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Smart and Intelligent Packaging 2020-2030

発行 IDTechEx Ltd. 商品コード 813705
出版日 ページ情報 英文 258 Slides
納期: 即日から翌営業日
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スマート・インテリジェントパッケージングの世界市場:2020-2030年 Smart and Intelligent Packaging 2020-2030
出版日: 2019年10月02日 ページ情報: 英文 258 Slides


第1章 エグゼクティブサマリー・総論

第2章 スマートパッケージング:成長推進因子

  • スマートパッケージングに対するニーズ
  • 小売り産業における問題
  • ヘルスケアにおける問題
  • より多くの人間の感覚をより良い方法で使用

第3章 エンドユーザーのフィードバック

  • エンドユーザーのニーズ:スマートパッケージングの促進要因
  • エンドユーザーのスマートパッケージングフィードバック:アプリケーションのニーズ
  • エンドユーザーのスマートパッケージングに対する見解:技術のニーズ
  • P&Gとプリンテッドエレクトロニクス
  • Diageとプリンテッドエレクトロニクス
  • Amcor
  • Colgate-Palmolive Group
  • Unilever

第4章 RFID:スマートパッケージング向けNFC・RAIN

  • RFID
  • RFID技術:全体像
  • パッシブRFID
  • 好みのRFID周波数
  • パッシブRFIDシステム
  • バッテリーアシストパッシブ/セミアクティブタグ
  • バッテリー付きパッシブ (BAP) RFIDセンサーの例
  • アクティブRFID
  • RTLS
  • チップレス/プリンテッドRFID
  • パッシブRFID技術:動作周波数別
  • パッシブHF・UHFタグの構造
  • HF/NFCコイルへの接触における課題
  • パッシブRFIDへの脅威:マシンビジョン、ほか

第5章 プリンテッド・フレキシブル・有機エレクトロニクス

  • プリンテッド・フレキシブル・有機エレクトロニクスの主要技術コンポーネントの説明・分析
  • 市場の潜在性・収益性
  • 現在の市場規模
  • 市場参入戦略:メリット・デメリット
  • バリューチェーン、など

第6章 ディスプレイ

  • エレクトロクロミックディスプレイ
  • ACエレクトロルミネセントディスプレイ
  • サーモクロミックディスプレイ

第7章 プリンテッドLED照明

第8章 プリンテッドフレキシブル電池

第9章 プリンテッドセンサー

第10章 ロジック

  • フレキシブル/プリンテッドトランジスター回路の各種タイプ
  • なぜプリンテッドトランジスターなのか
  • 半導体の選択肢の比較
  • しかし課題は残る
  • 半導体の選択肢
  • 既存のシリコンベースTFT技術:シリコンベース
  • 金属酸化物半導体
  • 金属酸化物製造プロセス
  • しかし、金属酸化物半導体はプリント可能なのか?
  • Evonikのソリューション:加工可能な金属酸化物
  • iXensicの最新の進歩
  • 有機半導体
  • OTFTモビリティの誇張:リアリティチェック
  • オールプリンテッドTFT
  • 次世代プリンテッドエレクトロニクス技術研究組合 (JAPERA) のオールプリンテッドTFT
  • S2SオートマチックプリンテッドOTFT
  • ロールツーロールプリンテッド有機TFT
  • Merckの有機TFT
  • カーボンナノチューブ・グラフェントランジスター
  • フレキシブル/プリンテッドトランジスター RFIDの最新の進歩、など

第11章 QRコード

第12章 容量性/ インクストライプID

  • トランジスター無しのRFID:HidE (Hidden Electronic Product Code)
  • PrintechnologicsのプリンテッドID
  • レーダーID 60GHz
  • Inksure:SARcodeの例
  • Touchcode:T-ink / Printechnologics
  • Touchcodeのアプリケーションコンセプト
  • Touchcodeの進歩
  • TicTag
  • Prismade Labs

第13章 RFIDセンサー

  • RFIDセンサー:主な選択肢
  • ICタグによるRFIDタグセンサー
  • パッシブUHF RFID センサー:Powercast・Vanguard ID Systemsによる共同開発
  • パッシブUHF RFID センサー:RFMicron・Smartrac
  • GE/ Kemsense:従来型RFIDラベルに基づいたバイオセンサー
  • ケミカルパワーレスRFIDセンサータグ
  • 失敗から得る教訓

第14章 化学品スマートパッケージング技術

  • 食品の劣化
  • 微生物腐敗
  • 化学・酵素活性
  • 酸化劣化・悪臭
  • 水分/蒸気の移動
  • 賞味期限の判定
  • 食品の劣化
  • 時間温度インジケータ(TTI)
  • 化学的時間温度インジケータ(TTI)の例
  • 鮮度インジケーター
  • 熟度インジケーター
  • 時間インジケーター、など

第15章 スマートパッケージングの用途:従来型RFID

  • パレット/ケースタギング
  • 小売アパレル・アイテムレベル
  • 偽造防止用RFID
  • 日本の経済産業省によるタグ目標
  • Coca-Cola Freestyle Machine、など

第16章 スマートブリスターバック

  • 服薬順守の課題
  • 現在のソリューション
  • プリンテッドエレクトロニクス/ RFIDソリューション
  • スマートブリスターバック、など

第17章 スマートパッケージング:ケーススタディ

第18章 電子スマートパッケージング:市場予測

  • RAIN (UHF RFID) スマートパッケージング
    • タグ数の予測
    • 平均価格の予測
    • 市場規模の予測
  • NFC (HF RFID) スマートパッケージング
    • タグ数の予測
    • 平均価格の予測
    • 市場規模の予測
  • 電子スマートパッケージング
    • 総数の予測
    • 市場規模の予測
  • 課題・市場機会

第19章 付録:企業プロファイル

第20章 付録:用語


Smart (or intelligent) packaging for goods is packaging which goes beyond the basic function of passively containing and protecting the product by adding useful functionality with real benefits for the consumer.

This comprehensive IDTechEx Research report covers the upcoming requirements and drivers for smart packaging; feedback from Fast Moving Consumer Goods (FMCG) brands with their views of smart packaging; assessment of enabling technologies; smart packaging case studies; key players; and forecasts of electronic smart packaging.

This analysis is done on a global basis, from assessing the rise of QR codes in China to the latest electronic smart labels based on novel semiconductors and other components that are enabling a radical change in the $400 billion+ packaging industry.

IDTechEx concludes how the global demand for electronic smart packaging features will be a $895 million market in 2030 versus $55 million in 2020 (and more if the infrastructure, software and services are also included). Based on an impartial analysis, IDTechEx expects that almost 21 billion packages sold in 2030 will feature an electronic feature to enhance the package.

Why Smart and Intelligent Packaging?

Smart and intelligent packaging can offer many different benefits to the brand, retailer and consumer. For example, it addresses the need for brands to reconnect with the customer or face potential oblivion from competing products. Other drivers include counterfeiting to the ageing population's need for better drug delivery devices.

There are many current and developing emerging technologies which are driving change in the smart packaging segment, often with very different purposes, which include:

  • RFID for wireless item identification (usually invisible to the consumer)
  • Electronic Articles Surveillance (EAS) for anti theft (usually invisible to the consumer)
  • QR codes for identification (increasingly used for payments)
  • Data loggers for temperature, shock, vibration, etc monitoring
  • Interactive smart packaging including illumination, sound, measuring (such as smart blister packs) and much more
  • Chemical indicators: temperature, frozen chemical visual indicators
  • Internal active packaging: whereby the package interacts with the contents to keep it fresher for longer, for example
  • External active packaging: whereby the package releases aromas, for example, to entice consumers

Drivers for Smart Packaging

There are prominent drivers for smart packaging, including the ageing population, more wealthy consumers, requirement for more data on products purchased, entertainment value, need to distinguish products amidst greater competition and tougher legislation.

Smart packaging can also solve big challenges such as monitoring patients not taking medication at the correct times when needed or informing that the medicines or foods are still safe to consume.

Across that backdrop there are other significant impending changes, from increasing home delivery of products and groceries which may change the value of the product packaging in the decision and sales process to many new enabling technologies from machine vision systems to identify items to the increasing adoption of RFID to printed electronics labels. Of course, sustainability is also a high priority for brands.

Global, Detailed Assessment of Smart Packaging

This report from IDTechEx covers the full picture and opportunities - in addition to the challenges. To gain very high volume, and therefore lowest costs, by selling across all industries, basic hardware platforms must be developed. These are discussed. The detailed market forecasts, statistics for associated industries, pros and cons, technology choices and lessons of success and failure provide a lucid, compact analysis.

The report is structured as follows:

  • Executive summary, including key conclusions and forecasts

The need for Smart Packaging and brand perspectives This section covers the drivers for smart packaging, end user requirements and voice of the customer based on feedback from global FMCG firms on their perspectives on smart packaging

  • RFID: NFC and RAIN for Smart Packaging
  • NFC and RAIN technologies, prices and their application to packaging
  • Printed, Flexible and Organic Electronics
  • Assessment of enabling technologies including displays, flexible/printed batteries, printed sensors and flexible logic circuits
  • QR codes
  • Failures and successes, analysis of use of QR codes in China
  • Capacitive ink strip / identification systems
  • Analysis of novel identification systems relevant to smart packaging
  • RFID Sensors
  • NFC and RAIN sensor systems, passive or with battery
  • Chemical smart packaging technologies
  • Review of chemical smart packaging technologies including time temperature and freshness indicators
  • Smart Packaging Applications: RFID
  • Applications and case studies of RFID smart packaging
  • Smart Blister Packs
  • Assessment of smart blister packs for monitoring medication compliance'
  • Smart Packaging Case Studies
  • Case studies and applications of printed electronics in smart packaging
  • Electronic Smart Packaging Forecasts
  • Forecasts and conclusions of electronic smart packaging. Forecasts are given in terms of number of units, average sales price and total market value for each of the following: NFC, RAIN RFID, Light-up/display based electronic smart packaging, audio smart packaging

Opportunities in Smart Packaging

The report identifies and assesses the many challenges still to be addressed, including the value of tagging products in the highest volume versus cost, sustainable profitable applications beyond one-off projects, environmental impact and unmet needs including the lack of integrators and complete product designers. Applicable technologies are assessed with details of the key players.

All of these opportunities and trends, including detailed ten year forecasts, are covered in this IDTechEx report "Smart and Intelligent Packaging 2020-2030". The report reveals many ways in which brands can create a sharp increase in market share, customer satisfaction and profitability. It covers case studies of successes and failures and why.

Analyst access from IDTechEx

All report purchases include up to 30 minutes telephone time with an expert analyst who will help you link key findings in the report to the business issues you're addressing. This needs to be used within three months of purchasing the report.

Table of Contents


  • 1.1.What is Smart Packaging?
  • 1.2.Why Smart Packaging - Logistical and Safety Reasons
  • 1.3.Why Smart Packaging - Increasing Sales and Better Merchandising
  • 1.4.Smart Packaging - Status
  • 1.5.Smart Packaging: Things Are Changing
  • 1.6.EAS tags
  • 1.7.QR Codes
  • 1.8.Unique ID with no silicon chip
  • 1.9.Chipless RFID or Flexible/Printed IC Passive tags
  • 1.10.RAIN (UHF RFID) Smart Packaging
  • 1.11.RAIN (UHF RFID) Smart Packaging 2020-2030
  • 1.12.RAIN (UHF RFID) tags 2020-2030 - numbers million
  • 1.13.RAIN (UHF RFID) tags 2020-2030 - avg sale price $cents
  • 1.14.RAIN (UHF RFID) tags 2020-2030 - market value $M
  • 1.15.NFC (HF RFID) Smart Packaging
  • 1.16.NFC (HF RFID) tags 2020-2030 - numbers million
  • 1.17.NFC (HF RFID) tags 2020-2030 - avg sale price $cents
  • 1.18.NFC (HF RFID) tags 2020-2030 - market value $M
  • 1.19.NFC (HF RFID) Smart Packaging Forecast Reasoning
  • 1.20.Electronic Smart Packaging beyond RFID
  • 1.21.Electronic Smart Packaging Total Forecast 2020-2030 Numbers million
  • 1.22.Electronic Smart Packaging Total Forecast 2020-2030 Market value $M
  • 1.23.Challenges and Opportunities


  • 2.1.The need for smart packaging
  • 2.2.Problems in the retail industry
  • 2.3.Problems in healthcare
  • 2.4.Using more of the human senses and in a better way


  • 3.1.End User Needs: Drivers for Smart Packaging
  • 3.2.End User Feedback on Smart Packaging - Application Needs
  • 3.3.End User Views on Smart Packaging - Technical Needs
  • 3.4.P&G and printed electronics
  • 3.5.Diageo and printed electronics
  • 3.6.Amcor
  • 3.7.Colgate-Palmolive Group
  • 3.8.Unilever


  • 4.1.RFID
  • 4.2.RFID Technologies: The Big Picture
  • 4.3.Passive RFID
  • 4.4.Favourite RFID frequencies
  • 4.5.Passive RFID Systems
  • 4.6.Battery Assisted Passive /Semi Active tags
  • 4.7.Examples of Battery Assisted Passive (BAP) RFID sensors
  • 4.8.Active RFID
  • 4.9.Real Time Locating Systems (RTLS)
  • 4.10.Chipless/printed RFID
  • 4.11.Passive RFID: Technologies by Operating Frequency
  • 4.12.Anatomy of passive HF and UHF tags
  • 4.13.Challenges in contacting HF/NFC coils
  • 4.14.Threats to passive RFID: machine vision?
  • 4.15.Might Packaging Become Irrelevant with Online Retailing?


  • 5.1.Description and analysis of the main technology components of printed, flexible and organic electronics
  • 5.2.Market potential and profitability
  • 5.3.Current market size
  • 5.4.Go to Market Strategies: Pros and Cons
  • 5.5.The value chain is unbalanced
  • 5.6.But many have shifted to provide complete solutions
  • 5.7.Many enabling printed electronic technologies are an enabler but not an obvious product
  • 5.8.Creating successful new products is hard
  • 5.9.Cost reduction has been more commercially successful...
  • 5.10....but if it is the only differentiator suppliers can struggle
  • 5.11.Competing on more than cost has been the most successful
  • 5.12.Keep It Simple, Stupid


  • 6.1.Electrochromic displays
    • 6.1.1.Electrochromic displays
    • 6.1.2.Ynvisible Electrochromic Displays
  • 6.2.AC Electroluminescent displays
    • 6.2.1.AC Electroluminescent displays
    • 6.2.2.AC electroluminescent displays
    • 6.2.3.EL technology
    • 6.2.4.AC Electroluminescent (EL) Displays
  • 6.3.Thermochromic displays
    • 6.3.1.Thermochromic Displays


  • 7.1.Printed LED lighting
  • 7.2.Nth Degree - Printed LEDs


  • 8.1.Introduction to batteries
  • 8.2.Comparison of Power Options
  • 8.3.Applications


  • 9.1.Applications of printed batteries
  • 9.2.Types of sensors that can be printed
  • 9.3.Sensors: Technology Readiness
  • 9.4.Capacitive pressure/force sensor
  • 9.5.Fluid level sensor


  • 10.1.Types of Flexible or Printed Transistor Circuits
  • 10.2.Why Print Transistors
  • 10.3.Semiconductor Choices Compared
  • 10.4.But challenges persist...
  • 10.5.Semiconductor choices
  • 10.6.Incumbent TFT technologies- silicon based
  • 10.7.Metal Oxide Semiconductors
  • 10.8.Metal Oxide production process
  • 10.9.But can Metal Oxide Semiconductors be printed?
  • 10.10.Evonik's solution processible metal oxide
  • 10.11.Latest progress with iXensic
  • 10.12.And even at room temperature with deep UV annealing
  • 10.13.Organic semiconductors
  • 10.14.OTFT Mobility hype: reality check
  • 10.15.All printed TFTs
  • 10.16.JAPERA all printed TFT
  • 10.17.S2S automatic printed OTFT
  • 10.18.Roll-to-roll printed organic TFTs
  • 10.19.Merck's Organic TFT
  • 10.20.Carbon nanotubes and graphene transistors
  • 10.21.Latest progress with flexible/printed transistor RFID
  • 10.22.Flexible or printed transistors for logic, creating smart systems
  • 10.23.Mediocre TFTs can do many functions
  • 10.24.Current work in developing flexible transistor RFID and Smart Packaging
  • 10.25.IMEC / Holst Centre Roadmap
  • 10.26.Benefits of flexible logic
  • 10.27.Save on IC attach cost?
  • 10.28.Logic Based Systems
  • 10.29.Lessons from the Silicon Chip: need for modularity
  • 10.30.Thin, flexible 'NFC' ICs come to market for simple wireless barcodes
  • 10.31.Printed electronics components
  • 10.32.PragmatIC's wine temperature sensing label
  • 10.33.Logic and Smart System Forecast 2018-2030 $ millions
  • 10.34.Company profiles related to this chapter


  • 11.1.QR Codes: Failure in Europe and America, Huge Success in China
  • 11.2.QR Codes: where next?
  • 11.3.Will NFC or RAIN Impact QR Codes?


  • 12.1.RFID without transistors Hidden Electronic Product Code (HidE)
  • 12.2.Printechnologics printed ID
  • 12.3.Radar ID 60GHz
  • 12.4.Inksure - SARcode Example
  • 12.5.Touchcode: T-ink / Printechnologics
  • 12.6.Touchcode Application Concepts
  • 12.7.Touchcode Progress
  • 12.8.TicTag
  • 12.9.Prismade Labs


  • 13.1.RFID Sensors: main choices
  • 13.2.RFID tag sensor from IC-TAG
  • 13.3.Passive UHF RFID sensor co-developed by Powercast and Vanguard ID Systems
  • 13.4.Passive UHF RFID Sensor: RFMicron and Smartrac
  • 13.5.GE/ Kemsense: BioSensors on conventional RFID labels
  • 13.6.Chemical powerless RFID sensor tag
  • 13.7.Lessons from Failures


  • 14.1.Food degradation
  • 14.2.Microbial Spoilage
  • 14.3.Chemical and Enzymatic Activity
  • 14.4.Oxidative Deterioration/Rancidity
  • 14.5.Moisture/Vapour Migration
  • 14.6.Determining Shelf Life
  • 14.7.Food Degradation
  • 14.8.Time Temperature Indicators (TTIs)
  • 14.9.Chemical TTIs
  • 14.10.Chemical Time Temperature Indicators
  • 14.11.Examples of Chemical Time Temperature Indicators (TTIs
  • 14.12.Freshness Indicators
  • 14.13.Ripeness Indicators
  • 14.14.Time Indicators


  • 15.1.Pallet/ case tagging
  • 15.2.Retail apparel, item level
  • 15.3.Retail Apparel Payback
  • 15.4.RFID for anti-counterfeiting - it's the law!
  • 15.5.METI, Japan, target 100 billion tags/year by 2025
  • 15.6.IDTechEx view on the METI announcement
  • 15.7.RFID provides more consumer engagement and use data
  • 15.8.Coca-Cola Freestyle Machine
  • 15.9.RFID provides more consumer engagement and use data


  • 16.1.The Problem: Medication Non-Compliance
  • 16.2.The Problem: Medication Non-Compliance - Statistics
  • 16.3.The Current Solution
  • 16.4.The Printed Electronics / RFID Solutions
  • 16.5.Smart Blister Packs
  • 16.6.Smart Blister Packs - Not a Big Success Yet
  • 16.7.Things are Changing & More Players Enter
  • 16.8.Smart Blister Packs: Outlook


  • 17.1.Batteries with integral battery tester
  • 17.2.Light up Packaging: Bombay Sapphire, KENT Gold, Copoya Rum
  • 17.3.Place mats - McDonalds
  • 17.4.Interactive tablecloth - Hallmark
  • 17.5.Beer package game - VTT Technology
  • 17.6.Cookie heater pack - T-Ink
  • 17.7.Theft detection - Swedish Postal Service and Deutsche Post


  • 18.1.RAIN (UHF RFID) Smart Packaging
  • 18.2.RAIN (UHF RFID) Smart Packaging 2020-2030
  • 18.3.RAIN (UHF RFID) tags 2020-2030 - numbers million
  • 18.4.RAIN (UHF RFID) tags 2020-2030 - avg sale price $cents
  • 18.5.RAIN (UHF RFID) tags 2020-2030 - market value $M
  • 18.6.NFC (HF RFID) Smart Packaging
  • 18.7.NFC (HF RFID) tags 2020-2030 - numbers million
  • 18.8.NFC (HF RFID) tags 2020-2030 - avg sale price $cents
  • 18.9.NFC (HF RFID) tags 2020-2030 - market value $M
  • 18.10.NFC (HF RFID) Smart Packaging Forecast Reasoning
  • 18.11.Electronic Smart Packaging beyond RFID
  • 18.12.Electronic Smart Packaging Total Forecast 2020-2030 Numbers million
  • 18.13.Electronic Smart Packaging Total Forecast 2020-2030 Market value $M
  • 18.14.Challenges and Opportunities



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