表紙:半導体接合の世界市場 (~2026年):タイプ (ダイボンダー・ウエハボンダー・フリップチップボンダー)・用途 (RFデバイス・MEMS&センサー・LED・3D NAND・CMOSイメージセンサー)・プロセスタイプ・技術・地域別
市場調査レポート
商品コード
1027223

半導体接合の世界市場 (~2026年):タイプ (ダイボンダー・ウエハボンダー・フリップチップボンダー)・用途 (RFデバイス・MEMS&センサー・LED・3D NAND・CMOSイメージセンサー)・プロセスタイプ・技術・地域別

Semiconductor Bonding Market by Type (Die Bonder, Wafer Bonder, and Flip Chip Bonder), Application (RF Devices, MEMS and Sensors, LED, 3D NAND and CMOS Image Sensors), Process Type, Technology and Region - Global Forecast to 2026

出版日: | 発行: MarketsandMarkets | ページ情報: 英文 201 Pages | 納期: 即納可能 即納可能とは

価格
価格表記: USDを日本円(税抜)に換算
本日の銀行送金レート: 1USD=111.41円
半導体接合の世界市場 (~2026年):タイプ (ダイボンダー・ウエハボンダー・フリップチップボンダー)・用途 (RFデバイス・MEMS&センサー・LED・3D NAND・CMOSイメージセンサー)・プロセスタイプ・技術・地域別
出版日: 2021年09月02日
発行: MarketsandMarkets
ページ情報: 英文 201 Pages
納期: 即納可能 即納可能とは
  • 全表示
  • 概要
  • 目次
概要

半導体接合の市場規模は予測期間中3.6%のCAGRで推移し、2021年の8億8700万米ドルから、2026年には10億5900万米ドルの規模に成長すると予測されています。

電気自動車やハイブリッド車などの用途で半導体接合の需要が高まっており、同市場の成長を後押ししています。

エネルギー効率が高く、環境に優しい車を作るための自動車の革新により、ICやセンサーなどの半導体デバイスの需要が高まっています。また、二酸化炭素の排出量を削減するため、一部の国では、政府の支援や業界内での大規模な投資により、EVやHEVの使用が徐々に拡大しています。EVに使用される半導体デバイスの増加とともに、半導体接合装置の需要も増加すると予測されています。

当レポートでは、世界の半導体接合の市場を調査し、市場の定義と概要、バリューチェーン、新型コロナウイルス感染症 (COVID-19) およびその他の市場影響因子の分析、技術・特許の分析、ケーススタディ、市場規模の推移・予測、プロセスタイプ・技術・タイプ・用途・地域/主要国など各種区分別の内訳、競合環境、主要企業のプロファイルなどをまとめています。

第1章 イントロダクション

第2章 調査手法

第3章 エグゼクティブサマリー

第4章 重要考察

第5章 市場概要

  • 市場力学
    • 促進要因
    • 抑制要因
    • 市場機会
    • 課題
  • バリューチェーン
  • エコシステム
  • 技術分析
  • ケーススタディ
  • 特許分析
  • ポーターのファイブフォース分析
  • 顧客の事業に影響を与える動向
  • 貿易分析

第6章 市場分析・予測:プロセスタイプ別

  • ダイツーダイ
  • ダイツーウエハ
  • ウエハ間

第7章 市場分析・予測:技術別

  • ダイ接合
    • エポキシダイ接合
    • 共晶ダイ接合
    • フリップチップアタッチメント
    • ハイブリッド接合(3D NAND用)
  • ウエハ接合
    • 直接接合
    • 陽極接合
    • TCB接合
    • ハイブリッド接合

第8章 市場分析・予測:タイプ別

  • ダイボンダー
    • 手動ダイボンダー
    • 半自動ダイボンダー
    • 完全自動ダイボンダー
  • ウエハボンダー
  • フリップチップボンダー

第9章 市場分析・予測:用途別

  • MEMS・センサー
  • CMOSイメージセンサー(CIS)
  • 無線周波数(RF)デバイス
  • LED
  • 3D NAND

第10章 市場分析・予測:地域・主要国別

  • アジア太平洋
  • 南北アメリカ
  • 欧州
  • その他の地域

第11章 競合情勢

  • 収益分析
  • 市場シェア分析
  • 主要企業の成功戦略
  • 競合リーダーシップマッピング
  • 競合状況・動向

第12章 企業プロファイル

  • 主要企業
    • ASM PACIFIC TECHNOLOGY
    • BESI
    • PANASONIC
    • FASFORD TECHNOLOGY
    • SHINKAWA LTD
    • EV GROUP(EVG)
    • SUSS MICROTECH SE
    • KULICKE & SOFFA INDUSTRIES
    • PALOMAR TECHNOLOGIES
    • SHIBAURA MECHATRONICS
  • 他の有力企業
    • TDK CORPORATION
    • TOKYO ELECTRON LIMITED
    • MITSUBISHI HEAVY INDUSTRIES MACHINE TOOLS
    • MYCRONIC GROUP
    • INTEL
    • SAMSUNG
    • CANON ANELVA CORPORATION
    • FINETECH
    • DR. TRESKY
    • SET CORPORATION SA
    • TOKYO OHKA KOYGO
    • BONDTECH
    • AYUMI INDUSTRIES
    • APPLIED MICROENGINEERING LIMITED
    • TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY(TSMC)
    • TORAY ENGINEERING

第13章 付録

目次
Product Code: SE 7972

Semiconductor bonding market was valued at USD 887 million in 2021 and is anticipated to reach USD 1,059 million by 2026, growing at a CAGR of 3.6% between 2021 to 2026. The growing demand for semiconductor bonding in applications such as electric and hybrid vehicles is driving the growth of semiconductor bonding market.

The semiconductor industry plays a vital role in electric and hybrid vehicles. The key components required in electric and hybrid vehicles include power semiconductor devices such as freewheeling diodes, ICs, MEMS, voltage boost DC-DC converters, fuel cell air compressors, motor drives, insulated gate bipolar transistors (IGBTs), and low-voltage power MOSFETs. Innovations in automobiles to build energy-efficient and environment-friendly vehicles have increased the demand for semiconductor devices such as ICs and sensors. Automobile companies also focus on using system on chip (SoC), which offers faster control and secure communication.

To reduce carbon emissions, the use of electric and hybrid vehicles is expanding gradually in some countries because of government support and substantial investments from the automotive industry. Advanced electric cars provided by some of the key car manufacturers, such as Bayerische Motoren Werke AG (BMW) (Germany), Ford Motor Company (US), and Toyota Motor Corporation (Japan), and the initiatives by several countries to reduce carbon emissions have increased the use of hybrid and electric vehicles. As more semiconductor devices are used in electric vehicles, the demand for semiconductor bonding equipment is expected to increase.

According to the International Energy Agency, the adoption of electric vehicles is continuously increasing across the globe, and their demand is expected to grow rapidly in the coming years. According to the Bloomberg New Energy Finance report, the sales of electric vehicles are estimated to grow to 41 million by 2040, thereby leading to a rise in the demand for electronic components used in electric vehicles.

Advanced systems, such as idling stop systems (ISS), would result in the growth in the semiconductor content in traditional fuel-based vehicles. For instance, in 2014, ROHM Semiconductor developed high-performance microcontrollers for various automotive systems, especially in electric and hybrid vehicles. Such advancements in the automotive sector increase the demand for semiconductor devices, subsequently driving the growth of the semiconductor bonding market.

Growing adoption of IoT and AI in automotive sector

The advent of Industry 4.0 and technologies such as IoT and AI in the automotive sector would contribute significantly toward the growth of the semiconductor bonding market. The increasing demand for vehicle connectivity would encourage new developments in the industry. With ongoing trends such as touch-free human-machine interfaces revolutionizing the automotive sector, there is a growing significance of connected cars. According to a report published by the GSM Association (GSMA) in 2019, the number of IoT connections is projected to reach 24.6 billion globally by 2025. Integration of IoT in automotive safety and communication technologies is one of the major reasons for the anticipated growth of IoT connections. The introduction of technologies such as advanced driver assistance systems (ADAS), adaptive cruise control, and intelligent parking assistance systems would further drive the market growth.

Cellular IoT connectivity and AI play a vital role in automotive and transportation sectors, with major use cases being shared mobility, autonomous vehicles, connected vehicles, telematics, smart public transportation, and C-V2sx vehicles. The development of smart infrastructures such as smart cities and intelligent transportation systems would accelerate the implementation of AI and IoT technologies in automotive and transportation. As per MarketsandMarkets, the connected car market is expected to grow from USD 53.9 billion in 2019 to USD 166 billion by 2025; it is anticipated to register a CAGR of 25.2% during 2020-2025.

The implementation of IoT and AI technologies in automobiles is leading to the integration of a large number of intelligent sensors and actuators, as well as AI chips such as ADAS, LiDAR, and neuromorphic chips. These components do not use standard packaging, as different customers have different packaging designs. The manufacturing process of these components comprises high-precision dispensing and stamping of epoxy. Some use eutectic and ultraviolet (UV) processes. This necessitates the demand for flexible multi-die and multi-process die bonding machines with high speed and high accuracy.

Asia Pacific is the fastest-growing region in the semiconductor bonding market

In 2020, APAC accounted for a 62.6% share of the global semiconductor bonding market. The growth of the semiconductor bonding in APAC is attributed to the presence of several OSAT players in China and Taiwan. The region also houses semiconductor fabrication facilities of a few of the major IDMs, such as Intel (US), Micron (US), NXP Semiconductors (Netherlands), SK Hynix (South Korea). Samsung (South Korea), Texas Instruments (US). ASM Pacific Technology Ltd. (Singapore), SHIBUYA CORPORATION (Japan), Kulicke & Soffa (Singapore), and Shinkawa Ltd. (Japan) are among the major players in this market that have their headquarters in APAC.

The breakup of primaries conducted during the study is depicted below:

  • By Company Type: Tier 1 - 45 %, Tier 2 - 32%, and Tier 3 -23%
  • By Designation: C-Level Executives - 30%, Directors - 45%, and Others - 25%
  • By Region: North America- 26%, Europe - 40%, APAC - 22% and ROW - 12%

Research Coverage

The report segments the semiconductor bonding market and forecasts its size, by volume and value, based on region (North America, Europe, Asia Pacific, and RoW), Semiconductor Bonding Market by Type (Die Bonder, Wafer Bonder and Flip Chip Bonder), Application (RF Devices, MEMS and Sensors, LED, 3D NAND and CMOS Image Sensors), Process Type(Die-to-die bonding, Die-to wafer bonding and Wafer-to-wafer bonding), Technology(Die bonding technology ( Eutectic Die Bonding (Epoxy Die Bonding, Flip Chip Attachment, Hybrid Bonding (for 3D-NAND)) and Wafer Bonding Technology (Direct Wafer Bonding, Anodic Wafer Bonding, Tcb Wafer Bonding, Hybrid Bonding, Others)). The report also provides a comprehensive review of market drivers, restraints, opportunities, and challenges in the semiconductor bonding market. The report also covers qualitative aspects in addition to the quantitative aspects of these markets.

Key Benefits of Buying This Report

  • This report includes market statistics pertaining to the process type, type, application, technology and region.
  • An in-depth value chain analysis has been done to provide deep insight into the semiconductor bonding market.
  • Major market drivers, restraints, challenges, and opportunities have been detailed in this report.
  • Illustrative segmentation, analyses, and forecasts for the market based on process type, type, application, technology, and region have been conducted to provide an overall view of the semiconductor bonding market.
  • The report includes an in-depth analysis and ranking of key players.

TABLE OF CONTENTS

1 INTRODUCTION

  • 1.1 STUDY OBJECTIVES
  • 1.2 MARKET DEFINITION AND SCOPE
    • 1.2.1 INCLUSIONS AND EXCLUSIONS
  • 1.3 SCOPE
    • 1.3.1 MARKETS COVERED
    • 1.3.2 YEARS CONSIDERED
  • 1.4 CURRENCY
  • 1.5 LIMITATIONS
  • 1.6 STAKEHOLDERS

2 RESEARCH METHODOLOGY

  • 2.1 RESEARCH DATA
    • FIGURE 1 SEMICONDUCTOR BONDING EQUIPMENT MARKET: RESEARCH DESIGN
    • 2.1.1 SECONDARY DATA
      • 2.1.1.1 Secondary sources
    • 2.1.2 PRIMARY DATA
      • 2.1.2.1 Primary sources
      • 2.1.2.2 Breakdown of primary interviews
  • 2.2 MARKET SIZE ESTIMATION
    • FIGURE 2 MARKET SIZE ESTIMATION METHODOLOGY: APPROACH 3-BOTTOM-UP MARKET ESTIMATION FOR SEMICONDUCTOR BONDING EQUIPMENT, BY TYPE
    • 2.2.1 BOTTOM-UP APPROACH
      • 2.2.1.1 Approach for estimating market size by bottom-up approach (demand side)
    • FIGURE 3 MARKET SIZE ESTIMATION METHODOLOGY: BOTTOM-UP APPROACH
    • 2.2.2 TOP-DOWN APPROACH
      • 2.2.2.1 Approach for estimating market size by top-down approach (supply side)
    • FIGURE 4 MARKET SIZE ESTIMATION METHODOLOGY: TOP-DOWN APPROACH
  • 2.3 MARKET BREAKDOWN AND DATA TRIANGULATION
    • FIGURE 5 DATA TRIANGULATION
  • 2.4 ASSUMPTIONS
    • FIGURE 6 ASSUMPTIONS FOR THE RESEARCH STUDY
  • 2.5 RISK ASSESSMENT
  • 2.6 LIMITATIONS
  • 2.7 PRIMARY INSIGHTS
    • TABLE 1 MARKET FORECASTING METHODOLOGY ADOPTED FROM 2019 TO 2026

3 EXECUTIVE SUMMARY

    • FIGURE 7 MARKET FOR WAFER BONDER TO GROW AT HIGHEST CAGR DURING 2021-2026
    • FIGURE 8 SEMICONDUCTOR BONDING MARKET FOR LED TO GROW AT HIGHEST CAGR DURING 2021-2026
    • FIGURE 9 APAC TO BE FASTEST-GROWING REGIONAL MARKET FOR SEMICONDUCTOR BONDING DURING FORECAST PERIOD
  • 3.1 IMPACT OF COVID-19 ON SEMICONDUCTOR BONDING MARKET
    • FIGURE 10 IMPACT OF COVID-19 ON SEMICONDUCTOR BONDING MARKET, 2018-2026 (USD MILLION)
  • 3.2 PRE-COVID-19
  • 3.3 PESSIMISTIC SCENARIO (POST-COVID-19)
  • 3.4 OPTIMISTIC SCENARIO (POST-COVID-19)
  • 3.5 REALISTIC SCENARIO (POST-COVID-19)

4 PREMIUM INSIGHTS

  • 4.1 ATTRACTIVE OPPORTUNITIES IN SEMICONDUCTOR BONDING MARKET
    • FIGURE 11 RISING NEED FOR 3D CHIPS IS ACTING AS POTENTIAL OPPORTUNITY FOR MARKET
  • 4.2 SEMICONDUCTOR BONDING MARKET, BY TYPE
    • FIGURE 12 MARKET FOR WAFER BONDER TO GROW AT HIGHER CAGR DURING FORECAST PERIOD
  • 4.3 MARKET FOR CLOUD SEMICONDUCTOR BONDING, BY COUNTRY
    • FIGURE 13 SEMICONDUCTOR BONDING MARKET IN JAPAN TO GROW AT HIGHEST CAGR DURING FORECAST PERIOD
  • 4.4 SEMICONDUCTOR BONDING MARKET IN APAC IN 2026, BY COUNTRY & APPLICATION
    • FIGURE 14 LED TO HOLD LARGEST SHARE OF SEMICONDUCTOR BONDING MARKET IN APAC IN 2026
  • 4.5 SEMICONDUCTOR BONDING MARKET, BY APPLICATION
    • FIGURE 15 MARKET FOR LED TO GROW AT HIGHEST CAGR BETWEEN 2021 AND 2026

5 MARKET OVERVIEW

  • 5.1 INTRODUCTION
  • 5.2 MARKET DYNAMICS
    • FIGURE 16 GROWING DEMAND FOR MINIATURIZATION OF ELECTRONIC DEVICES TO DRIVE SEMICONDUCTOR BONDING MARKET
    • 5.2.1 DRIVERS
      • 5.2.1.1 Growing demand for miniature electronic components
    • FIGURE 17 MEMS MARKET, 2017-2020 (USD MILLION)
      • 5.2.1.2 Increasing adoption of stacked die technology in IoT devices
    • FIGURE 18 INDUSTRIAL IOT MARKET, BY DEVICE AND TECHNOLOGY, 2017-2020 (USD BILLION)
      • 5.2.1.3 Rising demand for electric and hybrid vehicles
    • FIGURE 19 ELECTRIC VEHICLE SALES, 2013-2018 (MILLION UNITS)
    • FIGURE 20 SEMICONDUCTOR BONDING MARKET DRIVERS AND THEIR IMPACT
    • 5.2.2 RESTRAINTS
      • 5.2.2.1 High cost of ownership
    • FIGURE 21 SEMICONDUCTOR BONDING MARKET RESTRAINTS AND THEIR IMPACT
    • 5.2.3 OPPORTUNITIES
      • 5.2.3.1 Increasing demand for 3D semiconductor assembly and packaging
    • TABLE 2 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET FOR 3D ICS, 2020-2025 (USD MILLION)
      • 5.2.3.2 Expanding IC industry in China
    • TABLE 3 CHINA'S PROVINCES HAVE SIGNIFICANT INVESTMENT IN CHIP FUNDS (AS OF JUNE 2020)
      • 5.2.3.3 Growing adoption of IoT and AI in automotive sector
    • FIGURE 22 PROJECTED IOT CONNECTIONS BY 2025 (BILLION)
    • FIGURE 23 SEMICONDUCTOR BONDING MARKET OPPORTUNITIES AND THEIR IMPACT
    • 5.2.4 CHALLENGES
      • 5.2.4.1 Mechanical unbalance of moving parts and thin wafers being volatile and susceptible to damage caused by pressure or stress
      • 5.2.4.2 Increased complexities related to miniaturized structures of circuits
    • FIGURE 24 SEMICONDUCTOR BONDING MARKET CHALLENGES AND THEIR IMPACT
  • 5.3 VALUE CHAIN ANALYSIS
    • 5.3.1 SEMICONDUCTOR BONDING VALUE CHAIN
    • FIGURE 25 VALUE CHAIN OF SEMICONDUCTOR BONDING MARKET: MAJOR VALUE IS ADDED BY SEMICONDUCTOR BONDING EQUIPMENT PROVIDERS
    • 5.3.2 ASP ANALYSIS
    • TABLE 4 AVERAGE SELLING PRICES OF DIFFERENT TYPES OF BONDING MACHINES
    • 5.3.3 REGULATIONS
    • 5.3.4 EXPORTS-IMPORTS REGULATIONS
    • 5.3.5 RESTRICTION OF HAZARDOUS SUBSTANCES (ROHS) AND WASTE ELECTRICAL AND ELECTRONIC EQUIPMENT (WEEE)
    • 5.3.6 REGISTRATION, EVALUATION, AUTHORIZATION, AND RESTRICTION OF CHEMICALS (REACH)
  • 5.4 ECOSYSTEM
    • TABLE 5 ECOSYSTEM PLAYERS
  • 5.5 TECHNOLOGY ANALYSIS
    • 5.5.1 MEMS AND MOEMS
    • 5.5.2 WAFER BONDING
    • 5.5.3 DIE BONDING
    • 5.5.4 SOFT SOLDER
  • 5.6 CASE STUDIES
    • 5.6.1 LATEST DIE BONDING SOLUTIONS FOR PHOTONICS MANUFACTURING
    • 5.6.2 MRSI SOLVES ONE OF GREATEST CHALLENGES IN MODERN PHOTONICS MANUFACTURING
    • 5.6.3 QUICK SETTING RFID TAG BONDING - GLUTAG BONDING
    • 5.6.4 WORLD'S FIRST 300 MM COMPATIBLE 3D-INTEGRATED LSI ROOM TEMPERATURE WAFER BONDING DEVICE
  • 5.7 PATENTS ANALYSIS
    • FIGURE 26 KEY PATENT HOLDERS DURING 2010-2020
    • TABLE 6 LIST OF PATENTS
  • 5.8 PORTER'S FIVE FORCES ANALYSIS
    • TABLE 7 SEMICONDUCTOR BONDING MARKET: PORTER'S FIVE FORCES ANALYSIS
    • 5.8.1 BARGAINING POWER OF SUPPLIERS
    • 5.8.2 BARGAINING POWER OF BUYERS
    • 5.8.3 THREAT OF NEW ENTRANTS
    • 5.8.4 THREAT OF SUBSTITUTES
    • 5.8.5 INTENSITY OF COMPETITIVE RIVALRY
    • TABLE 8 IMPACT OF EACH FORCE ON MARKET, 2020 VS. 2026
  • 5.9 TRENDS/DISRUPTIONS IMPACTING CUSTOMER'S BUSINESS
    • FIGURE 27 REVENUE SHIFT FOR SEMICONDUCTOR BONDING MARKET
  • 5.10 TRADE ANALYSIS
    • TABLE 9 IMPORTS DATA FOR MACHINES AND APPARATUSES USED FOR MANUFACTURING SEMICONDUCTOR DEVICES OR ELECTRONIC INTEGRATED CIRCUITS, BY COUNTRY, 2015- 2019 (USD MILLION)
    • TABLE 10 EXPORTS DATA OF MACHINES AND APPARATUSES USED FOR MANUFACTURING SEMICONDUCTOR DEVICES OR ELECTRONIC INTEGRATED CIRCUITS, BY COUNTRY, 2015- 2019 (USD MILLION)

6 SEMICONDUCTOR BONDING MARKET, BY PROCESS TYPE

  • 6.1 INTRODUCTION
    • FIGURE 28 DIE-TO-WAFER BONDING IS EXPECTED TO GROW AT HIGHEST RATE BETWEEN 2021 AND 2026
    • TABLE 11 SEMICONDUCTOR BONDING MARKET SIZE, BY PROCESS TYPE, 2018-2020 (USD MILLION)
    • TABLE 12 SEMICONDUCTOR BONDING MARKET SIZE, BY PROCESS TYPE, 2021-2026 (USD MILLION)
  • 6.2 DIE-TO-DIE BONDING
    • 6.2.1 DIE-TO-DIE BONDING SEGMENT IS EXPECTED TO GROW AT 4.3% CAGR
    • TABLE 13 SEMICONDUCTOR BONDING MARKET SIZE FOR DIE-TO-DIE BONDING, BY REGION, 2018-2020 (USD MILLION)
    • TABLE 14 SEMICONDUCTOR BONDING MARKET SIZE FOR DIE-TO-DIE BONDING, BY REGION, 2021-2026 (USD MILLION)
  • 6.3 DIE-TO-WAFER BONDING
    • 6.3.1 SEVERAL DIFFERENT DIE-TO-WAFER BONDING APPROACHES ARE BEING CONSIDERED FOR HETEROGENEOUS INTEGRATION
    • TABLE 15 TYPES OF DIE-TO-WAFER BONDING
    • TABLE 16 SEMICONDUCTOR BONDING MARKET SIZE FOR DIE-TO-WAFER BONDING, BY REGION, 2018-2020 (USD MILLION)
    • TABLE 17 SEMICONDUCTOR BONDING MARKET SIZE FOR DIE-TO-WAFER BONDING, BY REGION, 2021-2026 (USD MILLION)
  • 6.4 WAFER-TO-WAFER BONDING
    • 6.4.1 WAFER-TO-WAFER IS USED FOR APPLICATIONS SUCH AS CMOS IMAGE SENSORS AND VARIOUS MEMORY AND LOGIC TECHNOLOGIES
    • TABLE 18 SEMICONDUCTOR BONDING MARKET SIZE FOR WAFER-TO-WAFER BONDING, BY REGION, 2018-2020 (USD MILLION)
    • TABLE 19 SEMICONDUCTOR BONDING MARKET SIZE FOR WAFER-TO-WAFER BONDING, BY REGION, 2021-2026 (USD MILLION)

7 SEMICONDUCTOR BONDING MARKET, BY TECHNOLOGY

  • 7.1 INTRODUCTION
  • 7.2 DIE BONDING
    • FIGURE 29 EPOXY DIE BONDING TECHNOLOGY IS PROJECTED TO HOLD LARGEST MARKET SHARE DURING FORECAST PERIOD
    • TABLE 20 DIE BONDING MARKET, BY TECHNOLOGY, 2018-2020 (USD MILLION)
    • TABLE 21 DIE BONDING MARKET, BY TECHNOLOGY, 2021-2026 (USD MILLION)
    • 7.2.1 EPOXY DIE BONDING
      • 7.2.1.1 Epoxy bonding to account for largest share of die bonder equipment market due to low cost and low curing temperature
    • 7.2.2 EUTECTIC DIE BONDING
      • 7.2.2.1 Eutectic die bonding is primarily used for fabrication of electronic components
    • 7.2.3 FLIP CHIP ATTACHMENT
      • 7.2.3.1 Flip chip attachment method is used for making electrical connections to chips
    • 7.2.4 HYBRID BONDING (FOR 3D NAND)
      • 7.2.4.1 Main application of hybrid bonding is in advanced 3D device stacking
  • 7.3 WAFER BONDING
    • FIGURE 30 MARKET FOR HYBRID BONDING TECHNOLOGY TO GROW AT HIGHEST CAGR DURING FORECAST PERIOD
    • TABLE 22 WAFER BONDING MARKET, BY TECHNOLOGY, 2018-2020 (USD MILLION)
    • TABLE 23 WAFER BONDING MARKET, BY TECHNOLOGY, 2021-2026 (USD MILLION)
    • 7.3.1 DIRECT WAFER BONDING
      • 7.3.1.1 Direct wafer bonding offers strong connection due to covalent forces
    • FIGURE 31 DIRECT WAFER BONDING PROCESS FLOW
    • 7.3.2 ANODIC WAFER BONDING
      • 7.3.2.1 Anodic wafer bonding offers advantage of wide process window, which helps in MEMS fabrication
    • FIGURE 32 ANODIC WAFER BONDING PROCESS FLOW
    • TABLE 24 DIFFERENCES BETWEEN DIRECT WAFER BONDING AND ANODIC WAFER BONDING
    • 7.3.3 TCB WAFER BONDING
      • 7.3.3.1 Metals such as Au, Cu, or Al are used for metal thermocompression bonding
    • FIGURE 33 METAL THERMOCOMPRESSION WAFER BONDING PROCESS FLOW
    • 7.3.4 HYBRID BONDING
      • 7.3.4.1 Xperi has developed new version of its hybrid bonding technology

8 SEMICONDUCTOR BONDING MARKET, BY TYPE

  • 8.1 INTRODUCTION
    • FIGURE 34 WAFER BONDER SEGMENT IS EXPECTED TO GROW AT HIGHEST CAGR BETWEEN 2021 AND 2026
    • TABLE 25 SEMICONDUCTOR BONDING MARKET SIZE, BY TYPE, 2018-2020 (MILLION UNIT)
    • TABLE 26 SEMICONDUCTOR BONDING MARKET SIZE, BY TYPE, 2021-2026 (MILLION UNITS)
    • TABLE 27 SEMICONDUCTOR BONDING MARKET SIZE, BY TYPE, 2018-2020 (USD MILLION)
    • TABLE 28 SEMICONDUCTOR BONDING MARKET SIZE, BY TYPE, 2021-2026 (USD MILLION)
  • 8.2 DIE BONDER
    • 8.2.1 MANUAL DIE BONDERS
      • 8.2.1.1 Manual die bonders play significant role in R&D, testing, and prototyping applications
    • 8.2.2 SEMIAUTOMATIC DIE BONDERS
      • 8.2.2.1 Semiautomatic die bonders are flexible and easy to use
    • 8.2.3 FULLY AUTOMATIC DIE BONDERS
      • 8.2.3.1 Fully automatic die bonders are expected to gain more market traction
    • TABLE 29 SEMICONDUCTOR BONDING MARKET SIZE FOR DIE BONDER, BY REGION, 2018-2020 (USD MILLION)
    • TABLE 30 SEMICONDUCTOR BONDING MARKET SIZE FOR DIE BONDER, BY REGION, 2021-2026 (USD MILLION)
  • 8.3 WAFER BONDER
    • 8.3.1 UV-RELEASE ADHESIVES, THERMAL-RELEASE ADHESIVES, AND SOLVENT-RELEASE ADHESIVES ARE USED IN WAFER BONDING
    • TABLE 31 SEMICONDUCTOR BONDING MARKET SIZE FOR WAFER BONDER, BY REGION, 2018-2020 (USD MILLION)
    • TABLE 32 SEMICONDUCTOR BONDING MARKET SIZE FOR WAFER BONDER, BY REGION, 2021-2026 (USD MILLION)
  • 8.4 FLIP CHIP BONDER
    • 8.4.1 FLIP CHIP BONDING CAN OFFER SEVERAL ADVANTAGES OVER OTHER INTERCONNECTION PROCESSES
    • TABLE 33 SEMICONDUCTOR BONDING MARKET SIZE FOR FLIP CHIP BONDER, BY REGION, 2018-2020 (USD MILLION)
    • TABLE 34 SEMICONDUCTOR BONDING MARKET SIZE FOR FLIP CHIP BONDER, BY REGION, 2021-2026 (USD MILLION)

9 SEMICONDUCTOR BONDING MARKET, BY APPLICATION

  • 9.1 INTRODUCTION
    • FIGURE 35 LED APPLICATION SEGMENT TO GROW AT HIGHEST RATE BETWEEN 2021 AND 2026
    • TABLE 35 SEMICONDUCTOR BONDING MARKET SIZE, BY APPLICATION, 2018-2020 (USD MILLION)
    • TABLE 36 SEMICONDUCTOR BONDING MARKET SIZE, BY APPLICATION, 2021-2026 (USD MILLION)
  • 9.2 MEMS AND SENSORS
    • 9.2.1 GROWTH IS DRIVEN BY HIGH DEMAND FROM CONSUMER ELECTRONICS MANUFACTURERS AND ADOPTION OF PATIENT MONITORING SOLUTIONS DURING COVID-19 PANDEMIC
    • TABLE 37 SEMICONDUCTOR BONDING MARKET SIZE FOR MEMS AND SENSORS, BY REGION, 2018-2020 (USD MILLION)
    • TABLE 38 SEMICONDUCTOR BONDING MARKET SIZE FOR MEMS AND SENSORS, BY REGION, 2021-2026 (USD MILLION)
  • 9.3 CMOS IMAGE SENSORS (CIS)
    • 9.3.1 INCREASING DEMAND FROM AUTOMOTIVE VERTICAL IS EXPECTED TO DRIVE DEMAND FOR CIS
    • TABLE 39 SEMICONDUCTOR BONDING MARKET SIZE FOR CIS, BY REGION, 2018-2020 (USD MILLION)
    • TABLE 40 SEMICONDUCTOR BONDING MARKET SIZE FOR CIS, BY REGION, 2021-2026 (USD MILLION)
  • 9.4 RADIOFREQUENCY (RF) DEVICES
    • 9.4.1 INCREASING DEMAND FOR RF DEVICES FOR SMARTPHONES TO DRIVE SEMICONDUCTOR BONDING MARKET
    • TABLE 41 SEMICONDUCTOR BONDING MARKET SIZE FOR RF DEVICES, BY REGION, 2018-2020 (USD MILLION)
    • TABLE 42 SEMICONDUCTOR BONDING MARKET SIZE FOR RF DEVICES, BY REGION, 2021-2026 (USD MILLION)
  • 9.5 LED
    • 9.5.1 INCREASING DEMAND FOR LED COMPONENTS IN HOME AND INFRASTRUCTURE MARKET TO AUGMENT GROWTH DURING FORECAST PERIOD
    • TABLE 43 SEMICONDUCTOR BONDING MARKET SIZE FOR LED, BY REGION, 2018-2020 (USD MILLION)
    • TABLE 44 SEMICONDUCTOR BONDING MARKET SIZE FOR LED, BY REGION, 2021-2026 (USD MILLION)
  • 9.6 3D NAND
    • TABLE 45 SEMICONDUCTOR BONDING MARKET SIZE FOR 3D NAND, BY REGION, 2018-2020 (USD MILLION)
    • TABLE 46 SEMICONDUCTOR BONDING MARKET SIZE FOR 3D NAND, BY REGION, 2021-2026 (USD MILLION)

10 GEOGRAPHIC ANALYSIS

  • 10.1 INTRODUCTION
    • FIGURE 36 SEMICONDUCTOR BONDING IN APAC TO GROW AT HIGHEST CAGR DURING FORECAST PERIOD
    • TABLE 47 SEMICONDUCTOR BONDING MARKET, BY REGION, 2018-2020 (USD MILLION)
    • TABLE 48 SEMICONDUCTOR BONDING MARKET, BY REGION, 2021-2026 (USD MILLION)
  • 10.2 APAC
    • FIGURE 37 APAC: SEMICONDUCTOR BONDING MARKET SNAPSHOT
    • TABLE 49 SEMICONDUCTOR BONDING MARKET IN APAC, BY TYPE, 2018-2020 (USD MILLION)
    • TABLE 50 SEMICONDUCTOR BONDING MARKET IN APAC, BY TYPE, 2021-2026 (USD MILLION)
    • TABLE 51 SEMICONDUCTOR BONDING MARKET IN APAC, BY PROCESS TYPE, 2018-2020 (USD MILLION)
    • TABLE 52 SEMICONDUCTOR BONDING MARKET IN APAC, BY PROCESS TYPE, 2021-2026 (USD MILLION)
    • TABLE 53 SEMICONDUCTOR BONDING MARKET IN APAC, BY APPLICATION, 2018-2020 (USD MILLION)
    • TABLE 54 SEMICONDUCTOR BONDING MARKET IN APAC, BY APPLICATION, 2021-2026 (USD MILLION)
    • TABLE 55 SEMICONDUCTOR BONDING MARKET IN APAC, BY DIE BONDING TECHNOLOGY, 2018-2020 (USD MILLION)
    • TABLE 56 SEMICONDUCTOR BONDING MARKET IN APAC, BY DIE BONDING TECHNOLOGY, 2021-2026 (USD MILLION)
    • TABLE 57 SEMICONDUCTOR BONDING MARKET IN APAC, BY WAFER BONDING TECHNOLOGY, 2018-2020 (USD MILLION)
    • TABLE 58 SEMICONDUCTOR BONDING MARKET IN APAC, BY WAFER BONDING TECHNOLOGY, 2021-2026 (USD MILLION)
    • TABLE 59 SEMICONDUCTOR BONDING MARKET IN APAC, BY COUNTRY, 2018-2020 (USD MILLION)
    • TABLE 60 SEMICONDUCTOR BONDING MARKET IN APAC, BY COUNTRY, 2021-2026 (USD MILLION)
    • 10.2.1 TAIWAN
      • 10.2.1.1 Presence of many key OSAT companies drives market growth in Taiwan
    • 10.2.2 CHINA
      • 10.2.2.1 Growing trend of miniaturization of consumer electronic products spurs market growth in China
    • 10.2.3 JAPAN
      • 10.2.3.1 Increasing demand for passenger cars and commercial vehicles and expanding presence of market players in country fuel market growth in Japan
    • 10.2.4 SOUTH KOREA
      • 10.2.4.1 South Korea to continue to account for largest market size in APAC during 2021-2026
    • 10.2.5 REST OF APAC
      • 10.2.5.1 Strong presence of semiconductor bonding manufacturers accelerates market growth in Rest of APAC
  • 10.3 AMERICAS
    • FIGURE 38 AMERICAS: SEMICONDUCTOR BONDING MARKET SNAPSHOT
    • TABLE 61 SEMICONDUCTOR BONDING MARKET IN AMERICAS, BY TYPE, 2018-2020 (USD MILLION)
    • TABLE 62 SEMICONDUCTOR BONDING MARKET IN AMERICAS, BY TYPE, 2021-2026 (USD MILLION)
    • TABLE 63 SEMICONDUCTOR BONDING MARKET IN AMERICAS, BY PROCESS TYPE, 2018-2020 (USD MILLION)
    • TABLE 64 SEMICONDUCTOR BONDING MARKET IN AMERICAS, BY PROCESS TYPE, 2021-2026 (USD MILLION)
    • TABLE 65 SEMICONDUCTOR BONDING MARKET IN AMERICAS, BY APPLICATION, 2018-2020 (USD MILLION)
    • TABLE 66 SEMICONDUCTOR BONDING MARKET IN AMERICAS, BY APPLICATION, 2021-2026 (USD MILLION)
    • TABLE 67 SEMICONDUCTOR BONDING MARKET IN AMERICAS, BY DIE BONDING TECHNOLOGY, 2018-2020 (USD MILLION)
    • TABLE 68 SEMICONDUCTOR BONDING MARKET IN AMERICAS, BY DIE BONDING TECHNOLOGY, 2021-2026 (USD MILLION)
    • TABLE 69 SEMICONDUCTOR BONDING MARKET IN AMERICAS, BY WAFER BONDING TECHNOLOGY, 2018-2020 (USD MILLION)
    • TABLE 70 SEMICONDUCTOR BONDING MARKET IN AMERICAS, BY WAFER BONDING TECHNOLOGY, 2021-2026 (USD MILLION)
    • TABLE 71 SEMICONDUCTOR BONDING MARKET IN AMERICAS, BY COUNTRY, 2018-2020 (USD MILLION)
    • TABLE 72 SEMICONDUCTOR BONDING MARKET IN AMERICAS, BY COUNTRY, 2021-2026 (USD MILLION)
    • 10.3.1 US
      • 10.3.1.1 US to continue to lead semiconductor bonding market in Americas during 2021-2026
    • 10.3.2 CANADA
      • 10.3.2.1 Ongoing government initiatives toward development of electric vehicle infrastructure to create market opportunities in near future
    • 10.3.3 REST OF AMERICAS
      • 10.3.3.1 Increasing demand for IoT and 5G is boosting demand for die bonding equipment in Rest of Americas
  • 10.4 EUROPE
    • FIGURE 39 EUROPE: SEMICONDUCTOR BONDING MARKET SNAPSHOT
    • TABLE 73 SEMICONDUCTOR BONDING MARKET IN EUROPE, BY TYPE, 2018-2020 (USD MILLION)
    • TABLE 74 SEMICONDUCTOR BONDING MARKET IN EUROPE, BY TYPE, 2021-2026 (USD MILLION)
    • TABLE 75 SEMICONDUCTOR BONDING MARKET IN EUROPE, BY PROCESS TYPE, 2018-2020 (USD MILLION)
    • TABLE 76 SEMICONDUCTOR BONDING MARKET IN EUROPE, BY PROCESS TYPE, 2021-2026 (USD MILLION)
    • TABLE 77 SEMICONDUCTOR BONDING MARKET IN EUROPE, BY APPLICATION, 2018-2020 (USD MILLION)
    • TABLE 78 SEMICONDUCTOR BONDING MARKET IN EUROPE, BY APPLICATION, 2021-2026 (USD MILLION)
    • TABLE 79 SEMICONDUCTOR BONDING MARKET IN EUROPE, BY DIE BONDING TECHNOLOGY, 2018-2020 (USD MILLION)
    • TABLE 80 SEMICONDUCTOR BONDING MARKET IN EUROPE, BY DIE BONDING TECHNOLOGY, 2021-2026 (USD MILLION)
    • TABLE 81 SEMICONDUCTOR BONDING MARKET IN EUROPE, BY WAFER BONDING TECHNOLOGY, 2018-2020 (USD MILLION)
    • TABLE 82 SEMICONDUCTOR BONDING MARKET IN EUROPE, BY WAFER BONDING TECHNOLOGY, 2021-2026 (USD MILLION)
    • TABLE 83 SEMICONDUCTOR BONDING MARKET IN EUROPE, BY COUNTRY, 2018-2020 (USD MILLION)
    • TABLE 84 SEMICONDUCTOR BONDING MARKET IN EUROPE, BY COUNTRY, 2021-2026 (USD MILLION)
    • 10.4.1 GERMANY
      • 10.4.1.1 Adoption of smart homes and connected cars to spur demand in Germany
    • 10.4.2 UK
      • 10.4.2.1 Deployment of 5G infrastructure is fueling market growth in UK
    • 10.4.3 FRANCE
      • 10.4.3.1 Developed communication network has prompted market growth in France
    • 10.4.4 IRELAND
      • 10.4.4.1 Presence of Intel's fab primarily drives market growth in Ireland
    • 10.4.5 ITALY
      • 10.4.5.1 Technology enhancements by players such as STMicroelectronics surge growth of semiconductor manufacturing equipment market in Italy
    • 10.4.6 REST OF EUROPE
      • 10.4.6.1 Initiatives of semiconductor bonding manufacturers to propel market growth in Rest of Europe
  • 10.5 ROW
    • TABLE 85 SEMICONDUCTOR BONDING MARKET IN ROW, BY TYPE, 2018-2020 (USD MILLION)
    • TABLE 86 SEMICONDUCTOR BONDING MARKET IN ROW, BY TYPE, 2021-2026 (USD MILLION)
    • TABLE 87 SEMICONDUCTOR BONDING MARKET IN ROW, BY PROCESS TYPE, 2018-2020 (USD MILLION)
    • TABLE 88 SEMICONDUCTOR BONDING MARKET IN ROW, BY PROCESS TYPE, 2021-2026 (USD MILLION)
    • TABLE 89 SEMICONDUCTOR BONDING MARKET IN ROW, BY APPLICATION, 2018-2020 (USD MILLION)
    • TABLE 90 SEMICONDUCTOR BONDING MARKET IN ROW, BY APPLICATION, 2021-2026 (USD MILLION)
    • TABLE 91 SEMICONDUCTOR BONDING MARKET IN ROW, BY DIE BONDING TECHNOLOGY, 2018-2020 (USD MILLION)
    • TABLE 92 SEMICONDUCTOR BONDING MARKET IN ROW, BY DIE BONDING TECHNOLOGY, 2021-2026 (USD MILLION)
    • TABLE 93 SEMICONDUCTOR BONDING MARKET IN ROW, BY WAFER BONDING TECHNOLOGY, 2018-2020 (USD MILLION)
    • TABLE 94 SEMICONDUCTOR BONDING MARKET IN ROW, BY WAFER BONDING TECHNOLOGY, 2021-2026 (USD MILLION)
    • TABLE 95 SEMICONDUCTOR BONDING MARKET IN ROW, BY REGION, 2018-2020 (USD MILLION)
    • TABLE 96 SEMICONDUCTOR BONDING MARKET IN ROW, BY REGION, 2021-2026 (USD MILLION)

11 COMPETITIVE LANDSCAPE

  • 11.1 INTRODUCTION
  • 11.2 REVENUE ANALYSIS
    • FIGURE 40 REVENUE ANALYSIS OF TOP THREE COMPANIES, 2020
  • 11.3 MARKET SHARE ANALYSIS, 2020
    • TABLE 97 SEMICONDUCTOR BONDING MARKET: MARKET SHARE ANALYSIS (2020)
  • 11.4 KEY PLAYER STRATEGIES/RIGHT TO WIN
    • 11.4.1 OVERVIEW OF STRATEGIES DEPLOYED BY KEY SEMICONDUCTOR BONDING COMPANIES
  • 11.5 COMPETITIVE LEADERSHIP MAPPING
    • 11.5.1 STAR
    • 11.5.2 EMERGING LEADER
    • 11.5.3 PERVASIVE
    • 11.5.4 PARTICIPANT
    • FIGURE 41 SEMICONDUCTOR BONDING MARKET: COMPETITIVE LEADERSHIP MAPPING, 2020
    • 11.5.5 SEMICONDUCTOR BONDING MARKET: TYPE FOOTPRINT
    • TABLE 98 COMPANY FOOTPRINT
    • TABLE 99 APPLICATION FOOTPRINT OF COMPANIES
    • TABLE 100 REGIONAL FOOTPRINT OF COMPANIES
  • 11.6 COMPETITIVE SITUATIONS AND TRENDS
    • 11.6.1 SEMICONDUCTOR BONDING MARKET: PRODUCT LAUNCHES, JANUARY 2018-APRIL 2021
    • 11.6.2 SEMICONDUCTOR BONDING MARKET: DEALS, JANUARY 2018-APRIL 2021

12 COMPANY PROFILES

  • (Business Overview, Products/services Offered, Recent Developments, and MnM View (Key strengths/Right to Win, Strategic Choices Made, and Weaknesses and Competitive Threats))**
  • 12.1 INTRODUCTION
  • 12.2 KEY PLAYERS
    • 12.2.1 ASM PACIFIC TECHNOLOGY
    • FIGURE 42 ASM PACIFIC TECHNOLOGY: COMPANY SNAPSHOT
    • 12.2.2 BESI
    • FIGURE 43 BESI: COMPANY SNAPSHOT
    • 12.2.3 PANASONIC
    • FIGURE 44 PANASONIC: COMPANY SNAPSHOT
    • 12.2.4 FASFORD TECHNOLOGY
    • FIGURE 45 FUJI CORPORATION: COMPANY SNAPSHOT
    • 12.2.5 SHINKAWA LTD
    • FIGURE 46 YAMAHA MOTOR ROBOTICS HOLDING CO.: COMPANY SNAPSHOT
    • 12.2.6 EV GROUP (EVG)
    • 12.2.7 SUSS MICROTECH SE
    • FIGURE 47 SUSS MICROTECH SE: COMPANY SNAPSHOT
    • 12.2.8 KULICKE & SOFFA INDUSTRIES
    • FIGURE 48 KULICKE & SOFFA INDUSTRIES: COMPANY SNAPSHOT
    • 12.2.9 PALOMAR TECHNOLOGIES
    • 12.2.10 SHIBAURA MECHATRONICS
    • FIGURE 49 SHIBAURA MECHATRONICS: COMPANY SNAPSHOT
  • 12.3 OTHER KEY PLAYERS
    • 12.3.1 TDK CORPORATION
    • 12.3.2 TOKYO ELECTRON LIMITED
    • 12.3.3 MITSUBISHI HEAVY INDUSTRIES MACHINE TOOLS
    • 12.3.4 MYCRONIC GROUP
    • 12.3.5 INTEL
    • 12.3.6 SAMSUNG
    • 12.3.7 CANON ANELVA CORPORATION
    • 12.3.8 FINETECH
    • 12.3.9 DR. TRESKY
    • 12.3.10 SET CORPORATION SA
    • 12.3.11 TOKYO OHKA KOYGO
    • 12.3.12 BONDTECH
    • 12.3.13 AYUMI INDUSTRIES
    • 12.3.14 APPLIED MICROENGINEERING LIMITED
    • 12.3.15 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY (TSMC)
    • 12.3.16 TORAY ENGINEERING
  • *Details on Business Overview, Products/services Offered, Recent Developments, and MnM View (Key strengths/Right to Win, Strategic Choices Made, and Weaknesses and Competitive Threats) might not be captured in case of unlisted companies.

13 APPENDIX

  • 13.1 INSIGHTS OF INDUSTRY EXPERTS
  • 13.2 DISCUSSION GUIDE
  • 13.3 KNOWLEDGE STORE: MARKETSANDMARKETS' SUBSCRIPTION PORTAL
  • 13.4 AVAILABLE CUSTOMIZATIONS
  • 13.5 RELATED REPORTS
  • 13.6 AUTHOR DETAILS