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3次元集積回路(3D IC/チップ)&シリコン貫通電極(TSV)インターコネクト市場:世界市場予測・動向分析(2011-2016年)

Three-dimensional Integrated Circuit (3D IC/Chip) & Through-Silicon Via (TSV) Interconnects Market - Global Forecast & Trend Analysis (2011 - 2016)

発行 MarketsandMarkets 商品コード 235820
出版日 ページ情報 英文 195 Pages
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3次元集積回路(3D IC/チップ)&シリコン貫通電極(TSV)インターコネクト市場:世界市場予測・動向分析(2011-2016年) Three-dimensional Integrated Circuit (3D IC/Chip) & Through-Silicon Via (TSV) Interconnects Market - Global Forecast & Trend Analysis (2011 - 2016)
出版日: 2012年04月05日 ページ情報: 英文 195 Pages
概要

2009年、世界の3D IC市場は22億1,000万ドルの市場規模を記録しました。2011年から2016年にかけては16.9%の年平均成長率で推移し、2016年には65億5,000万ドルの規模に成長すると予測されています。

当レポートでは、3D IC/チップおよびTSVインターコネクトの市場について調査分析し、市場の発展の経緯、技術区分による市場の分類、技術・製品・エンドユーズ・地域別の収益実績・予測(〜2016年)、市場影響因子の分析、新製品の開発動向、企業間の各種提携・契約、競合環境、主要企業のプロファイルなどをまとめ、概略下記の構成でお届けいたします。

第1章 イントロダクション

  • 要点
  • レポート概要
  • 対象市場
  • ステークホルダー
  • 調査手法

第2章 エグゼクティブサマリー

第3章 市場概要

  • 市場の定義
  • 世界の3D IC市場
  • 世界のTSVインターコネクト市場
  • 発展の経緯
  • 3D IC市場との関連産業区分
    • EDAベンダー
    • ファウンドリベンダー
    • ファブレスベンダー
    • 集積デバイス製造業者
  • 世界の3D IC市場の推計・予測
  • 世界の3D IC市場の力学
    • 成長推進因子
    • 成長阻害因子
    • 市場機会
  • 緊急課題
    • サプライチェーンの課題
  • 成功の鍵
    • 標準化
  • バリューチェーン分析
    • 産業区分別
    • 3D IC設計フロー別

第4章 3D IC市場の分類

  • 3D IC市場の分類:技術別
    • 3D IC市場:基板別
      • SOI
      • バルクシリコン
    • 3D IC市場:ボンディング技術別
      • ダイツーダイ
      • ダイツーウエハ
      • ウエハツーウエハ
      • ダイレクトボンディング
      • 粘着ボンディング
      • 金属ボンディング
    • 3D IC&TSVインターコネクト市場:工程順序別
      • ビアファース
      • ビアミドル
      • ビアラスト
  • 3D IC市場の分類:ファブリケーション技術別
    • ビーム再結晶化
    • ウエハボンディング
    • シリコンエピタキシャル成長
    • 固相結晶

第5章 製品別市場

  • メモリー
  • LED
  • センサー
  • パワー&アナログコンポーネント
  • MEMS
  • その他
  • 将来の用途

第6章 用途別市場

  • CE製品
    • モバイルデバイス
    • コンピューター・ラップトップ用プロセッサー
  • 情報通信技術
    • 通信
    • 情報技術・ネットワーキング
  • 自動車
    • 自動車センサー
    • 自動車ボディエレクトロニクス
  • 軍事・航空宇宙・防衛
  • その他

第7章 地域分析

  • 北米
  • 欧州
  • アジア
  • その他

第8章 競合環境

  • 概要
  • 主要企業・市場収益分析
  • 3D IC・TSVインターコネクト市場分析
  • 提携・ジョイントベンチャー・各種契約
  • M&A
  • 新製品開発

第9章 企業プロファイル(20社)

  • 企業概要
  • 財務データ
  • 製品・サービス
  • 戦略
  • 発展動向

図表

目次
Product Code: SE 1081

Title: 3D IC/Chip & TSV Interconnects Market - Global Forecast & Trend Analysis (2011 - 2016) By Technology (Substrate, Bonding Techniques, Process Realization, Fabrication), Products (Memory, LED, Sensor, MEMS, Power & Analog Components) & Applications (Mobile Devices, Processors, ICT, Networking, Automotive, Defense).

The gradual migration towards 3D ICs with TSVs happened with accelerated demand for higher bandwidths, reduced power consumption, and higher density. 3D IC technology and its integration with through silicon vias (TSVs) have been witnessing significant commercial strides in the past two years. This is mainly attributed to the high efficiency of the solution and the guaranteed return on investment (ROI) to the investors.

Improved performance, reduced timing, and form factor motivation serve as key drivers for adoption of 3D IC and TSV interconnect solutions. On the other hand, thermal and testing issues and high cost involved largely restrain the growth of the market. In terms of revenue generation, Asia is observed to hold the highest share of around 40%, followed by North America with 35%.

Amongst the different end-products that utilize 3D ICs and TSV interconnects, memories and sensors are expected to provide the largest market owing to improvements in design that can be achieved and the growing demand for such enhanced designs in a wide variety of applications. With respect to the application sectors, consumer electronics sector largely contributes to the overall growth of the market. In the near future, it is expected that newer applications such as hybrid memory, graphics processor unit, low density parity check decoder, and cell broadband engine will emerge and serve as potential markets for 3D ICs and TSV interconnects.

The global 3D IC market is expected to grow from $2.21 billion in 2009 to $6.55 billion in 2016 at a CAGR of 16.9% from 2011 to 2016. The companies in this market need to efficiently balance their expenditure between capacity expansion and technology advancement. This is considered critical since the market for 3D ICs is yet to gain complete recognition and its successful penetration into different end-user segments is largely governed by the R&D initiatives.

IntSim is an open-source CAD tool to simulate 2D and 3D-ICs. It can be used for predicting 2D/3D chip power, die size, number of metal levels, and optimal sizes of metal levels based on various technology and design parameters. Users can also study scaling trends, and use IntSim to optimize their chip designs.

Scope of the report

The 3D IC Chip and TSV interconnect market research report categorizes the global market on the basis of the different manufacturing approaches, use of these ICs in different end-products, use of these in various applications and geographical analysis; forecasting revenue and analyzing trends in the market.

On the basis of manufacturing approaches

The two types of substrates used in the process include silicon on insulator and bulk silicon. Based on the bonding technique employed, the different types include die to die, die to wafer, wafer to wafer, direct bonding, adhesive bonding, and metallic bonding. The different vias processing techniques include via first, via middle, and via last. The different fabrication technologies include beam recrystallization, wafer bonding, silicon epitaxial growth and solid phase crystallization. The market trend for these approaches is discussed.

On the basis of product

The product market is segmented into memories, LEDs, sensors, power and analog components, micro electro mechanical systems (MEMS), and others. The market trend for these products is discussed.

On the basis of applications

The application market is segmented into military, aerospace and defense, consumer electronics, information and communication technology, automotive, and others. The market trend for these applications is discussed.

On the basis of geography

  • North America
  • Europe
  • Asia
  • ROW

Each section will provide market data, market drivers, trends and opportunities, key players, and competitive outlook. This report will also provide market tables for covering the sub-segments and micro-markets. In addition, it provides more than 20 company profiles covering all the sub-segments.

Table of Contents

1. INTRODUCTION

  • 1.1. KEY TAKE-AWAYS
  • 1.2. REPORT DESCRIPTION
  • 1.3. MARKETS COVERED
  • 1.4. STAKEHOLDERS
  • 1.5. RESEARCH METHODOLOGY
    • 1.5.1. MARKET SIZE
    • 1.5.2. KEY DATA POINTS TAKEN FROM SECONDARY SOURCES
    • 1.5.3. KEY DATA POINTS TAKEN FROM PRIMARY SOURCES
    • 1.5.4. ASSUMPTIONS
    • 1.5.5. LIST OF COMPANIES COVERED DURING PRIMARIES

2. EXECUTIVE SUMMARY

3. MARKET OVERVIEW

  • 3.1. MARKET DEFINITION
  • 3.2. GLOBAL THREE DIMENSIONAL INTEGRATED CIRCUIT (3D IC) MARKET
  • 3.3. GLOBAL TSV INTERCONNECT MARKET
  • 3.4. HISTORY & EVOLUTION
  • 3.5. ALLIED INDUSTRY SEGMENTS TO 3D IC MARKET
    • 3.5.1. ELECTRONIC DESIGN AUTOMATION (EDA) VENDORS
    • 3.5.2. FOUNDRY VENDORS
    • 3.5.3. FABLESS VENDORS
    • 3.5.4. INTEGRATED DEVICE MANUFACTURERS
  • 3.6. GLOBAL 3D IC MARKET ESTIMATES AND FORECASTS
  • 3.7. GLOBAL 3D IC MARKET DYNAMICS
    • 3.7.1. DRIVERS
      • 3.7.1.1. Reduction in timing
      • 3.7.1.2. Improved performance
      • 3.7.1.3. Form factor motivation
    • 3.7.2. RESTRAINTS
      • 3.7.2.1. Cost
      • 3.7.2.2. Thermal issues
      • 3.7.2.3. Testing issues
    • 3.7.3. OPPORTUNITIES
      • 3.7.3.1. Need for advanced architecture in electronic products
      • 3.7.3.2. Opportunity for reactive ion etching (RIE) equipment manufacturers
  • 3.8. BURNING ISSUES
    • 3.8.1. SUPPLY CHAIN ISSUES
  • 3.9. WINNING IMPERATIVES
    • 3.9.1. STANDARDIZATION
  • 3.10. VALUE CHAIN ANALYSIS
    • 3.10.1. VALUE CHAIN ANALYSIS BASED ON INDUSTRY SEGMENTS
    • 3.10.2. VALUE CHAIN ANALYSIS BASED ON 3D IC DESIGN FLOW

4. 3D IC MARKET CLASSIFICATION

  • 4.1. CLASSIFICATION OF 3D IC MARKET BY TECHNOLOGY
    • 4.1.1. 3D IC MARKET SEGMENTATION BY SUBSTRATE
      • 4.1.1.1. Silicon on Insulator (SOI)
      • 4.1.1.2. Bulk silicon
    • 4.1.2. 3D IC MARKET SEGMENTATION BY BONDING TECHNIQUE
      • 4.1.2.1. Die to Die
      • 4.1.2.2. Die to wafer
      • 4.1.2.3. Wafer to wafer
      • 4.1.2.4. Direct bonding
      • 4.1.2.5. Adhesive bonding
      • 4.1.2.6. Metallic bonding
    • 4.1.3. 3D IC & TSV INTERCONNECTS MARKET SEGMENTATION BY PROCESS REALIZATION
      • 4.1.3.1. Via first
      • 4.1.3.2. Via middle
      • 4.1.3.3. Via last
  • 4.2. 3D IC MARKET SEGMENTATION BY FABRICATION TECHNOLOGY
    • 4.2.1. BEAM RECRYSTALLIZATION
      • 4.2.1.1. Restraint
        • 4.2.1.1.1. Need for high temperature
    • 4.2.2. WAFER BONDING
      • 4.2.2.1. Drivers
        • 4.2.2.1.1. Identical electrical properties
        • 4.2.2.1.2. Reduced complexity
    • 4.2.3. SILICON EPITAXIAL GROWTH
      • 4.2.3.1. Restraint
        • 4.2.3.1.1. Degradation in quality
    • 4.2.4. SOLID PHASE CRYSTALLIZATION
      • 4.2.4.1. Drivers
        • 4.2.4.1.1. Compatibility with conventional processing environments
        • 4.2.4.1.2. Absence of thermal issues

5. PRODUCT MARKET

  • 5.1. MEMORIES
  • 5.2. LIGHT EMITTING DIODES
  • 5.3. SENSORS
  • 5.4. POWER AND ANALOG COMPONENTS
  • 5.5. MICROELECTROMECHNICAL SYSTEMS (MEMS)
  • 5.6. OTHERS
  • 5.7. FUTURE APPLICATIONS

6. APPLICATION MARKET

  • 6.1. CONSUMER ELECTRONICS SECTOR
    • 6.1.1. MOBILE DEVICES
    • 6.1.2. PROCESSORS IN COMPUTERS AND LAPTOPS
  • 6.2. INFORMATION AND COMMUNICATION TECHNOLOGY SECTOR
    • 6.2.1. COMMUNICATIONS
    • 6.2.2. INFORMATION TECHNOLOGY & NETWORKING
  • 6.3. AUTOMOTIVE SECTOR
    • 6.3.1. AUTOMOTIVE SENSORS
    • 6.3.2. AUTOMOTIVE BODY ELECTRONICS
  • 6.4. MILITARY, AEROSPACE AND DEFENSE
  • 6.5. OTHER SECTORS

7. GEOGRAPHIC ANALYSIS

  • 7.1. NORTH AMERICA
  • 7.2. EUROPE
  • 7.3. ASIA
  • 7.4. REST OF THE WORLD

8. COMPETITIVE LANDSCAPE

  • 8.1. OVERVIEW
  • 8.2. MARKET PLAYERS AND MARKET REVENUE ANALYSIS
  • 8.3. 3D IC AND TSV INTERCONNECT MARKET ANALYSIS
  • 8.4. COLLABORATIONS, PARTNERSHIPS, JOINT VENTURES AND AGREEMENTS
  • 8.5. MERGERS & ACQUISITIONS
  • 8.6. NEW PRODUCT DEVELOPMENT

9. COMPANY PROFILES

  • 9.1. AMKOR TECHNOLOGY
    • 9.1.1. OVERVIEW
    • 9.1.2. PRODUCTS & SERVICES
    • 9.1.3. FINANCIALS
    • 9.1.4. STRATEGY
    • 9.1.5. DEVELOPMENTS
  • 9.2. ELPIDA MEMORY INC
    • 9.2.1. OVERVIEW
    • 9.2.2. PRODUCTS & SERVICES
    • 9.2.3. FINANCIALS
    • 9.2.4. STRATEGY
    • 9.2.5. DEVELOPMENTS
  • 9.3. IBM CORP
    • 9.3.1. OVERVIEW
    • 9.3.2. PRODUCTS & SERVICES
    • 9.3.3. FINANCIALS
    • 9.3.4. STRATEGY
    • 9.3.5. DEVELOPMENTS
  • 9.4. INTEL CORPORATION
    • 9.4.1. OVERVIEW
    • 9.4.2. PRODUCTS & SERVICES
    • 9.4.3. FINANCIALS
    • 9.4.4. STRATEGY
    • 9.4.5. DEVELOPMENTS
  • 9.5. MICRON TECHNOLOGY INC
    • 9.5.1. OVERVIEW
    • 9.5.2. PRODUCTS & SERVICES
    • 9.5.3. FINANCIALS
    • 9.5.4. STRATEGY
    • 9.5.5. DEVELOPMENTS
  • 9.6. MONOLITHIC 3D INC
    • 9.6.1. OVERVIEW
    • 9.6.2. PRODUCTS & SERVICES
    • 9.6.3. FINANCIALS
    • 9.6.4. STRATEGY
    • 9.6.5. DEVELOPMENTS
  • 9.7. NEC ELECTRONICS CORPORATION
    • 9.7.1. OVERVIEW
    • 9.7.2. PRODUCTS & SERVICES
    • 9.7.3. FINANCIALS
    • 9.7.4. STRATEGY
    • 9.7.5. DEVELOPMENTS
  • 9.8. QUALCOMM INCORPORATED
    • 9.8.1. OVERVIEW
    • 9.8.2. PRODUCTS & SERVICES
    • 9.8.3. FINANCIALS
    • 9.8.4. STRATEGY
    • 9.8.5. DEVELOPMENTS
  • 9.9. RENESAS ELECTRONICS CORPORATION
    • 9.9.1. OVERVIEW
    • 9.9.2. PRODUCTS & SERVICES
    • 9.9.3. FINANCIALS
    • 9.9.4. STRATEGY
    • 9.9.5. DEVELOPMENTS
  • 9.10. SAMSUNG ELECTRONICS CO LTD
    • 9.10.1. OVERVIEW
    • 9.10.2. PRODUCTS & SERVICES
    • 9.10.3. FINANCIALS
    • 9.10.4. STRATEGY
    • 9.10.5. DEVELOPMENTS
  • 9.11. SONY
    • 9.11.1. OVERVIEW
    • 9.11.2. PRODUCTS & SERVICES
    • 9.11.3. FINANCIALS
    • 9.11.4. STRATEGY
    • 9.11.5. DEVELOPMENTS
  • 9.12. STATSCHIP PAC
    • 9.12.1. OVERVIEW
    • 9.12.2. PRODUCTS & SERVICES
    • 9.12.3. FINANCIALS
    • 9.12.4. STRATEGY
    • 9.12.5. DEVELOPMENTS
  • 9.13. ST MICROELECTRONICS
    • 9.13.1. OVERVIEW
    • 9.13.2. PRODUCTS & SERVICES
    • 9.13.3. FINANCIALS
    • 9.13.4. STRATEGY
    • 9.13.5. DEVELOPMENTS
  • 9.14. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
    • 9.14.1. OVERVIEW
    • 9.14.2. PRODUCTS & SERVICES
    • 9.14.3. FINANCIALS
    • 9.14.4. STRATEGY
    • 9.14.5. DEVELOPMENTS
  • 9.15. TEXAS INSTRUMENTS INCORPORATED
    • 9.15.1. OVERVIEW
    • 9.15.2. PRODUCTS & SERVICES
    • 9.15.3. FINANCIALS
    • 9.15.4. STRATEGY
    • 9.15.5. DEVELOPMENTS
  • 9.16. TEZZARON SEMICONDUCTOR
    • 9.16.1. OVERVIEW
    • 9.16.2. PRODUCTS & SERVICES
    • 9.16.3. FINANCIALS
    • 9.16.4. STRATEGY
    • 9.16.5. DEVELOPMENTS
  • 9.17. TOSHIBA CORPORATION
    • 9.17.1. OVERVIEW
    • 9.17.2. PRODUCTS & SERVICES
    • 9.17.3. FINANCIALS
    • 9.17.4. STRATEGY
    • 9.17.5. DEVELOPMENTS
  • 9.18. UNITED MICROELECTRONICS CORPORATION
    • 9.18.1. OVERVIEW
    • 9.18.2. PRODUCTS & SERVICES
    • 9.18.3. FINANCIALS
    • 9.18.4. STRATEGY
    • 9.18.5. DEVELOPMENTS
  • 9.19. XILINX INCORPORATED
    • 9.19.1. OVERVIEW
    • 9.19.2. PRODUCTS & SERVICES
    • 9.19.3. FINANCIALS
    • 9.19.4. STRATEGY
    • 9.19.5. DEVELOPMENTS
  • 9.20. ZIPTRONIX, INC
    • 9.20.1. OVERVIEW
    • 9.20.2. PRODUCTS & SERVICES
    • 9.20.3. FINANCIALS
    • 9.20.4. STRATEGY
    • 9.20.5. DEVELOPMENTS

LIST OF TABLES

  • TABLE 1: 3D IC MARKET REVENUE, BY GEOGRAPHY, 2009 - 2016 ($BILLION)
  • TABLE 2: GLOBAL 3D IC MARKET REVENUE, BY PRODUCTS, 2009 - 2016 ($BILLION)
  • TABLE 3: GLOBAL 3D IC MARKET, BY APPLICATIONS, 2009 - 2016 ($BILLION)
  • TABLE 4: GLOBAL 3D IC MARKET REVENUE ($BILLION) & VOLUME (BILLION UNITS), 2009 - 2016
  • TABLE 5: IC IP MARKET REVENUE, BY SEGMENT, 2012 - 2017 ($MILLION)
  • TABLE 6: IC IP MARKET VOLUME, BY SEGMENT 2012 - 2017 (MILLION UNITS)
  • TABLE 7: GLOBAL IC IP MARKET REVENUE, BY APPLICATION 2012 - 2017 ($MILLION)
  • TABLE 8: GLOBAL IC IP MARKET REVENUE, BY GEOGRAPHY, 2012 - 2017 ($MILLION)
  • TABLE 9: 3D IC MARKET REVENUE, BY GEOGRAPHY, 2009 - 2016 ($BILLION)
  • TABLE 10: GLOBAL 3D IC MARKET REVENUE, BY PRODUCT TYPES, 2009 - 2016 ($BILLION)
  • TABLE 11: GLOBAL 3D IC MARKET, BY APPLICATION SECTORS, 2009 - 2016 ($BILLION)
  • TABLE 12: GLOBAL SOI WAFERS MARKET, BY TYPE, 2008 - 2015 ($MILLION)
  • TABLE 13: GLOBAL THICK FILM SOI WAFERS MARKET REVENUE, BY PRODUCT, 2008 - 2015 ($MILLION)
  • TABLE 14: GLOBAL THIN FILM SOI WAFERS MARKET REVENUE, BY APPLICATIONS, 2008 - 2015 ($MILLION)
  • TABLE 15: COMPARATIVE STUDY OF BONDING TECHNIQUES
  • TABLE 16: VIA FIRST APPROACH - ADVANTAGES & DISADVANTAGES
  • TABLE 17: 3D IC MARKET REVENUE FOR MEMORIES, BY GEOGRAPHY, 2009 - 2016 ($BILLION)
  • TABLE 18: GLOBAL LED CHIPS MARKET, BY APPLICATIONS, 2007 - 2014 ($MILLION)
  • TABLE 19: 3D IC MARKET REVENUE FOR LEDS, BY GEOGRAPHY, 2009 - 2016 ($BILLION)
  • TABLE 20: GLOBAL SENSORS MARKET FOR CONSUMER ELECTRONICS, BY SENSOR TYPES, 2008 - 2015 ($MILLION)
  • TABLE 21: AUTOMOTIVE SENSOR MARKET REVENUE, BY APPLICATIONS, 2010 - 2016 ($BILLION)
  • TABLE 22: 3D IC MARKET REVENUE FOR SENSORS, BY GEOGRAPHY, 2009 - 2016 ($BILLION)
  • TABLE 23: 3D IC MARKET REVENUE FOR POWER AND ANALOG COMPONENTS, BY GEOGRAPHY, 2009 - 2016 ($BILLION)
  • TABLE 24: 3D IC MARKET REVENUE FOR MEMS, BY GEOGRAPHY, 2009 - 2016 ($BILLION)
  • TABLE 25: 3D IC MARKET FOR OTHER PRODUCTS, BY GEOGRAPHY, 2009 - 2016 ($BILLION)
  • TABLE 26: FUTURE POTENTIAL APPLICATIONS FOR 3D ICS
  • TABLE 27: GLOBAL MOBILE HANDSET MARKET REVENUE, BY TYPES, 2008 - 2015 ($MILLION)
  • TABLE 28: GLOBAL SENSORS MARKET, BY APPLICATIONS UNDER CONSUMER ELECTRONICS SECTOR, 2008 - 2015 ($MILLION)
  • TABLE 29: 3D IC MARKET REVENUE IN CONSUMER ELECTRONICS SECTOR, BY GEOGRAPHY, 2009 - 2016 ($BILLION)
  • TABLE 30: 3D IC MARKET REVENUE IN INFORMATION AND COMMUNICATION TECHNOLOGIES SECTOR, BY GEOGRAPHY, 2009 - 2016 ($BILLION)
  • TABLE 31: 3D IC MARKET REVENUE IN AUTOMOTIVE SECTOR, BY GEOGRAPHY, 2009 - 2016 ($BILLION)
  • TABLE 32: GLOBAL AUTOMOTIVE SENSORS MARKET REVENUE, BY PRODUCT TYPES, 2010 - 2016 ($BILLION)
  • TABLE 33: 3D IC MARKET REVENUE IN MILITARY, AEROSPACE & DEFENSE SECTOR, BY GEOGRAPHY, 2009 - 2016 ($BILLION)
  • TABLE 34: 3D IC MARKET REVENUE IN OTHER APPLICATION SECTORS, BY GEOGRAPHY, 2009 - 2016 ($BILLION)
  • TABLE 35: NORTH AMERICA: 3D IC MARKET REVENUE, BY PRODUCTS, 2009 - 2016 ($BILLION)
  • TABLE 36: NORTH AMERICA: 3D IC MARKET REVENUE, BY APPLICATIONS, 2009 - 2016 ($BILLION)
  • TABLE 37: EUROPE: 3D IC MARKET REVENUE, BY PRODUCTS, 2009 - 2016 ($BILLION)
  • TABLE 38: EUROPE: 3D IC MARKET, BY APPLICATIONS, 2009 - 2016 ($BILLION)
  • TABLE 39: ASIA: 3D IC MARKET REVENUE, BY PRODUCTS, 2009 - 2016 ($BILLION)
  • TABLE 40: ASIAN 3D IC MARKET REVENUE, BY APPLICATIONS, 2009 - 2016 ($BILLION)
  • TABLE 41: REST OF THE WORLD: 3D IC MARKET REVENUE, BY PRODUCTS, 2009 - 2016 ($BILLION)
  • TABLE 42: REST OF THE WORLD 3D IC MARKET, BY APPLICATIONS, 2009 - 2016 ($BILLION)
  • TABLE 43: 3D IC AND TSV INTERCONNECT MARKET - KEY PLAYER REVENUE ($BILLION)
  • TABLE 44: 3D IC AND TSV INTECONNECT MARKET - KEY PLAYERS' REVENUE ANALYSIS, 2011 ($BILLION)
  • TABLE 45: COLABORATIONS/PARTNERSHIPS/AGREEMENTS/JOINT VENTURES, 2009 - 2011
  • TABLE 46: MERGERS AND ACQUISITIONS, 2009 - 2011
  • TABLE 47: NEW PRODUCTS, 2009 - 2011
  • TABLE 48: AMKOR TECHNOLOGY - FINANCIALS, 2010 - 2011 ($MILLION)
  • TABLE 49: ELPIDA MEMORY INC. FINANCIALS, 2009 - 2010 ($MILLION)
  • TABLE 50: IBM - FINANCIALS, 2010 - 2011 ($MILLION)
  • TABLE 51: INTEL CORPORATION: MARKET REVENUE, 2009 - 2010 ($MILLION)
  • TABLE 52: INTEL CORPORATION: MARKET REVENUE, BY SEGMENT, 2011 ($BILLION)
  • TABLE 53: MICRON TECHNOLOGY - FINANCIALS, 2010 - 2011 ($MILLION)
  • TABLE 54: MICRON TECHNOLOGY - NET SALES FROM DIFFERENT PRODUCT CATEGORIES, 2010 - 2011 ($MILLION)
  • TABLE 55: NEC CORPORATION: MARKET REVENUE, 2010-2011 ($MILLION)
  • TABLE 56: NEC CORPORATION: MARKET REVENUE, BY SEGMENT, 2011 ($BILLION)
  • TABLE 57: QUALCOMM INC: MARKET REVENUE, BY SEGMENTS, 2010 - 2011 ($MILLION)
  • TABLE 58: RENESAS ELECTRONICS: MARKET REVENUE, BY SEGMENTS, 2011 ($MILLION)
  • TABLE 59: SAMSUNG ELECTRONICS: MARKET REVENUE, 2009-2010 ($MILLION)
  • TABLE 60: SONY: MARKET REVENUE, 2010-2011 ($BILLION)
  • TABLE 61: SONY: PROPORTION OF SALES BY BUSINESS SEGMENT, 2011
  • TABLE 62: STATSCHIPPAC LTD: MARKET REVENUE, 2010-2011 ($MILLION)
  • TABLE 63: STMICROELECTRONICS: MARKET REVENUE, BY SEGMENT, 2009 - 2010 ($MILLION)
  • TABLE 64: STMICROELECTRONICS: MARKET REVENUE, BY GEOGRAPHY, 2009 - 2010 ($MILLION)
  • TABLE 65: TSMC: MARKET REVENUE, BY SEGMENTS (UNCONSOLIDATED), 2009 - 2010 ($THOUSANDS)
  • TABLE 66: TEXAS INSTRUMENTS: MARKET REVENUE, BY SEGMENTS, 2009 - 2010 ($MILLION)
  • TABLE 67: TOSHIBA: MARKET REVENUE, 2010 - 2011 ($BILLION)
  • TABLE 68: UMC: MARKET REVENUE, 2010 - 2011 ($MILLION)
  • TABLE 69: XILINX: MARKET REVENUE, 2010 - 2011 ($THOUSANDS)
  • TABLE 70: XILINX: % OF TOTAL NET REVENUES, BY END MARKETS, 2010 - 2011

LIST OF FIGURES

  • FIGURE 1: 3D IC AND TSV INTERCONNECT MARKET SEGMENTATION
  • FIGURE 2: IC IP MARKET REVENUE ($MILLION) & VOLUME (MILLION UNITS), 2011 - 2016
  • FIGURE 3: HISTORY AND EVOLUTION OF 3D IC AND TSV INTERCONNECT
  • FIGURE 4: ALLIED INDUSTRY SEGMENTS TO 3D IC & TSV INTERCONNECT MARKETS - MARKET SHARE ANALYSIS
  • FIGURE 5: FABLESS IC VENDORS - MARKET SHARE ANALYSIS
  • FIGURE 6: 3D ICS AND TSV INTERCONNECTS MARKET DRIVERS - IMPACT ASSESSMENT
  • FIGURE 7: 3D ICS AND TSV INTERCONNECTS MARKET RESTRAINTS - IMPACT ASSESSMENT
  • FIGURE 8: 3D ICS AND TSV INTERCONNECTS MARKET OPPORTUNITIES - IMPACT ASSESSMENT
  • FIGURE 9: 3D IC - STANDARDS AND ORGANIZATIONS
  • FIGURE 10: VALUE CHAIN ANALYSIS BASED ON INDUSTRY SEGMENTS
  • FIGURE 11: VALUE CHAIN ANALYSIS BASED ON 3D IC DESIGN FLOW
  • FIGURE 12: 2D VS 3D TECHNOLOGIES FOR FLASH MEMORIES - COST ANALYSIS
  • FIGURE 13: MARKET ASSESSMENT CHART FOR LED DRIVER ICS
  • FIGURE 14: 3D IC AND TSV INTERCONNECT MARKET - FUTURE POTENTIAL APPLICATIONS
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