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イーサネットスイッチおよびPHYチップのガイド

A Guide to Ethernet Switch and PHY Chips, Thirteenth Edition

発行 Linley Group 商品コード 302326
出版日 ページ情報 英文
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イーサネットスイッチおよびPHYチップのガイド A Guide to Ethernet Switch and PHY Chips, Thirteenth Edition
出版日: 2017年07月31日 ページ情報: 英文
概要

イーサネット市場は技術の変換に大きな影響を受ける傾向があり、その結果として多くの場合ベンダーのシェアが大きく変動します。イーサネットスイッチにおいては、10ギガビットイーサネット(10GbE)の出荷台数が急増しており、市場シェアの獲得を巡ってBroadcom、Intel、MarvellおよびMellanoxなどのベンダーが凌ぎを削っています。これらのベンダーは製品にさらに多くの機能を付加し、ポート数を増やすとともに、ワット損を削減しています。BroadcomとMarvellは、ギガビットイーサネットスイッチチップの市場においてもリーダーです。10GbE市場が新たな成長段階に移行する中、光PHYベンダーの再編が進むとともに、10GBase-T市場のリーダーが台頭しつつあります。

当レポートでは、イーサネットスイッチおよびPHYチップの市場を取り上げ、市場の概要、ターゲット市場、イーサネットの用途、およびこれらの製品の一般的な特徴を概括し、主要なベンダーの概要をまとめるとともに、各製品部門における製品の比較を行うなど、概略以下の構成でお届けいたします。

第1章 ネットワークと機器

  • LAN
  • イーサネットLANの発展
  • ケーブル設備
  • イーサネットクライアント
  • データセンター
  • キャリアーネットワーク
    • 有線アクセス
    • ワイヤレスアクセス
  • イーサネット機器
    • SMBスイッチ
    • デスクトップスイッチ
    • データセンタースイッチ
    • モジュール式LANスイッチ
    • キャリアーイーサネットスイッチ
    • 有線アクセス機器
    • ワイヤレスアクセス機器

第2章 イーサネット技術

  • ネットワーク層とIEEE802標準
  • リンク層
    • スパニングツリーとVLAN
    • データセンターブリッジング
    • リンクアグリゲーション
    • TRILL
    • 認証・セキュリティー
  • キャリアーイーサネット
    • プロバイダーブリッジング
    • MPLS
    • キャリアーイーサネットサービス
    • OAM・保護スイッチング
    • タイミング同期
    • 階層的トラフィック管理
  • イーサネット物理層
    • ファストイーサネット
    • ギガビットイーサネット
    • 10GbE光
    • 10GBase-LRM
    • 10GBase-CX4
    • 10GBase-T
    • 40GbE、100GbE
    • バックプレーンイーサネット標準
    • エネルギー効率の良いイーサネット
  • 物理層インターフェース
  • 光モジュール
  • 関連プロトコル
    • ファイバーチャネルオーバーイーサネット(FCoE)
    • QoS、DiffServ
    • IPルーティング、マルチキャスト
    • ECMP
    • ネットワーク管理
    • パワーオーバーイーサネット
  • ホストおよびファブリックインターフェース
    • PCI
    • PCI Express
    • Interlaken

第3章 高速設計の問題

  • シグナルインテグリティー(信号品位)
    • 混線とEMI
    • チャネル効果:ISIと反射
    • ファイバーの障害
    • ジッター
  • PCBとコネクター
  • 信号調節
    • コーディング
    • 等化
  • クロックとデータ復旧

第4章 イーサネットスイッチとPHYチップ

  • スイッチチップ
    • 一般的な特徴
    • 性能
    • システム設計
    • ソフトウェアの懸案事項
  • GbEオーバーCu PHY
    • 一般的な特徴
  • 10GbpsイーサネットPHY
    • 光モジュールアーキテクチャー
    • 光PHYアーキテクチャーと一般的な特徴
    • 銅PHYアーキテクチャーと一般的な特徴
    • 相互運用性とコンプライアンス
    • 性能
  • 40Gbpsおよび100GbpsイーサネットPHY

第5章 技術動向

  • データセンター
  • 企業LAN
  • キャリアーイーサネット
  • 物理層の発展
  • ソフトウェア定義ネットワーク(SDN)

第6章 市場の展望

  • 市場規模・予測
    • GbEスイッチ
    • 10GbEスイッチ
    • 10GbE PHY
    • 40GbEおよび100GbEの展望
  • 市場シェア

第7章 Broadcom

  • 会社紹介
  • スイッチチップの特徴
    • キャリアーイーサネットスイッチチップ
    • 企業・データセンタースイッチチップ
  • スイッチシステム設計
  • スイッチファブリック
  • 10Gbps超PHY
    • 10GbE/40GbE光・バックプレーントランシーバー
    • 10Gbps銅トランシーバー
    • 100Gbpsトランシーバー
  • 製品ロードマップ
  • 総括

第8章 Intel

  • 会社紹介
  • 主な特徴と性能
  • 設計の詳細
  • 製品ロードマップ
  • 総括

第9章 Marvell

  • 会社紹介
  • スイッチチップ
    • 企業およびキャリアーイーサネットスイッチチップ
    • データセンターおよび10GbEスイッチチップ
    • Prestera-EXスイッチチップ
    • システム設計
  • 10Gbps PHY
    • 光トランシーバー
    • 銅トランシーバー
  • 製品ロードマップ
  • 総括

第10章 Vitesse

  • 会社紹介
  • キャリアーイーサネットスイッチチップ
    • 設計の詳細
  • 10Gbps PHYおよびCDR
  • 製品ロードマップ
  • 総括

第11章 その他のスイッチチップベンダー

  • Centec
    • 会社紹介
    • 主な特徴と性能
    • 総括
  • Mellanox
    • 会社紹介
    • 主な特徴と性能
    • 総括
  • まだ注目されていない新興企業

第12章 その他のPHYベンダー

  • AppliedMicro
  • Aquantia
  • Avago
  • Cortina
  • Inphi
  • MoSys
  • Semtech

第13章 スイッチとPHYの比較

  • 10GbE/40GbEスイッチチップの比較
    • 主な差別化要因
  • キャリアーイーサネットスイッチチップの比較
    • 主な差別化要因
  • 企業スイッチチップの比較
    • 主な差別化要因
  • 10-100Gbps PHYの比較
    • 10GBase-T銅PHY
    • 40GbE光PHY
    • 100GbEギアボックストランシーバー
    • 主な差別化要因

第14章 総括

  • ベンダーの展望
    • Broadcom
    • Marvell
    • 他のデータセンタースイッチベンダー
    • 他のキャリアーイーサネットスイッチベンダー
    • PHYベンダー
  • 結び

このページに掲載されている内容は最新版と異なる場合があります。詳細はお問い合わせください。

目次

Evaluating and Comparing the Latest Ethernet Switches and PHY Chips

The Ethernet market is marked by technology transitions, which often result in large shifts in vendor share. Over the past several years, large data-center operators have increased the pace of technology innovation, creating markets for new speeds and new physical layers. These dynamics are behind the introduction of high-density 100G Ethernet switch chips, which also serve the new 25G and 50G Ethernet standards. The same operators also have a huge appetite for data-center interconnect (DCI) bandwidth, creating early demand for 400G Ethernet.

In Ethernet switches, Barefoot Networks, Broadcom, Cavium, Centec, Innovium, Marvell, and Mellanox are competing to win market share in data centers. These vendors are adding 100G Ethernet support along with new features for SDN and NFV. For data centers, most PHY development now focuses on 100GbE retimer chips using 25Gbps serdes technology, with 50Gbps PAM4 on the horizon.

The large size of the Ethernet switch and PHY market continues to keep it a competitive environment. "A Guide to Ethernet Switch and PHY Chips" breaks this market into three growth segments:

  • Data-center switch chips
  • 10GbE PHYs for copper (10GBase-T)
  • 100GbE gearbox PHYs and 25Gbps retimers

Unlike typical market research, this report provides technology analysis and head-to-head product comparisons. Which chips will win designs and why? How will these vendors be positioned as 100GbE ramps? Only The Linley Group's unique technology analysis can provide this forward-looking view.

We Sort Out the Technology and the Key Vendors

"A Guide to Ethernet Switch and PHY Chips" begins with an extensive overview of this dynamic market. The report provides tutorials that help you decipher the myriad of acronyms and Ethernet standards. We explore the target markets and applications for Ethernet silicon, followed by an explanation of the common attributes of these products.

Following these introductory chapters, the report delivers a complete chapter on five leading switch vendors: Barefoot Networks, Broadcom, Cavium, Intel, and Marvell. Each vendor chapter includes company background information, full details of announced products, a discussion of the vendor's roadmap where available, and our conclusions about the vendor and its products. Then, for each product segment, we include a chapter covering other vendors and a chapter comparing the products in the segment.

Product-segment chapters include coverage of switch chips and PHY chips. We cover switch chips from Centec, Innovium, and Mellanox. For the physical layer, we focus on 10Gbps Ethernet-over-copper chips and 100Gbps gearbox PHYs and retimers. Covered PHY vendors include Aquantia and Inphi. Finally, we offer our outlook for the leading vendors in each segment and for the overall market.

Make Informed Decisions

As the leading vendor of technology analysis for networking silicon, The Linley Group has the expertise to deliver a comprehensive look at the full range of chips designed for 10GbE/25GbE/100GbE applications. Principal analyst Bob Wheeler and Senior Analyst Loring Wirbel use their broad experience to deliver the deep technical analysis and strategic information you need to make informed business decisions.

Whether you are looking for the right Ethernet chip for your application or seeking to partner with or invest in a chip vendor, this report will cut your research time and save you money. Make the intelligent decision, order "A Guide to Ethernet Switch and PHY Chips" today.

This report is written for:

  • Engineers designing Ethernet switch products or systems that embed an Ethernet switch or PHY
  • Marketing and engineering staff at companies that sell related chips who need more information on Ethernet chips
  • Technology professionals who wish an introduction to Ethernet chips
  • Financial analysts who desire a detailed analysis and comparison of data-center Ethernet semiconductor companies and their chances of success

What's New

Updates to the Thirteenth Edition of "A Guide to Ethernet Switch and PHY Chips" incorporate new announcements made since the release of the previous edition.

  • Coverage of Broadcom's new Tomahawk II, Trident 3, and Jericho+ Ethernet switch chips
  • Coverage of Marvell's Bobcat 3 25G Ethernet switch
  • Coverage of Barefoot Networks' Tofino programmable switch
  • Coverage of Innovium's 12.8Tbps Teralynx switch
  • Full-chapter coverage of Cavium's Xpliant programmable switch
  • 2016 market size and vendor share for GbE switch chips, 10GbE switch chips, and 10GbE PHYs
  • Updated market forecasts for GbE through 100GbE switch chips as well as 10GbE and 100GbE PHYs, from 2016 - 2021
  • Product comparisons updated to include the latest chips

Executive Summary

This report examines Ethernet switch chips and physical-layer (PHY) chips for data-center applications. We look at 10G Ethernet (10GbE), 25G Ethernet (25GbE), and 100G Ethernet (100GbE) switch chips. Some 100GbE products enable draft-standard 200G Ethernet and 400G Ethernet rates as well. We cover 10GBase-T (copper) PHYs as well as 100GbE gearbox PHYs and retimers. The newest 10GBase-T chips also handle the new 2.5Gbps and 5Gbps standards for twisted-pair cabling.

The market for Ethernet chips was once dominated by enterprise applications but now relies on cloud data centers for growth. In data centers, virtually every OEM and ODM system design uses ASSPs. Cisco's ASIC-based Nexus products are the major exception, but even this line uses ASSPs in some models. The rising white-box movement also threatens to loosen OEMs' hold and shift the market toward bare-metal systems built by ODMs. Hyperscale-data-center operators are driving the early ramp in 100G Ethernet switch chips, which enable 25G and 50G Ethernet for server access.

In 2016, however, 10GbE still dominated data-center switch shipments. We estimate combined 10GbE/40GbE switch- and PHY-chip revenue reached $1.4 billion in 2016, driven by fixed-configuration switches for top-of-rack (ToR) and leaf/spine use.

Although we refer to them as optical PHYs, 10Gbps serdes components also serve in SFP+ direct-attach cabling. Because new ASSP and ASIC designs integrate these serdes, we believe the market for standalone optical PHYs has peaked. By contrast, switch chips won't integrate 10GBase-T PHYs in the foreseeable future. As a result, 10GBase-T PHY revenue grew nearly 60% in 2016. An emerging opportunity exists in 100GbE PHYs based on 25Gbps serdes technology. Owing to signal-integrity challenges, we expect an increasing portion of switch designs will require retimers between switch ASSPs/ASICs and optical modules.

The vendor landscape for data-center switch chips comprises one dominant supplier, several incumbents with limited share, and a number of new entrants vying for a piece of this fast-growing market. Technology discontinuities include new Ethernet data rates - 25Gbps, 50Gbps, 200Gbps, and 400Gbps - as well as software-defined networking (SDN). The latter trend has led to new programmable switch architectures that are more flexible than traditional fixed-pipeline designs.

Broadcom gained share in the 10GbE transition, and it controlled more than 90% of the market by revenue in 2016. The company's Trident family dominates ASSP-based data-center switch designs for 10GbE. In 2015, Broadcom shipped its first Tomahawk switch for 100GbE designs, and it saw revenue ramp in 2016. Avago's acquisition of Broadcom, which closed in February 2016, has had little impact on the Ethernet switch and PHY products. The company continues to invest in three different switch architectures serving the data center. One is Trident 3, an evolution of the venerable Trident family that adds programmability.

Marvell is Broadcom's top competitor across the full Ethernet switching market, but it fell behind its archrival in the data-center segment. Following 2016 management changes, the company has refocused its Ethernet strategy, and it brought its first 25G/100G Ethernet switch (known as Bobcat 3) to production. Still, Marvell has yet to match the breadth of Broadcom's data-center portfolio.

Among the new entrants is Cavium, which was the first vendor to begin production of a customer-programmable 100GbE switch chip. This product line came from its spin-in of Xpliant. Cavium is now sampling a second-generation design that competes more directly with Trident 3.

Barefoot Networks is another newcomer with a programmable 100GbE design. It stands out by supporting an open programming language called P4. The startup supplies a P4 compiler that customers can use to generate code for its Tofino switch chip.

Innovium is the latest startup to disclose a data-center switch chip. It was first to announce a chip that handles the new 200G and 400G Ethernet standards, but that chip had not yet sampled at press time.

InfiniBand leader Mellanox is a recent entrant in Ethernet switch chips and is shipping 100GbE products. The company has strong technology and an excellent record of product execution. It has primarily supplied system-level switch products, however, limiting its impact in the chip market.

Based in China, privately held Centec initially targeted Carrier Ethernet designs, but its newest products also address data-center designs. In 2016, it reached production with its first 10GbE switch chip, which includes 100GbE uplink ports.

Before 2015, Intel shipped conventional 10GbE/40GbE switch chips that competed with those from Broadcom and others. The company's most recent product, however, is a unique chip that combines multiple host controllers with an Ethernet switch. The FM10000 (code-named Red Rock Canyon) works with Xeon server processors in network appliances.

In addition to switch chips, Broadcom and Marvell offer PHYs for 10GbE and 100GbE. PHY specialists that serve the data center include Inphi, which was first to market with a 100GbE gearbox chip developed in CMOS technology. Privately held Aquantia emerged as an early leader in 10GBase-T and pioneered the NBase-T specification, which later became the basis for the 2.5G/5G Ethernet standard.

Table of Contents

List of Figures

List of Tables

About the Authors

About the Publisher

Preface

Executive Summary

1 Networks and Equipment

  • LAN
  • Evolution of Ethernet LANs
  • Cable Plants
  • Ethernet Clients
  • Data Centers
  • Carrier Networks
  • Ethernet Equipment
    • Desktop Switches
    • Data-Center Switches
    • Modular LAN Switches

2 Ethernet Technology

  • Network Layers and IEEE 802 Standards
  • Link Layers
    • Spanning Tree and VLANs
    • Data Center Bridging
    • Link Aggregation
    • TRILL and SPB
    • Authentication and Security
  • Ethernet Physical Layers
    • Fast Ethernet
    • Gigabit Ethernet
    • 10GbE Optical
    • 10GBase-LRM
    • 10GBase-CX4
    • 10GBase-T
    • 40GbE and 100GbE
    • Backplane Ethernet Standards
    • Energy Efficient Ethernet
  • Physical-Layer Interfaces
  • Optical Modules
  • Related Protocols
    • VM Switching
    • QoS and DiffServ
    • IP Routing and Multicast
    • Equal Cost Multicast Routing Protocol (ECMP)
    • MPLS
    • Fibre Channel Over Ethernet (FCoE)

List of Figures

  • Figure 1-1. Typical enterprise-LAN architecture.
  • Figure 1-2. Typical enterprise data-center components.
  • Figure 1-3. Generic network architecture.
  • Figure 2-1. IEEE 802.3 basic frame format.
  • Figure 2-2. Ethernet physical layer.
  • Figure 2-3. 10G Ethernet physical layer.
  • Figure 2-4. Layer model for 40G/100G Ethernet.
  • Figure 2-5. Modules and interfaces for 10Gbps applications.
  • Figure 2-6. 40GbE and 100GbE modules and interfaces.
  • Figure 3-1. Data transmission across connectors.
  • Figure 3-2. Data transmission using pre-emphasis.
  • Figure 3-3. Impulse response and equalization.
  • Figure 4-1. Architecture of a generic SFP+ optical module.
  • Figure 4-2. Block diagram of a 10Gbps serdes.
  • Figure 4-3. Block diagram of a generic 10GBase-T PHY.
  • Figure 4-4. Block diagram of a typical gearbox chip.
  • Figure 5-1. P4 abstract forwarding model.
  • Figure 5-2. Comparison of MicroQSFP, QSFP-DD, and CFP8 MSAs.
  • Figure 6-1. Worldwide revenue market share for 10GbE switch chips.
  • Figure 6-2. Worldwide revenue market share for 10Gbps optical-PHY chips.
  • Figure 6-3. Worldwide revenue market share for 10GBase-T PHY chips.
  • Figure 6-4. Forecast for Ethernet switch-ASSP revenue, 2016-2021.
  • Figure 6-5. Forecast for Ethernet PHY-ASSP revenue, 2016-2021.
  • Figure 7-1. Block diagram of Barefoot Pisa pipeline.
  • Figure 7-2. Block diagram of Barefoot Tofino-64 switch.
  • Figure 8-1. Block diagram of Broadcom 32x100GbE ToR switch.
  • Figure 9-1. Block diagram of Cavium CNX880xx switch.
  • Figure 10-1. Block diagram of Intel FM10000 switch.
  • Figure 10-2. Block diagram of quad-socket server using Intel FM10000.
  • Figure 11-1. Block diagram of Marvell 25GbE top-of-rack switch.
  • Figure 11-2. Marvell Prestera software stack.

List of Tables

  • Table 2-1. OSI reference model.
  • Table 2-2. Ethernet PHY standards.
  • Table 2-3. PCI Express revisions and characteristics.
  • Table 6-1. Worldwide revenue market share for 10GbE switch chips.
  • Table 6-2. Worldwide revenue market share for 10Gbps optical-PHY chips.
  • Table 6-3. Worldwide revenue market share for 10GBase-T PHY chips.
  • Table 6-4. Revenue forecast for Ethernet switch ASSPs by speed, 2016-2021.
  • Table 6-5. Revenue for Ethernet PHY ASSPs by speed/media, 2016-2021.
  • Table 7-1. Key parameters for Barefoot Tofino-64 switch.
  • Table 8-1. Key parameters for selected Broadcom data-center switch chips.
  • Table 8-2. Key parameters for selected Broadcom StrataDNX devices.
  • Table 8-3. Key parameters for selected Broadcom 10GBase-T transceivers.
  • Table 8-4. Key parameters for Broadcom 100Gbps transceiver chips.
  • Table 9-1. Key parameters for Cavium Xpliant switch products.
  • Table 10-1. Key parameters for selected Intel Ethernet switch chips.
  • Table 11-1. Key parameters for Marvell data-center switch products.
  • Table 11-2. Key parameters for Marvell 10GBase-T PHYs.
  • Table 11-3. Key parameters for Marvell 100Gbps transceiver chips.
  • Table 12-1. Key parameters for selected Centec Ethernet switch chips.
  • Table 12-2. Key parameters for Innovium Teralynx switch.
  • Table 12-3. Key parameters for Mellanox Spectrum and Spectrum-2 chips.
  • Table 13-1. Key parameters for second-generation Aquantia AQrate PHYs.
  • Table 13-2. Key parameters for Inphi 100Gbps PHYs.
  • Table 14-1. Comparison of 100GbE hyperscale-fabric switch chips.
  • Table 14-2. Comparison of 25GbE ToR switch chips.
  • Table 14-3. Comparison of 100Gbps gearbox chips with RS-FEC.
  • Table 14-4. Comparison of 100GbE retimers.
  • Table 14-5. Comparison of quad-port 10GBase-T PHY chips.
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