株式会社グローバルインフォメーション
TEL: 044-952-0102
表紙
市場調査レポート

フレキシブルエレクトロニクス向けバリア層の技術、市場、予測:2017年〜2027年

Barrier Layers for Flexible Electronics 2017-2027: Technologies, Markets, Forecasts

発行 IDTechEx Ltd. 商品コード 312862
出版日 ページ情報 英文 208 Slides
納期: 即日から翌営業日
価格
本日の銀行送金レート: 1USD=113.24円で換算しております。
Back to Top
フレキシブルエレクトロニクス向けバリア層の技術、市場、予測:2017年〜2027年 Barrier Layers for Flexible Electronics 2017-2027: Technologies, Markets, Forecasts
出版日: 2017年06月22日 ページ情報: 英文 208 Slides
概要

世界のフレキシブルバリアフィルム市場は、2026年には8億7500万米ドルを超える規模に達することが予測されています。

当レポートは、フレキシブルエレクトロニクス製品に対応するバリア層技術の市場を詳細に分析し、2026年までの見通しを示したもので、各種の関連技術に加え、主要企業のプロファイルも紹介しています。

第1章 調査範囲

第2章 成熟段階へと到達しつつあるバリア技術 - 商業化の現状

  • 主なディスプレイメーカーのトレンド
    • Samsung
    • LG
    • その他
  • TFEとバリアラミネート加工
  • フレキシブルプラスチックやフレキシブルガラスを利用したMLバリア
  • シングルレイヤーとマルチレイヤー
  • フレキシブル基板の処理
  • 原子層成長法 (ALD) の現在および将来の展望と市場シェア

第3章 カプセル化についてのイントロダクション

第4章 表面平滑度 - 欠陥

  • 表面平滑度に関する重要課題
  • 微小欠陥
    • ピンホール - 粒子
    • 平滑度/ひびと傷
    • ナノ欠陥

第5章 バリア技術:これまでの進歩

  • Vitex
  • GE

第6章 バリア製造工程の進歩

第7章 バリア接着剤

  • DELO
  • tesa
  • 3M
  • Henkel

第8章 主要企業のプロファイル

  • 高分子基板にダイアドや無機レイヤーを蒸着した製品のメーカー
    • 凸版印刷
    • Vitriflex
    • Holst Centre - TNO
    • 三菱
    • 東レ
    • 3M
    • Amcor
    • Tera-Barrier
    • 富士フイルム
    • UDC
    • コニカミノルタ
    • Samsung
    • Honeywell
    • LG Display
    • Applied Materials
    • Meyer Burger Group
  • 高分子フィルムを開発しているその他の企業
    • Dow Chemical
    • Jindal
  • フレキシブルガラス
    • Schott AG
    • Corning
    • 旭硝子 (AGC)
    • 日本電気硝子 (NEG)
  • フレキシブルバリアのためのALD技術
    • Lotus
    • Beneq
    • Encapsulix
  • 他のアプローチ
    • CNM Technologies
    • 3M

第9章 バリアフィルム技術の有効市場

  • OLEDディスプレイ - OLED照明
  • 有機薄膜トランジスター (OTFT)
  • 液晶ディスプレイ - 電気泳動ディスプレイ
  • 有機太陽電池 (OPV)
  • CIGS - アモルファスシリコン

第10章 バリア性能評価技術

  • カルシウムテスト
  • MOCON
  • Vinci Technologies
  • SEMPA
  • VG Scienta
  • 蛍光トレーサー
  • ブラックスポット分析
  • トリチウムテスト
  • CEA
  • 3M
  • IMRE
  • 質量分析法 - 気体透過 (WVTRとOTR評価技術への応用の可能性)
  • Kisco Uniglobe

第11章 フレキシブルエレクトロニクス用バリアフィルムの予測

  • 有機エレクトロニクスおよびプリンテッド無機エレクトロニクスの潜在的な重要性
  • バリアフィルム市場の規模
  • プラスチック基板上のフレキシブルガラスまたは無機レイヤー

第12章 結論

このページに掲載されている内容は最新版と異なる場合があります。詳細はお問い合わせください。

目次

Encapsulation films, in-line deposition, ALD and flexible glass

By 2027 flexible barrier manufacturing will be a market of more than $3.1 billion.

The first examples of flexible consumer electronic devices are now a reality, and a large opportunity lies in developing them further: devices in a flexible form factor that can operate without deterioration in performance, allowing them to be more robust, lightweight and versatile in their use and form factor is the end game . In order for products such as flexible displays and photovoltaics to be commercially successful, they must be robust enough to survive for the necessary time and conditions required of the device. This condition has been a limitation of many flexible, organic or printable electronics. This highlights the fact that beyond flexibility, printability and functionality, one of the most important requirements is robust encapsulation; this is a major challenge as many of the materials used in printed or organic electronic displays are chemically sensitive, and will react with many environmental components such as oxygen and moisture.

Plastic substrates and transparent flexible encapsulation barriers can be used, but these offer little protection to oxygen and water, resulting in the devices rapidly degrading. In order to achieve device lifetimes of tens of thousands of hours, water vapor transmission rates (WVTR) must be 10-6 g/m2/day, and oxygen transmission rates (OTR) must be < 10-3 cm3/m2/day. For Organic Photovoltaics, the required WVTR is not as stringent as OLEDs require but is still very high at a level of 10-5 g/m2/day. These transmission rates are several orders of magnitude smaller than what is possible using any conventional plastic substrate, and they can also be several orders of magnitude smaller than what can be measured using common equipment designed for this purpose.

Table 1: Water vapor and oxygen transmission rates of various materials

Source: Source IDTechEx

For these (and other) reasons, there has been intense interest in developing transparent barrier materials with much lower permeabilities, a market that will reach over $3,1bn by 2027.

Figure 1: Barrier layer market forecasts in US$ million*

*For the full forecast data please purchase this report
Source: IDTechEx

This report from IDTechEx gives an in-depth review of the needs, emerging solutions and key players. It addresses specific topics such as:

  • The choice device developers have to make is whether to follow the route of direct deposition of thin film encapsulation (TFE) or that of encapsulation with a pre-made barrier film, supplied by film producers. Each approach has its merits and drawbacks which are discussed in the report, along with which application spaces follow which approach and why.
  • Companies which are active in the development of high barrier films and their achievements on the field to date. The report covers a range of approaches in encapsulation, such as dyads, deposition of inorganic layers on plastic substrates and flexible glass.
  • Depending on the deposition process utilized, different qualities of barrier are produced: PE CVD has been a proven technology that has been most commonly used to date, but an interest in ALD has been precipitating with many active projects looking into its incorporation in encapsulation solutions. Benefits and drawbacks are discussed in detail.
  • Surface smoothness and defects (such as cracks and pinholes) and the effect that these would have on the barrier behavior of the materials studied.
  • Traditional methods of measurement of permeability are reaching the end of their abilities. The MOCON WVTR measurement device, which has been an industry standard, cannot give adequate measurements at the low levels of permeability required for technologies such as organic photovoltaics and OLEDs. Other methods of measurement and equipment developed are being discussed.
  • Forecasts for displays, lighting and thin film photovoltaics (in terms of market value as well as area of barrier film sold into different verticals), in order to understand the influence that the development of flexible barriers would have at the mass deployment and adoption of these technologies.
  • Detailed profiles and benchmarking of key technology developers, based in almost 10 years of IDTechEx research in the space for barrier layers.

For those developing flexible electronics, seeking materials needs and opportunities, this is a must-read report.

Analyst access from IDTechEx

All report purchases include up to 30 minutes telephone time with an expert analyst who will help you link key findings in the report to the business issues you're addressing. This needs to be used within three months of purchasing the report.

Table of Contents

1. INTRODUCTION

  • 1.1. Introduction to flexible encapsulation & barrier layers
  • 1.2. The need for flexible encapsulation & barrier layers
  • 1.3. Comparison of performance metrics for different encapsulation solutions
  • 1.4. Comparison of performance metrics for different encapsulation solutions

2. BARRIER TECHNOLOGY - COMMERCIALIZATION STATUS

  • 2.1. Technology trends from major adopters - Samsung
  • 2.2. Technology trends from major adopters - LG & others
  • 2.3. Technology trends:TFE vs. barrier lamination
  • 2.4. Technology trends: Single or multilayer - Substrate handling
  • 2.5. Technology trends: The future of ALD in encapsulation
  • 2.6. Technology trends: The future of ALD in encapsulation
  • 2.7. Technology trends: plastics vs. flexible glass
  • 2.8. Technology trends: plastics vs. flexible glass (2)

3. ENCAPSULATION- BASIC PRINCIPLES

  • 3.1. Barrier technology principles
  • 3.2. Barrier key requirements
  • 3.3. Barrier key requirements
  • 3.4. Encapsulation: Dyads

4. SURFACE SMOOTHNESS - DEFECTS

  • 4.1. Surface smoothness considerations
  • 4.2. Porosity pinholes and cracks
  • 4.3. Barrier properties as a function of the thickness of the deposited film
  • 4.4. Micro defects
  • 4.5. Pinholes
  • 4.6. Particles
  • 4.7. Eliminating scratches and cracks
  • 4.8. Resistance to scratching/cracking
  • 4.9. Nano-defects

5. BARRIER TECHNOLOGIES - PAST DEVELOPMENTS

  • 5.1. Vitex - The PML process
  • 5.2. Vitex - Multilayers and dyads
  • 5.3. The multilayer barrier and the Vitex flexible glass.
  • 5.4. Vitex - Multilayers and dyads
  • 5.5. Vitex - hybrid encapsulation and Samsung acquisition
  • 5.6. GE - graded barrier
  • 5.7. GE - graded barrier - Sabic acquisition
  • 5.8. POLO - Fraunhofer

6. ADVANCES IN ENCAPSULATION MANUFACTURING PROCESSES

  • 6.1. Advances in encapsulation manufacturing processes - ALD
  • 6.2. R2R ALD
  • 6.3. PECVD will compete head to head with ALD

7. BARRIER ADHESIVES

  • 7.1. Barrier adhesives
  • 7.2. Barrier adhesives: 3M
  • 7.3. Barrier adhesives: DELO - Henkel
  • 7.4. Barrier adhesives: tesa

8. ADDRESSABLE MARKET SEGMENTS FOR ENCAPSULATION TECHNOLOGIES

  • 8.1. Addressable markets - Flexible OLED displays & lighting
  • 8.2. Addressable markets - plastic rigid precede fully flexible OLED displays
  • 8.3. Addressable markets: Quantum dot (QD) LCDs
  • 8.4. Addressable markets: Integration approaches for QD LCDs
  • 8.5. Addressable markets: quantum dot enhancement film
  • 8.6. Addressable markets: OTFTs, LCDs and electrophoretic displays
  • 8.7. Addressable markets: flexible photovoltaics

9. MARKET FORECASTS

  • 9.1. The potential significance of organic and printed inorganic electronics: flexibility, robustness & lower cost
  • 9.2. Challenges with non rigid substrates
  • 9.3. Inkjet printing for organic material deposition
  • 9.4. ALD entering maturity in encapsulation applications
  • 9.5. Application driven choice between in-line TFE and barrier film: Flexible PV and Quantum Dots
  • 9.6. Barrier material forecasts 2017-2027 (sq. m)
  • 9.7. Barrier revenues forecasts 2017-2027 ($ million)

10. COMPANY PROFILES

  • 10.1.1. Toppan Printing
  • 10.1.2. Vitriflex
  • 10.1.3. TNO Holst Centre
  • 10.1.4. Mitsubishi
  • 10.1.5. 3M
  • 10.1.6. Amcor
  • 10.1.7. Tera-Barrier Films
  • 10.1.8. Fujifilm
  • 10.1.9. UDC
  • 10.1.10. Konica Minolta
  • 10.1.11. Samsung
  • 10.1.12. LG Display
  • 10.1.13. Applied Materials
  • 10.1.14. Meyer Burger Group
  • 10.2. Flexible glass
    • 10.2.1. Schott AG
    • 10.2.2. Corning
    • 10.2.3. Asahi Glass Company (AGC)
    • 10.2.4. Nippon Electric Glass (NEG)
  • 10.3. ALD deposition for flexible barriers
    • 10.3.1. ALD deposition for flexible barriers
    • 10.3.2. Lotus
    • 10.3.3. Beneq
    • 10.3.4. Encapsulix

11. BARRIER MEASUREMENTS

  • 11.1. The Calcium Test
  • 11.2. MOCON
  • 11.3. Vinci Technologies
  • 11.4. SEMPA
  • 11.5. VG Scienta
  • 11.6. Fluorescent Tracers
  • 11.7. Black Spot Analysis
  • 11.8. Tritium Test
  • 11.9. CEA
  • 11.10. 3M
  • 11.11. IMRE
  • 11.12. Mass Spectroscopy - gas permeation (WVTR & OTR potential applications)
  • 11.13. Kisco Uniglobe
Back to Top