製品種類別・材料別・用途別・地域別の詳細動向、市場競争の状態、今後の技術開発・市場発展の方向性、主要企業のプロファイルなどを調査・考察しております。

第1章 イントロダクション

第2章 分析手法

第3章 エグゼクティブ・サマリー

第4章 重要考察

第5章 市場概要

  • イントロダクション
  • 市場の内訳
  • 市場のダイナミクス
    • 促進要因
      • コンピュータ・通信機器産業における熱管理ソリューションの需要拡大
      • LED照明向けサーマルパッド・熱伝導材料の需要増加
      • エネルギー消費量削減のための省エネ型装置へのニーズ
    • 抑制要因
      • 高コスト
    • 市場機会
      • 新興国におけるサーマルパッド・熱伝導材料の需要増大
    • 課題
      • 熱伝導材料の小型化に伴う安定性の問題

第6章 産業動向

  • バリューチェーン分析
    • 研究・製品開発
    • 製造・組立
    • 流通・マーケティング・販売
  • サプライチェーン分析
    • 主な影響要因
  • ポーターのファイブフォース分析

第7章 熱伝導材料市場:種類別

  • イントロダクション
  • 放熱グリス
  • 相変化材料
  • サーマルパッド
  • その他

第8章 熱伝導材料市場:素材の種類別

  • イントロダクション
  • ギャップパッド
    • エラストマー
  • 相変化材料

第9章 熱伝導材料市場:製品別

  • イントロダクション
  • サイリスタ
  • IGBT
  • MOSFET
  • パワートランジスタ

第10章 熱伝導材料市場:用途別

  • イントロダクション
  • 家電製品
  • 通信機器
  • 電源ユニット
  • その他

第11章 熱伝導材料市場:地域別

  • イントロダクション
  • 北米
  • 欧州
  • アジア太平洋地域
  • 他の国々 (ROW)

第12章 競争環境

  • 概要
  • 市場シェア分析:世界の熱伝導材料市場
  • 競争状況と動向
  • 新製品の発売
  • 合意・事業協力・契約・合弁事業
  • 企業合併・買収 (M&A)
  • 規模拡張

第13章 企業プロファイル

  • イントロダクション
  • 3M
    • 事業概要
    • 製品ポートフォリオ
    • 近年の動向
    • MNMの見解
  • DOW CORNING
  • HENKEL AG
  • LAIRD TECHNOLOGIES
  • PARKER HANNIFIN CORP
  • HONEYWELL INTERNATIONAL INC.
  • THE BERGQUIST COMPANY
  • STOCKWELL ELASTOMERICS, INC.
  • 富士高分子工業
  • GRAFTECH INTERNATIONAL HOLDINGS INC.

第14章 付録

目次
Product Code: SE 3376

The thermal interface pads & material market comprises various products used for transferring heat from electronic components to heat sinks in a wide range of electronic applications across different industries. Thermal interface pads & materials are widely used in consumer electronics, telecom equipment, power supply units, and others. This report segments the said market based on type, product, application, and geography. The report entails the analyses and forecasts related to the thermal interface pads & material market.

. Based on the type of materials used, the thermal interface pads & material market has been classified into phase change material, thermal pads, thermal grease, and others. The said market has been segmented on the basis of application into consumer electronics, telecom equipment, power supply units, and others.

The global thermal interface pads & material market is estimated to reach at $1379.02 million by 2020, at a CAGR of 8.47% from 2015 to 2020. The PCM market is expected to grow at a highest CAGR; its growth is expected to be driven by consumer electronics and telecom equipment industries.

The market has been segmented based on geography into North America, Europe, Africa, APAC, and RoW. APAC is currently the largest market for thermal interface pads & material markets and is expected to exhibit a high growth rate in the next seven years.

The report also details the competitive landscape of the thermal interface pads & materials market by analyzing the strategies adopted by the major players to achieve growth in the market. Apart from the market segmentation data, the report also includes qualitative analysis of various market dynamics such as the drivers, restraints, opportunities, burning issues, and winning imperatives. It also analyzes the overall market through various models; such as the Porter's Five Forces framework. The report includes the profiles of the major market players in the global thermal interface pads & material market along with their respective market share analyses.

Some of the prominent companies in this market include 3M (U.S.), Dow Corning (U.S.), Parker Chomerics (U.S.), and Laird Technologies (U.K.).

Table of Contents

1. Introduction

  • 1.1. Objectives of the Study
  • 1.2. Thermal Interface Pads Market Definition
  • 1.3. Study Scope
    • 1.3.1. Markets Covered
    • 1.3.2. Year Consideration
    • 1.3.3. Years Considered for Currency
  • 1.4. Limitations
  • 1.5. Stakeholders

2. Research Design

  • 2.1. Demand-Side Analysis
    • 2.1.1. Increasing Demand for PCS, Laptops, & Tablets
    • 2.1.2. Growing Thermal Management Solutions Market
  • 2.2. Thermal Interface Pads Market Size Estimation
  • 2.3. Thermal Interface Pads Market Breakdown and Data Triangulation
  • 2.4. Thermal Interface Pads Market Share Estimation
    • 2.4.1. Key Data From Secondary Sources
    • 2.4.2. Key Data From Primary Sources
    • 2.4.3. Assumptions

3. Executive Summary

4. Premium Insides

  • 4.1. Attractive Opportunities for the Thermal Interface Materials Market
  • 4.2. Thermal Interface Materials Market - Major Applications
  • 4.3. Thermal Interface Materials Market, By Region
  • 4.4. the U.S. and APAC Dominate the Global Thermal Interface Materials Market
  • 4.5. Global Thermal Interface Materials Market Size, By Region

5. Market Overview

  • 5.1. Introduction
  • 5.2. Thermal Interface Pads Market Segmentation
  • 5.3. Thermal Interface Pads Market Dynamics
    • 5.3.1. Drivers
      • 5.3.1.1. Growing Demand for Thermal Management Solutions in the Computer and Telecom Equipment Industry
      • 5.3.1.2. Increase in Demand for Thermal Pads and Thermal Interface Materials in Led Lighting
      • 5.3.1.3. Need for Energy Efficient Devices to Limit the Energy Consumption
    • 5.3.2. Restraints
      • 5.3.2.1. High Costs
    • 5.3.3. Opportunities
      • 5.3.3.1. the Growing Demand for Thermal Interface Material & Thermal Pads From the Emerging Economies of the World
    • 5.3.4. Challenges
      • 5.3.4.1. Stability Issues Related to Thermal Interface Material While Downsizing

6. Industry Trends

  • 6.1. Value Chain Analysis
    • 6.1.1. Research & Product Development
    • 6.1.2. Manufacturing & Assembly
    • 6.1.3. Distribution, Marketing, & Sales
  • 6.2. Supply Chain Analysis
    • 6.2.1. Key Influencers
  • 6.3. Porter's Five Forces Model
    • 6.3.1. Threats of New Entrants
    • 6.3.2. Threats of Substitutes
    • 6.3.3. Bargaining Power of Suppliers
    • 6.3.4. Bargaining Power of Buyers
    • 6.3.5. Degree of Competition

7. Thermal Interface Material Market, By Type

  • 7.1. Introduction
  • 7.2. Thermal Grease
  • 7.3. Phase Change Material
  • 7.4. Thermal Pads
  • 7.5. Others

8. Thermal Interface Pads Market, By Material Type

  • 8.1. Introduction
  • 8.2. Gap Pads
    • 8.2.1. Elastomer
  • 8.3. Phase Change Material

9. Thermal Interface Material Market, By Product

  • 9.1. Introduction
  • 9.2. Thyristor
  • 9.3. IGBT
  • 9.4. Mosfet
  • 9.5. Power Transistors

10. Thermal Interface Pads Market, By Application

  • 10.1. Introduction
  • 10.2. Consumer Electronics
  • 10.3. Telecom Equipment
  • 10.4. Power Supply Units
  • 10.5. Others

11. Thermal Interface Materials Market, By Geography

  • 11.1. Introduction
  • 11.2. North America
  • 11.3. Europe
  • 11.4. APAC
  • 11.5. Rest of the World (RoW)

12. Competitive Landscape

  • 12.1. Overview
  • 12.2. Market Share Analysis, Thermal Interface Material Market
  • 12.3. Competitive Situation and Trends
  • 12.4. New Product Launches
  • 12.5. Agreements, Collaborations, Contract & Joint Ventures
  • 12.6. Mergers and Acquisitions
  • 12.7. Expansions

13. Company Profiles (Overview, Products and Services, Financials, Strategy & Development)*

  • 13.1. Introduction
  • 13.2. 3M
  • 13.3. DOW Corning
  • 13.4. Henkel AG
  • 13.5. Laird Technologies
  • 13.6. Parker Hannifin Corp
  • 13.7. Honeywell International Inc.
  • 13.8. The Bergquist Company
  • 13.9. Stockwell Elastomerics, Inc.
  • 13.10. Fujipoly
  • 13.11. Graftech International Holdings Inc.

*Details on Overview, Products and Services, Financials, Strategy & Development Might Not Be Captured in Case of Unlisted Companies.

14. Appendix

  • 14.1. Insights of Industry Experts
  • 14.3. Introducing RT: Real Time Market Intelligence
  • 14.4. Related Reports

List of Tables

  • Table 1: Thermal Interface Materials Market, By Type, 2014-2020 ($Million)
  • Table 2: Thermal Interface Material Market, By Application 2014-2020 ($Million)
  • Table 3: Driver Analysis
  • Table 4: Restraint Analysis
  • Table 5: Opportunity Analysis
  • Table 6: Challenge Analysis
  • Table 7: Thermal Interface Materials Market, By Type, 2014-2020 ($Million)
  • Table 8: Thermal Grease Market, By Application, 2014-2020 ($Million)
  • Table 9: Thermal Grease Market, By Product 2014-2020 ($Million)
  • Table 10: Thermal Grease Market, By Geography, 2014-2020 ($Million)
  • Table 11: PCM Market, By Application, 2014-2020 ($Million)
  • Table 12: PCM Market, By Product, 2014-2020 ($Million)
  • Table 13: PCM Market, By Geography, 2014-2020 ($Million)
  • Table 14: Thermal Pads Market, By Type, 2014-2020 ($Million)
  • Table 15: Others Thermal Interface Pads Market, By Application, 2014-2020 ($Million)
  • Table 16: Others Thermal Interface Pads Market, By Product, 2014-2020 ($Million)
  • Table 17: Others Thermal Interface Pads Market, By Geography, 2014-2020 ($Million)
  • Table 18: Thermal Interface Pads Market, By Type, 2014-2020 ($Million)
  • Table 19: Thermal Interface Pads Market, By Application, 2014-2020 ($Million)
  • Table 20: Thermal Interface Pads Market, By Product 2014-2020 ($Million)
  • Table 21: Elastomer Thermal Pads Market, By Application, 2014-2020 ($Million)
  • Table 22: Elastomer Thermal Pads Market, By Geography, 2014-2020 ($Million)
  • Table 23: PCM Thermal Pads Market, By Application 2014-2020 ($Million)
  • Table 24: Thermal Interface Material Market, By Product, 2014-2020 ($Million)
  • Table 25: Thyristor Market, By Thickness, 2014-2020 ($Million)
  • Table 26: IGBT Market, By Thickness, 2014-2020 ($Million)
  • Table 27: Mosfet Market, By Thickness, 2014-2020 ($Million)
  • Table 28: Power Transistor Market, By Thickness, 2014-2020 ($Million)
  • Table 29: Thermal Interface Pads Market, By Application 2014-2020 ($Million)
  • Table 30: Consumer Electronics Market, By Region 2014-2020 ($Million)
  • Table 31: Telecom Equipment Market, By Region 2014-2020 ($Million)
  • Table 32: Power Supply Units Market, By Product, 2014-2020 ($Million)
  • Table 33: Others Thermal Interface Pads Market, By Products 2014-2020 ($Million)
  • Table 34: Thermal Interface Materials Market, By Geography 2014-2020 ($Million)
  • Table 35: North American Thermal Interface Pads Market, By Type, 2014-2020 ($Million)
  • Table 36: North American TIM Market, By Application 2014-2020 ($Million)
  • Table 37: North American TIM Market, By Country 2014-2020 ($Million)
  • Table 38: U.S. Thermal Interface Pad Market, By Application, 2014-2020 ($Million)
  • Table 39: Canada Thermal Interface Pad Market, By Application, 2014-2020 ($Million)
  • Table 40: Mexico Thermal Interface Pad Market, By Application, 2014-2020 ($Million)
  • Table 41: European TIM Market, By Type, 2014-2020 ($Million)
  • Table 42: Europe TIM Market, By Application, 2014-2020 ($Million)
  • Table 43: European Thermal Interface Pads Market, By Country, 2014-2020 ($Million)
  • Table 44: U.K. Thermal Interface Pads Market, By Application, 2014-2020 ($Million)
  • Table 45: Germany Thermal Interface Pads Market, By Application, 2014-2020 ($Million)
  • Table 46: French Thermal Interface Pad Market, By Application, 2014-2020 ($Million)
  • Table 47: Italy Thermal Interface Pads Market, By Application, 2014-2020 ($Million)
  • Table 48: Spain Thermal Interface Pad Market, By Application, 2014-2020 ($Million)
  • Table 49: Others Thermal Interface Pad Market, By Application, 2014-2020 ($Million)
  • Table 50: APAC Thermal Interface Pads Market, By Type, 2014-2020 ($Million)
  • Table 51: APAC Thermal Interface Pad Market, By Application, 2014-2020 ($Million)
  • Table 52: APAC Thermal Interface Pad Market, By Country, 2014-2020 ($Million)
  • Table 53: Japan Thermal Interface Pad Market, By Application, 2014-2020 ($Million)
  • Table 54: China Thermal Interface Pad Market, By Application, 2014-2020 ($Million)
  • Table 55: South Korea Thermal Interface Pad Market, By Application, 2014-2020 ($Million)
  • Table 56: India Thermal Interface Pad Market, By Application, 2014-2020 ($Million)
  • Table 57: Others Thermal Interface Pad Market, By Application, 2014-2020 ($Million)
  • Table 58: RoW Thermal Interface Pad Market, By Type, 2014-2020 ($Million)
  • Table 59: RoW Thermal Interface Pad Market, By Application, 2014-2020 ($Million)
  • Table 60: RoW Thermal Interface Pad Market, By Region, 2014-2020 ($Million)
  • Table 61: Latin American Thermal Interface Pad Market, By Country, 2014-2020 ($Million)
  • Table 62: Latin American Thermal Interface Pad Market, By Application, 2014-2020 ($Million)
  • Table 63: Middle Eastern Thermal Interface Pad Market, By Country, 2014-2020 ($Million)
  • Table 64: Middle Eastern Thermal Interface Pad Market, By Application, 2014-2020 ($Million)
  • Table 65: Top Companies for Thermal Interface Material Market, By Application
  • Table 66: New Product Launches, 2010-2015
  • Table 67: Agreements, Collaborations, & Joint Ventures, 2015
  • Table 68: Mergers and Acquisitions, 2012-2014
  • Table 69: Expansions, 2014
  • Table 70: 3M Product Portfolio
  • Table 71: DOW Corning: Product Portfolio
  • Table 72: DOW Corning: Recent Developments
  • Table 73: Laird Technologies: Product Portfolio
  • Table 74: Laird Technologies: Recent Developments
  • Table 75: Parker Hannifin Corporation: Product Portfolio
  • Table 76: The Bergquist Company: Product Portfolio
  • Table 77: The Bergquist Company: Recent Developments
  • Table 78: Stockwell Elastomerics Inc.: Product Portfolio
  • Table 79: Fujipoly: Product Portfolio
  • Table 80: Fujipoly: Recent Developments

List of Figures

  • Figure 1: Thermal Interface Pad Market Covered
  • Figure 2: Research Design
  • Figure 3: PCS, Laptops, & Tablets Demand (2010-2013)
  • Figure 4: Thermal Management Solutions Market (2010-2013)
  • Figure 5: Thermal Interface Material & Thermal Pads Market Size Estimation Methodology: Bottom-Up Approach
  • Figure 6: Thermal Interface Material & Thermal Pads Market Size Estimation Methodology: Top-Down Approach
  • Figure 7: Breakdown of Primary Interviews: By Company Type, Designation, and Region
  • Figure 8: Thermal Interface Material Market Snapshot (2014-2020): PCM is Expected to Grow at the Highest CAGR During the Forecast Period
  • Figure 9: Global Thermal Interface Material Application Canvas, 2014:APAC Holds the Largest Share in the Thermal Interface Pad Market
  • Figure 10: Attractive Opportunities for the Thermal Interface Materials Market
  • Figure 11: Consumer Electronics is Expected to Witness A High Growth Rate During the Forecast Period
  • Figure 12: APAC Held the Highest Share in the Global Thermal Interface Materials Market
  • Figure 13: The U.S. & APAC Together Account for 57% of the Overall Thermal Interface Materials Market
  • Figure 14: APAC Holds the Maximum Share in the Global Thermal Interface Materials Market in 2014
  • Figure 15: Consumer Electronics Held the Highest Share in the Global Thermal Interface Materials Market in 2014
  • Figure 16: Thermal Interface Material & Thermal Pads Market - Segmentation
  • Figure 17: Drivers, Restraints, Opportunities, and Challenges for the Thermal Interface Material & Thermal Pads
  • Figure 18: Value Chain Analysis
  • Figure 19: Supply Chain Analysis
  • Figure 20: Porter's Five Forces Analysis
  • Figure 21: Porters Analysis: Thermal Interface Materials & Thermal Pads
  • Figure 22: Threats of New Entrants
  • Figure 23: Threats of Substitutes
  • Figure 24: Bargaining Power of Suppliers
  • Figure 25: Bargaining Power of Buyers
  • Figure 26: Degree of Competition
  • Figure 27: PCM Based Products Likely to Drive the TIM Market During the Forecast Period
  • Figure 28: APAC is Expected to Drive the Thermal Grease Market During the Forecast Period, 2015-2020
  • Figure 29: Increased Demand From the Consumer Electronics Industry Will Fuel the Growth of PCM During the Forecast Period
  • Figure 30: Telecom Equipment Industry is Driving the Thermal Pads Market
  • Figure 31: IGBT is Expected to Drive the Thermal Interface Materials Market During the Forecast Period
  • Figure 32: Consumer Electronics and Telecom Equipment Will Fuel the Growth of the TIM and Thermal Pads Market During the Forecast Period
  • Figure 33: Geographic Snapshot (2014)- Emerging Economies are the New Hot Spots
  • Figure 34: APAC is the Fastest Growing Region for the Thermal Interface Pad Market
  • Figure 35: North American Thermal Interface Pad Market Snapshot: Demand Will Be Driven By PCM
  • Figure 36: Germany and U.K. Accounted for the Majority of the Demand for Thermal Interface Materials in Europe, 2014
  • Figure 37: APAC Thermal Interface Pad Market Snapshot: Demand Will Be Driven By the Consumer Electronics and Telecom Equipment Industries
  • Figure 38: Top Companies Adopted Mergers & Acquisitions and New Product Launches as the Key Growth Strategies During 2011-2014
  • Figure 39: Global Thermal Interface Material Market Share, By Key Player, 2014
  • Figure 40: Battle for Market Share: Acquisitions Was the Key Strategy
  • Figure 41: Key Players-Geographic Analysis
  • Figure 42: 3M: Company Snapshot
  • Figure 43: 3M: SWOT Analysis
  • Figure 44: DOW Corning Corporation: SWOT Analysis
  • Figure 45: Henkel AG: Company Snapshot
  • Figure 46: Henkel AG: SWOT Analysis
  • Figure 47: Laird Technologies: Company Snapshot
  • Figure 48: Laird Technologies: SWOT Analysis
  • Figure 49: Parker Hannifin Corp: Company Snapshot
  • Figure 50: Parker Hannifin Corp.: SWOT Analysis
  • Figure 51: Honeywell International Inc.: Company Snapshot
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