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市場調査レポート

2Dから3Dプリンテッドエレクトロニクスまで 2015-2025年

3D Printed Electronics and Circuit Prototyping 2015-2025

発行 IDTechEx Ltd. 商品コード 335243
出版日 ページ情報 英文 103 Slides
納期: 即日から翌営業日
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2Dから3Dプリンテッドエレクトロニクスまで 2015-2025年 3D Printed Electronics and Circuit Prototyping 2015-2025
出版日: 2015年12月01日 ページ情報: 英文 103 Slides
概要

当レポートでは、2Dから3Dプリンテッドエレクトロニクスに広がる既存技術・新興技術、主要アプリケーションタイプ、同市場に製品を提供する企業について調査し、特にインクジェット導電性インク・絶縁インク、導体ペースト・絶縁体の押出およびエアロゾルジェット技術に注目して、分析しています。

第1章 エグゼクティブサマリー

第2章 イントロダクション

  • プリンテッドエレクトロニクス
  • プリンテッドエレクトロニクス:商業的失敗
  • プリンテッドエレクトロニクス:商業的成功
  • 3Dプリンティング
  • 3Dプリンティング:商業用途
  • 3Dプリンティング:ハイブリッドマシン
  • 教訓

第3章 従来型PCB

  • 歴史
  • 実装コンポーネント
  • レイヤー
  • 複雑性
  • 地域
  • プロトタイピング
  • メカニクス
  • SWOT分析

第4章 材料

  • 機能性材料
  • 金属
  • 導電性熱可塑性フィラメント
  • 導電性インク
  • 導体ペースト
  • 導電性フォトポリマー

第5章 用途

  • 相互接続
  • アンテナ
  • マイクロバッテリー
  • 少量生産
  • エレクトロマグネット (電磁石)
  • セラミックコンデンサー
  • 有機太陽光発電
  • メタマテリアル
  • 弾道整流器
  • 圧電素子

第6章 技術

  • 押出溶融はんだ
  • 押出溶融はんだ:SWOT
  • 押出導電性フィラメント
  • 押出導電性フィラメント:SWOT
  • インクジェット
  • インクジェット:SWOT
  • エアロゾル
  • エアロゾル:SWOT
  • ペースト押出
  • ペースト押出:SWOT

第7章 競合技術

  • 3Dプリンターおよび導電性インク/ペースト/接着剤
  • CNCミリング
  • LDS (レーザーダイレクトストラクチャリング)

第8章 企業

  • AgIC
  • AgIC: SWOT
  • Voltera
  • Voltera: SWOT
  • Cartesian Co.
  • Cartesian Co: SWOT
  • BotFactory
  • BotFactory: SWOT
  • NanoDimension
  • NanoDimension: SWOT
  • Ceradrop
  • Ceradrop: SWOT
  • Optomec
  • Optomec: SWOT
  • Neotech AMT
  • Neotech AMT: comparison
  • Neotech AMT: SWOT
  • Voxel8
  • Voxel8: conductivity
  • Voxel8: SWOT
  • Novacentrix and nScrypt
  • Pulse Electronics

第9章 研究機関

  • University of Texas at El Paso (UTEP)
  • Cornell University

第10章 市場・予測

  • エンドユーザー
  • 企業の分類
  • 技術の強み・弱み
  • 機会
  • Kickstarter (キックスターター基金)
  • 消費者市場
  • 教育市場
  • 専門PCBプロトタイピング市場
  • 産業市場
  • 総市場予測
  • 予測の制限事項
  • 結論

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目次

The market for 3D printed electronics will exceed $1 billion by 2025.

This is the only market research report covering the evolution of 3D printed electronics

The 3D printing industry created a tsunami of hype in 2012 with the advent of the world's first consumer-level 3D printers. This hype around consumer-level technologies made 3D printing a household name. Surprisingly, this culminated in rapid growth across the entire industry including established players offering high-end industrial equipment. The same pattern will repeat in 2016 with the advent of a new breed of printers capable of depositing electrically conductive and insulating materials: the first step towards 3D printed electronics.

Customers funding first generation machines have already spent over $800k on Kickstarter alone. These consumer-level machines will drive the hype but next generation machines aimed at professional use will become the largest commercial markets over the next decade by servicing professional prototyping and manufacturing end users. In addition we have the first truly 3D electronics printer coming to market in 2015 and the impact it will have is unknown.

This report relates the emerging market for 3D printed electronics to the existing markets for printed electronics and 3D printing that IDTechEx has been researching for years. We explain why some candidate applications will not succeed commercially and identify two main applications that will create a total market worth over $1bn by 2025 thanks to core advantages over competing technologies and huge addressable markets. In addition we explore many potential applications for fully 3D printed electronics.

This report discusses all existing and emerging technologies that span 2D and 3D printed electronics, all major applications, all players bringing products to market in this space. Specifically, the inkjetting of conductive and insulating inks, extrusion of conductive pastes and insulators and the Aerosol Jet technology.

The following technologies are covered in detail including lists of all major vendors for each technology type and SWOT analyses quantifying characteristics such as equipment and material prices, conductivities and precision:

  • Inkjetting conductive and insulating inks.
  • Extrusion of conductive metals and insulating thermoplastics.
  • Extrusion of conductive pastes and insulating thermoplastics.
  • Aerosol Jet.

The following materials are covered:

  • Metals.
  • Conductive thermoplastics.
  • Conductive inks.
  • Conductive pastes.
  • Conductive photopolymers.

Eighteen potential commercial applications of 3D printed electronics are considered, most of which have already been demonstrated in the lab.

All major players are covered including SWOT analyses comparing their commercial products and technologies.

This report gives forecasts to 2025 broken down into the following market sectors:

  • 1. Consumer.
  • 2. Education.
  • 3. Professional PCB prototyping.
  • 4. Antenna manufacture

Restraints that are inhibiting the uptake of 3D printed electronics are covered as well as drivers.

Analyst access from IDTechEx

All report purchases include up to 30 minutes telephone time with an expert analyst who will help you link key findings in the report to the business issues you're addressing. This needs to be used within three months of purchasing the report.

Table of Contents

1. EXECUTIVE SUMMARY

  • 1.1. Drivers and restraints
  • 1.2. Market forecast
  • 1.3. Technologies

2. INTRODUCTION

  • 2.1. Printed Electronics
  • 2.2. Printed Electronics: commercial failures
  • 2.3. Printed Electronics: commercial successes
  • 2.4. 3D Printing
  • 2.5. 3D Printing: commercial applications
  • 2.6. 3D Printing: hybrid machines
  • 2.7. Lessons learned

3. TRADITIONAL PCBS

  • 3.1. Traditional PCBs: history
  • 3.2. Traditional PCBs: mounting components
  • 3.3. Traditional PCBs: layers
  • 3.4. Traditional PCBs: complexity
  • 3.5. Traditional PCBs: geography
  • 3.6. Traditional PCBs: prototyping
  • 3.7. Traditional PCBs: mechanics
  • 3.8. Traditional PCBs: heat
  • 3.9. Traditional PCB: SWOT analysis

4. MATERIALS

  • 4.1. Functional materials
  • 4.2. Metals
  • 4.3. Conductive thermoplastic filaments
  • 4.4. Conductive inks
  • 4.5. Conductive pastes
  • 4.6. Conductive photopolymers

5. APPLICATIONS

  • 5.1. Interconnects
  • 5.2. Antennas
  • 5.3. Microbatteries
  • 5.4. Low volume manufacturing
  • 5.5. Electromagnets
  • 5.6. Ceramic capacitor
  • 5.7. Organic Photovoltaic
  • 5.8. Metamaterials
  • 5.9. Ballistic rectifier
  • 5.10. Piezoelectric device

6. TECHNOLOGIES

  • 6.1. Extrude molten solder
  • 6.2. Extrude molten solder: SWOT
  • 6.3. Extrude conductive filament
  • 6.4. Extrude conductive filament: SWOT
  • 6.5. Inkjet
  • 6.6. Inkjet: SWOT
  • 6.7. Aerosol Jet
  • 6.8. Aerosol Jet: SWOT
  • 6.9. Paste extrusion
  • 6.10. Paste extrusion

7. COMPETING TECHNOLOGIES

  • 7.1. 3D Printer and conductive ink/paste/glue
  • 7.2. CNC Milling
  • 7.3. Laser Direct Structuring (LDS)

8. PLAYERS

  • 8.1. AgIC
  • 8.2. AgIC: SWOT
  • 8.3. Voltera
  • 8.4. Voltera: SWOT
  • 8.5. Cartesian Co.
  • 8.6. Cartesian Co: SWOT
  • 8.7. BotFactory
  • 8.8. BotFactory: SWOT
  • 8.9. NanoDimension
  • 8.10. NanoDimension: SWOT
  • 8.11. Ceradrop
  • 8.12. Ceradrop: SWOT
  • 8.13. Optomec
  • 8.14. Optomec: SWOT
  • 8.15. Neotech AMT
  • 8.16. Neotech AMT: comparison
  • 8.17. Neotech AMT: SWOT
  • 8.18. Voxel8
  • 8.19. Voxel8: conductivity
  • 8.20. Voxel8: SWOT
  • 8.21. Novacentrix and nScrypt
  • 8.22. Pulse Electronics

9. RESEARCH INSTITUTES

  • 9.1. University of Texas at El Paso (UTEP)
  • 9.2. Cornell University

10. MARKETS AND FORECASTS

  • 10.1. End users
  • 10.2. Player classification
  • 10.3. Technology strengths and weaknesses
  • 10.4. Opportunities
  • 10.5. Kickstarter funding
  • 10.6. Consumer market
  • 10.7. Educational market
  • 10.8. Professional PCB prototyping market
  • 10.9. Industrial market
  • 10.10. Total market forecast
  • 10.11. Limitations of the forecast
  • 10.12. Conclusions

11. COMPANY PROFILES

  • 11.1. AgIC
  • 11.2. BotFactory
  • 11.3. Cartesian Co
  • 11.4. CERADROP
  • 11.5. Chemcubed
  • 11.6. Nano Dimension
  • 11.7. Nascent Objects, Inc
  • 11.8. Novacentrix
  • 11.9. nScrypt Inc
  • 11.10. Optomec
  • 11.11. Pulse Electronics
  • 11.12. Voxel8
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