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Smart Materials Opportunities in Structural Electronics and Electrics 2020-2030

発行 IDTechEx Ltd. 商品コード 721790
出版日 ページ情報 英文 295 Slides
納期: 即日から翌営業日
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構造用エレクトロニクス&エレクトリクスとしてのスマートマテリアル:2019-2029年 Smart Materials Opportunities in Structural Electronics and Electrics 2020-2030
出版日: 2019年10月31日 ページ情報: 英文 295 Slides


第1章 エグゼクティブサマリー・総論

  • 定義
  • 本書の目的
  • 重要性
  • 実現技術
  • 課題
  • 市場規模
  • 新製品・技術のロードマップ

第2章 イントロダクション:経緯・定義・能力・展望

  • 構造用エレクトロニクスの発展の経緯

第3章 求められるスマートマテリアルの機能・形態

  • 概要
  • 機能・形態の合理性
  • 機能・形態:現在の選択肢

第4章 製造技術:リードするインモールドエレクトロニクス (IME)

  • IMEとは?
  • IMEプロセスとは
  • IME導電性インク要件
  • マテリアルポートフォリオの多様性
  • 機能性材料の幅の拡大
  • 用途・商業化に向けた進展・試作:概要
  • IME機能性材料サプライヤー
  • TactoTekのアプローチ:IME SEのリーダー

第5章 その他の製造技術:コンフォーマルプリンティング・MID・3DPE・噴霧など

  • 3D表面へのダイレクトプリント
    • Optomec Aerosol:市場リーダー
    • コンフォーマルプリンティングの例:
      • Harvard University
      • University of Illinois at Urbana Champaign
      • Optomec
    • Pulse Electronics
    • GKN・Boeing:787用ヒーター
    • Nano Dimension (イスラエル)・Ceradrop (フランス)
    • Neotech・Novacentrix・nScrypt
  • 成形回路部品 (MID):LDS
    • 概要
    • MID・LDS:LPKF, Festo
    • IMEにおけるLDSの各種用途
    • MID - LPKF・Molexの例
    • MID - TRWの例
  • プリンテッドPCB
    • Agナノ粒子インクを用いた高速PCB試作に向けた進歩
    • プリンテッドPCB:新規参入企業
  • 転写:テストストリップ印刷とラミネーション
  • 3Dプリンテッドエレクトロニクス
    • 概要
    • トヨタ
    • Aconity3D
    • Functionalize
    • Harvard University
    • Princeton University
    • Nascent Objects
    • AgIC
    • Voltera
    • Cartesian
    • Botfactory
    • Voxel8
    • 製造オプションの比較

第6章 大規模SE:自動車・航空機・船舶・建造物・道路

  • 概要
  • 自動車
    • 耐荷重スーパーキャパシター構造体
    • Imperial College London
    • Queensland University of Technology
    • Trinity College Dublin
    • Vanderbilt University
    • ZapGo
  • PV車体
    • 車体用先進薄膜PV
    • Sion Motors
    • IFEVS
    • EIEV
  • 発電タイヤ
    • Triboelectric Univ
    • Univ. Bolton
  • 航空機
    • ソーラー航空機の例:Sunstar
    • Sunseeker Duo
    • Solar Impulse
    • SolarShip
    • American Semiconductor:スマート機体・翼
    • Boeing 787 Dreamliner
    • Airbus:3Dプリント
    • Nervous system:NASA
    • Morphing wing:FlexFoil・NASA、など
  • ボート・船舶による大面積波力発電
    • EIEV船
    • 例:Okeanos Pearl
    • PlanetSolar・SolarLab
    • EIEV調査船、など
  • ビル・建造物
    • アクティブスマートガラス
    • Samsung OLEウィンドウ
    • 建物一体型PV (BIPV)
    • 太陽電池タイル
    • ソーラー温室
  • スマートブリッジ:例
  • スマートロード
    • スマートロードの潜在技術
    • 現在の道路研究プロジェクト:圧電モーションハーベスティング
    • ソーラー道路:Missouri Department of Transportation
    • ソーラー道路
    • Bouygues Colas
    • Pavenergy
    • TNO SolaRoad、など

The new IDTechEx report, "Smart Material Opportunities in Structural Electronics 2020-2030" analyses and forecasts a $200 billion opportunity. Making dumb structures smart means saving in weight, space and cost but it also makes new things possible such as huge solar drones up for five years beaming the internet to everyone. The new solar cars never plug in. The Executive Summary and Conclusions says expect better appliances, wearables, vehicles lasting generations. Think one-piece flexible phones with no case, smart fuselages and smart roads. Learn enablers: additive metal and dielectric patterning and new organic, inorganic and composite materials merged. From transparent concrete to stretchable ink patterns, it introduces the e-window performing three functions and the wave blanket as a power station, all facilitated by new materials and processing with huge sales potential. Many infograms pull together market readiness of composites and how improved metal patterning can create electricity and bend light. See separate forecasts for vehicles, building and ground-integrated photovoltaics, for in-mold electronics, flexible AMOLEDs and other SE technologies. Even elements of this are forecasted including embedded RFID, solar cars, building integrated photovoltaics, smart glass. Appraise technology roadmaps for flexible phones as they integrate flexible batteries.

The Introduction reveals the evolution of the needs and practices with phones, wearables, vehicles, structures and more. Which of the 12 energy harvesting technologies lend themselves to being incorporated in the new monolithic smart structures? Tesla sunroof with electric tinting and lighting functions in one glass, human body area networks, energy positive solar boats and self-healing plastics are among the host of examples explained.

Chapter 3 Vehicle Integrated Photovoltaics VIPV introduces such things as energy positive solar cars, autonomous solar flying wings that replace trucks and those upper atmosphere solar drones. Infograms show how many disciplines leverage to deliver many benefits here. Why the importance of single crystal silicon bodywork but potential of GaAs film and thin film, 3 junction InGaP, GaAs, InGaAs. Which companies, why, by when?

Chapter 4 pulls together Smart Roads, Bridges, Buildings emphasising new materials and potential. Here is the largest sector BIPV including solar tiles and windows. What materials and benefits? Scope for heat and piezoelectric harvesting roads? Why did solar roads and environs fail in Germany and France but they look good in the UK, Netherlands, Japan, China and Hungary? What new materials? What next?

Chapter 5 goes deeper with Materials and Manufacturing: Large Structural Electrics. Here is structural battery and supercapacitor technology from graphene and CNT, glass and carbon fiber to vanadium and ruthenium boosting pseudocapacitance. Learn new reinforcement with multifunctional resins. Understand progress of electrically multifunctional fibers, smart glass electrically changing color, tint, display, darkness, photovoltaic action, even greenhouses optimising both electricity creation and plant growth with new dyes. Throughout there are many examples of research progress and deployment.

Chapter 6 Monolithic Flexible Display Materials and Technology examines the materials and processes as glass-free AMOLEDS become a complete flexible phone or other device. No need for a case. What is monolithic now and what gets incorporated later? How do you print flexible quantum dot displays? What seven key components merge into flexible OLEDs?

Chapters 7 addresses in detail the vital new subject of Vehicle and Consumer Goods Simplification: In Mold Electronics with its stretchable inks, dielectric patterning and so on. Chapter 8 covers alternatives and complementary materials and processes such as Conformal Printing, MID, 3D printed electronics using elastomers and metals, optronics and the research on spraying of electrically active new materials. "Smart Material Opportunities in Structural Electronics 2020-2030" analyses and forecasts a formidable new business opportunity.

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Table of Contents


  • 1.1.Changing the world
  • 1.2.Purpose of this report
  • 1.3.Primary conclusions
    • 1.3.1.Technological megatrend
    • 1.3.2.Benefits
    • 1.3.3.Challenges
    • 1.3.4.Why now?
    • 1.3.5.Focus
  • 1.4.Evolution
  • 1.5.Most promising SE functions in business potential with examples
  • 1.6.SE opportunity vs progress by business sector
  • 1.7.SE manufacturing and technology readiness by applicational sector and date
  • 1.8.Structural electronics as protective coating or wrap: applications compared
  • 1.9.Structural electronics as load bearing structure: applications compared
  • 1.10.Structural electronics technologies compared
    • 1.10.1.Thickness vs area
    • 1.10.2.In use
    • 1.10.3.Working well in laboratory and trials
    • 1.10.4.Later
  • 1.11.Formats of technology
  • 1.12.Status of multifunctional composites by application
  • 1.13.Much more can be done with metal patterning on appropriate substrates
  • 1.14.Some organisations attempting significant SE advances
  • 1.15.Patent analysis
    • 1.15.1.Structural electronics
    • 1.15.2.Structural solar
  • 1.16.Market forecasts
    • 1.16.1.Overview 2020-2030
    • 1.16.2.Solar energy-independent cars 2019-2030 - Number of vehicles (thousand)
    • 1.16.3.Solar energy-independent cars 2019-2030 - Market Value (US$ billion)
    • 1.16.4.Smart glass market size ($ million) 2019-2030
    • 1.16.5.Building integrated photovoltaics BIPV
    • 1.16.6.RFID sensor tags and systems $ million
  • 1.17.SE product and technology roadmaps 2019-2040
    • 1.17.1.General
    • 1.17.2.Roadmap to flexible displays and phones
    • 1.17.3.Roadmap for solar and supercapacitor cars


  • 2.1.Progression to structural electronics
    • 2.1.1.Sequence
    • 2.1.2.Multiple sources
    • 2.1.3.Beginnings: PCBs: multilayer, heat pipe vias, load bearing PCB
    • 2.1.4.True structural electronics: Plastic Electronic, Smart Plastics Network
    • 2.1.5.Hybrid structural-conventional
    • 2.1.6.Hybrid structural conventional: wearables Matrix Powerwatch
    • 2.1.7.Flexible mobile phones
  • 2.2.Emerging structural electronics
    • 2.2.1.Tesla sunroof with electric tinting and integrated lighting
    • 2.2.2.Energy harvesting suitable for SE
  • 2.3.Combining many functions
    • 2.3.1.Overview and healthcare
    • 2.3.2.Triboelectric integrated with other sensing/ harvesting
  • 2.4.Vehicles
    • 2.4.1.Load bearing supercapacitors replace steel bodywork


  • 3.1.Basics
    • 3.1.1.Definitions and history
    • 3.1.2.Energy positive vehicles
    • 3.1.3.New user propositions enabled by structural solar
  • 3.2.Importance of solar cars
  • 3.3.Tipping points for sales of solar cars
  • 3.4.Tipping points for sales of solar trucks, buses and trains
  • 3.5.Corporate and geographical positioning
  • 3.6.Chemistry
  • 3.7.Format
  • 3.8.Leading solar cars compared: Sono, Lightyear, Hanergy, Toyota
  • 3.9.Solar buses and trucks
  • 3.10.Energy Independent Electric Vehicles EIEV


  • 4.1.Overview
  • 4.2.Smart roads and other paving
    • 4.2.1.Overview
    • 4.2.2.Smart road probability of success vs current investment
    • 4.2.3.Piezoelectric motion harvesting US, UK
    • 4.2.4.Realistic solar roads, parking, paths, barriers overview
    • 4.2.5.Solar roads in France and Germany a failure
    • 4.2.6.Mirai Labo Japan
    • 4.2.7.Pavenergy China
    • 4.2.8.Platio Hungary
    • 4.2.9.Solar Roadways USA
    • 4.2.10.Tokyo Government Japan
    • 4.2.11.TNO SolaRoad Netherlands
  • 4.3.Gantry vs road surface: Korea, China
  • 4.4.Solar wind / sound barriers: Eindhoven University of Technology
  • 4.5.Building integrated photovoltaics
    • 4.5.1.Overview
    • 4.5.2.BAPV vs BIPV
    • 4.5.3.BIPV technologies and location


  • 5.1.Overview
  • 5.2.Dream for supercapacitors and their derivatives: other planned benefits
  • 5.3.Structural battery technology
  • 5.4.Structural supercapacitor technology
    • 5.4.1.Imperial College London; Chalmers Sweden
    • 5.4.2.Queensland University of Technology Australia, Rice University USA
    • 5.4.3.Trinity College Dublin Ireland
    • 5.4.4.Vanderbilt University USA
    • 5.4.5.ZapGo UK
  • 5.5.Smart glass technology
    • 5.5.1.Active smart glass in buildings - Market drivers
    • 5.5.2.Active and passive glass darkening materials
  • 5.6.Smart cement technology
    • 5.6.1.Batteries as cement
    • 5.6.2.Battery charging cement Magment (TM)
  • 5.7.Structural photovoltaic materials and future
    • 5.7.1.Choice of operating principles
    • 5.7.2.Comparison of performance and issues
    • 5.7.3.Sharp conversion efficiency 37.9%
    • 5.7.4.Perovskite silicon tandem: record 25.2% efficiency
    • 5.7.5.CIGS PV in action
    • 5.7.6.pcSi PV in action
    • 5.7.7.scSi PV in action
    • 5.7.8.GaAs PV in action
    • 5.7.9.Future structural photovoltaics plus structural supercapacitor
    • 5.7.10.Three in one PV window material
    • 5.7.11.Building integrated photovoltaic thermal (BIPVT)
  • 5.8.Multi-functional PV materials
    • 5.8.1.Optimising crop growth in greenhouses
    • 5.8.2.Desalination and optimising growth
    • 5.8.3.Fiber making and storing electricity
    • 5.8.4.Fiber and film making electricity two ways and storing


  • 6.1.First step: OLED on plastic substrate
  • 6.2.Inkjet printing organic materials for thin film encapsulation of OLEDs
  • 6.3.Printed OLED: key players
  • 6.4.Printing for monolithic flexible displays is near
  • 6.5.Printing flexible quantum dot displays
  • 6.6.Resulting flexible devices 2018-2020
  • 6.7.Key components for flexible OLEDs


  • 7.1.What is in-mould electronics?
    • 7.1.1.IME products have exceptional environmental tolerance
    • 7.1.2.Aircraft aerofoil flap with integral heater for de-icing using in-mold electronics
    • 7.1.3.IME: 3D friendly process for circuit making
    • 7.1.4.Related processes comparison IMD, IME, MID/LDS
  • 7.2.What is the in-mold electronic process?
    • 7.2.1.Comments on requirements
  • 7.3.Conductive ink requirements for IME
    • 7.3.1.New ink requirements: stretchability
    • 7.3.2.New ink requirements: portfolio approach
  • 7.4.Diversity of material portfolio
    • 7.4.1.New ink requirements: surviving heat stress
    • 7.4.2.New ink requirements: stability
    • 7.4.3.All materials in the stack must be reliable
    • 7.4.4.Design: general observations
  • 7.5.Expanding range of functional materials
    • 7.5.1.Stretchable carbon nanotube transparent conducting films
    • 7.5.2.Beyond IME conductive inks: adhesives
    • 7.5.3.Beyond conductive inks: thermoformed polymeric actuator?
  • 7.6.Overview of applications, commercialization progress, and prototypes
    • 7.6.1.In-mold electronic application: automotive
    • 7.6.2.White goods, medical and industrial control (HMI)
    • 7.6.3.Is IME commercial yet?
    • 7.6.4.First (ALMOST) success story: overhead console in cars
    • 7.6.5.Commercial products: wearable technology
    • 7.6.6.Automotive: direct heating of headlamp plastic covers
    • 7.6.7.Automotive: human machine interfaces
    • 7.6.8.White goods: human machine interfaces
    • 7.6.9.Mobile phone storage
  • 7.7.IME functional material suppliers
    • 7.7.1.Emerging value chain
    • 7.7.2.Stretchable conductive ink suppliers multiply
    • 7.7.3.IME conductive ink suppliers multiply
    • 7.7.4.IME with functional films made with evaporated lines
  • 7.8.Approach of TactoTek: the IME SE leader
    • 7.8.1.TactoTek Profile


  • 8.1.Printing directly on a 3D surface
    • 8.1.1.Optomec Aerosol: market leader
    • 8.1.2.Conformal printing examples: Harvard University, University of Illinois at Urbana Champaign, Optomec
    • 8.1.3.Pulse Electronics
    • 8.1.4.Spraying leading edge 787 heater GKN, Boeing
    • 8.1.5.Nano Dimension Israel, Ceradrop France
    • 8.1.6.Neotech, Novacentrix, nScrypt
  • 8.2.Molded Interconnect Devices: Laser Direct Structuring
    • 8.2.1.Overview
    • 8.2.2.MID and LDS: LPKF, Festo
    • 8.2.3.Applications of laser direct structuring in IME
    • 8.2.4.MID - LPKF and Molex examples
    • 8.2.5.MID - TRW example
  • 8.3.Genuinely Printed PCB
    • 8.3.1.Progress towards rapid PCB prototyping using Ag nanoparticle inks
    • 8.3.2.Printed PCB: Newcomers
  • 8.4.Transfer printing: printing test strips & using lamination to compete with IME
  • 8.5.3D printed electronics
    • 8.5.1.Overview
    • 8.5.2.Toyota Japan
    • 8.5.3.Aconity3D Germany, USA
    • 8.5.4.Functionalise USA
    • 8.5.5.Harvard University
    • 8.5.6.Princeton University
    • 8.5.7.Nascent Objects
    • 8.5.8.aGic Japan, Voltera Canada
    • 8.5.9.Cartesian USA, Botfactory USA
    • 8.5.10.Voxel8
  • 8.6.Manufacturing options compared
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