表紙
市場調査レポート

プリンテッドエレクトロニクス対応印刷機器市場

Printing Equipment for Printed Electronics 2015-2025

発行 IDTechEx Ltd. 商品コード 320181
出版日 ページ情報 英文 225 Pages
納期: 即日から翌営業日
価格
本日の銀行送金レート: 1USD=101.39円で換算しております。
Back to Top
プリンテッドエレクトロニクス対応印刷機器市場 Printing Equipment for Printed Electronics 2015-2025
出版日: 2015年09月01日 ページ情報: 英文 225 Pages
概要

当レポートは、プリンテッドエレクトロニクスに対応する印刷機器市場のビジネスチャンスを明らかにしたもので、スクリーン印刷、インクジェット印刷、フレキソ印刷(およびオフセット印刷)、グラビア印刷、ナノインプリンティングとエンボス加工、転写、コーティングシステム(スロットダイなど)といった印刷技術や印刷関連の製造技術、熱乾燥、赤外線や紫外線による硬化処理、光硬化処理といった印刷後の処理工程に対応する技術の市場を詳細に分析するとともに、各分野の主な企業や各国政府が資金を拠出している研究センターのプロファイルも紹介します。

第1章 エグゼクティブサマリーと結論

  • 各種印刷技術の比較
  • 印刷機器のタイプ別、コンポーネント別予測

第2章 イントロダクション

  • プリンテッドエレクトロニクスとは何か
  • 印刷技術の利点
  • プリンテッドエレクトロニクス技術やコンポーネントのタイプ
  • プリンテッドエレクトロニクスの市場規模
  • 印刷技術

第3章 プリンテッドエレクトロニクス市場

  • 結晶シリコン太陽電池
  • 薄膜太陽電池
  • タッチスクリーン
  • ロジックデバイスとメモリー
  • OLEDディスプレイと照明
  • スマートパッケージ
  • 透明導電膜
  • 直接印刷

第4章 スクリーン印刷

  • イントロダクション
  • スクリーン印刷技術の見通し
  • 各種デバイスやコンポーネントへの適合性
  • 既存の用途
  • 将来の用途
  • 技術革新と進歩
    • 解像度
    • プリントオンプリント(ダブルプリント)
  • 主要企業のプロファイル

第5章 インクジェット印刷

  • イントロダクション
  • インクジェット印刷技術の見通し
  • 各種デバイスやコンポーネントへの適合性
  • 既存の用途
  • 将来の用途
    • 相互接続
    • マスカスタマイゼーション
    • OELDとフラットパネルディスプレイ、OLED照明、タッチスクリーン、有機太陽電池(OPV)
    • タッチパネルのベゼル
    • マスキング後のめっき処理
    • 太陽電池のバスバーとフィンガー
  • 主要企業のプロファイル

第6章 フレキソ印刷

  • イントロダクション
  • フレキソ印刷技術の見通し
  • 各種デバイスやコンポーネントへの適合性
  • 既存の用途
  • 将来の用途
  • 主要企業のプロファイル

第7章 グラビア印刷

  • イントロダクション
  • グラビア印刷技術の見通し
  • 各種デバイスやコンポーネントへの適合性
  • 既存の用途
  • 将来の用途
  • 主要企業のプロファイル

第8章 他のタイプの印刷技術

  • 他の印刷技術の予測
  • ナノインプリンティングとエンボス加工
    • 対象となる用途
  • 転写
    • 対象となる用途

第9章 コーティングシステム:スロットダイと各種代替技術

  • コーティングシステム
  • 対象となる用途
  • 主要企業のプロファイル

第10章 印刷後の処理工程

  • 熱乾燥
  • 赤外線硬化と紫外線硬化
  • 光硬化
  • 主要企業のプロファイル

第11章 機器の統合、取扱

  • 主要企業のプロファイル

第12章 各国政府が資金を拠出している研究センター

  • 研究センターのプロファイル

IDTECHEXの調査レポートとコンサルティングサービス

図表

このページに掲載されている内容は最新版と異なる場合があります。詳細はお問い合わせください。

目次

This unique report assesses the applications, technologies and opportunities for equipment that is enabling printed electronics. It covers the different types of printing, curing/sintering and other key manufacturing equipment, providing assessment of the manufacturing requirements for different applications, growth areas, ten year forecasts for each printing method by application and detailed company assessments.

For each printing and sintering technology, the following is addressed:

  • Analysis of existing uses of the printing technology for printed electronics/electrics
  • Assessment of the capability and technology development and roadmaps for each printing type
  • Suitability of each process to the wide range of applications possible
  • Trends and emerging opportunities for each printing technology, with ten year forecasts segmented by printing type and technology type and assessment of markets
  • Leading suppliers and detailed company profiles of over 90 organizations from around the world, based almost entirely on direct interviews with each organization

This is assessed for the following printing and printed related manufacturing technologies:

  • Screen printing
  • Inkjet printing
  • Flexo printing (and offset)
  • Gravure printing (and offset)
  • Nano imprinting/embossing
  • Transfer printing
  • Coating systems (Slot die and alternatives)

Additionally, the following post-printing processes are also covered, including

  • Thermal drying
  • IR and UV curing
  • Photonic curing

This assessment also covers global organizations integrating equipment including complete solution providers, along with government/industry backed printed electronics initiatives and manufacturing centers.

Strong investment, strong growth, profitable but subsidized

Initially the printed, organic and flexible electronics industry was driven by significant investment and technological development from the fine chemicals industry. However, the equipment industry has become strongly involved, from equipment suppliers to the printing and electronics industries seeking growth opportunities to those having designed completely new equipment from the bottom-up specifically to address the current and emerging opportunity.

IDTechEx find that screen printing currently dominates commercial printed electronics products made by printing, but intense focus on inkjet printing and high volume flexo and gravure printing is beginning to see these printing types move from R&D to pilot and some commercial product production. Governments have made significant investments in equipment to help companies start to manufacture the technology, which has created a particularly strong market in Europe. America lags due to limited government funding and even though the government funded equipment purchases in Europe are now slowing that is offset by the growth in purchases from Asia. This report analyzes where, who and quantifies the market opportunity.

State of the market and emerging applications assessed

Each printing type is assessed against the manufacture needs of a range of emerging products. Often, printing is only part of the process to make the complete product and therefore this report addresses printing electronic or electrical materials by individual layers that build up to making the full components. We cover the printing requirements of over 80 functional layers that are used to create the following components:

  • Displays: OLED, electrophoretic, AC electroluminescent, electrochromic
  • Lighting: OLED, LED
  • Sensors: Biosensors, capacitive, piezoresistive, piezoelectric, temperature, gas, organic photodetector, hybrid CMOS photodetector, digital X-ray
  • Photovoltaics: crystalline silicon PV, OPV, DSSC, aSi, CIGs and others
  • Energy storage: batteries, supercapacitors
  • Touch screens: Capacitive
  • Logic and Memory: Logic, TFTs, memory
  • Others: Membrane keypads/switches, RF antennas, heating elements, smart packaging, flexible circuits

Granular ten year forecasts

IDTechEx find that in 2015 the value of products sold that will be made by printing will be $9.15 billion, rising to $15.57 billion in 2025. This report breaks down the value of each printing technology type by each of the main application categories listed above, providing a ten year forecast for each.

image1

Over 90 organizations covered

Progress of over 90 organizations is covered, based on direct interviews with most of them, segmented by the products they provide and value chain positioning. The application priority and latest technology developments for each organization is given. Government backed printed electronics manufacturing centers are also covered. The market leaders are identified.

Expert insights that add value

IDTechEx has studied printed, organic and flexible electronics technologies and markets since 2002. We conduct hundreds of interviews each year with organizations involved in the topic and have developed accurate models for forecasting in addition to having global insights directly from leading executives across the supply chain. Additionally, IDTechEx hosts the world's largest events on the topic - Printed Electronics USA, Printed Electronics Europe and Printed Electronics Asia, giving us close interactions with all involved parties and particularly end users, assessing their needs and therefore the market pull.

Analyst access included to help guide you

All report purchases include up to 30 minutes telephone time with an expert analyst who will help you link key findings in the report to the business issues you're addressing. This needs to be used within three months of purchasing the report.

Table of Contents

1. EXECUTIVE SUMMARY AND CONCLUSIONS

  • 1.1. Comparison of Printing Technologies
    • 1.1.1. Output performance comparison
    • 1.1.2. Running performance comparison
    • 1.1.3. Printing Type by Application
    • 1.1.4. Value chain for equipment for printed electronics
    • 1.1.5. Profitability
    • 1.1.6. Opportunities - Component Attach
  • 1.2. Forecasts by printing equipment type vs component 2015-2025
  • 1.3. Printed Electronics Equipment Sales: Companies Look to Asia
    • 1.3.1. Europe Government Funding for Equipment Declines

2. INTRODUCTION

  • 2.1. What is printed electronics
  • 2.2. Why printing?
  • 2.3. Types of Printed electronics technologies/components
  • 2.4. Market size of printed electronics 2015-2025
  • 2.5. Printing Technologies

3. PRINTED ELECTRONICS MARKET

  • 3.1. Crystalline Silicon Photovoltaics
  • 3.2. Thin Film Photovoltaics
  • 3.3. Touch screens
  • 3.4. Logic and memory
  • 3.5. OLED displays and lighting
  • 3.6. Smart Packaging
  • 3.7. Transparent Conductive Films
  • 3.8. Direct Printing

4. SCREEN PRINTING

  • 4.1. Introduction
  • 4.2. Screen printing forecasts 2015-2025
  • 4.3. Suitability to different devices/ components
  • 4.4. Existing uses
  • 4.5. Future uses
  • 4.6. Innovation and technical progress
    • 4.6.1. Resolution
    • 4.6.2. Print on print (Double print)
  • 4.7. Company profiles
    • 4.7.1. A&M Kinzel Siebdruckmaschinen Ltd
    • 4.7.2. Applied Materials Baccini
    • 4.7.3. Asada Mesh
    • 4.7.4. DEK Printing Machines Ltd
    • 4.7.5. Dynamesh
    • 4.7.6. Ever Bright Printing Machine Fty. Ltd
    • 4.7.7. KIWO
    • 4.7.8. Metal Etch Services Inc
    • 4.7.9. p-tec GmbH
    • 4.7.10. Saati Americas Corp
    • 4.7.11. Sefar
    • 4.7.12. Spartanics
    • 4.7.13. SPGprints
    • 4.7.14. Thieme Corporation
    • 4.7.15. Thieme GmbH & Co KG
    • 4.7.16. Ulano
    • 4.7.17. UTZ Technologies
    • 4.7.18. Werner Kammann Maschinenfabrik GmbH & Co. KG

5. INKJET PRINTING

  • 5.1. Introduction
  • 5.2. Inkjet printing forecasts 2015-2025
  • 5.3. Suitability to different devices/ components
  • 5.4. Existing uses
  • 5.5. Future uses
    • 5.5.1. Printed interconnects
    • 5.5.2. Mass customization
    • 5.5.3. OLED and flat panel displays, OLED lighting, Touch screens, OPV
    • 5.5.4. Touch panel bezels
    • 5.5.5. Masking followed by plating
    • 5.5.6. PV bus bars and fingers
  • 5.6. Company profiles
    • 5.6.1. Ceradrop
    • 5.6.2. Fujifilm Dimatix
    • 5.6.3. Kateeva
    • 5.6.4. Meyer Burger PixDro
    • 5.6.5. Optomec
    • 5.6.6. Samsung Electro-Mechanics
    • 5.6.7. SCHMID Group
    • 5.6.8. Seiko Epson
    • 5.6.9. SIJ Technology
    • 5.6.10. Sonoplot
    • 5.6.11. THG Inkjet
    • 5.6.12. Unijet
    • 5.6.13. Xaar

6. FLEXO PRINTING

  • 6.1. Introduction
  • 6.2. Flexo printing forecasts 2015-2025
  • 6.3. Suitability to different devices/ components
  • 6.4. Existing uses
  • 6.5. Future uses
  • 6.6. Company profiles
    • 6.6.1. Gallus
    • 6.6.2. Harper Corporation
    • 6.6.3. Mark Andy
    • 6.6.4. Multi Print Systems (MPS)
    • 6.6.5. Nilpeter
    • 6.6.6. Omet Varyflex

7. GRAVURE PRINTING

  • 7.1. Introduction
  • 7.2. Gravure printing forecasts 2015-2025
  • 7.3. Suitability to different devices/ components
  • 7.4. Existing uses
  • 7.5. Future uses
  • 7.6. Company profiles
    • 7.6.1. Bobst Group
    • 7.6.2. Chestnut Engineering
    • 7.6.3. Comco
    • 7.6.4. Harper Corporation
    • 7.6.5. Komori
    • 7.6.6. Mirwec Film
    • 7.6.7. Nilpeter
    • 7.6.8. Ohio Gravure Technologies Accupress

8. OTHER PRINTING TYPES

  • 8.1. Other printing forecasts 2015-2025
  • 8.2. Nano imprinting/embossing
    • 8.2.1. Target applications
    • 8.2.2. PragmatIC Printing
    • 8.2.3. TNO
  • 8.3. Transfer printing
    • 8.3.1. Target applications
    • 8.3.2. Semprius

9. COATING SYSTEMS: SLOT DIE AND ALTERNATIVES

  • 9.1. Coating systems
  • 9.2. Target Applications
  • 9.3. Company profiles
    • 9.3.1. Coatema
    • 9.3.2. MegTec
    • 9.3.3. Mitsubishi Materials Corporation
    • 9.3.4. Ntact

10. POST PRINTING PROCESSING

  • 10.1. Thermal drying
  • 10.2. IR and UV curing
  • 10.3. Photonic curing
  • 10.4. Company profiles
    • 10.4.1. Adphos
    • 10.4.2. Heraeus Noblelight
    • 10.4.3. Novacentrix
    • 10.4.4. Xenon Corporation

11. EQUIPMENT INTEGRATION, HANDLING

  • 11.1. Company profiles
    • 11.1.1. 3D Micromac
    • 11.1.2. Aixtron
    • 11.1.3. Applied Laser Engineering ALE
    • 11.1.4. Beneq
    • 11.1.5. Bosch Rexroth
    • 11.1.6. DP Patterning
    • 11.1.7. InkTec
    • 11.1.8. Kimoto Tech
    • 11.1.9. Kroenert
    • 11.1.10. Martin Automatic
    • 11.1.11. Mekoprint A/S
    • 11.1.12. Nordson Asymtek
    • 11.1.13. Northfield Automation Systems
    • 11.1.14. Notion Systems
    • 11.1.15. Owens Design
    • 11.1.16. Rolith, Inc.
    • 11.1.17. Sempa Systems GmbH
    • 11.1.18. Soligie
    • 11.1.19. TDK-Lambda
    • 11.1.20. Teknek Ltd.
    • 11.1.21. VDL FLOW
    • 11.1.22. Von Ardenne
    • 11.1.23. Vinci Technologies
    • 11.1.24. Werner Kammann Maschinenfabrik GmbH & Co. KG
    • 11.1.25. Xymox

12. GOVERNMENT FUNDED CENTERS

  • 12.1. Center profiles
    • 12.1.1. Acreo, Sweden
    • 12.1.2. CEA, France
    • 12.1.3. Cetemmsa, Spain
    • 12.1.4. CPI, UK
    • 12.1.5. CSEM, Switzerland
    • 12.1.6. Flexible Display Center, Arizona, USA
    • 12.1.7. Holst Center (TNO, IMEC, Dutch Ministry of Economy Affairs, Government of Flanders), The Netherlands
    • 12.1.8. ITRI, Taiwan
    • 12.1.9. NRC
    • 12.1.10. Printable Electronics Research Center, China
    • 12.1.11. The Thailand Organic and Printed Electronics Center (TOPIC), Thailand
    • 12.1.12. VTT

IDTECHEX RESEARCH REPORTS

IDTECHEX CONSULTANCY

TABLES

  • 1.1. Displays
  • 1.2. Lighting
  • 1.3. Sensors
  • 1.4. PV
  • 1.5. Energy Storage
  • 1.6. Touch Screens
  • 1.7. Logic and Memory
  • 1.8. Other Components
  • 1.9. Leading providers of inkjet
  • 1.10. Leading providers of flexo, gravure and offset
  • 1.11. Leading providers of screen printing
  • 1.12. Leading providers of coating
  • 1.13. Leading providers of photonic curing/sintering
  • 1.14. Leading providers of other
  • 1.15. Logic/memory
  • 1.16. OLED Display
  • 1.17. OLED Light
  • 1.18. Electrophoretic/E-wetting/BiStable LCD
  • 1.19. Electrochromic
  • 1.20. Electroluminescent
  • 1.21. Battery
  • 1.22. Photovoltaics
  • 1.23. Sensors
  • 1.24. Conductors (ink only)
  • 2.1. Description and analysis of the main technology components of printed and potentially printed electronics
  • 2.2. Market value $ billions of only printed electronics 2015-2025
  • 2.3. Printing techniques with a physical master vs those without a physical master
  • 3.1. SWOT Analysis
  • 4.1. Key mechanical variables
  • 4.2. Output variables
  • 4.3. Screen printing forecasts 2015-2025
  • 4.4. The strengths and weaknesses of screen printing
  • 5.1. Key variables
  • 5.2. Output characteristics
  • 5.3. Inkjet printing forecasts 2015-2025
  • 5.4. The strengths and weaknesses of inkjet printing
  • 6.1. Flexo printing forecasts 2015-2025
  • 6.2. The strengths and weaknesses of inkjet printing
  • 7.1. Key variables
  • 7.2. Output characteristics
  • 7.3. Gravure printing forecasts 2015-2025
  • 7.4. The strengths and weaknesses of gravure printing
  • 8.1. Other printing forecasts 2015-2025

FIGURES

  • 1.1. The current market for printed, organic and flexible electronics
  • 1.2. Four main types of printed technologies being pursued for printed electronics
  • 1.3. Printed performance characteristics of the different printing types relevant to printed electronics
  • 1.4. Comparison of the different printing types by a number of running parameters
  • 1.5. Current status of printing by volume
  • 1.6. The value chain for equipment supply for printed electronics
  • 1.7. Printed electronics centers worldwide
  • 2.1. Market value $ billions of only printed electronics 2015-2025
  • 3.1. Example of a grid structure
  • 3.2. Sheet resistance as a function of optical transmission for different materials. Metal grids have the best performance, i.e., sheet resistance of 10 Ohm at 95% transmission.
  • 3.3. Comparing the optical clarity of TCFs made using different materials/processes. It is noted that the directly printed metal mesh TCFs are not completely invisible and the naked eye can detect the grid structures.
  • 3.4. Players
  • 4.1. Screen printing is one of the oldest printing processes. It incorporates a frame (E), mesh (D), image (C), squeegee (B) and ink (A).
  • 4.2. Rotary screen printing wraps the mesh around a cylinder
  • 4.3. Screen printing forecasts 2015-2025
  • 4.4. Two of the largest markets along with their needs
  • 5.1. Ink jet technology
  • 5.2. Inkjet printing forecasts 2015-2025
  • 5.3. Printed interconnects
  • 5.4. Adaptive routing for board level packaging
  • 5.5. OLED/OPV encapsulation barriers, OPV/OLED lighting, signage and displays, touch screens
  • 5.6. Bezel (black matrix), conductive traces, spacers, bridges
  • 5.7. Less lateral growth during electroplating
  • 5.8. Size of ink droplet volume versus it's radius
  • 6.1. Flexo printing forecasts 2015-2025
  • 6.2. Flexo printed conductive lines.
  • 7.1. Gravure printing forecasts 2015-2025
  • 8.1. Other printing forecasts 2015-2025
  • 8.2. Transfer printed GaAs FETs on PET
  • 8.3. Semprius opportunity space
  • 9.1. A simplified schematic of a manufacturing process flow.
Back to Top