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半導体組立・検査受託市場:動向、予測、競合分析

Outsourced Semiconductor Assembly and Test Market: Trends, Forecast and Competitive Analysis

出版日: | 発行: Lucintel | ページ情報: 英文 200 Pages | 納期: 3営業日

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半導体組立・検査受託市場:動向、予測、競合分析
出版日: 2022年06月01日
発行: Lucintel
ページ情報: 英文 200 Pages
納期: 3営業日
ご注意事項 :
本レポートは最新情報反映のため適宜更新し、内容構成変更を行う場合があります。ご検討の際はお問い合わせください。
  • 全表示
  • 概要
  • 目次
概要

世界の半導体組立・検査受託(OSAT)の市場規模は、2021年から2027年に4.6%のCAGRで拡大し、2027年には450億米ドルになると予測されています。市場を牽引する主な要因にはより高機能・高性能な製品を提供するためのエレクトロニクス製品内の半導体コンテンツの増加、スマートフォンやインターネット接続機器の需要の伸び、安全、ナビゲーション、燃費、排ガス削減、エンターテインメントシステムなどのための自動車内の電子コンテンツの増加などがあります。

当レポートでは半導体組立・検査受託の世界市場を調査し、市場規模や予測、市場の促進要因および課題、市場動向、セグメント別の市場分析、競合情勢、成長機会分析などの体系的な情報を提供しています。

目次

第1章 エグゼクティブサマリー

第2章 市場の背景と分類

  • イントロダクション
  • サプライチェーン
  • 業界の促進要因と課題

第3章 市場動向と予測分析(2016年~2027年)

  • マクロ経済動向と予測
  • 世界市場動向と予測
  • サービスタイプ別
    • 組み立てと梱包
    • 検査
  • 包装タイプ別
    • ワイヤーボンド
    • フリップチップ他
    • ウェーハレベル
    • その他
  • 最終用途産業別
    • 通信
    • 家電
    • コンピュータとネットワーキング
    • 産業用電子機器
    • その他

第4章 地域別の市場動向と予測分析(2016年~2027年)

  • 地域別
  • 北米
    • 包装タイプ別
    • 最終用途産業別
    • 米国
    • カナダ
    • メキシコ
  • 欧州
    • 包装タイプ別
    • 最終用途産業別
    • ドイツOSAT市場
    • 英国
    • フランス
  • アジア太平洋地域
    • 包装タイプ別
    • 最終用途産業別
    • 中国
    • 日本
    • 韓国
  • その他の地域

第5章 競合分析

  • 製品ポートフォリオ分析
  • 地理的リーチ
  • ポーターのファイブフォース分析

第6章 成長機会と戦略分析

  • 成長機会分析
    • サービスタイプ別
    • 包装タイプ別
    • 最終用途産業別
    • 地域別
  • 世界市場における新たな動向
  • 戦略分析
    • 新製品の開発
    • 合併、買収、および合弁事業
    • 認定とライセンシング
    • 生産能力の拡大

第7章 主要企業プロファイル

  • Advanced Semiconductor Engineering
  • Amkor
  • Jiangsu Changjiang Electronics Technology
  • Siliconware Precision Industries Co. ltd.
  • PTI (Powertech Technology Inc.)
  • Tianshui Huatian Technology co. Ltd
  • Tongfu Microelectronics co. Ltd
  • United test and assembly center Ltd
  • King Yuan Electronics co, Ltd.
  • ChipMOS
目次

The future of the global outsourced semiconductor assembly and test (OSAT) market looks promising with opportunities in the computer & networking, consumer electronics, industrial electronics, and telecom industries. The global OSAT market is expected to reach an estimated $45 billion by 2027 with a CAGR of 4.6% from 2021 to 2027. The major drivers for this market are increasing semiconductor content within electronics products to provide greater functionality and higher levels of performance, growth in demand for smartphones and internet connected devices, and increasing electronic content in automotive for safety, navigation, fuel efficiency, emission reduction, and entertainment system.

Evolution of OSAT Opportunities

OSAT opportunities have evolved through number of stages as presented in figure below:

Emerging Trends in the OSAT Market

Emerging trend, which has a direct impact on the dynamics of the industry, includes miniaturization and higher functionality semiconductors.

A total of 107 figures / charts and 68 tables are provided in this 200-page report to help in your business decisions. A sample figure with insights is shown below. To learn the scope of benefits, companies researched, and other details of the facial cleanser market report, please download the report brochure.

OSAT Market by Segment

The study includes a forecast for the global OSAT market by service type, packaging type, end use industries, and region as follows:

OSAT Market by Service Type [Value ($M) shipment analysis for 2016 - 2027]:

  • Assembly & Packaging
  • Testing

OSAT Market by Packaging Type [Value ($B) shipment analysis for 2016 - 2027]:

  • Wire Bond
  • Flip Chip
  • Wafer Level
  • Others

OSAT Market by End Use Industry [Value ($M) shipment analysis for 2016 - 2027]:

  • Telecommunication
  • Computer & Networking
  • Consumer Electronics
  • Industrial Electronics
  • Others

OSAT Market by Region [Value ($M) shipment analysis for 2016 - 2027]:

  • North America
  • US
  • Canada
  • Mexico
  • Europe
  • Germany
  • The United Kingdom
  • France
  • Asia Pacific
  • China
  • Japan
  • South Korea
  • The Rest of the World

List of OSAT Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies OSAT companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the OSAT companies profiled in this report includes.

  • Advanced Semiconductor Engineering
  • Amkor
  • Jiangsu Changjiang Electronics Technology
  • Siliconware Precision Industries Co. ltd.
  • PTI(Powertech Technology Inc.)
  • Tianshui Huatian Technology co. Ltd
  • Tongfu Microelectronics co. Ltd
  • United test and assembly center Ltd
  • King Yuan Electronics co, Ltd.
  • ChipMOS

OSAT Market Insight

  • Lucintel forecasts that computer and networking will remain the largest end use segment over the forecast period due to increasing demand of semiconductors in data centers, network infrastructure, and storage applications.
  • Wire bond will remain the largest packaging type over the forecast period, as wire bond packaging is cost effective solution for low to medium pin count applications.
  • Asia Pacific will remain the largest region over the forecast period and it is also expected to witness the highest growth over the over the forecast period due to a growing adoption of IoT (internet of things), increasing electronic content per vehicles, and growing industrial automation in countries such as China, Taiwan, and India.

Features of OSAT Market

  • Market Size Estimates:OSAT market size estimation in terms of value ($B)
  • Trend and Forecast Analysis:Market trends (2016-2021) and forecast (2022-2027) by various segments and regions.
  • Segmentation Analysis:Market size by service type, packaging type, and end use industries.
  • Regional Analysis:OSAT market breakdown by North America, Europe, Asia Pacific, and the Rest of the World.
  • Growth Opportunities:Analysis of growth opportunities in different service type, packaging type, end use industries, and regions for the OSAT market.
  • Strategic Analysis:This includes M&A, new product development, and competitive landscape for the OSAT market.
  • Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

Q1. What is the OSAT market size?

Answer:The global OSAT market is expected to reach an estimated $45 billion by 2027

Q2. What is the growth forecast for OSAT market?

Answer:The OSAT market is expected to grow at a CAGR of 4.6% from 2021 to 2027.

Q3. What are the major drivers influencing the growth of the OSAT market?

Answer: The major drivers for this market are increasing semiconductor content within electronics products to provide greater functionality and higher levels of performance, growth in demand for smartphones and internet connected devices, and increasing electronic content in automotive for safety, navigation, fuel efficiency, emission reduction, and entertainment system.

Q4. What are the major applications or end use industries for OSAT?

Answer:Computer and networking and consumer electronics are the major end use industries for facial cleanser.

Q5. What are the emerging trends in OSAT market?

Answer:Emerging trend, which has a direct impact on the dynamics of the industry, includes miniaturization and higher functionality semiconductors.

Q6. Who are the key OSAT companies?

Answer:Some of the key OSAT companies are as follows:

  • Advanced Semiconductor Engineering
  • Amkor
  • Jiangsu Changjiang Electronics Technology
  • Siliconware Precision Industries Co. ltd.
  • PTI(Powertech Technology Inc.)
  • Tianshui Huatian Technology co. Ltd
  • Tongfu Microelectronics co. Ltd
  • United test and assembly center Ltd
  • King Yuan Electronics co, Ltd.
  • ChipMOS

Q7.Which OSAT product segment will be the largest in future?

Answer: Lucintel forecasts that wire bond will remain the largest packaging type over the forecast period, as wire bond packaging is cost effective solution for low to medium pin count applications.

Q8: In OSAT market, which region is expected to be the largest in next 5 years?

Answer:Asia Pacific is expected to remain the largest region and witness the highest growth over next 5 years

Q9. Do we receive customization in this report?

Answer:Yes, Lucintel provides 10% Customization Without any Additional Cost.

This report answers following 11 key questions

  • Q.1 What are some of the most promising potential, high growth opportunities for the global OSAT market by service type (assembly/packaging and testing), end use industry (telecommunication & devices, computer & networking, consumer electronics, industrial electronics, others), packaging type (wire bond, flip chip, wafer level, and others),and region (North America, Europe, Asia Pacific, and the Rest of the World)?
  • Q. 2 Which segments will grow at a faster pace and why?
  • Q.3 Which regions will grow at a faster pace and why?
  • Q.4 What are the key factors affecting market dynamics? What are the drivers and challenges of the market?
  • Q.5 What are the business risks and threats to the market?
  • Q.6 What are the emerging trends in this market and the reasons behind them?
  • Q.7 What are the changing demands of customers in the market?
  • Q.8 What are the new developments in the market? Which companies are leading these developments?
  • Q.9 Who are the major players in this market? What strategic initiatives are being implemented by key players for business growth?
  • Q.10 What are some of the competitive products and processes in this area and how big of a threat do they pose for loss of market share via material or product substitution?
  • Q.11 What M & A activities have taken place in the last 5 years in this market?

Table of Contents

1. Executive Summary

2. Market Background and Classifications

  • 2.1: Introduction
  • 2.2: Supply Chain
  • 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2016 to 2027

  • 3.1: Macroeconomic Trends and Forecast
  • 3.2: Global OSAT Market Trends and Forecast
  • 3.3: Global OSAT Market by Service Type
    • 3.3.1: Assembly & Packaging
    • 3.3.2: Testing
  • 3.4: Global OSAT Market by Packaging Type
    • 3.4.1: Wire bond
    • 3.4.2: Flip Chip Others
    • 3.4.3: Wafer level
    • 3.4.4: Others
  • 3.5: Global OSAT Market by End Use Industry
    • 3.5.1: Telecommunication
    • 3.5.2: Consumer Electronics
    • 3.5.3: Computer and Networking
    • 3.5.4:Industrial Electronics
    • 3.5.5: Others

4. Market Trends and Forecast Analysis by Region from 2016 to 2027

  • 4.1: Global OSAT Market by Region
  • 4.2: North American OSAT Market
    • 4.2.1: North American OSAT Market by Packaging Type
    • 4.2.2: North American OSAT Market by End Use Industry
    • 4.2.3: United States OSAT Market
    • 4.2.4: Canadian OSAT Market
    • 4.2.5: Mexican OSAT Market
  • 4.3: European OSAT Market
    • 4.3.1: European OSAT Market by Packaging Type
    • 4.3.2: European OSAT Market by End Use Industry
    • 4.3.3: German OSAT Market
    • 4.3.4: United Kingdom OSAT Market
    • 4.3.5: French OSAT Market
  • 4.4 : APAC OSAT Market
    • 4.4.1: APAC OSAT Market by Packaging Type
    • 4.4.2: APAC OSAT Market by End Use Industry
    • 4.4.3: Chinese OSAT Market
    • 4.4.4: Japanese OSAT Market
    • 4.4.5: South Korean OSAT Market
  • 4.5: ROW OSAT Market

5. Competitor Analysis

  • 5.1: Product Portfolio Analysis
  • 5.2: Geographical Reach
  • 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

  • 6.1: Growth Opportunity Analysis
    • 6.1.1: Growth Opportunities Analysis by Service Type
    • 6.1.1: Growth Opportunities Analysis by Packaging Type
    • 6.1.2: Growth Opportunities Analysis by End Use Industry
    • 6.1.3: Growth Opportunities Analysis by Region
  • 6.2: Emerging Trends of the Global OSAT Market
  • 6.3: Strategic Analysis
    • 6.3.1: New Product Development
    • 6.3.2: Mergers, Acquisitions, and Joint Ventures
    • 6.3.3: Certification and Licensing
    • 6.3.4: Capacity Expansion

7. Company Profiles of Leading Players

  • 7.1: Advanced Semiconductor Engineering
  • 7.2: Amkor
  • 7.3: Jiangsu Changjiang Electronics Technology
  • 7.4: Siliconware Precision Industries Co. ltd.
  • 7.5: PTI(Powertech Technology Inc.)
  • 7.6: Tianshui Huatian Technology co. Ltd
  • 7.7:Tongfu Microelectronics co. Ltd
  • 7.8: United test and assembly center Ltd
  • 7.9: King Yuan Electronics co, Ltd.
  • 7.10: ChipMOS